CN214205956U - Anti-oxidation high-frequency double-sided circuit board - Google Patents
Anti-oxidation high-frequency double-sided circuit board Download PDFInfo
- Publication number
- CN214205956U CN214205956U CN202120168190.3U CN202120168190U CN214205956U CN 214205956 U CN214205956 U CN 214205956U CN 202120168190 U CN202120168190 U CN 202120168190U CN 214205956 U CN214205956 U CN 214205956U
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- circuit board
- heat
- copper sheet
- heat dissipation
- fixedly connected
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Abstract
The utility model discloses an anti-oxidant high frequency double-sided circuit board, including the heat dissipation copper sheet, heat dissipation copper sheet top is provided with the circuit board, heat dissipation copper sheet below is provided with down the circuit board, go up the circuit board and all seted up the heat conduction hole with lower circuit board, be provided with the heat conduction post in the heat conduction hole, all be provided with the heat-conducting plate between heat dissipation copper sheet and last circuit board, the lower circuit board, heat conduction post one end fixed connection is in heat-conducting plate keep away from heat dissipation copper sheet one side, the equal fixedly connected with connecting rod of terminal surface side down on the heat dissipation copper sheet, the connecting rod extends to circuit board and lower circuit board outside one end fixedly connected with fixed block. The utility model discloses in, through the heat-conducting plate with the leading-in heat dissipation copper sheet of heat, dispel the heat through a large amount of louvres in the heat dissipation piece, can carry out effectual heat dissipation to the circuit board, effectively protected the circuit board, avoid the circuit board high temperature to cause the damage.
Description
Technical Field
The utility model relates to a circuit board field especially relates to an anti-oxidant high frequency double-sided circuit board.
Background
The circuit board is also called a circuit board, a ceramic circuit board, an alumina ceramic circuit board, an aluminum nitride ceramic circuit board, a PCB board, an aluminum substrate, a high frequency board, a thick copper board, an impedance board, a PCB, an ultra-thin circuit board, a printed (copper etching technology) circuit board, etc., and the circuit board is classified into three major categories, namely a single-sided board, a double-sided board, and a multi-layered circuit board, according to the number of layers. The double-sided board is an extension of a single-sided board, and is used when a single-layer wiring cannot meet the requirements of an electronic product. Copper is coated on both sides of the circuit board, so that wires are arranged between the two layers, and the wires can be connected through the through holes to form required network connection.
The circuit board produces a large amount of heats because of the existence of circuit easily in the actual work process, and the heat is piled up and is not derived the work efficiency who influences the circuit board easily, and damages the circuit board easily when the high temperature even burns out the circuit board, causes the conflagration, now needs an anti-oxidant high frequency double-sided circuit board to solve these problems.
SUMMERY OF THE UTILITY MODEL
The utility model aims at solving the defects existing in the prior art and providing an anti-oxidation high-frequency double-sided circuit board.
In order to achieve the above purpose, the utility model adopts the following technical scheme: the utility model provides an anti-oxidant high frequency two-sided circuit board, includes the heat dissipation copper sheet, heat dissipation copper sheet top is provided with the circuit board, heat dissipation copper sheet below is provided with lower circuit board, go up the circuit board and all seted up the heat conduction hole with lower circuit board, be provided with the heat conduction post in the heat conduction hole, all be provided with the heat-conducting plate between heat dissipation copper sheet and last circuit board, the lower circuit board, heat conduction post one end fixed connection is in the heat-conducting plate and is kept away from heat dissipation copper sheet one side.
As a further description of the above technical solution.
The upper end face and the lower end face of the heat dissipation copper sheet are fixedly connected with connecting rods, and the connecting rods extend to the upper circuit board and one end of the outer side of the lower circuit board is fixedly connected with a fixing block.
As a further description of the above technical solution:
the fixed block is internally provided with a fixed groove, the connecting rod is fixedly connected in the fixed groove, and the fixed block is internally provided with a buffer groove.
As a further description of the above technical solution:
the buffer slot inner wall one side fixedly connected with spring, the spring other end fixedly connected with dog.
As a further description of the above technical solution:
and heat conducting cavities are formed in one sides, far away from the radiating copper sheet, of the two groups of heat conducting plates and are distributed at equal intervals.
As a further description of the above technical solution:
the radiating copper sheet is characterized in that radiating blocks are fixedly connected to two ends of the radiating copper sheet, and multiple groups of radiating holes are formed in the radiating blocks at equal intervals.
As a further description of the above technical solution:
and heat conducting grooves are formed in the sides, away from the heat dissipation copper sheet, of the upper circuit board and the lower circuit board, and are provided with multiple groups.
As a further description of the above technical solution:
the connecting rod penetrates through the upper circuit board and the lower circuit board and is connected with the upper circuit board and the lower circuit board in a sliding mode.
The utility model discloses following beneficial effect has:
1. the utility model discloses a heat conduction post, heat-conducting plate, heat dissipation copper sheet, radiating block, louvre etc. that set up, through the heat conduction post with the leading-in heat-conducting plate of heat, then through the heat-conducting plate with the leading-in heat dissipation copper sheet of heat, a large amount of louvres in the radiating block are scattered the heat and are gone, can carry out effectual heat dissipation to the circuit board, have effectively protected the circuit board, avoid the circuit board high temperature to cause the damage.
2. The utility model discloses a connecting rod, fixed block, dashpot, spring etc. that set up, elasticity through the spring can make the circuit board be connected inseparabler with circuit board down, the wholeness of lifting line board.
3. The utility model discloses a heat conduction groove, heat conduction hole, heat conduction chamber etc. that set up can further dispel the heat to the circuit board, further strengthen the radiating efficiency of whole circuit board structure.
Drawings
Fig. 1 is a schematic perspective view of an antioxidant high-frequency double-sided circuit board according to the present invention;
fig. 2 is a schematic structural view of an anti-oxidation high-frequency double-sided circuit board provided by the present invention;
fig. 3 is a front view of an anti-oxidation high-frequency double-sided circuit board provided by the utility model;
fig. 4 is an enlarged view of a portion a in fig. 2.
Illustration of the drawings:
1. an upper circuit board; 2. a lower circuit board; 3. a heat conducting plate; 4. a connecting rod; 5. a fixed block; 6. a heat dissipating block; 7. a heat dissipation copper sheet; 8. a heat conduction hole; 9. a heat conducting groove; 10. a heat-conducting column; 11. heat dissipation holes; 12. A heat conducting cavity; 13. a spring; 14. fixing grooves; 15. a buffer tank; 16. and a stop block.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance, and furthermore, unless otherwise explicitly stated or limited, the terms "mounted," "connected," and "connected" are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Referring to fig. 1-4, the present invention provides an embodiment: the utility model provides an anti-oxidant high frequency double-sided circuit board, including heat dissipation copper sheet 7, heat dissipation copper sheet 7 top is provided with circuit board 1, heat dissipation copper sheet 7 below is provided with circuit board 2 down, go up circuit board 1 and circuit board 2 down have all seted up heat conduction hole 8, be provided with heat conduction post 10 in the heat conduction hole 8, heat dissipation copper sheet 7 and last circuit board 1, all be provided with heat-conducting plate 3 between the circuit board 2 down, heat conduction post 10 one end fixed connection is in heat-conducting plate 3 and keeps away from heat dissipation copper sheet 7 one side, lead to heat conduction plate 3 through heat conduction post 10, then lead to heat dissipation copper sheet 7 through heat conduction plate 3 with the heat, dispel the heat through a large amount of louvres 11 in the radiating block 6, can carry out effectual heat dissipation to the circuit board, the circuit board has effectively been protected, avoid the circuit board high temperature to cause the damage.
7 up end of heat dissipation copper sheet and the equal fixedly connected with connecting rod 4 of terminal surface side down, connecting rod 4 extends to circuit board 1 and circuit board 2 outside one end fixedly connected with fixed block 5 down, be provided with fixed slot 14 in the fixed block 5, connecting rod 4 fixed connection is in fixed slot 14, buffer slot 15 has been seted up in the fixed block 5, 15 inner wall one side fixedly connected with springs 13 of buffer slot, springs 13 other end fixedly connected with dog 16, elasticity through springs 13 can make circuit board 1 be connected inseparabler with circuit board 2 down, the wholeness of promotion circuit board.
Two sets of heat-conducting plates 3 keep away from heat dissipation copper sheet 7 one side and have all seted up heat conduction chamber 12, heat conduction chamber 12 is the equidistance and distributes, the equal fixedly connected with radiating block 6 in heat dissipation copper sheet 7 both ends, multiunit louvre 11 has been seted up to the inside equidistance of radiating block 6, go up circuit board 1 and lower circuit board 2 keep away from heat dissipation copper sheet 7 one side and have all seted up heat-conducting groove 9, heat-conducting groove 9 is provided with the multiunit, can further dispel the heat to the circuit board, further strengthen the radiating efficiency of whole circuit board structure, connecting rod 4 runs through circuit board 1 and lower circuit board 2 and sliding connection with it.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications and variations can be made in the embodiments or in part of the technical features of the embodiments without departing from the spirit and the scope of the invention.
Claims (8)
1. The utility model provides an anti-oxidant high frequency double-sided circuit board, includes heat dissipation copper sheet (7), its characterized in that: an upper circuit board (1) is arranged above the radiating copper sheet (7), a lower circuit board (2) is arranged below the radiating copper sheet (7), heat conducting holes (8) are formed in the upper circuit board (1) and the lower circuit board (2), heat conducting columns (10) are arranged in the heat conducting holes (8), heat conducting plates (3) are arranged between the radiating copper sheet (7) and the upper circuit board (1) and between the radiating copper sheet (7) and the lower circuit board (2), and one ends of the heat conducting columns (10) are fixedly connected to one sides, away from the radiating copper sheet (7), of the heat conducting plates (3).
2. The antioxidant high-frequency double-sided circuit board according to claim 1, characterized in that: the heat dissipation copper sheet (7) up end and the equal fixedly connected with connecting rod (4) of terminal surface side down, connecting rod (4) extend to circuit board (1) and circuit board (2) outside one end fixedly connected with fixed block (5) down.
3. The antioxidant high-frequency double-sided circuit board according to claim 2, characterized in that: the novel fixing device is characterized in that a fixing groove (14) is formed in the fixing block (5), the connecting rod (4) is fixedly connected into the fixing groove (14), and a buffer groove (15) is formed in the fixing block (5).
4. The antioxidant high-frequency double-sided circuit board according to claim 3, characterized in that: one side of the inner wall of the buffer groove (15) is fixedly connected with a spring (13), and the other end of the spring (13) is fixedly connected with a stop block (16).
5. The antioxidant high-frequency double-sided circuit board according to claim 1, characterized in that: two groups of heat conduction plates (3) are far away from one side of the heat dissipation copper sheet (7) and are provided with heat conduction cavities (12), and the heat conduction cavities (12) are distributed equidistantly.
6. The antioxidant high-frequency double-sided circuit board according to claim 1, characterized in that: the heat dissipation copper sheet (7) is characterized in that two ends of the heat dissipation copper sheet are fixedly connected with heat dissipation blocks (6), and a plurality of groups of heat dissipation holes (11) are formed in the heat dissipation blocks (6) at equal intervals.
7. The antioxidant high-frequency double-sided circuit board according to claim 1, characterized in that: the heat-conducting grooves (9) are formed in one sides, far away from the heat-radiating copper sheets (7), of the upper circuit board (1) and the lower circuit board (2), and multiple groups of heat-conducting grooves (9) are arranged.
8. The antioxidant high-frequency double-sided circuit board according to claim 2, characterized in that: the connecting rod (4) penetrates through the upper circuit board (1) and the lower circuit board (2) and is connected with the upper circuit board and the lower circuit board in a sliding mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120168190.3U CN214205956U (en) | 2021-01-21 | 2021-01-21 | Anti-oxidation high-frequency double-sided circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120168190.3U CN214205956U (en) | 2021-01-21 | 2021-01-21 | Anti-oxidation high-frequency double-sided circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214205956U true CN214205956U (en) | 2021-09-14 |
Family
ID=77637106
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120168190.3U Active CN214205956U (en) | 2021-01-21 | 2021-01-21 | Anti-oxidation high-frequency double-sided circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214205956U (en) |
-
2021
- 2021-01-21 CN CN202120168190.3U patent/CN214205956U/en active Active
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