CN107113919A - Electric heating device - Google Patents
Electric heating device Download PDFInfo
- Publication number
- CN107113919A CN107113919A CN201580044496.5A CN201580044496A CN107113919A CN 107113919 A CN107113919 A CN 107113919A CN 201580044496 A CN201580044496 A CN 201580044496A CN 107113919 A CN107113919 A CN 107113919A
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- ptc
- electrode
- fluid channel
- heat
- producing machine
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- 238000005485 electric heating Methods 0.000 title claims abstract description 60
- 239000004065 semiconductor Substances 0.000 claims abstract description 64
- 238000001816 cooling Methods 0.000 claims abstract description 37
- 239000012530 fluid Substances 0.000 claims description 107
- 239000007788 liquid Substances 0.000 claims description 51
- 230000005611 electricity Effects 0.000 claims description 27
- 238000007789 sealing Methods 0.000 claims description 23
- 206010037660 Pyrexia Diseases 0.000 claims description 22
- 239000000463 material Substances 0.000 claims description 21
- 239000002826 coolant Substances 0.000 claims description 17
- 238000009413 insulation Methods 0.000 claims description 16
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- 238000010586 diagram Methods 0.000 description 15
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 11
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- 229910002027 silica gel Inorganic materials 0.000 description 11
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- 230000000694 effects Effects 0.000 description 9
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24H—FLUID HEATERS, e.g. WATER OR AIR HEATERS, HAVING HEAT-GENERATING MEANS, e.g. HEAT PUMPS, IN GENERAL
- F24H1/00—Water heaters, e.g. boilers, continuous-flow heaters or water-storage heaters
- F24H1/10—Continuous-flow heaters, i.e. heaters in which heat is generated only while the water is flowing, e.g. with direct contact of the water with the heating medium
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24H—FLUID HEATERS, e.g. WATER OR AIR HEATERS, HAVING HEAT-GENERATING MEANS, e.g. HEAT PUMPS, IN GENERAL
- F24H9/00—Details
- F24H9/18—Arrangement or mounting of grates or heating means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
- H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Combustion & Propulsion (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- Materials Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Resistance Heating (AREA)
Abstract
Can be electric heater unit or semiconductor cooling device, the present invention is using sandwiched type structure arrangement, and heat transfer efficiency is high, power density is big, compact conformation, small volume, and cost is low, and assembles simple the present invention relates to electric heating device.
Description
The present invention relates to electric heating devices, especially liquid-type PTC electricity heat-producing machine and semiconductor cooling device.
Existing electric heating uses metal base, then is being inserted into PTC electric heating sheets above.Two defects are primarily present, disadvantage is first is that increase heat transfer intermediate link, and thermal resistance increases, and the thermal efficiency is low, power density is small；Disadvantage increases cost second is that increase sub- part.
The prior art is layered on top of each other using multiple flat heat exchange tubes and ptc heater, inlet head and outlet heads is provided in flat heat exchange tubes, and fasten to reduce thermal contact resistance with heat exchange pressing component.The structure compare before hot-water heating PTC electric heater more compact structure, heat exchange efficiency increases；But its inlet head and outlet heads also occupy the space of comparable no heat exchange effect, and have to effectively work with special heat exchange pressing component.
Summary of the invention
The technical problem to be solved by the present invention is overcome the deficiencies in the prior art, from one more preferably angle with the structure of more simple and effective provide a kind of electric heat-producing machine.
The technical solution adopted by the present invention to solve the technical problems is: a kind of electricity heat-producing machine, including PTC electric heating group body, the PTC electric heating group body includes PTC electrode bar assembly, the PTC electrode bar assembly includes positive electrode item, PTC fever tablet group, negative electrode item, and the PTC fever tablet group is made of several PTC fever tablets.
Wherein, the positive electrode item includes electrode film, positive pole ear.
Wherein, the negative electrode item includes negative electrode plate, negative lug.
Wherein, the PTC fever tablet group is arranged between positive electrode item and negative electrode item, is more preferably arranged between electrode film and negative electrode plate.
Wherein, respectively external side is equipped with the first insulating layer for the electrode film and negative electrode plate.Alternatively, the PTC electrode strip module outer surface is equipped with the first insulating layer, all outer surfaces of the preferably described PTC electrode strip component external in addition to electrode tabs are equipped with the first insulating layer.
The so-called PTC fever tablet of the present invention, can also claim PTC element, including PTC heat generating ceramic piece, and/or high molecular PTC fever tablet.
The so-called electrode tabs of the present invention, the general designation with extraneous electrical connections as on electrode strip or electrode slice.
Wherein, the PTC fever tablet in PTC electrode bar assembly is connect preferably by way of gluing with positive and negative electrode piece；Certainly, the mode that compression can also be used connects.
Further, the PTC electrode bar assembly, the first insulating layer form the first single piece；The PTC electricity heat-producing machine includes fluid channel, and the fluid channel and first single piece are successively spaced setting and form PTC electric heating group body.Wherein, the fluid channel is also possible to partition (or separator channels), and the fluid channel or partition include: various fins, fins set, flat tube etc..
Further, the outermost of the PTC electric heating group body is preferably fluid channel.
Further, the fluid channel is fins set, and the fins set and the first single piece are successively spaced setting.
Further, the fins set is the fins set being made of multiple groups fin；Alternatively, the fins set is made of side plate, fin, strip of paper used for sealing, fin is placed between adjacent both side plate, strip of paper used for sealing is placed on fin bottom end and top.
Further, first seal is respectively set between adjacent two fluid channel, each first seal is to the first unitarily formed both sides of the edge or sealed insulation is integrally formed.In this way, the effect of isolation will be sealed by playing between heat exchanging liquid and the first single piece (or PTC electrode bar assembly).
Further, the PTC electricity heat-producing machine further includes mainboard, which has internal cavity, and the tab of electrode strip is stretched out on mainboard by internal cavity, and forms sealing structure between mainboard inner wall.
Further, the PTC electric heating group body is arranged in the internal cavity of mainboard, and sealing structure is formed between the inner wall of mainboard；Alternatively, first single piece is arranged in the internal cavity of mainboard, and sealing structure is formed between the inner wall of mainboard；Alternatively, the tab of electrode strip is stretched out on mainboard by internal cavity, sealing structure is formed between tab and the inner wall of mainboard.
Further, the electric heat-producing machine further includes shell, and the interior of shell forms cavity；The mainboard and/or the PTC electric heating group body are located in the cavity of the shell.
In an advantageous embodiment, the PTC electric heating group body is exposed in the cavity of the shell, and the fluid channel is connected to the cavity.In this way, PTC electric heating group body can be directly soaked in fluid, when fluid enters into and through cavity, fluid is directly entered in the fluid channel of PTC electric heating group body by compact cavity, and effectively exchanging heat, volume accounting is bigger, and overall structure is more compact.Further, the cavity of shell is separated into two spaces by the mainboard, is located at the first space by the tab that mainboard stretches out, PTC electric heating assembly other parts are exposed to second space, and second space passes through for fluid.
Certainly, retention mechanism also can be set in shell, so that PTC electric heating group body interior contact is close.The retention mechanism includes a variety of, fastening spring or bolt and nut connection fastening between enclosure interior transverse direction.
Alternatively, it is further, it is provided with clamp system on PTC electric heating group body, so that PTC electric heating group body interior contact is close.
The preferred plastic housing of shell, and preferably using the plastic housing for surrounding form up and down.
Wherein, the mainboard can be single radial cut slot form, be also possible to more open slot forms.
Alternatively, further, the PTC electricity heat-producing machine further includes end socket, and the both ends of the PTC electric heating group body are connected to the end socket, is provided with inlet and liquid outlet on the end socket.Connection between the both ends and the end socket of the PTC electric heating group body is preferably by the way of gluing.The end socket is used to pass in and out the liquid collecting or liquid separation of fluid, and the end socket can be header used in similar parallel-flow heat exchanger, or can it is similar be end socket used in plate-fin heat exchanger etc..
Further, the fluid channel uses closed type fluid channel.So-called closed type fluid channel refers to, be perpendicular to four sides (being parallel to four faces of the fluid channel of liquid flow direction) on the section of the fluid channel of liquid flow direction it is closed (interconnected in other words), be not directly contacted between fluid and the first single piece.
Further, the closed type fluid channel is plate beam or flat tube.The plate beam is made of side plate, fin, strip of paper used for sealing, and fin is placed between adjacent both side plate, and strip of paper used for sealing is placed on fin bottom end and top；The plate beam is also a kind of fins set.The flat tube can be single hole or porous；It can be extrusion forming, be also possible to welding fabrication, flat tube material can be metal, and it is nonmetallic to be also possible to plastics etc..
Alternatively, further, the fluid channel uses open fluid channel.So-called open fluid channel is closed to be not all perpendicular to four sides on the section of the fluid channel of liquid flow direction, there is the part directly contacted between fluid and the first single piece, for example fluid is directly contacted with the first unitarily formed first insulating layer.
The open fluid channel includes following several forms: the fluid channel is surrounded and is formed by two adjacent first single pieces and the second seal being set between two adjacent first single pieces；It is formed alternatively, the fluid channel is surrounded by the main board between two adjacent first single pieces and two adjacent first single pieces；Alternatively, the fluid channel is surrounded and is formed by the first single piece, side plate and the second seal being set between the first single piece and side plate；Alternatively, the fluid channel is surrounded and is formed by the first single piece, shell and the second seal being set between the first single piece and shell.
The second seal, effect is to prevent heat exchanging liquid from flowing to except mainboard or shell from the up and down direction between adjacent two first single piece for sealing the gap between adjacent two first single piece.If mainboard is more open slot forms, each open slot is inserted into the first single piece, and is full of and is sealed by the first single piece, then can be omitted second seal in this way.
The side plate, a part positioned at the outermost of PTC electric heating group body, as two sides fluid channel.
Further, the second seal is respectively arranged in the upper and lower part that the top between two adjacent first single pieces is arranged between a second seal or two adjacent first single pieces.
Further, first insulating layer material is the insulating materials that resistance to heat exchanging liquid impregnates.This material has the insulation silica gel of resistance to heat exchanging liquid immersion, the Kapton for being externally coated with epoxy resin, etc..The insulating materials that so-called resistance to heat exchanging liquid impregnates refers to that the insulating materials is immersed in heat exchanging liquid and is still able to maintain good insulation function.If resistance to heat exchanging liquid is selected to impregnate
The insulating materials then also can be selected as first seal as the first insulating layer material in insulating materials.
Further, several fins are provided in the open fluid channel, with enhanced heat exchange performance.The fin can be various forms of fins, such as light straight fins, saw tooth fin, perforated fin etc..Wherein, preferred embodiment comprising the PTC electric heating group body in following electric heat-producing machine: the first single piece is formed by the insulating layer that PTC electrode bar assembly and the resistance to heat exchanging liquid being arranged in outside PTC electrode bar assembly impregnate, and PTC electric heating group body is successively spaced stacking by the first single piece and fin and is formed.First single piece and fin are combined with each other by the preferred embodiment, on the one hand fin has played tissue flow field and improved the outstanding role of heat transfer effect, have on the other hand played the first unitarily formed effect of separation and support, increase the mechanical strength of entire electric heat-producing machine.
Further, first insulating layer is ceramic insulation piece or high molecular material insulating trip or coating (such as spraying, dip-coating) insulating layer or plating insulating layer, alternatively, the electrode film and the external of negative electrode plate wrap up the first insulating layer.
Further, the first insulating layer material selected from insulating polymeric material, ceramic insulating material and doped with ceramics polymer composite insulating material in any one or a few.
Further, the first insulating layer material selected from silica gel, organic siliconresin, inorganic silicon, polyimides, Teflon, polyester-imide, epoxy resin, esters of acrylic acid adhesive, acrylic tackifier, benzoxazine, doped with ceramics silica gel in any one or a few.
Further, the method that first insulating layer is arranged is selected from one of coating, smooth and wrapped (or package) or several combinations.
Further, the coating method that first insulating layer is arranged is selected from one of spraying, brushing, roller coating, deposition, dip-coating, dispensing, screen printing, roller coating, electrophoresis and blade coating or several combinations.
Further, the first seal is electric insulating sealant or electro-insulating rubber circle or welded seal part.
Further, the positive pole ear is located at the top of electrode film, and the negative lug is located at the top of negative electrode plate；The heat exchanging liquid flow direction of the fluid channel is for left side to the right side of PTC electricity heat-producing machine or by right side to left side.
Heat exchanging liquid used in PTC electricity heat-producing machine of the present invention preferably uses water base coolant liquid, such as pure water or common anti-icing fluid, and wherein the host component of anti-icing fluid is about 50% ethylene glycol+about 50% water.
More than, it refers both to not include special inlet head and outlet heads on closed type fluid channel and open fluid channel.The inlet and outlet of PTC electric heating group body upper fluid is in the two sides of fluid channel.
In addition, the present invention also provides a kind of PTC electricity heat-producing machine core, the core is made of the first single piece, plate beam and first seal.First single piece and the alternately laminated setting of plate beam, and first seal is set between adjacent two plates beam, first seal is sealed surrounding of first single piece in addition to tab.
Certainly, it can further expand, the present invention also provides a kind of PTC electricity heat-producing machine core, the core includes the first single piece, fluid channel.The PTC electricity heat-producing machine core of first single piece sandwich structure similar with the alternately laminated setting formation of fluid channel.
The present invention also provides a kind of semiconductor cooling device, the semiconductor cooling device includes semiconductor heat-dissipating group body, and the semiconductor heat-dissipating group body includes several semi-conducting electrode single pieces and several fluid channels；The semi-conducting electrode single piece is alternateed with the fluid channel to be stacked, and at least partly surface of the fluid channel is directly contacted with the unitarily formed at least partly outer surface of the semi-conducting electrode, and cooling passage is equipped in the fluid channel.
Wherein, the fluid channel in above-mentioned semiconductor cooling device is alternatively referred to as partition or separator channels.
Wherein, the semi-conducting electrode single piece is made of semi-conducting electrode component and the first insulating layer being set on the outside of the semi-conducting electrode component；Wherein, the semi-conducting electrode component includes semiconductor chip and the electrode slice for being set to the semiconductor chip or more two sides.The electrode slice is the electrode of sheet.Including following situation: electrode slice quantity is 2, i.e., the connection electrode of collector and emitter is electrode slice, and the connection electrode of grid is traditional bonding binding line (wire bond)；Alternatively, electrode slice quantity is 3 or 5, i.e. all connection electrodes of collector, emitter and grid are electrode slice.
Wherein, the semiconductor core can be igbt chip and/or diode chip for backlight unit.
Further, first seal is set between adjacent two fluid channels, and each first seal is to the unitarily formed surrounding of the semi-conducting electrode or sealing is integrally formed.
Further, the fluid channel is closed cooling passage.
Further, the fluid channel is plate beam or flat tube.
Further, the fluid channel is open cooling passage.
Further, the fluid channel is corrugated fin or serrated fin or the fin with side plate.
Further, the outermost two sides of the semiconductor heat-dissipating group body are fluid channel.
Further, the semiconductor cooling device further includes shell, the shell is for accommodating the semiconductor heat-dissipating group body, the electrode slice and the electrical connection section (such as tab) in the external world are extended except the shell and are sealed between the shell, are provided with inlet and liquid outlet on the shell.
Further, first insulating layer is the insulating materials that resistance to coolant liquid is impregnated.
Further, the insulating materials that the resistance to coolant liquid is impregnated is insulating polymeric material, ceramic insulating material and doped with any one or a few in the insulating polymeric material of ceramics.
Further, boss is provided between the electrode slice and the semiconductor chip.The boss is referred to as pad level, for increasing the spacing of two sides electrode slice.
Further, second insulating layer is additionally provided at the position in addition to the semiconductor chip between the electrode slice.
Further, the semiconductor chip is conductive adhesive or soldering or soldering with the electric connection mode of the electrode slice or crimps.
Further, the mode that the first insulating layer is arranged is spraying or dip-coating.
Further, the electrode slice material is aluminium alloy or stainless steel or copper；It is wherein preferably stainless steel.
Further, the electrode slice quantity of the semi-conducting electrode component is 2 or 3 or 5.
The beneficial effects of the present invention are: the present invention is arranged using sandwiched type structure, heat transfer efficiency is high, power density is big, compact-sized, small in size, at low cost, and assembles simple.
The following further describes the present invention with reference to the drawings.
Fig. 1 is the first unitarily formed structural schematic diagram；
Fig. 2 is the first single piece and the alternately stacked structural schematic diagram of fluid channel；
Fig. 3 is the cross section schematic diagram of the first insulating layer of external package of electrode film and negative electrode plate；
Fig. 4 is the partial enlarged view in Fig. 3 at A；
Fig. 5 is the structural schematic diagram of PTC electric heating group body；
Fig. 6-1 is the structural schematic diagram of single radial cut slot mainboard；
Fig. 6-2 is the structural schematic diagram of more open slot mainboards；
Fig. 7 is the schematic diagram of PTC electric heating group body installation in the motherboard；
Fig. 8-1 is a kind of structural schematic diagram (explosive view) of closed type fluid channel (plate beam)；
Fig. 8-2 is the structural schematic diagram of another closed type fluid channel (flat tube)；
Fig. 9-1 is the structural schematic diagram of the open fluid channel of saw tooth fin form；
Fig. 9-2 gives a kind of open fluid channel of plain fin form, and including the plate up and down that parallel riser is connected with riser both ends, plate is directly contacted with the first single piece, and fluid channel is formed between riser；
Figure 10-1,10-2 be include open fluid channel PTC electric heating group body side structure schematic diagram；
Figure 11 is the PTC electricity heat-producing machine schematic diagram for including open fluid channel；
Figure 12 is the front view and side view of end socket；
Figure 13 semi-conducting electrode component top view；
Figure 14 semi-conducting electrode single piece top view；
Semi-conducting electrode single piece A-A diagrammatic cross-section in Figure 15 Figure 14；
Figure 16 semiconductor heat-dissipating group body diagrammatic cross-section；
The plane for the unitarily formed semi-conducting electrode component of another semi-conducting electrode that Figure 17 embodiment five provides breaks up figure；
Semi-conducting electrode single piece diagrammatic cross-section in Figure 18 embodiment six；
Semiconductor heat-dissipating group body schematic diagram in Figure 19 embodiment six.
Presently in connection with attached drawing, the present invention is further illustrated.These attached drawings are simplified schematic diagram, and the basic structure of the invention will be illustrated schematically only, therefore it only shows the composition relevant to the invention.
Embodiment one
As shown in the picture, a kind of electric heat-producing machine, including PTC electric heating group body, PTC electric heating group body include PTC electrode bar assembly, PTC electrode bar assembly includes positive electrode item 1, PTC fever tablet group, negative electrode item 2, and PTC fever tablet group is made of several PTC fever tablets 3.Wherein, PTC fever tablet 3 is preferably PTC heat generating ceramic piece.
Positive electrode item 1 includes electrode film, positive pole ear；Negative electrode item 2 includes negative electrode plate, negative lug；The 3 groups of settings of PTC fever tablet are between electrode film and negative electrode plate.Positive pole ear is located at the top of the left side of electrode film, and negative lug is located at the top of the right edge of negative electrode plate.Any position in electrode film or negative electrode plate top can be set in positive pole ear, negative lug according to actual needs.Preferably, PTC fever tablet group can be adhered between positive and negative electrode piece using silica gel.
PTC electrode bar assembly, the first insulating layer 4 form the first single piece 8；Respectively external side is equipped with the first insulating layer 4 for first single piece 8 as shown in Figure 1, electrode film and negative electrode plate.First insulating layer 4 is ceramic insulation piece or insulating polymeric material or spray applied insulation or plating insulating layer；Alternatively, the external of the first single piece 8 as shown in Figure 3, Figure 4, electrode film and negative electrode plate wraps up the first insulating layer 4.
PTC electricity heat-producing machine includes fluid channel 5, as shown in figure 5, fluid channel 5 and the first single piece 8, which are successively spaced setting, forms PTC electric heating group body, the outermost of PTC electric heating group body is fluid channel 5.Fluid channel 5 is internal at work heat exchanging liquid stream process, and the heat exchanging liquid in heat convection body channel 5 generated by PTC electrode strip component operation is heated.
As shown in figure 5, first seal 6 is respectively set between adjacent two fluid channel 5, each first seal 6 forms sealed insulation to the both sides of the edge of the first single piece 8, lower part to the first single piece 8, top and sealed insulation can also be integrally formed.First seal 6 is paste electric insulating sealant, and the glue with stronger adhesive strength can be selected as first seal 6, to make strongly to be bonded together between adjacent two fluid channel 5, and make 8 intimate contact heat transfer of fluid channel 5 and the first single piece.
As shown in Fig. 6-1, Fig. 7, for that can assemble the PTC electric heating group body being sealed, PTC electricity heat-producing machine further includes mainboard 7, which has internal cavity 71, PTC electric heating group body is arranged in the internal cavity 71 of mainboard 7, and forms sealing structure between the inner wall of mainboard 7.In addition, the outside of mainboard 7 is enclosed with the plastic shell (not shown) for accommodating mainboard 7 Yu PTC electric heating group body.The effect of plastic shell is a cavity, and heat exchanging liquid passes therethrough.It other than inlet and outlet, is sealed elsewhere, plastic shell surrounds form using upper and lower shell.On PTC electric heating group body stacking direction, modeling
Gap is slightly less than the thickness on PTC electric heating group body stacking direction (certainly between material outer casing inner wall face, elastic rubber can also be set between plastic shell inner surface), then PTC electric heating group body is caught in plastic shell and has the function that further to compress PTC electric heating group body.
The quantity of PTC fever tablet 3 is 18, several PTC fever tablets 3 are in three rows, six column distribution between electrode film and negative electrode plate, it requires according to this embodiment, the quantity of first single piece 8 is three, the quantity of fluid channel 5 is four, for other embodiments, the first single piece 8 and 5 quantity of fluid channel of other quantity also can be set.Quantity selection for PTC fever tablet 3, user can select according to actual needs, and all numbers, are only for example in the application, can be in the same way.
Fluid channel 5 is preferably the lamina beam 511 as shown in Fig. 8-1, this is a kind of closed type fluid channel, is made of two pieces of side plate 5b, one group of fin 5a, two strip of paper used for sealing 5c, and fin is placed between both side plate 5b, and strip of paper used for sealing 5c is placed on the bottom end fin 5a and top.The lamina beam 511 is also a kind of fins set.The flow direction of heat exchanging liquid is for left side to the right side of PTC electricity heat-producing machine or by right side to left side in fluid channel 5.In order to preferably be sealed, a circle groove can also be opened up in two outer surfaces side plate 5b of plate beam 511, for placing O-ring seal, the first single piece 8 is preferably sealed between two lamina beams 511.
For example, 511 length and width dimensions of lamina beam are 190*70mm, with a thickness of 5 ± 0.5mm.Positive electrode item 1 and 2 length and width of negative electrode item are 180*60mm, with a thickness of 0.2 ± 0.05mm, positive pole ear, negative lug size be 10*10mm；PTC fever tablet 3 is 30*20mm, with a thickness of 3.5 ± 0.05mm；First insulating layer 4 with a thickness of 0.5 ± 0.05mm.
Certainly, the porous extruding flat tube 512 as shown in Fig. 8-2 can also be used in closed type fluid channel 5.It squeezes flat tube 512 and is used as a kind of closed type fluid channel, moulding process is simple.
The present invention is arranged using sandwiched type structure, and heat transfer efficiency is high, power density is big, compact-sized, small in size, at low cost, and is assembled simple.
Compared with the prior art, the present invention has following feature and technical effect outstanding: the present invention passes through the closed assembly that the fluid channels such as the first single piece and plate beam are easier, and preferably the plate of the first single piece two sides is tightened by way of sealing glue sticking and is thickly linked together, both reliable sealing had been realized, reliable abutting is also achieved.In compared with the prior art first using multiple flat heat exchange tubes stacking after be inserted into ptc heater and its must exclusively with heat exchange push part as fastening fixing mechanism；Structure of the invention is simpler, and technique is easier, and the close contact inside PTC electricity heat-producing machine can also be protected, and heat-conducting effect is more preferable；Although the present invention can also increase special fastening fixing mechanism, it is not required or preferably.In addition, not needing special fluid inlet head and outlet heads, therefore volume is more compact due to the both ends that the fluid inlet and outlet on PTC electric heating group body is plate beam；Along with PTC electric heating group body can be immersed directly in coolant liquid, therefore heat exchange efficiency is higher.
Embodiment two
On PTC electrode bar assembly, all outer surfaces in addition to tab are coated with the insulation silica gel conduct that resistance to heat exchanging liquid impregnates
First insulating layer 4；Form the first single piece 8.The insulation silica gel that first insulating layer, 4 material uses resistance to heat exchanging liquid to impregnate.This silica gel, which is soaked in heat exchanging liquid, is still able to maintain good electric insulation functions, is suitably applied the PTC electric heating group body using open fluid channel.The present embodiment uses the fins set being made of the saw tooth fin 513 of multiple groups as shown in fig. 9-1 as fluid channel.Moreover, because PTC electrode bar assembly surrounding, top and bottom have been coated with the first insulating layer 4 that the resistance to heat exchanging liquid impregnates, therefore no longer need that first seal in addition is arranged.The present embodiment preferably uses four serrated fins 513 and three the first single pieces 8 as shown in fig. 9-1 to alternate stacking and forms PTC electric heating group body (or PTC electricity heat-producing machine core).Select the adhesive of resistance to coolant liquid that will be bonded together between saw tooth fin 513 and the first single piece 8, in this way, on the one hand the mechanical strength (such as the antivibration fatigue resistance being applied on automobile) in the internal portion of PTC electric heating group can be improved, on the other hand it can reduce thermal contact resistance between saw tooth fin 513 and the first single piece 8, be conducive to heat and be more efficiently transmitted on saw tooth fin 513 and be dispersed into heat exchanging liquid.The stiffness and strength of usual first single piece 8 are insufficient for automobile-used anti-vibration requirement, therefore wherein saw tooth fin 513 plays an important role: on the one hand plaing a part of to separate and support the first single piece 8, improve whole vibration strength；On the other hand tissue coolant liquid flow field, enhanced heat exchange, the positive effect for promoting the PTC electricity heat-producing machine thermal power density are played.
Then, the internal cavity 72 (or slot hole) that each tab 101 of the PTC electric heating group body passes through plastic main panel 7 as in fig. 6-2 is stretched out on mainboard 7, and carries out sealing (being such as sealed using electric insulating sealant) between tab 101 and internal cavity 72.Plastic shell 12 is made of upper housing 121 and lower case 122, and lower case 122 is provided with inlet and liquid outlet (being not shown on figure) on the direction perpendicular to Figure 11.It will be in the cavity of PTC electric heating group body insertion lower case 122, internal cavity or so inner surface is provided with flexible rubber layer (not shown), spacing dimension between the cavity inner surface of lower case 122 is preferably slightly smaller than the thickness of the left and right directions of PTC electric heating group body, to form certain interference immovable fitting.Mainboard 7 and 122 upper edge of lower case are formed along surrounding reliably seals (such as adding bolt and nut to be fastenedly connected sealing with rubber seal).Then upper housing 121 is covered on mainboard 7 simultaneously fit sealing.Currently preferred PTC electricity heat-producing machine is formed in this way.
Certainly, the open fluid channel as shown in Fig. 9-2 can also be used in the present embodiment.
Certainly, it can also be provided with a second seal 10 on the top between two adjacent first single pieces 8, and increases side plate 9 in the external of two sides saw tooth fin, constitute the PTC electric heating group body as shown in Figure 10-2.
The present embodiment is spaced apart from each other stacking by multiple first single pieces 8 and saw tooth fin 513, the PTC electricity heat-producing machine of " sandwich " formula that formed, not only components are less, cost is lower but also shorter more efficient from the heat transfer path of heat generating components (PTC fever tablet) to heat transfer medium (heat exchanging liquid).
Embodiment three
The present embodiment is using PTC electric heating group body described in embodiment one, i.e., closed type fluid channel 511 and the setting of the first single piece 8 interval are separately plus first seal 6 forms PTC electric heating group body.The difference is that in PTC electric heating group body left and right ends
It is communicated therewith using end socket 11 as shown in figure 12, the mode of connection is gluing, forms the PTC electricity heat-producing machine with end socket 11.
Example IV
The semiconductor cooling device includes semiconductor heat-dissipating group body, and the semiconductor heat-dissipating group body includes six groups of semi-conducting electrode single pieces and seven flat tubes；The semi-conducting electrode single piece and flat tube, which alternate, to be stacked, and the flat tube surface is directly contacted with semi-conducting electrode single piece outer surface, and equipped with closed cooling passage in the flat tube；Wherein, the semi-conducting electrode single piece is made of semi-conducting electrode component and the first insulating layer being set on the outside of the semi-conducting electrode component, wherein, the semi-conducting electrode component includes semiconductor chip and the electrode slice for being set to the semiconductor chip or more two sides.In the present embodiment, using the electrode strip for integrating electrode tabs and electrode slice, which is and extraneous electrical connection section.
In order to ensure semi-conducting electrode single piece surrounding and coolant liquid are sufficiently sealed, it is respectively set first seal between adjacent two flat tube, each first seal is to surrounding of the semi-conducting electrode single piece in addition to tab or sealing is integrally formed.
Electrode strip 502,503,505 in Figure 13 is made of electrode slice 521,531,551 and tab 522,532,552, and Figure 15 shows the schematic diagram of soldering-tin layer position on each electrode slice.Electrode slice 551 upper surface in downside is respectively disposed with an igbt chip 506 and a diode chip for backlight unit 507, downside electrode slice 551 is electrically connected by soldering-tin layer 505b with the collector of igbt chip 506, is electrically connected by the cathode of soldering-tin layer 505a and diode chip for backlight unit 507；The left electrode slice 521 in upside is electrically connected by soldering-tin layer 502b with the emitter of igbt chip 506, is electrically connected by the anode of soldering-tin layer 502a and diode chip for backlight unit 507；The right electrode slice 531 in upside is electrically connected by soldering-tin layer 503a with the grid of igbt chip 506.It also needs to be isolated with second insulating layer 504 between the electrode slice 521,531 of upside the right and left.If the spacing very little between power-on and power-off pole piece, anti- creepage distance is insufficient, then need between power-on and power-off pole piece in addition to chip 506,507 place coating second insulating layer 504 to ensure reliably to insulate between power-on and power-off pole piece, wherein insulation silica gel can be used in second insulating layer 504.Semi-conducting electrode component is formd as a result,.
Reserved three electrical connection sections with the external world in the semi-conducting electrode component two sides, i.e. three tabs 522,532,552.On the semi-conducting electrode component, all exposed surfaces are coated with the first insulating layer 501 on electrode slice 521,531,551, it is further preferable that remaining exposed surface is coated with the first insulating layer 501 in addition to tab on entire semi-conducting electrode component, semi-conducting electrode single piece 102 is formed, as shown in figure 14.
As shown in figure 16, fluid channel uses porous extruding flat tube 512, and inside is formed with closed cooling passage.Semiconductor heat-dissipating group body is flat tube 512 by six groups of semi-conducting electrode single pieces 102 and seven alternately laminated formation of porous extruding flat tube 512, the i.e. outermost two sides of semiconductor heat-dissipating group body.If the first insulating layer 501 is impregnated intolerant to coolant liquid, first seal 100 is then set between every adjacent two flat tubes 512, which is the sealing material of resistance to anti-icing fluid, so that semi-conducting electrode single piece 102 is isolated with coolant liquid, semiconductor heat-dissipating group body is formd as a result,.
The present embodiment further includes shell (not shown), which is made of, shell left and right two half parts (or two half part of front and back)
For accommodating semiconductor heat-dissipating group body, the tab of electrode strip extends except shell to be electrically connected with the external world, encapsulation process is done between electrode strip and shell, is provided with inlet and liquid outlet on shell.
The semiconductor cooling device of above structure, the heat transfer path between euthermic chip and coolant liquid is shorter, and thermal resistance is small, and chip two sides are adequately cooled, and cooling efficiency is high；Therefore the semiconductor cooling device is small in size, power density is very high.And, the present embodiment substitutes traditional binding line (wire bond) or binding band (ribbon bond) with full electrode slice, the contact surface of electrode slice and chip is bigger, therefore the current-carrying capability of electrode slice is stronger, and significantly reduce parasitic inductance, the rush of current of chip is smaller, and chip is safer.Moreover, the structure is simple, manufacturing cost is low.
Embodiment five
The present embodiment provides another semi-conducting electrode single pieces.Figure is broken up as shown in Figure 17 for the plane of its semi-conducting electrode component, it is wherein semi-conducting electrode component 14 in dot-dash wire frame, in order to become apparent from explanation, upper electrode piece P3, P4, P5, which individually detaches to illustrate from semi-conducting electrode component 14, to be come, and dotted line frame states each upper electrode piece position original on semi-conducting electrode component 14.Unlike example IV, the semi-conducting electrode single piece of the present embodiment includes 5 electrode slices, 2 electrode slices P1, P2 are arranged at lower part, and there are 3 electrode slices P3, P4, P5 in top, 2 igbt chips A1, A2 and 2 diode chip for backlight unit B1, B2 are provided between power-on and power-off pole piece.Lower electrode piece P1 is electrically connected with the anode of the collector of igbt chip A1, the emitter of A2, the cathode of diode B1 and B2 respectively；P2 is electrically connected with the grid of igbt chip A2；Upper electrode piece P3 is electrically connected with the grid of A1；P4 is electrically connected with the anode of the emitter of A1, B1；P5 is electrically connected with the cathode of the collector of A2, B2.Constitute as a result, include 2 igbt chips and 2 diode chip for backlight unit semi-conducting electrode component 14；Then, on the semi-conducting electrode component 14, in addition to each tab (not shown), remaining all exsertion part spray insulation adhesive forms the first insulating layer, so as to form semi-conducting electrode single piece.Referring next to shown in above-described embodiment, forming a kind of semiconductor cooling device.
Embodiment six
The present embodiment is partly referring to example IV, the semi-conducting electrode single piece of the present embodiment is as shown in figure 18, electrode slice 551 upper surface in downside is respectively disposed with an igbt chip 506 and a diode chip for backlight unit 507, downside electrode slice 551 is electrically connected by conducting resinl (conducting resinl is not shown) with the collector of igbt chip 506, is electrically connected by the cathode of conducting resinl and diode chip for backlight unit 507；It is bonded together with boss 502c, boss 502d on the left electrode slice 521 in upside by conducting resinl, is bonded together on the right electrode slice 531 in upside by conducting resinl and boss 503c respectively.The boss 502d of the left electrode slice 521 in upside is electrically connected by conducting resinl with the emitter of igbt chip 506, and boss 502c is electrically connected by conducting resinl with the anode of diode chip for backlight unit 507；The boss 503c of the right electrode slice 531 in upside is electrically connected by conducting resinl with the grid of igbt chip 506.It also needs to be isolated with second insulating layer 504 between the electrode slice 521,531 of upside the right and left.Due to the spacing very little between power-on and power-off pole piece, anti-creepage distance is insufficient, thus need to place coating second insulating layer 504 between power-on and power-off pole piece in addition to chip 506,507 to ensure on
It reliably insulate between lower electrode slice, wherein insulation silica gel can be used in second insulating layer 504.Semi-conducting electrode component is formd as a result,.
Above-mentioned electrical connection is electrically connected with crimping substitution conducting resinl, and the so-called crimping of the present invention, which refers to, compresses electrode slice, boss and chip by external pressure, is electrically connected it reliably.
Reserved three electrical connection sections with the external world in the semi-conducting electrode component two sides, i.e. three tabs 522,532,552.On above-mentioned semi-conducting electrode component, in addition at three tabs 522,532,552, remaining all exposed surface is coated with the first insulating layer 501b, and material used in first insulating layer 501b is the insulating materials that resistance to coolant liquid is impregnated；As a result, to form semi-conducting electrode single piece 103.
The present embodiment also introduces serrated fin 513 as shown in fig. 9-1, by two groups of above-mentioned semi-conducting electrode single pieces 103 and three groups of alternately laminated compressions of fin 513, form semiconductor heat-dissipating group body as shown in figure 19, it wherein include open cooling passage in fin 513, coolant liquid is directly contacted with the first insulating layer 501b.
The present embodiment includes shell (not shown), the shell is made of left and right two half parts (or two half part of front and back), shell is for accommodating semiconductor heat-dissipating group body, the tab of electrode strip extend except shell so as to the external world be electrically connected, encapsulation process is done between electrode strip and shell, is provided with inlet and liquid outlet on shell.
The present embodiment is other than possessing technical effect shown in example IV, the present embodiment structure is simpler, and coolant liquid is directly contacted with the first insulating layer, avoids the thermal contact resistance between the thermal conduction resistance of flat tube wall surface and flat tube wall surface and the first insulating layer, therefore heat exchange efficiency is higher, cost is lower.The glue basis material of conducting resinl preferably uses silica gel, and solidification temperature is lower, and operating procedure is easier.Silica gel is that elastomer resisting temperature alternation ability is strong, can effectively adapt to semiconductor chip temperature alternating environment, extend the working life of semiconductor cooling device.
Embodiment seven
The present embodiment is most of similar with embodiment six, and the insulating layer that resistance to coolant liquid is arranged in the semi-conducting electrode component external used forms semi-conducting electrode single piece, and combines to form semiconductor heat-dissipating group body with saw tooth fin.The difference is that the electrode slice quantity of its semi-conducting electrode component is 2, i.e., the connection electrode of collector and emitter is electrode slice, and the connection electrode of grid is traditional binding line (wire bond) or binding band (ribbon bond).
Alternatively, semiconductor single piece uses the semiconductor package body in similar CN103999213A, and the insulating layer of resistance to coolant liquid is coated in the semiconductor package body body exterior.Then semiconductor heat-dissipating group body is formed with saw tooth fin.
Taking the above-mentioned ideal embodiment according to the present invention as inspiration, through the above description, relevant staff can carry out various changes and amendments without departing from the scope of the technological thought of the present invention' completely.The technical scope of the present invention is not limited to the contents of the specification, it is necessary to which the technical scope thereof is determined according to the scope of the claim.
Claims (33)
- A kind of electricity heat-producing machine, it is characterized in that including PTC electric heating group body, the PTC electric heating group body include PTC electrode bar assembly, the PTC electrode bar assembly includes positive electrode item, PTC fever tablet group, negative electrode item, and the PTC fever tablet group is made of several PTC fever tablets；The PTC fever tablet group is arranged between positive electrode item and negative electrode item；Respectively external side is equipped with the first insulating layer for the positive electrode item and negative electrode item.
- A kind of electric heat-producing machine according to claim 1, characterized in that the positive electrode item includes electrode film, positive pole ear；The negative electrode item includes negative electrode plate, negative lug.
- A kind of electric heat-producing machine according to claim 1, characterized in that the PTC electrode bar assembly, the first insulating layer form the first single piece；The PTC electricity heat-producing machine includes fluid channel, and the fluid channel and first single piece are successively spaced setting and form PTC electric heating group body.
- A kind of electric heat-producing machine according to claim 3, characterized in that the fluid channel is fins set, and the fins set and the first single piece are successively spaced setting.
- A kind of electric heat-producing machine according to claim 4, characterized in that the fins set is the fins set being made of multiple groups fin；Alternatively,The fins set is made of side plate, fin, strip of paper used for sealing, and fin is placed between adjacent both side plate, and strip of paper used for sealing is placed on fin bottom end and top.
- A kind of electric heat-producing machine according to claim 3, characterized in that first seal is respectively set between adjacent two fluid channel, each first seal is to the first unitarily formed both sides of the edge or sealed insulation is integrally formed.
- A kind of electric heat-producing machine according to claim 3, characterized in that the PTC electricity heat-producing machine further includes shell；The interior of shell forms cavity, and in the cavity, the fluid channel is connected to the cavity for the PTC electric heating body component exposure.
- A kind of electric heat-producing machine according to claim 7, characterized in that retention mechanism is provided in shell, so that PTC electric heating group body interior contact is close.
- A kind of electricity heat-producing machine according to any one of claim 2-8, characterized in that the PTC electricity heat-producing machine further includes mainboard；The mainboard is located in the cavity of the shell.
- A kind of electric heat-producing machine according to claim 9, characterized in that the mainboard has internal cavity, and the tab of electrode strip is stretched out on mainboard by the internal cavity of mainboard, and forms sealing structure between mainboard internal cavity.
- A kind of electric heat-producing machine according to claim 1 or 3, characterized in that clamp system is provided on PTC electric heating group body, so that PTC electric heating group body interior contact is close.
- A kind of electric heat-producing machine according to claim 3, characterized in that the PTC electricity heat-producing machine further includes end socket, and the both ends of the PTC electric heating group body are connected to the end socket, is provided with inlet and liquid outlet on the end socket.
- A kind of electric heat-producing machine according to claim 3, characterized in that the fluid channel is closed type fluid channel.
- A kind of electric heat-producing machine according to claim 13, characterized in that the closed type fluid channel is plate beam or flat tube.
- A kind of electric heat-producing machine according to claim 1, characterized in that the PTC electrode bar assembly and the first insulating layer that PTC electrode strip module outer surface is arranged in form the first single piece；Wherein, first insulating layer material is the insulating materials that resistance to heat exchanging liquid impregnates；The PTC electricity heat-producing machine further includes fluid channel, and the fluid channel and first single piece are successively spaced setting and form PTC electric heating group body；Wherein, at least partly surface of the fluid channel is directly contacted with first single piece at least partly outer surface.
- A kind of electric heat-producing machine according to claim 15, characterized in that the fluid channel is saw tooth fin or plain fin or perforated fin.
- A kind of electric heat-producing machine according to claim 1, characterized in that first insulating layer material is the insulating materials that resistance to heat exchanging liquid impregnates.
- A kind of electric heat-producing machine according to claim 17, characterized in that first insulating layer is ceramic insulation piece or high molecular material insulating trip or applies insulating layer coating or plate insulating layer.
- A kind of electric heat-producing machine according to claim 2, characterized in that first insulating layer wraps up the electrode film and negative electrode plate.
- A kind of semiconductor cooling device, which is characterized in that the semiconductor cooling device includes semiconductor heat-dissipating group body, and the semiconductor heat-dissipating group body includes several semi-conducting electrode single pieces and several fluid channels；The semi-conducting electrode single piece is alternateed with the fluid channel to be stacked, and at least partly surface of the fluid channel is directly contacted with the unitarily formed at least partly outer surface of the semi-conducting electrode, and cooling passage is equipped in the fluid channel；Wherein, the semi-conducting electrode single piece is made of semi-conducting electrode component and the first insulating layer being set on the outside of the semi-conducting electrode component；Wherein, the semi-conducting electrode component includes semiconductor chip and the electrode slice for being set to the semiconductor chip or more two sides.
- The semiconductor cooling device according to claim 20, which is characterized in that first seal is set between adjacent two fluid channel, and each first seal is to the unitarily formed surrounding of the semi-conducting electrode or sealing is integrally formed.
- The semiconductor cooling device according to claim 20, which is characterized in that closed cooling passage is equipped in the fluid channel.
- The semiconductor cooling device according to claim 20, which is characterized in that the fluid channel is plate beam or flat tube.
- The semiconductor cooling device according to claim 20, which is characterized in that open cooling passage is equipped in the fluid channel.
- The semiconductor cooling device according to claim 20, which is characterized in that the fluid channel is corrugated fin or serrated fin or the fin with side plate.
- The semiconductor cooling device according to claim 20, which is characterized in that the outermost two sides of the semiconductor heat-dissipating group body are fluid channel.
- The semiconductor cooling device according to claim 20, it is characterized in that, the semiconductor cooling device further includes shell, the shell is for accommodating the semiconductor heat-dissipating group body, the electrode slice and the electrical connection section in the external world are extended except the shell and are sealed between the shell, are provided with inlet and liquid outlet on the shell.
- Semiconductor cooling device according to claim 20, which is characterized in that first insulating layer is the insulating materials that resistance to coolant liquid is impregnated.
- Semiconductor cooling device according to claim 28, which is characterized in that the insulating materials that the resistance to coolant liquid is impregnated is insulating polymeric material, ceramic insulating material and doped with any one or a few in the insulating polymeric material of ceramics.
- Semiconductor cooling device according to claim 20, which is characterized in that be provided with boss between the electrode slice and the semiconductor chip.
- Semiconductor cooling device according to claim 20, which is characterized in that be additionally provided with second insulating layer at the position in addition to the semiconductor chip between the electrode slice.
- Semiconductor cooling device according to claim 20, which is characterized in that the semiconductor chip is conductive adhesive or soldering or soldering with the electric connection mode of the electrode slice or crimps.
- Semiconductor cooling device according to claim 20, which is characterized in that the electrode slice quantity of the semi-conducting electrode component is 2 or 3 or 5.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201710147232.3A CN107339794A (en) | 2014-12-16 | 2015-12-15 | Electric heating device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410783463X | 2014-12-16 | ||
| CN201410783463.XA CN104540247A (en) | 2014-12-16 | 2014-12-16 | Electric heater |
| CN2015104418213 | 2015-07-26 | ||
| CN201510441821 | 2015-07-26 | ||
| CN2015105475571 | 2015-08-31 | ||
| CN201510547557 | 2015-08-31 | ||
| PCT/CN2015/097408 WO2016095804A1 (en) | 2014-12-16 | 2015-12-15 | Electrical heat-generating device |
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| CN201710147232.3A Division CN107339794A (en) | 2014-12-16 | 2015-12-15 | Electric heating device |
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| DE102018203231A1 (en) | 2017-03-06 | 2018-09-06 | Dana Canada Corporation | HEAT EXCHANGERS FOR COOLING SEVERAL LAYERS OF ELECTRONIC MODULES |
| WO2019169502A1 (en) * | 2018-03-07 | 2019-09-12 | Dana Canada Corporation | Heat exchanger with integrated electrical heating element |
| US20190277578A1 (en) * | 2018-03-07 | 2019-09-12 | Dana Canada Corporation | Heat exchangers with integrated electrical heating elements and with multiple fluid flow passages |
| CN109920625A (en) * | 2019-04-26 | 2019-06-21 | 深圳市吉百顺科技有限公司 | A kind of inductor and its production technology |
| CN117650107B (en) * | 2024-01-29 | 2024-04-02 | 合肥先进封装陶瓷有限公司 | Multi-chip packaging structure and packaging method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1374574A (en) * | 2002-04-16 | 2002-10-16 | 南京工业大学 | Heat exchanger with hot fin plate |
| CN201499328U (en) * | 2009-09-08 | 2010-06-02 | 蒋国屏 | Heat-conducting aluminium pipe for PTC heater and PTC heater |
| CN101949584A (en) * | 2009-01-23 | 2011-01-19 | 贝洱两合公司 | Heat exchanger |
| CN104144530A (en) * | 2014-07-21 | 2014-11-12 | 谢彦君 | Electric heating device and manufacturing method of electric heating device |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1882200A (en) * | 2005-06-16 | 2006-12-20 | 富准精密工业(深圳)有限公司 | Heat-conductive module |
| WO2009096007A1 (en) * | 2008-01-30 | 2009-08-06 | Koshiro Taguchi | On-vehicle heater and its manufacturing method |
| CN207219057U (en) * | 2014-07-21 | 2018-04-10 | 谢彦君 | A kind of electric heat-producing machine |
| CN106455149A (en) * | 2014-12-16 | 2017-02-22 | 谢彦君 | Electric heater |
| CN204334978U (en) * | 2014-12-16 | 2015-05-13 | 江苏港星方能超声洗净科技有限公司 | A kind of electric heat-producing machine |
-
2015
- 2015-12-15 CN CN201580044496.5A patent/CN107113919A/en active Pending
- 2015-12-15 WO PCT/CN2015/097408 patent/WO2016095804A1/en active Application Filing
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1374574A (en) * | 2002-04-16 | 2002-10-16 | 南京工业大学 | Heat exchanger with hot fin plate |
| CN101949584A (en) * | 2009-01-23 | 2011-01-19 | 贝洱两合公司 | Heat exchanger |
| CN201499328U (en) * | 2009-09-08 | 2010-06-02 | 蒋国屏 | Heat-conducting aluminium pipe for PTC heater and PTC heater |
| CN104144530A (en) * | 2014-07-21 | 2014-11-12 | 谢彦君 | Electric heating device and manufacturing method of electric heating device |
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