WO2016095804A1

WO2016095804A1 - Electrical heat-generating device

Info

Publication number: WO2016095804A1
Application number: PCT/CN2015/097408
Authority: WO
Inventors: 谢彦君
Original assignee: 宋正贤; 谢彦君
Priority date: 2014-12-16
Filing date: 2015-12-15
Publication date: 2016-06-23
Also published as: CN107113919A

Abstract

The present invention relates to an electrical heat-generating device, which may be an electric heating device or a semiconductor cooling device. The present invention is arranged in a sandwich structure. The present invention has high heat conductivity, high power density, a compact structure, a small volume, low costs and is easy to assemble.

Description

Electric heating device

Technical field

The present invention relates to electrical heating devices, particularly liquid PTC electric heaters and semiconductor cooling devices.

Background technique

The existing electric heating uses a metal base, and a PTC electric heating sheet is inserted thereon. There are two main defects. The disadvantage is that the heat transfer intermediate link is increased, the thermal resistance is increased, the thermal efficiency is low, and the power density is small. The second disadvantage is that the sub-parts are added and the cost is increased.

The prior art employs a plurality of flat heat exchange tubes and PTC heaters which are laminated to each other. The flat heat exchange tubes are provided with an inlet head and an outlet head, and are fastened by heat exchange pressing members to reduce contact thermal resistance. Compared with the previous plumbing PTC electric heater, the structure is more compact and the heat exchange efficiency is improved; however, the inlet head and the outlet head also occupy a considerable space without heat exchange, and special heat must be used. Exchange the pressing parts to work effectively.

Summary of the invention

The technical problem to be solved by the present invention is to overcome the deficiencies of the prior art and provide an electric heater from a more preferable point of view, with a simpler and more efficient structure.

The technical solution adopted by the present invention to solve the technical problem thereof is: an electric heating device comprising a PTC electric heating assembly, the PTC electric heating assembly comprising a PTC electrode strip assembly, the PTC electrode strip assembly comprising a positive electrode The strip, the PTC heating sheet group and the negative electrode strip, the PTC heating sheet group is composed of a plurality of PTC heating sheets.

Wherein, the positive electrode strip comprises a positive electrode sheet and a positive electrode tab.

Wherein, the negative electrode strip comprises a negative electrode sheet and a negative electrode tab.

Wherein, the PTC heating sheet group is disposed between the positive electrode strip and the negative electrode strip, and more preferably disposed between the positive electrode sheet and the negative electrode sheet.

Wherein, the outer side of each of the positive electrode sheet and the negative electrode sheet is provided with a first insulating layer. Alternatively, the outer surface of the PTC electrode strip assembly is provided with a first insulating layer, and preferably all outer surfaces of the PTC electrode strip assembly except the electrode tab are provided with a first insulating layer.

The PTC heating sheet of the present invention may also be referred to as a PTC element, including a PTC heating ceramic sheet, and/or a polymer PTC heating sheet.

The so-called electrode tab of the present invention is a general term for the electrical connection portion with the outside on the electrode strip or the electrode sheet.

The PTC heating element in the PTC electrode strip assembly is preferably connected to the positive and negative electrode sheets by gluing; of course, it can also be connected by pressing.

Further, the PTC electrode strip assembly and the first insulating layer constitute a first integral piece; the PTC electric heater includes a fluid passage, and the fluid passage is sequentially spaced from the first integral member to form a PTC electric heating group body. Wherein, the fluid passage may also be a partition (or a diaphragm passage), and the fluid passage or partition includes: various fins, a fin group, a flat tube, and the like.

Further, the outermost periphery of the PTC electric heating assembly is preferably a fluid passage.

Further, the fluid channel is a fin group, and the fin group is sequentially spaced from the first unitary member.

Further, the fin group is a fin group composed of a plurality of sets of fins; or the fin group is composed of a side plate, a fin, and a seal, and fins and fins are placed between adjacent side plates. Place a seal on the bottom and top.

Further, a first sealing member is respectively disposed between the adjacent two fluid passages, and each of the first sealing members forms a sealing insulation on both side edges or the whole of the first integral member. In this way, the effect of sealing the heat exchange liquid from the first monolith (or PTC electrode strip assembly) is achieved.

Further, the PTC electric heater further includes a main board having an inner cavity, and the tab of the electrode strip protrudes from the main board through the inner cavity, and forms a sealing structure with the inner wall of the main board.

Further, the PTC electric heating assembly is disposed in the inner cavity of the main board and forms a sealing structure with the inner wall of the main board; or the first integral piece is disposed in the inner cavity of the main board, and A sealing structure is formed between the inner wall of the main plate and the inner wall of the main plate; or the tab of the electrode strip protrudes from the main plate through the inner cavity, and a sealing structure is formed between the tab and the inner wall of the main plate.

Further, the electric heater further includes a casing, the casing forming a cavity therein; and the main plate and/or the PTC electric heating group are located in a cavity of the casing.

In a preferred embodiment, the PTC electrical heating assembly is exposed to a cavity of the outer casing, the fluid passage being in communication with the cavity. In this way, the PTC electric heating group can be directly immersed in the fluid. When the fluid enters and passes through the cavity, the fluid directly enters the fluid passage of the PTC electric heating group through the compact cavity, and the effective heat exchange volume accounts for a larger proportion. The overall structure is more compact. Further, the main board divides the cavity of the outer casing into two spaces, the tabs protruding through the main board are located in the first space, the other parts of the PTC electric heating component are exposed to the second space, and the second space is used for fluid to pass.

Of course, a fastening mechanism may also be provided in the outer casing to make the internal contact of the PTC electric heating assembly tight. The fastening mechanism includes a plurality of fastening springs between the interior of the housing, or a bolt-and-nut connection.

Alternatively, further, the PTC electric heating unit is provided with a clamping mechanism to make the internal contact of the PTC electric heating unit tight.

The outer casing is preferably a plastic casing, and preferably a plastic casing in the form of upper and lower enclosures.

The main board may be in the form of a single open slot or may be in the form of a multi-open slot.

Or, further, the PTC electric heater further includes a sealing head, and both ends of the PTC electric heating assembly communicate with the sealing head, and the sealing head is provided with a liquid inlet and a liquid outlet . The connection between the two ends of the PTC electric heating unit and the head is preferably in a gluing manner. The head is used for liquid collection or liquid separation of the incoming and outgoing fluids, and the head may be a header similar to that used for parallel flow heat exchangers, or may be similarly used for a plate fin heat exchanger.

Further, the fluid passage adopts a closed fluid passage. By closed fluid passage, it is meant that four sides of the cross section of the fluid passage perpendicular to the direction of flow of the liquid (ie, four faces of the fluid passage parallel to the direction of flow of the liquid) are closed (or interconnected), the fluid There is no direct contact with the first integral piece.

Further, the closed fluid passage is a bundle or a flat tube. The plate bundle is composed of a side plate, a fin and a seal, and fins are placed between adjacent two side plates, and a seal is placed at the bottom end and the top end of the fin; the plate bundle is also a fin group. The flat tube may be single-hole or porous; it may be extrusion-molded or welded, and the flat tube material may be metal or non-metallic such as plastic.

Alternatively, further, the fluid channel employs an open fluid channel. The so-called open fluid passage is not completely closed on the four sides of the cross section of the fluid passage perpendicular to the flow direction of the liquid, and there is a direct contact portion between the fluid and the first integral member, such as the first part of the fluid and the first integral member. The insulation layer is in direct contact.

The open fluid passage includes a form in which the fluid passage is surrounded by two adjacent first integral members and a second seal disposed between two adjacent first integral members; or, the fluid passage Formed by two adjacent first integral members and a main plate portion between two adjacent first integral members; or, the fluid passage is formed by the first integral member, the side plate, and between the first integral member and the side plate The second seal is surrounded by the formation; or the fluid passage is formed by the first integral member, the outer casing, and the second seal disposed between the first integral member and the outer casing.

The second sealing member functions to seal a gap between two adjacent first integral members to prevent heat exchange liquid from flowing from the upper and lower directions between the adjacent two first integral members to the main board or the outer casing. . If the main board is in the form of a multi-opening slot, each of the open slots is inserted into the first unitary piece and filled and sealed by the first unitary member, so that the second sealing member can be omitted.

The side plates are located at the outermost periphery of the PTC electric heating assembly as part of the fluid passages on both sides.

Further, an upper portion between two adjacent first integral members is provided with one of the second sealing members, or an upper portion and a lower portion between two adjacent first integral members are respectively provided with one of the second sealing members.

Further, the first insulating layer material is an insulating material immersed in a heat-resistant liquid. The material is an insulating silica gel immersed in a heat-resistant liquid, a polyimide film coated with an epoxy resin, and the like. The so-called insulating material immersed in the heat exchange liquid means that the insulating material can maintain a good insulating function by being immersed in the heat exchange liquid. If you choose to resist heat exchange liquid soaking As the first insulating layer material, the insulating material may also be used as the first sealing member.

Further, a plurality of fins are disposed in the open fluid passage to enhance heat exchange performance. The fins may be fins of various forms, such as straight fins, serrated fins, porous fins, and the like. Wherein, a preferred embodiment of the PTC electric heating assembly in the electric heater is formed: the first integral member is formed by the PTC electrode strip assembly and the insulating layer immersed in the heat-resistant liquid disposed outside the PTC electrode strip assembly, and the PTC is electrically heated. The assembly is formed by sequentially laminating the first monolith and the fins. The preferred embodiment combines the first integral piece and the fins, and the fins exert a prominent effect on the tissue flow field and the heat exchange effect on the one hand, and on the other hand play the role of separating and supporting the first integral piece, increasing the whole The mechanical strength of the electric heater.

Further, the first insulating layer is a ceramic insulating sheet, or a polymer material insulating sheet, or an insulating layer such as spray coating, dip coating, or a plating insulating layer, or the positive electrode sheet and the negative electrode The outer portion of the sheet wraps the first insulating layer.

Further, the material of the first insulating layer is selected from any one or more of a polymer insulating material, a ceramic insulating material, and a ceramic composite insulating material.

Further, the first insulating layer material is selected from the group consisting of silica gel, silicone resin, inorganic silicon, polyimide, Teflon, polyester imine, epoxy resin, acrylate adhesive, acrylic adhesive, benzo Any one or more of an oxazine or a ceramic-doped silica gel.

Further, the method of disposing the first insulating layer is selected from the group consisting of one or several of coating, flat, and wrapping (or wrapping).

Further, the coating method for setting the first insulating layer is selected from one or more of spraying, brushing, roll coating, deposition, dip coating, dispensing, screen printing, roll coating, electrophoresis, and blade coating. Combination of species.

Further, the first sealing member is an insulating sealant, or an insulating rubber ring, or a welded seal.

Further, the positive electrode tab is located at the top of the positive electrode tab, and the negative electrode tab is located at the top of the negative electrode tab; the heat exchange liquid flow direction of the fluid passage is from the left side to the right side of the PTC electric heater or From right to left.

The heat exchange liquid used in the PTC electric heater of the present invention preferably uses a water-based coolant such as pure water or a conventional antifreeze, wherein the main component of the antifreeze is about 50% ethylene glycol + about 50% water.

Above, both the closed fluid channel and the open fluid channel do not include a dedicated inlet head and outlet header. The inlet and outlet of the fluid on the PTC electric heating unit are on either side of the fluid passage.

In addition, the present invention also provides a PTC electric heater core, the core being composed of a first integral piece, a bundle of plates, and a first seal. The first monolith and the bundle are alternately stacked, and a first seal is disposed between the adjacent bundles, and the first seal seals the circumference of the first integral member except the tab.

Of course, it can be further expanded, the present invention also provides a PTC electric heater core, the core comprising a first integral piece, a fluid passage. The first monolith and the fluid passage are alternately laminated to form a PTC electric heater core forming a sandwich-like structure.

The present invention also provides a semiconductor cooling device including a semiconductor heat dissipation assembly including a plurality of semiconductor electrode monoliths and a plurality of fluid passages; the semiconductor electrode monolith and the fluid passage Arranged alternately, at least a portion of the surface of the fluid passage is in direct contact with at least a portion of the outer surface of the semiconductor electrode monolith, and a coolant passage is disposed in the fluid passage.

Among them, the fluid passage in the above semiconductor cooling device may also be referred to as a partition or a diaphragm passage.

Wherein the semiconductor electrode monolith is composed of a semiconductor electrode assembly and a first insulating layer disposed outside the semiconductor electrode assembly; wherein the semiconductor electrode assembly includes a semiconductor chip and electrodes disposed on upper and lower sides of the semiconductor chip sheet. The electrode sheet is a sheet-shaped electrode. The method includes the following: the number of the electrode sheets is two, that is, the connecting electrode of the collector and the emitter is an electrode sheet, and the connecting electrode of the gate is a conventional wire bond; or the number of the electrode sheets is 3 One or five, that is, the collector, the emitter, and all the connection electrodes of the gate are electrode pads.

The semiconductor core can be an IGBT chip and/or a diode chip.

Further, a first sealing member is disposed between the adjacent two fluid passages, and each of the first sealing members forms a seal around the whole or the whole of the semiconductor electrode integral member.

Further, the fluid channel is a closed coolant channel.

Further, the fluid channel is a bundle or a flat tube.

Further, the fluid channel is an open coolant channel.

Further, the fluid channel is a corrugated fin, or a zigzag fin, or a fin with a side plate.

Further, the outermost sides of the semiconductor heat dissipation assembly are fluid passages.

Further, the semiconductor cooling device further includes a housing for accommodating the semiconductor heat dissipation assembly, and an electrical connection portion (such as a tab) of the electrode sheet to the outside extends outside the housing and The outer casing is sealed, and the outer casing is provided with a liquid inlet and a liquid outlet.

Further, the first insulating layer is an insulating material that is resistant to coolant immersion.

Further, the insulating material immersed in the coolant is any one or more of a polymer insulating material, a ceramic insulating material, and a ceramic insulating material doped with ceramic.

Further, a boss is disposed between the electrode sheet and the semiconductor chip. The bosses may also be referred to as pad upper layers for increasing the pitch of the electrode sheets on both sides.

Further, a second insulating layer is further disposed between the electrode sheets at a portion other than the semiconductor chip.

Further, the electrical connection between the semiconductor chip and the electrode sheet is conductive adhesive bonding, or soldering, or soldering, or pressure bonding.

Further, the first insulating layer is provided by spraying or dip coating.

Further, the electrode sheet material is an aluminum alloy, or stainless steel, or copper; and preferably stainless steel.

Further, the number of the electrode sheets of the semiconductor electrode assembly is two or three or five.

The invention has the beneficial effects that the invention adopts the sandwich structure arrangement, has high heat transfer efficiency, large power density, compact structure, small volume, low cost and simple assembly.

DRAWINGS

The invention will now be further described with reference to the accompanying drawings.

Figure 1 is a schematic view showing the structure of a first unitary member;

2 is a schematic structural view of a first integral piece and a fluid passage alternately stacked;

3 is a cross-sectional, cross-sectional view showing the outer insulating sheet of the positive electrode sheet and the negative electrode sheet;

Figure 4 is a partial enlarged view of A in Figure 3;

Figure 5 is a schematic structural view of a PTC electric heating assembly;

Figure 6-1 is a schematic structural view of a single-open slot motherboard;

Figure 6-2 is a schematic structural view of a multi-open slot main board;

Figure 7 is a schematic view showing the PTC electric heating unit mounted in the main board;

Figure 8-1 is a schematic structural view (explosion diagram) of a closed fluid passage (plate bundle);

Figure 8-2 is a schematic structural view of another closed fluid passage (flat tube);

Figure 9-1 is a schematic structural view of an open fluid passage in the form of serrated fins;

Figure 9-2 shows an open fluid passage in the form of a straight fin, comprising parallel risers and upper and lower plates joined at both ends of the riser. The plates are in direct contact with the first integral piece and fluid is formed between the risers. aisle;

10-1, 10-2 are schematic side views of a PTC electric heating assembly including an open fluid passage;

Figure 11 is a schematic view of a PTC electric heater including an open fluid passage;

Figure 12 is a front view and a side view of the head;

Figure 13 is a top view of the semiconductor electrode assembly;

Figure 14 is a top view of the semiconductor electrode monolith;

Figure 15 is a cross-sectional view of the semiconductor electrode monolith A-A in Figure 14;

Figure 16 is a schematic cross-sectional view of a semiconductor heat dissipation assembly;

Figure 17 is a plan view of a semiconductor electrode assembly of another semiconductor electrode monolith provided by the fifth embodiment;

Figure 18 is a cross-sectional view showing the semiconductor electrode monolith in the sixth embodiment;

19 is a schematic diagram of a semiconductor heat dissipation assembly in the sixth embodiment.

detailed description

The invention will now be further described with reference to the drawings. The drawings are a simplified schematic diagram to illustrate only the basic structure of the invention in a schematic manner, and thus only show the configuration related to the present invention.

Embodiment 1

As shown in the accompanying drawings, an electric heating device includes a PTC electric heating assembly, and the PTC electric heating assembly includes a PTC electrode strip assembly including a positive electrode strip 1, a PTC heating sheet group, and a negative electrode strip 2 The PTC heating sheet group is composed of a plurality of PTC heating sheets 3. Among them, the PTC heating sheet 3 is preferably a PTC heating ceramic sheet.

The positive electrode strip 1 includes a positive electrode sheet and a positive electrode tab; the negative electrode strip 2 includes a negative electrode sheet and a negative electrode tab; and the PTC heating sheet 3 is disposed between the positive electrode sheet and the negative electrode sheet. The positive electrode tab is located at the top of the left side of the positive electrode sheet, and the negative electrode tab is located at the top of the right side of the negative electrode sheet. The positive electrode tab and the negative electrode tab may be disposed at any position on the top of the positive electrode tab or the negative electrode tab according to actual needs. Preferably, the PTC heating sheet group may be bonded between the positive and negative electrode sheets by using silica gel.

The PTC electrode strip assembly and the first insulating layer 4 constitute a first integral member 8; the first integral member 8 shown in FIG. 1 has a first insulating layer 4 on a side of each of the positive electrode tab and the negative electrode tab. The first insulating layer 4 is a ceramic insulating sheet or a polymer insulating material or a sprayed insulating layer or a plated insulating layer; or, as shown in FIGS. 3 and 4, the first integral member 8 has a positive electrode sheet and a negative electrode sheet. The first insulating layer 4 is wrapped.

The PTC electric heater includes a fluid passage 5. As shown in FIG. 5, the fluid passage 5 and the first integral member 8 are sequentially spaced apart to form a PTC electric heating assembly, and the outermost periphery of the PTC electric heating assembly is a fluid passage 5. The fluid passage 5 has a heat exchange liquid flow inside during operation, and the heat exchange liquid in the fluid passage 5 is heated by the heat generated by the operation of the PTC electrode strip assembly.

As shown in FIG. 5, a first sealing member 6 is disposed between the adjacent two fluid passages 5, and each of the first sealing members 6 forms a sealing insulation on both side edges of the first integral member 8, and may also be opposite to the first integral member 8. The lower portion, the upper portion, and the entirety form a sealed insulation. The first sealing member 6 is a paste-like insulating sealant, and a glue having a strong bonding strength can be selected as the first sealing member 6 so as to strongly bond between the adjacent two fluid passages 5 and make the fluid passage 5 Heat transfer in close contact with the first unitary member 8.

As shown in FIG. 6-1 and FIG. 7 , in order to assemble the sealed PTC electric heating assembly, the PTC electric heater further includes a main board 7 having an inner cavity 71 and a PTC electric heating unit. A sealing structure is formed in the inner cavity 71 of the main plate 7 and between the inner wall of the main plate 7. In addition, the exterior of the main board 7 is wrapped with a plastic case (not shown) for accommodating the main board 7 and the PTC electric heating unit. The function of the plastic casing is a cavity through which the heat exchange liquid passes. In addition to the import and export, the other places are sealed, and the plastic outer casing is in the form of the upper and lower outer casings. In the PTC electric heating group stacking direction, plastic The gap between the inner wall surfaces of the material casing is slightly smaller than the thickness of the PTC electric heating group stacking layer (of course, an elastic rubber member may be disposed between the inner surfaces of the plastic outer casing), and then the PTC electric heating unit body is clamped into the plastic outer casing to further press. The function of the PTC electric heating unit is tight.

The number of PTC heating fins 3 is 18, and a plurality of PTC heating fins 3 are arranged in three rows and six columns between the positive electrode tab and the negative electrode tab. According to the requirements of the embodiment, the number of the first monolithic members 8 is three, and the fluid The number of channels 5 is four, and for other embodiments, other numbers of first monoliths 8 and fluid channels 5 may be provided. For the number of PTC heating fins 3, the user can select according to actual needs. All the numbers in this application are merely examples and can be extended.

The fluid passage 5 is preferably a single layer bundle 511 as shown in Fig. 8-1, which is a closed fluid passage composed of two side plates 5b, a set of fins 5a, and two seals 5c on both sides. Fins are placed between the plates 5b, and the seal 5c is placed at the bottom end and the top end of the fins 5a. The single layer bundle 511 is also a fin set. The flow direction of the heat exchange liquid in the fluid passage 5 is from left to right or from right to left of the PTC electric heater. In order to better seal, a groove may be formed on the outer surfaces of the two side plates 5b of the plate bundle 511 for placing the O-ring to better seal the first integral member 8 to the two sheets. Between the layer bundles 511.

For example, the single-layer plate bundle 511 has a length and width of 190*70 mm and a thickness of 5±0.5 mm. The positive electrode strip 1 and the negative electrode strip 2 have a length and width of 180*60 mm, a thickness of 0.2±0.05 mm, a positive electrode tab and a negative electrode tab having a size of 10*10 mm, and a PTC heating sheet 3 of 30*20 mm and a thickness of 3.5±. 0.05 mm; the thickness of the first insulating layer 4 is 0.5 ± 0.05 mm.

Of course, the closed fluid passage 5 can also be a porous extruded flat tube 512 as shown in Figure 8-2. The extruded flat tube 512 is used as a closed fluid passage, and the molding process is simple.

The invention adopts a sandwich structure arrangement, has high heat transfer efficiency, large power density, compact structure, small volume, low cost and simple assembly.

Compared with the prior art, the present invention has the following outstanding features and technical effects: the present invention firstly stacks the fluid passages such as the first integral member and the plate bundle, and preferably by means of a sealant. The bundles on both sides of the monolith are tightly joined to achieve a reliable seal and a reliable fit. Compared with the prior art, a plurality of flat heat exchange tubes are stacked before inserting a PTC heater, and a heat exchange pressing member that must be specially used as a fastening and fixing mechanism; the structure of the invention is simpler and the process is simpler. The close contact inside the PTC electric heater can also be ensured, and the heat conduction effect is better; although the invention can also add a special fastening and fixing mechanism, it is not necessary or preferred. In addition, since the fluid inlet and outlet on the PTC electric heating group is the two ends of the bundle, no special fluid inlet head and outlet head are required, so the volume is more compact; and the PTC electric heating body can be directly immersed in In the coolant, the heat exchange efficiency is higher.

Embodiment 2

On the PTC electrode strip assembly, all outer surfaces except the tabs are coated with insulating silica gel soaked in heat-resistant liquid. The first insulating layer 4; that is, the first integral member 8 is formed. The material of the first insulating layer 4 is an insulating silica gel immersed in a heat-resistant liquid. The silica gel is immersed in the heat exchange liquid and still maintains good electrical insulation function, and is suitable for use in a PTC electric heating assembly using an open fluid passage. This embodiment employs a fin group composed of a plurality of sets of serrated fins 513 as shown in Fig. 9-1 as fluid passages. Moreover, since the first insulating layer 4 immersed in the heat-resistant liquid is coated around the top, the upper portion and the bottom of the PTC electrode strip assembly, it is no longer necessary to additionally provide the first sealing member. In this embodiment, four zigzag fins 513 and three first unitary members 8 as shown in FIG. 9-1 are preferably alternately laminated to form a PTC electric heating assembly (or PTC electric heater core). The coolant-resistant adhesive is used to bond the serrated fins 513 and the first integral member 8, so that the mechanical strength inside the PTC electric heating assembly (such as the anti-vibration strength applied to the automobile) can be improved on the one hand. On the other hand, the contact thermal resistance between the serration fin 513 and the first integral member 8 can be reduced, which facilitates more efficient transfer of heat to the serrated fin 513 and emission into the heat exchange liquid. Generally, the rigidity and strength of the first integral member 8 are insufficient to meet the anti-vibration requirements of the vehicle, and therefore the serrated fins 513 play an important role: on the one hand, the function of separating and supporting the first integral member 8 to improve the overall vibration resistance. Strength; on the other hand, it plays an active role in organizing the coolant flow field, enhancing heat transfer, and improving the heating power density of the PTC electric heater.

Then, the respective tabs 101 of the PTC electric heating assembly body protrude through the inner cavity 72 (or slot hole) of the plastic main board 7 as shown in FIG. 6-2, and are protruded on the main board 7, and The ear 101 is sealed to the inner cavity 72 (eg, sealed with an insulating sealant). The plastic casing 12 is composed of an upper casing 121 and a lower casing 122, and the lower casing 122 is provided with a liquid inlet and a liquid outlet (not shown) in a direction perpendicular to FIG. The PTC electric heating assembly is inserted into the cavity of the lower casing 122, and the left and right inner surfaces of the inner cavity are provided with an elastic rubber layer (not shown), and the spacing between the inner surfaces of the lower casing 122 is preferably It is slightly smaller than the thickness dimension of the PTC electric heating group in the left-right direction in order to form a certain interference fastening fit. The main board 7 forms a reliable seal with the upper edge of the lower casing 122 (such as a rubber seal ring and a bolt and nut fastening connection). The upper casing 121 is then overlaid on the main board 7 and sealed tightly. This forms the preferred PTC electric heater of the present invention.

Of course, this embodiment can also adopt an open fluid passage as shown in FIG. 9-2.

Of course, a second sealing member 10 may be disposed on the upper portion between the two adjacent first integral members 8, and the side plate 9 may be added on the outer side of the serrated fins on both sides to form a PTC as shown in FIG. 10-2. Electric heating of the body.

In this embodiment, a plurality of first integral members 8 and serrated fins 513 are stacked one on another to form a "sandwich" type PTC electric heater, which has fewer parts, lower cost, and heat-generating components (PTC heating sheets). The heat transfer path to the heat transfer medium (heat exchange liquid) is shorter and more efficient.

Embodiment 3

In this embodiment, the PTC electric heating assembly body of the first embodiment is used, that is, the closed fluid passage 511 is spaced apart from the first integral member 8 and the first sealing member 6 is formed to form a PTC electric heating assembly. The difference is that the left and right ends of the PTC electric heating unit The head 11 is connected to the head 11 as shown in Fig. 12, and the connection is made by gluing to form a PTC electric heater with a head 11.

Embodiment 4

The semiconductor cooling device includes a semiconductor heat dissipation assembly including six sets of semiconductor electrode monoliths and seven flat tubes; the semiconductor electrode monolith and the flat tubes are alternately stacked one on another, the flat tube surface and The outer surface of the semiconductor electrode unit is directly in contact, and the flat tube is provided with a closed coolant channel; wherein the semiconductor electrode unit is composed of a semiconductor electrode assembly and a first insulating layer disposed outside the semiconductor electrode assembly In the composition, the semiconductor electrode assembly includes a semiconductor chip and electrode sheets disposed on upper and lower sides of the semiconductor chip. In this embodiment, an electrode strip is formed which integrates the electrode tab and the electrode sheet, and the tab is an electrical connection with the outside.

In order to ensure that the periphery of the semiconductor electrode unit is sufficiently sealed with the coolant, a first sealing member is respectively disposed between the adjacent two flat tubes, and each of the first sealing members forms a seal on the periphery or the whole of the semiconductor electrode unit except the tab.

The electrode strips 502, 503, 505 in Fig. 13 are composed of

electrode sheets

521, 531, 551 and

tabs

522, 532, 552, and Fig. 15 is a view showing the position of the solder layer on each of the electrode sheets. An IGBT chip 506 and a diode chip 507 are respectively disposed on the upper surface of the lower electrode sheet 551. The lower electrode sheet 551 is electrically connected to the collector of the IGBT chip 506 through the solder layer 505b, and passes through the solder layer 505a and the negative electrode of the diode chip 507. The upper left electrode sheet 521 is electrically connected to the emitter of the IGBT chip 506 through the solder layer 502b, and is electrically connected through the solder layer 502a and the positive electrode of the diode chip 507; the upper right electrode sheet 531 passes through the solder layer 503a and the IGBT chip 506. The gate is electrically connected. The second insulating layer 504 is also required to be separated between the

electrode sheets

521 and 531 on the upper and lower sides of the upper side. If the spacing between the upper and lower electrode sheets is small and the creepage resistance distance is insufficient, the second insulating layer 504 is applied between the upper and lower electrode sheets except the

chips

506 and 507 to ensure reliable insulation between the upper and lower electrode sheets. The second insulating layer 504 may be an insulating silica gel. Thereby, the semiconductor electrode assembly is formed.

Three electrical connections to the outside, namely three

tabs

522, 532, 552, are reserved on both sides of the semiconductor electrode assembly. On the semiconductor electrode assembly, all exposed surfaces on the

electrode sheets

521, 531, 551 are coated with a first insulating layer 501, and more preferably, the entire exposed surface of the entire semiconductor electrode assembly except the tab is coated with a first insulating layer. Layer 501 forms a semiconductor electrode monolith 102 as shown in FIG.

As shown in Fig. 16, the fluid passage employs a porous extruded flat tube 512 having a closed coolant passage formed therein. The semiconductor heat dissipation assembly is formed by alternately stacking six sets of semiconductor electrode monoliths 102 and seven porous extruded flat tubes 512, that is, the outermost sides of the semiconductor heat dissipation assembly are flat tubes 512. If the first insulating layer 501 is not resistant to coolant immersion, a first sealing member 100 is disposed between each adjacent two flat tubes 512, and the sealing material is an anti-freezing liquid sealing material, so that the semiconductor electrode monolith 102 Isolated from the coolant, thereby forming a semiconductor heat sink assembly.

The embodiment further includes a housing (not shown) composed of left and right halves (or front and rear halves), the housing The semiconductor strip heat dissipating body is arranged to extend outside the outer casing to be electrically connected to the outside, and the electrode strip and the outer casing are sealed, and the liquid inlet and the liquid outlet are disposed on the outer casing.

In the semiconductor cooling device of the above structure, the heat transfer path between the heat generating chip and the cooling liquid is short, the heat resistance is small, and both sides of the chip are sufficiently cooled, and the cooling efficiency is high; therefore, the semiconductor cooling device is small in size and has a very high power density. high. Moreover, in this embodiment, the full electrode sheet replaces the conventional wire bond or ribbon bond, and the contact surface of the electrode sheet and the chip is larger, so the current carrying capacity of the electrode sheet is stronger and significant. The parasitic inductance is reduced, the current impact of the chip is smaller, and the chip is safer. Moreover, the structure is simple and the manufacturing cost is low.

Embodiment 5

This embodiment provides another semiconductor electrode monolith. As shown in Fig. 17, a plan view of a semiconductor electrode assembly in which a dot-dash frame is a semiconductor electrode assembly 14 is provided, and the upper electrode sheets P3, P4, P5 are separately drawn from the semiconductor electrode assembly 14 for clarity of illustration. From the illustration, the dashed line indicates the original position of each of the upper electrode sheets on the semiconductor electrode assembly 14. Different from the fourth embodiment, the semiconductor electrode integrated member of the present embodiment includes five electrode sheets, two electrode sheets P1 and P2 at the lower portion, and three electrode sheets P3, P4 and P5 at the upper portion, and the upper and lower electrode sheets are disposed. There are two IGBT chips A1, A2 and two diode chips B1, B2. The lower electrode sheet P1 is electrically connected to the collector of the IGBT chip A1, the emitter of the A2, the cathode of the diode B1, and the anode of the B2, respectively; P2 is electrically connected to the gate of the IGBT chip A2; the gates of the upper electrode sheets P3 and A1 are electrically connected Connected; P4 is electrically connected to the emitter of A1 and the anode of B1; P5 is electrically connected to the collector of A2 and the cathode of B2. Thereby, the semiconductor electrode assembly 14 including two IGBT chips and two diode chips is formed; then, on the semiconductor electrode assembly 14, all the exposed portions except the respective tabs (not shown) are spray-insulated. The adhesive forms a first insulating layer, thereby forming a semiconductor electrode monolith. Then, referring to the above embodiment, a semiconductor cooling device is constructed.

Embodiment 6

Referring to the fourth embodiment, the semiconductor electrode assembly of the present embodiment is as shown in FIG. 18. The upper surface of the lower electrode sheet 551 is respectively provided with an IGBT chip 506 and a diode chip 507, and the lower electrode sheet 551 is electrically conductive. The glue (the conductive glue is not shown) is electrically connected to the collector of the IGBT chip 506, and is electrically connected to the cathode of the diode chip 507 through the conductive paste; the upper left electrode sheet 521 is electrically connected to the boss 502c and the boss respectively. The 502d is bonded together, and the upper right electrode sheet 531 is bonded to the boss 503c by a conductive paste. The boss 502d of the upper left electrode sheet 521 is electrically connected to the emitter of the IGBT chip 506 through a conductive paste, and the bump 502c is electrically connected to the anode of the diode chip 507 through the conductive paste; the boss 503c of the upper right electrode sheet 531 is electrically conductive. The glue is electrically connected to the gate of the IGBT chip 506. The second insulating layer 504 is also required to be separated between the

electrode sheets

521 and 531 on the upper and lower sides of the upper side. Since the spacing between the upper and lower electrode sheets is small and the creepage resistance distance is insufficient, it is necessary to apply a second insulating layer 504 between the upper and lower electrode sheets except for the

chips

506 and 507 to ensure The lower electrode sheets are reliably insulated, and the second insulating layer 504 may be an insulating silica gel. Thereby, the semiconductor electrode assembly is formed.

The above electrical connection or crimping is used instead of the conductive adhesive. The so-called crimping in the present invention means that the electrode sheet, the boss and the chip are pressed by external pressure to make them reliably electrically connected.

Three electrical connections to the outside, namely three

tabs

522, 532, 552, are reserved on both sides of the semiconductor electrode assembly. On the above semiconductor electrode assembly, except for the three

tabs

522, 532, and 552, all the exposed surfaces are coated with a first insulating layer 501b, and the material of the first insulating layer 501b is a coolant immersed insulating material. Thereby, the semiconductor electrode monolith 103 is thereby formed.

In this embodiment, a zigzag fin 513 as shown in FIG. 9-1 is further introduced, and two sets of the above-mentioned semiconductor electrode monolith 103 and three sets of fins 513 are alternately laminated and pressed to form a semiconductor heat dissipating body as shown in FIG. The fin 513 includes an open coolant channel, and the coolant directly contacts the first insulating layer 501b.

The present embodiment includes a housing (not shown) composed of left and right halves (or front and rear halves) for housing a semiconductor heat sink assembly, the tabs of the electrode strip extending outside the housing for external electrical The connection is made between the electrode strip and the outer casing, and the liquid inlet and the liquid outlet are arranged on the outer casing.

In addition to the technical effects shown in the fourth embodiment, the embodiment has a simpler structure, and the coolant is in direct contact with the first insulating layer, thereby avoiding the thermal resistance of the flat tube wall surface and the flat tube wall surface and the first insulation. The thermal resistance of the contact between the layers is higher and the cost is lower. The adhesive base material of the conductive adhesive can preferably be made of silica gel, which has a lower curing temperature and a simpler operation process. Silicone is an elastomer with high temperature resistance, which can effectively adapt to the temperature variation environment of semiconductor chips and prolong the working life of semiconductor cooling devices.

Example 7

Most of the embodiments are similar to the sixth embodiment, and the semiconductor electrode assembly is provided with an insulating layer that is resistant to the coolant to form a semiconductor electrode monolith, and is combined with the serrated fin to form a semiconductor heat dissipating assembly. The difference is that the number of the electrode pieces of the semiconductor electrode assembly is two, that is, the connection electrode of the collector and the emitter is the electrode piece, and the connection electrode of the gate is a conventional wire bond or a binding band ( Ribbon bond).

Alternatively, the semiconductor monolith is made of a semiconductor package similar to that of CN103999213A, and an insulating layer resistant to a coolant is applied to the outside of the body of the semiconductor package. The semiconductor heat sink assembly is then formed with the serrated fins.

In view of the above-described embodiments of the present invention, various changes and modifications may be made by those skilled in the art without departing from the scope of the invention. The technical scope of the present invention is not limited to the contents of the specification, and the technical scope thereof must be determined according to the scope of the claims.

Claims

An electric heating device comprising a PTC electric heating assembly, the PTC electric heating assembly comprising a PTC electrode strip assembly, the PTC electrode strip assembly comprising a positive electrode strip, a PTC heating sheet group, and a negative electrode The PTC heating sheet group is composed of a plurality of PTC heating sheets;

The PTC heating sheet group is disposed between the positive electrode strip and the negative electrode strip;

A side of each of the positive electrode strip and the negative electrode strip is provided with a first insulating layer.
The electric heating device according to claim 1, wherein the positive electrode strip comprises a positive electrode sheet and a positive electrode tab; and the negative electrode strip comprises a negative electrode sheet and a negative electrode tab.
An electric heating device according to claim 1, wherein said PTC electrode strip assembly and said first insulating layer constitute a first integral member; said PTC electric heater comprises a fluid passage, said fluid passage The PTC electric heating assembly is formed to be sequentially spaced apart from the first integral member.
An electric heater according to claim 3, wherein said fluid passage is a fin group, and said fin group is sequentially spaced from said first integral member.
An electric heating device according to claim 4, wherein said fin group is a fin group composed of a plurality of sets of fins; or

The fin group is composed of a side plate, a fin and a seal, and fins are placed between adjacent side plates, and a seal is placed at the bottom end and the top end of the fin.
The electric heater according to claim 3, wherein a first sealing member is disposed between the adjacent two fluid passages, and each of the first sealing members forms a seal on both side edges or the whole of the first integral member. insulation.
An electric heating device according to claim 3, wherein said PTC electric heater further comprises a casing; a cavity is formed inside said casing, said PTC electric heating body assembly being exposed to said Within the cavity, the fluid passage is in communication with the cavity.
An electric heater according to claim 7, wherein a fastening mechanism is provided in the outer casing so that the internal contact of the PTC electric heating unit is tight.
An electric heater according to any one of claims 2-8, wherein said PTC electric heater further comprises a main board; said main board being located in a cavity of said outer casing.
The electric heater according to claim 9, wherein the main board has an inner cavity, and the tab of the electrode strip protrudes from the inner wall of the main board through the inner cavity of the main board, and the cavity of the main board Form a sealed structure.
An electric heater according to claim 1 or 3, wherein the PTC electric heating unit is provided with a clamping mechanism to make the internal contact of the PTC electric heating unit tight.
An electric heating device according to claim 3, wherein said PTC electric heater further comprises a head, and both ends of said PTC electric heating unit are in communication with said head. The inlet and the outlet are provided on the head.
An electric heater according to claim 3, wherein said fluid passage is a closed fluid passage.
An electric heater according to claim 13, wherein said closed fluid passage is a bundle or a flat tube.
An electric heating device according to claim 1, wherein said PTC electrode strip assembly and said first insulating layer disposed on an outer surface of said PTC electrode strip assembly form a first integral member; wherein said first The insulating layer material is an insulating material immersed in the heat-resistant liquid;

The PTC electric heater further includes a fluid passage, the fluid passage and the first integral member are sequentially spaced apart to form a PTC electric heating assembly; wherein at least a portion of the surface of the fluid passage and the first integral member At least part of the outer surface is in direct contact.
An electric heater according to claim 15, wherein said fluid passage is a serrated fin, or a straight fin, or a porous fin.
The electric heater according to claim 1, wherein the first insulating layer material is an insulating material immersed in a heat-resistant liquid.
The electric heater according to claim 17, wherein the first insulating layer is a ceramic insulating sheet, or a polymer material insulating sheet, or an insulating layer or a plating insulating layer.
An electric heater according to claim 2, wherein said first insulating layer surrounds said positive electrode sheet and said negative electrode sheet.
A semiconductor cooling device, comprising: a semiconductor heat sink assembly comprising a plurality of semiconductor electrode monoliths and a plurality of fluid passages; the semiconductor electrode monolith and the fluid passage Arranging alternately, at least part of the surface of the fluid channel is in direct contact with at least part of the outer surface of the semiconductor electrode monolith, and a coolant channel is disposed in the fluid channel;

Wherein the semiconductor electrode monolith is composed of a semiconductor electrode assembly and a first insulating layer disposed outside the semiconductor electrode assembly; wherein the semiconductor electrode assembly includes a semiconductor chip and electrodes disposed on upper and lower sides of the semiconductor chip sheet.
The semiconductor cooling device according to claim 20, wherein a first sealing member is disposed between the adjacent two of said fluid passages, and each of said first sealing members forms a seal around or substantially integrally with said semiconductor electrode unit.
A semiconductor cooling device according to claim 20, wherein said fluid passage is provided with a closed coolant passage.
A semiconductor cooling device according to claim 20, wherein said fluid passage is a bundle or a flat tube.
A semiconductor cooling device according to claim 20, wherein said fluid passage is provided with an open coolant passage.
The semiconductor cooling device according to claim 20, wherein said fluid passage is a corrugated fin, or a zigzag fin, or a fin with a side plate.
The semiconductor cooling device according to claim 20, wherein the outermost sides of the semiconductor heat dissipation assembly are fluid passages.
A semiconductor cooling device according to claim 20, wherein said semiconductor cooling device further comprises a casing for accommodating said semiconductor heat dissipating assembly, said electrode plate and said external electrical connection extending from said The outer casing is sealed from and sealed with the outer casing, and the outer casing is provided with a liquid inlet and a liquid outlet.
The semiconductor cooling device according to claim 20, wherein said first insulating layer is an insulating material that is resistant to coolant immersion.
The semiconductor cooling device according to claim 28, wherein the coolant immersed insulating material is any one of a polymer insulating material, a ceramic insulating material, and a ceramic insulating polymer material. Several.
The semiconductor cooling device according to claim 20, wherein a boss is provided between the electrode sheet and the semiconductor chip.
The semiconductor cooling device according to claim 20, wherein a second insulating layer is further disposed between the electrode sheets at a portion other than the semiconductor chip.
The semiconductor cooling device according to claim 20, wherein the electrical connection between the semiconductor chip and the electrode sheet is conductive adhesive bonding, or soldering, or soldering, or pressure bonding.
The semiconductor cooling device according to claim 20, wherein the number of the electrode sheets of the semiconductor electrode assembly is two or three or five.