CN117650107B - Multi-chip packaging structure and packaging method thereof - Google Patents
Multi-chip packaging structure and packaging method thereof Download PDFInfo
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- CN117650107B CN117650107B CN202410118372.8A CN202410118372A CN117650107B CN 117650107 B CN117650107 B CN 117650107B CN 202410118372 A CN202410118372 A CN 202410118372A CN 117650107 B CN117650107 B CN 117650107B
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 22
- 238000000034 method Methods 0.000 title claims abstract description 14
- 239000000110 cooling liquid Substances 0.000 claims abstract description 112
- 238000002955 isolation Methods 0.000 claims abstract description 78
- 238000007789 sealing Methods 0.000 claims abstract description 77
- 238000001816 cooling Methods 0.000 claims abstract description 13
- 230000007246 mechanism Effects 0.000 claims abstract description 11
- 238000005219 brazing Methods 0.000 claims description 14
- 239000000945 filler Substances 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 239000007788 liquid Substances 0.000 claims description 5
- 150000002739 metals Chemical class 0.000 claims description 5
- 238000004891 communication Methods 0.000 claims description 3
- 238000005086 pumping Methods 0.000 claims description 2
- 238000003303 reheating Methods 0.000 claims description 2
- 230000001276 controlling effect Effects 0.000 claims 1
- 239000012809 cooling fluid Substances 0.000 claims 1
- 230000001105 regulatory effect Effects 0.000 claims 1
- 230000017525 heat dissipation Effects 0.000 abstract description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 238000000926 separation method Methods 0.000 abstract description 2
- 238000010992 reflux Methods 0.000 description 18
- 238000005457 optimization Methods 0.000 description 8
- 230000013011 mating Effects 0.000 description 2
- 239000012466 permeate Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000003750 conditioning effect Effects 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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Abstract
The invention relates to the technical field of chip packaging, and discloses a multi-chip packaging structure and a packaging method thereof, wherein the multi-chip packaging structure comprises an outer shell and a plurality of inner isolation cooling mechanism outer covers; the inner isolation cooling mechanism comprises an inner isolation heat exchange assembly and an inner isolation sealing assembly; the inner isolation sealing assembly comprises an inner sealing cover, a cooling liquid guiding assembly, a cooling liquid backflow assembly, a telescopic safety protection assembly, a cooling liquid suction assembly and a plurality of telescopic outer through pipes, wherein the cooling liquid guiding assembly, the cooling liquid backflow assembly, the telescopic safety protection assembly and the cooling liquid suction assembly are arranged on the inner sealing cover; according to the invention, an isolation cooling mode among multiple chips is adopted, each chip is subjected to separation sealing treatment through the inner isolation heat exchange component and the inner isolation sealing component, the heat dissipation efficiency of each chip can be independently controlled, and after packaging, if the problem of insufficient sealing performance occurs, the position with insufficient sealing performance can be independently subjected to split treatment, the whole body is not required to be disassembled, the reworking cost is effectively reduced, and the production efficiency is improved.
Description
Technical Field
The invention relates to the technical field of chip packaging, in particular to a multi-chip packaging structure and a packaging method thereof.
Background
The chip package structure is a shell for mounting semiconductor integrated circuit chips, plays roles of placing, fixing, sealing, protecting chips and enhancing electrothermal performance, and is also a bridge for communicating the world inside the chips with external circuits, and contacts on the chips are connected to pins of the package shell by wires, and the pins are connected with other devices by wires on a printed board.
The multi-chip integrated package is common at present, but at present, many package modes are stacked, all chips are in a common working environment, the environment temperature of the working space where each chip is located cannot be controlled respectively, and moreover, many package structures are high in integration and high in assembly coordination degree, after the package is welded, if the situation of insufficient sealing performance occurs, all welded parts need to be subjected to heating disconnection treatment again to be separated conveniently, so that the reworking cost is high, and the time consumption is long.
Disclosure of Invention
The present invention is directed to a multi-chip package structure and a method for packaging the same.
The invention provides a multi-chip packaging structure, which comprises an outer shell, a plurality of inner isolation cooling mechanisms arranged in the outer shell, and an outer sealing cover welded at the opening end of the outer shell, wherein a plurality of chips are respectively arranged in the corresponding inner isolation cooling mechanisms;
the inner isolation cooling mechanism comprises an inner isolation heat exchange component and an inner isolation sealing component welded at the opening end of the inner isolation heat exchange component;
the inner isolation heat exchange assembly comprises an inner isolation shell connected to the bottom of the outer shell and a plurality of wavy heat exchange tubes connected to the inner wall of the inner isolation shell;
the inner isolation sealing assembly comprises an inner sealing cover, a cooling liquid guiding assembly, a cooling liquid backflow assembly, a telescopic safety protection assembly, a cooling liquid sucking assembly and a plurality of telescopic outer through pipes, wherein the cooling liquid guiding assembly, the cooling liquid backflow assembly, the telescopic safety protection assembly, the cooling liquid sucking assembly and the plurality of telescopic outer through pipes are arranged on the inner sealing cover, one ends of the plurality of telescopic outer through pipes, which are positioned in the outer shell, are respectively connected with the cooling liquid guiding assembly, the cooling liquid backflow assembly, the telescopic safety protection assembly and the cooling liquid sucking assembly, the input ends of the plurality of wave-shaped heat exchange tubes are respectively connected with the output ends of the cooling liquid guiding assembly, the output ends of the plurality of wave-shaped heat exchange tubes are respectively connected with the input ends of the cooling liquid backflow assembly, the telescopic safety protection assembly covers a chip when being stretched out and contacted with the bottom of the inner isolation shell, and the space between the outer wall of the telescopic safety protection assembly and the inner isolation shell is communicated with one end of the cooling liquid sucking assembly.
As a further optimization scheme of the invention, the cooling liquid guiding-in assembly comprises a plurality of input branch pipes connected with the lower end of the inner sealing cover, a total input pipe connected with the upper end of the inner sealing cover and a plurality of input channels arranged in the inner sealing cover, wherein the plurality of input branch pipes are respectively communicated with the total input pipe through corresponding input channels, and the input branch pipes are connected with the input ends of the wavy heat exchange pipes.
As a further optimization scheme of the invention, the cooling liquid reflux assembly comprises a plurality of reflux branch pipes connected with the lower end of the inner sealing cover, a total reflux pipe connected with the upper end of the inner sealing cover and a plurality of reflux channels arranged in the inner sealing cover, wherein the reflux branch pipes are respectively communicated with the total reflux pipe through corresponding reflux channels, and the reflux branch pipes are connected with the output ends of the wavy heat exchange pipes.
As a further optimization scheme of the invention, the telescopic safety protection assembly comprises a telescopic cover assembly connected with the lower end of the inner sealing cover and an adjusting assembly connected with the upper end of the inner sealing cover, and the adjusting assembly is communicated with the inner space of the telescopic cover assembly.
As a further optimization scheme of the invention, the telescopic covering component comprises a first corrugated pipe, a second corrugated pipe and an annular plate body, wherein the first corrugated pipe and the second corrugated pipe are connected to the lower end of the inner sealing cover, the annular plate body is arranged in parallel with the inner sealing cover, one ends of the first corrugated pipe and the second corrugated pipe are fixedly connected with the annular plate body, a sealing cavity is formed among the inner sealing cover, the first corrugated pipe, the second corrugated pipe and the annular plate body, and the adjusting component is communicated with the sealing cavity.
As a further optimization scheme of the invention, the adjusting component comprises a first guide pipe connected to the upper end of the inner sealing cover, and the first guide pipe is communicated with the sealing cavity.
As a further optimization scheme of the invention, the cooling liquid suction assembly comprises a second guide pipe connected to the upper end of the inner sealing cover, a third corrugated pipe connected to the lower end of the inner sealing cover and a guide hole arranged on the annular plate body, wherein the guide hole is arranged at a position, close to the lower end, of the annular plate body and is communicated with the second guide pipe through the third corrugated pipe, and the third corrugated pipe is positioned in the sealing cavity.
As a further optimization scheme of the invention, the telescopic outer through pipe comprises a hard straight pipe section and a corrugated pipe section, and the corrugated pipe section is connected with a main input pipe or a main return pipe or a first guide pipe or a second guide pipe.
As a further optimization scheme of the invention, the shell is provided with a plurality of first perforations, second perforations, third perforations and fourth perforations, the hard pipe section of the telescopic outer pipe connected with the main input pipe is welded at the first perforations, the hard pipe section of the telescopic outer pipe connected with the main return pipe is welded at the second perforations, the hard pipe section of the telescopic outer pipe connected with the first flow guide pipe is welded at the third perforations, and the hard pipe section of the telescopic outer pipe connected with the second flow guide pipe is welded at the fourth perforations.
A packaging method of a multi-chip packaging structure is used for packaging the multi-chip packaging structure, and comprises the following steps: mounting the chips into the respective inner isolation cases;
assembling an inner sealing cover to an upper end opening of an inner isolation shell, assembling a plurality of telescopic outer through pipes to an outer shell, assembling brazing filler metal between the inner sealing cover and the inner isolation shell, between a cooling liquid guiding-in assembly and an input end of a wavy heat exchange tube, between a cooling liquid backflow assembly and an output end of the wavy heat exchange tube, between the outer shell and the plurality of telescopic outer through pipes, and between the plurality of telescopic outer through pipes and the cooling liquid guiding-in assembly, the cooling liquid backflow assembly, the telescopic safety protection assembly and the cooling liquid suction assembly respectively, then integrally conveying the brazing filler metal into a vacuum brazing furnace for brazing treatment, and taking out the brazing filler metal after setting time;
the method comprises the steps of controlling the telescopic safety protection assembly to extend and cover corresponding chips, connecting the output end of the cooling liquid backflow assembly with the pressure measuring equipment, connecting the input end of the cooling liquid introduction assembly with the cooling liquid conveying equipment, introducing cooling liquid with set pressure into the wavy heat exchange tube, detecting the cooling liquid through the pressure measuring equipment, judging to be qualified products if the pressure is stable, observing whether liquid leakage occurs at the connecting positions of the telescopic outer through tube and the cooling liquid introduction assembly, the cooling liquid backflow assembly, the telescopic safety protection assembly and the cooling liquid suction assembly if the pressure is unstable, disconnecting the cooling liquid conveying equipment and the pressure measuring equipment if the pressure is not stable, extracting residual cooling liquid in the wavy heat exchange tube, extracting the cooling liquid permeated between the telescopic safety protection assembly and the inner isolation shell through the cooling liquid suction assembly, reheating the welding position of the inner sealing cover and the inner isolation shell, separating the inner sealing cover and the inner isolation shell, and carrying out subsequent repairing or reworking procedures.
The invention has the beneficial effects that: according to the invention, an isolation cooling mode among multiple chips is adopted, each chip is subjected to separation sealing treatment through the inner isolation heat exchange component and the inner isolation sealing component, the heat dissipation efficiency of each chip can be independently controlled, and after packaging, if the problem of insufficient sealing performance occurs, the position with insufficient sealing performance can be independently subjected to split treatment, the whole body is not required to be disassembled, the reworking cost is effectively reduced, and the production efficiency is improved.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is an enlarged view of the invention at A in FIG. 1;
FIG. 3 is a schematic view of the structure of the inner isolation seal assembly of the present invention;
FIG. 4 is a mating view of the inner cover and telescoping safety shield assembly of the present invention;
FIG. 5 is a mating view of the telescoping safety shield assembly of the present invention with a coolant suction assembly;
FIG. 6 is a cross-sectional view taken at B-B in FIG. 3 in accordance with the present invention;
fig. 7 is a cross-sectional view of the invention at C-C in fig. 3.
In the figure: 1. an outer housing; 101. a first perforation; 102. a second perforation; 103. a third perforation; 104. a fourth perforation; 21. an internal isolation heat exchange assembly; 2101. an inner isolation housing; 2102. wave-shaped heat exchange tubes; 22. an inner isolation seal assembly; 2201. an inner cover; 2202. an input branch pipe; 2203. a return branch pipe; 2204. a main input pipe; 2205. a total return pipe; 2206. a first bellows; 2207. a second bellows; 2208. an annular plate body; 2209. a first draft tube; 2210. a second flow guide pipe; 2211. a third bellows; 2212. a deflector aperture; 2213. a telescopic outer tube; 3. and (5) an outer sealing cover.
Detailed Description
The subject matter described herein will now be discussed with reference to example embodiments. It should be understood that these embodiments are discussed only to enable those skilled in the art to better understand and thereby practice the subject matter described herein. In addition, features described with respect to some examples may be combined in other examples as well.
As shown in fig. 1-7, a multi-chip package structure comprises an outer shell 1, a plurality of inner isolation cooling mechanisms arranged in the outer shell 1, and an outer sealing cover 3 welded at the opening end of the outer shell 1, wherein a plurality of chips are respectively arranged in the corresponding inner isolation cooling mechanisms;
the inner isolation cooling mechanism comprises an inner isolation heat exchange assembly 21 and an inner isolation sealing assembly 22 welded at the opening end of the inner isolation heat exchange assembly 21;
the inner isolation heat exchange assembly 21 comprises an inner isolation shell 2101 connected to the bottom of the outer shell 1 and a plurality of wavy heat exchange tubes 2102 connected to the inner wall of the inner isolation shell 2101;
the inner isolation sealing assembly 22 comprises an inner sealing cover 2201, a cooling liquid guiding assembly, a cooling liquid backflow assembly, a telescopic safety protection assembly, a cooling liquid sucking assembly and a plurality of telescopic outer through pipes 2213, wherein the cooling liquid guiding assembly, the cooling liquid backflow assembly, the telescopic safety protection assembly, the cooling liquid sucking assembly and the plurality of telescopic outer through pipes 2213 are arranged on the inner sealing cover 2201, one ends of the plurality of telescopic outer through pipes 2213, which are positioned in the outer casing 1, are respectively connected with the cooling liquid guiding assembly, the cooling liquid backflow assembly, the telescopic safety protection assembly and the cooling liquid sucking assembly, the input ends of the plurality of wavy heat exchange pipes 2102 are connected with the output ends of the cooling liquid guiding assembly, the output ends of the plurality of wavy heat exchange pipes 2102 are connected with the input ends of the cooling liquid backflow assembly, when the telescopic safety protection assembly stretches and contacts with the bottom of the inner isolation casing 2101, the telescopic safety protection assembly covers a chip, and a space between the outer wall of the telescopic safety protection assembly and the inner wall of the inner isolation casing 2101 is communicated with one end of the cooling liquid sucking assembly.
When the multi-chip package structure is packaged, the chip is mounted in the corresponding inner isolation housing 2101; assembling an inner sealing cover 2201 to an upper end opening of an inner isolation shell 2101, assembling a plurality of telescopic outer through pipes 2213 to the outer shell 1, assembling brazing filler metals between the inner sealing cover 2201 and the inner isolation shell 2101, between a cooling liquid introducing assembly and an input end of a wavy heat exchange tube 2102, between a cooling liquid backflow assembly and an output end of the wavy heat exchange tube 2102, between the outer shell 1 and the plurality of telescopic outer through pipes 2213, and between the plurality of telescopic outer through pipes 2213 and the cooling liquid introducing assembly, the cooling liquid backflow assembly, the telescopic safety protection assembly and the cooling liquid sucking assembly respectively, then integrally conveying the brazing filler metals into a vacuum brazing furnace for brazing treatment, and taking out the brazing filler metals after a set time;
the telescopic safety protection assembly is controlled to extend and cover corresponding chips, the output end of the cooling liquid reflux assembly is connected with the pressure measuring equipment, the input end of the cooling liquid guide assembly is connected with the cooling liquid conveying equipment, cooling liquid with set pressure is guided into the wavy heat exchange tube 2102, the pressure measuring equipment is used for detecting the cooling liquid, if the pressure is stable, the cooling liquid is judged to be qualified, if the pressure is unstable, the junction between the telescopic outer tube 2213 and the cooling liquid guide assembly, the cooling liquid reflux assembly, the telescopic safety protection assembly and the cooling liquid suction assembly is observed, if the liquid leakage occurs, the cooling liquid conveying equipment and the pressure measuring equipment are disconnected, residual cooling liquid in the wavy heat exchange tube 2102 is pumped out, meanwhile, cooling liquid which permeates between the telescopic safety protection assembly and the inner isolation shell 2101 is pumped out through the cooling liquid suction assembly, then the welding part of the inner sealing cover 2201 and the inner isolation shell 2101 is reheated, the inner sealing cover 2201 and the inner isolation shell 2101 are separated, and a subsequent repairing or reworking procedure is carried out, the heat exchange efficiency of the corresponding inner isolation assembly 21 is controlled independently, and the working environment temperature of different chips is controlled, and the defective cost and reworking procedure is reduced.
The cooling liquid guiding component comprises a plurality of input branch pipes 2202 connected to the lower end of the inner sealing cover 2201, a total input pipe 2204 connected to the upper end of the inner sealing cover 2201, and a plurality of input channels arranged in the inner sealing cover 2201, wherein the plurality of input branch pipes 2202 are respectively communicated with the total input pipe 2204 through corresponding input channels, and the input branch pipes 2202 are connected with the input ends of the wavy heat exchange pipes 2102.
The cooling liquid reflux assembly comprises a plurality of reflux branch pipes 2203 connected to the lower end of the inner cover 2201, a total reflux pipe 2205 connected to the upper end of the inner cover 2201, and a plurality of reflux channels arranged in the inner cover 2201, wherein the reflux branch pipes 2203 are respectively communicated with the total reflux pipe 2205 through corresponding reflux channels, and the reflux branch pipes 2203 are connected with the output ends of the wavy heat exchange pipes 2102.
As described above, when the wavy heat exchange tube 2102 is controlled to exchange heat with the heat in the corresponding inner insulation housing 2101, the cooling liquid with a set flow rate is input through the total input tube 2204, the cooling liquid is input from the total input tube 2204, flows through the input channel and the input branch tube 2202 and then flows into the input end of the wavy heat exchange tube 2102, when the cooling liquid flows through the oshen heat exchange tube, the heat emitted by the chip during operation can be exchanged, the cooling liquid after heat absorption flows out from the output end of the wavy heat exchange tube 2102, flows through the backflow branch tube 2203 and the backflow channel in sequence and is collected to the total backflow tube 2205, and is discharged from the total backflow tube 2205, so as to form a continuous heat dissipation effect.
The telescopic safety protection assembly comprises a telescopic cover assembly connected to the lower end of the inner cover 2201 and an adjusting assembly connected to the upper end of the inner cover 2201, wherein the adjusting assembly is communicated with the inner space of the telescopic cover assembly.
The telescopic cover assembly comprises a first corrugated pipe 2206 and a second corrugated pipe 2207 which are connected to the lower end of an inner cover 2201 and an annular plate body 2208 which is arranged in parallel with the inner cover 2201, one ends of the first corrugated pipe 2206 and the second corrugated pipe 2207 are fixedly connected with the annular plate body 2208, a sealing chamber is formed among the inner cover 2201, the first corrugated pipe 2206, the second corrugated pipe 2207 and the annular plate body 2208, and the adjusting assembly is communicated with the sealing chamber.
The conditioning assembly includes a first draft tube 2209 attached to the upper end of the inner cover 2201, the first draft tube 2209 in communication with the sealed chamber.
It should be noted that, after the encapsulation is finished, in order to detect the sealing performance of the cooling liquid flow path, a covering type sealing protection needs to be performed on the chip in the inner isolation casing 2101, so that a region with insufficient sealing performance appears in the cooling liquid flow path, and the cooling liquid is largely permeated into the inner isolation casing 2101, so that the influence on the chip is caused, therefore, when the above test is performed, a liquid with a set amount and a set pressure needs to be introduced into a sealing cavity formed between the inner sealing cover 2201, the first corrugated pipe 2206, the second corrugated pipe 2207 and the annular plate 2208 through the first honeycomb duct 2209, so that the annular plate 2208 is pushed to the chip until the annular plate 2208 is tightly contacted with the bottom of the inner isolation casing 2101, and at this time, the chip is covered, and in a sealing space formed between the inner sealing cover 2201, the second corrugated pipe 2207 and the bottom of the inner isolation casing 2101, at this time, the leaked cooling liquid can be effectively ensured not to flow into the region where the chip is located.
The cooling liquid pumping assembly includes a second guiding tube 2210 connected to the upper end of the inner cover 2201, a third corrugated tube 2211 connected to the lower end of the inner cover 2201, and a guiding hole 2212 arranged on the annular plate body 2208, wherein the guiding hole 2212 is arranged at a position of the annular plate body 2208 near the lower end, the guiding hole 2212 is communicated with the second guiding tube 2210 through the third corrugated tube 2211, and the third corrugated tube 2211 is located in the sealed cavity.
When the sealing performance is insufficient, that is, the cooling liquid is allowed to remain only in the area between the outside of the first bellows 2206 and the inner wall of the inner housing 2101 after flowing into the inner housing 2101, the second flow guide tube 2210 may be connected to the second flow guide tube 2210 via the external pump body, and negative pressure may be formed in the second flow guide tube 2210, the third bellows 2211 and the flow guide hole 2212, so that the cooling liquid existing in the area between the outside of the first bellows 2206 and the inner wall of the inner housing 2101 is pumped out, and the flow guide hole 2212 is located near the bottom of the inner housing 2101, so that the cooling liquid may be basically pumped out completely, even if a part remains, the chip may not be greatly affected, and at this time, the reworking process may be performed.
The telescopic outer tube 2213 comprises a hard straight tube section and a corrugated tube section, and the corrugated tube section is connected with the main input tube 2204 or the main return tube 2205 or the first guide tube 2209 or the second guide tube 2210.
The casing 1 is provided with a plurality of first perforations 101, second perforations 102, third perforations 103 and fourth perforations 104, the hard pipe section of the telescopic outer pipe 2213 connected with the main input pipe 2204 is welded at the first perforations 101, the hard pipe section of the telescopic outer pipe 2213 connected with the main return pipe 2205 is welded at the second perforations 102, the hard pipe section of the telescopic outer pipe 2213 connected with the first flow guide pipe 2209 is welded at the third perforations 103, and the hard pipe section of the telescopic outer pipe 2213 connected with the second flow guide pipe 2210 is welded at the fourth perforations 104.
It should be noted that, when the above-mentioned fault that the cooling liquid permeates into the inner isolation housing 2101 occurs, the inner cover 2201 needs to be detached from the opening of the inner isolation housing 2101, and after the inner cover 2201 is separated from the inner isolation housing 2101, the corrugated pipe section of the flexible and telescopic outer pipe 2213 can separate the inner cover 2201 from the inner isolation housing 2101 in the initial matching state without separating the whole flexible outer pipe 2213 from the outer housing 1 and the corresponding pipe on the inner cover 2201, and after the treatment, the inner cover 2201 can be conveniently reinstalled to the assembling state, thereby not only reducing the rework cost, but also greatly improving the machining efficiency.
The present embodiment has been described above, but the present embodiment is not limited to the above-described specific embodiment, which is merely illustrative and not restrictive, and many forms can be made by those of ordinary skill in the art in light of the present embodiment, which fall within the protection of the present embodiment.
Claims (10)
1. The multi-chip packaging structure is characterized by comprising an outer shell (1), a plurality of inner isolation cooling mechanisms arranged in the outer shell (1) and an outer sealing cover (3) welded at the opening end of the outer shell (1), wherein a plurality of chips are respectively arranged in the corresponding inner isolation cooling mechanisms;
the inner isolation cooling mechanism comprises an inner isolation heat exchange assembly (21) and an inner isolation sealing assembly (22) welded at the opening end of the inner isolation heat exchange assembly (21);
the inner isolation heat exchange assembly (21) comprises an inner isolation shell (2101) connected to the bottom of the outer shell (1), and a plurality of wavy heat exchange tubes (2102) connected to the inner wall of the inner isolation shell (2101);
the inner isolation sealing assembly (22) comprises an inner sealing cover (2201), a cooling liquid guiding assembly, a cooling liquid backflow assembly, a telescopic safety protection assembly, a cooling liquid sucking assembly and a plurality of telescopic outer through pipes (2213), wherein the cooling liquid guiding assembly is arranged on the inner sealing cover (2201), the plurality of telescopic outer through pipes (2213) penetrate through the outer shell (1), one ends of the plurality of telescopic outer through pipes (2213) located in the outer shell (1) are respectively connected with the cooling liquid guiding assembly, the cooling liquid backflow assembly, the telescopic safety protection assembly and the cooling liquid sucking assembly, the input ends of the plurality of wave-shaped heat exchange pipes (2102) are connected with the output ends of the cooling liquid guiding assembly, the output ends of the plurality of wave-shaped heat exchange pipes (2102) are connected with the input ends of the cooling liquid backflow assembly, and when the telescopic safety protection assembly stretches and contacts with the bottom of the inner isolation shell (2101), and the space between the outer wall of the telescopic safety protection assembly and the inner wall of the inner isolation shell (2101) is communicated with one end of the cooling liquid sucking assembly.
2. The multi-chip package structure according to claim 1, wherein the cooling liquid introducing assembly comprises a plurality of input branch pipes (2202) connected to the lower end of the inner cover (2201), a total input pipe (2204) connected to the upper end of the inner cover (2201), and a plurality of input channels provided inside the inner cover (2201), the plurality of input branch pipes (2202) are respectively communicated with the total input pipe (2204) through corresponding input channels, and the input branch pipes (2202) are connected with the input ends of the wave-shaped heat exchange pipes (2102).
3. The multi-chip package structure according to claim 2, wherein the cooling liquid return assembly comprises a plurality of return branch pipes (2203) connected to the lower end of the inner cover (2201), a total return pipe (2205) connected to the upper end of the inner cover (2201), and a plurality of return channels arranged in the inner cover (2201), the plurality of return branch pipes (2203) are respectively communicated with the total return pipe (2205) through corresponding return channels, and the return branch pipes (2203) are connected with the output ends of the wavy heat exchange pipes (2102).
4. A multi-chip package structure according to claim 3, wherein the retractable safety protection assembly comprises a retractable cover assembly connected to a lower end of the inner cover (2201) and an adjusting assembly connected to an upper end of the inner cover (2201), and the adjusting assembly is in communication with an inner space of the retractable cover assembly.
5. The multi-chip package structure of claim 4, wherein the telescopic cover assembly comprises a first bellows (2206) and a second bellows (2207) connected to the lower end of the inner cover (2201) and an annular plate body (2208) parallel to the inner cover (2201), one ends of the first bellows (2206) and the second bellows (2207) are fixedly connected with the annular plate body (2208), a sealing chamber is formed between the inner cover (2201), the first bellows (2206), the second bellows (2207) and the annular plate body (2208), and the adjusting assembly is communicated with the sealing chamber.
6. The multi-chip package structure of claim 5, wherein the regulating assembly comprises a first flow guide tube (2209) connected to an upper end of the inner cover (2201), and the first flow guide tube (2209) is in communication with the sealing chamber.
7. The multi-chip package structure of claim 6, wherein the cooling fluid pumping assembly comprises a second guiding tube (2210) connected to the upper end of the inner cover (2201), a third corrugated tube (2211) connected to the lower end of the inner cover (2201), and a guiding hole (2212) arranged on the annular plate body (2208), the guiding hole (2212) is arranged at a position, close to the lower end, of the annular plate body (2208), the guiding hole (2212) is communicated with the second guiding tube (2210) through the third corrugated tube (2211), and the third corrugated tube (2211) is arranged in the sealing cavity.
8. The multi-chip package structure according to claim 7, wherein the telescopic outer tube (2213) comprises a rigid straight tube section and a corrugated tube section, and the corrugated tube section is connected to a main input tube (2204) or a main return tube (2205) or a first guide tube (2209) or a second guide tube (2210).
9. The multi-chip package structure according to claim 8, wherein the outer housing (1) is provided with a plurality of first through holes (101), second through holes (102), third through holes (103) and fourth through holes (104), the hard pipe section of the telescopic outer pipe (2213) connected with the main input pipe (2204) is welded at the first through holes (101), the hard pipe section of the telescopic outer pipe (2213) connected with the main return pipe (2205) is welded at the second through holes (102), the hard pipe section of the telescopic outer pipe (2213) connected with the first guide pipe (2209) is welded at the third through holes (103), and the hard pipe section of the telescopic outer pipe (2213) connected with the second guide pipe (2210) is welded at the fourth through holes (104).
10. A packaging method for packaging the multi-chip package structure according to any one of claims 1 to 9, comprising the steps of: mounting the chips into respective inner isolation cases (2101);
assembling an inner sealing cover (2201) to an upper end opening of an inner isolation shell (2101), then assembling a plurality of telescopic outer through pipes (2213) on the outer shell (1), and assembling brazing filler metals between the inner sealing cover (2201) and the inner isolation shell (2101), between a cooling liquid introducing assembly and an input end of a wave-shaped heat exchange tube (2102), between a cooling liquid backflow assembly and an output end of the wave-shaped heat exchange tube (2102), between the outer shell (1) and the plurality of telescopic outer through pipes (2213), and between the plurality of telescopic outer through pipes (2213) and the cooling liquid introducing assembly, the cooling liquid backflow assembly, the telescopic safety protection assembly and the cooling liquid suction assembly respectively, then integrally conveying the brazing filler metals into a vacuum brazing furnace for brazing treatment, and taking out after setting time;
the method comprises the steps of controlling the telescopic safety protection assembly to extend and cover corresponding chips, connecting the output end of the cooling liquid backflow assembly with pressure measuring equipment, connecting the input end of the cooling liquid introduction assembly with the cooling liquid conveying equipment, introducing cooling liquid with set pressure into the wavy heat exchange tube (2102), detecting the cooling liquid through the pressure measuring equipment, judging to be qualified products if the pressure is stable, observing whether liquid leakage occurs at the joint between the telescopic outer tube (2213) and the cooling liquid introduction assembly, the cooling liquid backflow assembly, the telescopic safety protection assembly and the cooling liquid suction assembly or not if the liquid leakage does not exist, disconnecting the cooling liquid conveying equipment and the pressure measuring equipment, extracting residual cooling liquid in the wavy heat exchange tube (2102), extracting the cooling liquid permeated between the telescopic safety protection assembly and the inner isolation shell (2101) through the cooling liquid suction assembly, and then reheating the welded part of the inner sealing cover (2201) and the inner isolation shell (2101) and separating the inner sealing cover (2201) from the inner isolation shell (2101), and carrying out subsequent repair or reworking procedures.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410118372.8A CN117650107B (en) | 2024-01-29 | 2024-01-29 | Multi-chip packaging structure and packaging method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4450505A (en) * | 1982-06-09 | 1984-05-22 | Sperry Corporation | Apparatus for cooling integrated circuit chips |
| EP0453675A1 (en) * | 1990-04-27 | 1991-10-30 | Digital Equipment Corporation | Independent cooling chamber for multichip unit |
| WO2016095804A1 (en) * | 2014-12-16 | 2016-06-23 | 宋正贤 | Electrical heat-generating device |
| CN113964095A (en) * | 2020-07-20 | 2022-01-21 | 新奥科技发展有限公司 | Protection system, protection method and control method of drilling chip |
| CN219937042U (en) * | 2023-06-21 | 2023-10-31 | 南通优睿半导体有限公司 | Multi-chip packaging substrate |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7139172B2 (en) * | 2004-07-01 | 2006-11-21 | International Business Machines Corporation | Apparatus and methods for microchannel cooling of semiconductor integrated circuit packages |
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4450505A (en) * | 1982-06-09 | 1984-05-22 | Sperry Corporation | Apparatus for cooling integrated circuit chips |
| EP0453675A1 (en) * | 1990-04-27 | 1991-10-30 | Digital Equipment Corporation | Independent cooling chamber for multichip unit |
| WO2016095804A1 (en) * | 2014-12-16 | 2016-06-23 | 宋正贤 | Electrical heat-generating device |
| CN113964095A (en) * | 2020-07-20 | 2022-01-21 | 新奥科技发展有限公司 | Protection system, protection method and control method of drilling chip |
| CN219937042U (en) * | 2023-06-21 | 2023-10-31 | 南通优睿半导体有限公司 | Multi-chip packaging substrate |
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| CN117650107A (en) | 2024-03-05 |
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