CN217183537U - Communication electronic printed circuit board - Google Patents
Communication electronic printed circuit board Download PDFInfo
- Publication number
- CN217183537U CN217183537U CN202220273646.7U CN202220273646U CN217183537U CN 217183537 U CN217183537 U CN 217183537U CN 202220273646 U CN202220273646 U CN 202220273646U CN 217183537 U CN217183537 U CN 217183537U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- board body
- plate
- protection plate
- protection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Abstract
The utility model discloses a communication electronic printed circuit board, which relates to the technical field of communication electronics, and aims at the problems that the prior circuit board is not provided with a protection mechanism, the prior circuit board is easy to damage when falling and being installed, and the short circuit of the circuit board is easily caused due to poor heat dissipation effect of the circuit board; the protection mechanism comprises a first protection plate, a second protection plate, a limit groove, a pull ring, a clamping block, a telescopic spring and a limit hole. The utility model discloses communication electronics printed wiring board can effectual improvement circuit board body's radiating effect, reduces the circuit board body and leads to its short circuit because of the high temperature, also can effectual reduction circuit board body produce the damage at the in-process that drops or install simultaneously.
Description
Technical Field
The utility model relates to a communication electronics technical field especially relates to a communication electronics printed wiring board.
Background
In the process of transporting or installing a circuit board in communication electronics, once the circuit board is stressed excessively or falls, the circuit board is easy to bend and damage, high temperature can be generated in the using process of the circuit board, the circuit board is easy to short circuit due to poor heat dissipation effect of the circuit board, and therefore the communication electronic printed circuit board is provided for solving the problems.
SUMMERY OF THE UTILITY MODEL
The utility model provides a pair of communication electronic printed circuit board has solved the circuit board and has not produced the problem that damages and the not good very easy circuit board short circuit of radiating effect of circuit board when dropping and installing very easily at protection machanism.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
a communication electronic printed circuit board comprises a circuit board body, wherein protection mechanisms are arranged at the top end and the bottom end of the circuit board body and used for protecting the circuit board body, and heat dissipation mechanisms are arranged at the top end and the side wall of the circuit board body and used for conducting heat generated by the circuit board body out;
protection machanism includes first guard plate, second guard plate, spacing groove, pull ring, fixture block, expanding spring and spacing hole, first guard plate is located the top of circuit board body, the second guard plate is located the bottom of circuit board body, the spacing groove is located the one end that first guard plate and second guard plate are close to the circuit board body.
Preferably, the bottom of first guard plate top and second guard plate all is provided with spacing hole, two the one end in spacing hole passes first guard plate and second guard plate respectively and extends to the outside, the fixture block is located the inside of first guard plate and second guard plate, and two the one end of fixture block passes first guard plate and the inside that the second guard plate extends to the circuit board body.
Preferably, the telescopic spring sleeve is arranged on the circumferential side wall of the clamping block in a sleeved mode, the telescopic spring is connected with the first protection plate and the second protection plate at one end respectively, the telescopic spring is far away from one end of the first protection plate and the second protection plate and is connected with the clamping block, and the pull ring is located at one end, far away from the circuit board body, of the clamping block.
Preferably, the heat dissipation mechanism includes fixed plate, threaded rod, miniature heat dissipation fan, first conducting strip and second conducting strip, the one end of fixed plate is connected with the second guard plate, the tip of first conducting strip is connected with first guard plate and second guard plate, the second conducting strip is located the top of circuit board body.
Preferably, the miniature heat dissipation fan is located the top of fixed plate, just the miniature heat dissipation fan is the symmetry setting with the axis of fixed plate, the threaded rod is located the top of fixed plate, the one end of threaded rod passes the fixed plate and extends to the outside.
Preferably, the circuit board body includes insulating layer, signal layer and power layer, the insulating layer is located between signal layer and the power layer, the top and the bottom of circuit board body all are provided with the draw-in groove, draw-in groove and fixture block phase-match.
The utility model has the advantages that:
1. the circuit board body is cooled through the first heat conducting fins and the second heat conducting fins, and then the miniature cooling fan is started to accelerate air flow of the circuit board body, so that the cooling effect of the circuit board body can be effectively improved, and short circuit of the circuit board body caused by overhigh temperature is reduced.
2. Fix the circuit board body between first guard plate and second guard plate through fixture block and draw-in groove, protect the circuit board body through first guard plate and second guard plate to can effectual reduction circuit board body produce the damage at the in-process that drops or install.
In conclusion, the device can effectively improve the heat dissipation effect of the circuit board body, reduce short circuit of the circuit board body caused by overhigh temperature, and meanwhile, can effectively reduce damage of the circuit board body in the dropping or mounting process.
Drawings
Fig. 1 is a schematic structural diagram of the present invention.
Fig. 2 is a schematic diagram of the circuit board structure of the present invention.
Fig. 3 is a schematic view of the split structure of the present invention.
Fig. 4 is an enlarged schematic view of a portion a in fig. 3 according to the present invention.
Reference numbers in the figures: 1. a circuit board body; 2. a protection mechanism; 201. a first shield plate; 202. a second guard plate; 203. a limiting groove; 204. a pull ring; 205. a clamping block; 206. a tension spring; 207. a limiting hole; 3. a heat dissipation mechanism; 301. a fixing plate; 302. a threaded rod; 303. a micro heat dissipation fan; 304. a first thermally conductive sheet; 305. a second thermally conductive sheet; 4. an insulating layer; 5. a signal layer; 6. a power layer; 7. a clamping groove.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.
Referring to fig. 1-4, the communication electronic printed circuit board comprises a circuit board body 1, wherein the top end and the bottom end of the circuit board body 1 are provided with protection mechanisms 2, the protection mechanisms 2 are used for protecting the circuit board body 1, the top end and the side wall of the circuit board body 1 are provided with heat dissipation mechanisms 3, and the heat dissipation mechanisms 3 are used for guiding out heat generated by the circuit board body 1;
protection machanism 2 includes first guard plate 201, second guard plate 202, spacing groove 203, pull ring 204, fixture block 205, expanding spring 206 and spacing hole 207, first guard plate 201 is located the top of circuit board body 1, second guard plate 202 is located the bottom of circuit board body 1, spacing groove 203 is located the one end that first guard plate 201 and second guard plate 202 are close to circuit board body 1.
As shown in fig. 3 and 4, the top end of the first protection plate 201 and the bottom end of the second protection plate 202 are provided with limiting holes 207, one end of each of the limiting holes 207 extends to the outside through the first protection plate 201 and the second protection plate 202, the latch 205 is positioned inside the first and second protection plates 201 and 202, one ends of the two latch blocks 205 extend to the inside of the circuit board body 1 through the first protection plate 201 and the second protection plate 202, the extension springs 206 are sleeved on the circumferential side walls of the clamping blocks 205, one ends of the two extension springs 206 are respectively connected with the first protection plate 201 and the second protection plate 202, one end of the extension spring 206, which is far away from the first protection plate 201 and the second protection plate 202, is connected with the fixture block 205, the pull ring 204 is located at one end of the fixture block 205, which is far away from the circuit board body 1, the first protection plate 201 and the second protection plate 202 can effectively prevent the circuit board body 1 from being bent or damaged when being dropped or installed.
As shown in fig. 1 to 3, the heat dissipation mechanism 3 includes a fixing plate 301, a threaded rod 302, a micro heat dissipation fan 303, a first heat conduction fin 304 and a second heat conduction fin 305, one end of the fixing plate 301 is connected to the second protection plate 202, an end of the first heat conduction fin 304 is connected to the first protection plate 201 and the second protection plate 202, the second heat conduction fin 305 is located at a top end of the circuit board body 1, the micro heat dissipation fan 303 is located at a top end of the fixing plate 301, the micro heat dissipation fan 303 is symmetrically arranged around a central axis of the fixing plate 301, the threaded rod 302 is located at a top end of the fixing plate 301, one end of the threaded rod 302 passes through the fixing plate 301 to extend to the outside, the circuit board body 1 includes an insulating layer 4, a signal layer 5 and a power layer 6, the insulating layer 4 is located between the signal layer 5 and the power layer 6, and the top end and the bottom end of the circuit board body 1 are both provided with a slot 7, the clamping groove 7 is matched with the clamping block 205, and the heat dissipation of the circuit board body 1 is accelerated through the miniature heat dissipation fan 303 on the fixing plate 301, so that the heat dissipation effect of the circuit board body 1 can be effectively improved.
The working principle is as follows: when the device is used, the circuit board body 1 is firstly placed in the limiting groove 203 in the second protection plate 202, then the first protection plate 201 is placed at the top end of the circuit board body 1, then the pull ring 204 on the first protection plate 201 and the second protection plate 202 is pulled to drive the clamping block 205 to move, so that the clamping block 205 is inserted into the clamping groove 7, the circuit board body 1 can be effectively fixed between the first protection plate 201 and the second protection plate 202, then the device is fixed through the threaded rod 302, the circuit board body 1 can be effectively prevented from being bent or damaged when falling or being installed, then heat in the circuit board body 1 is led out through the second heat conducting sheet 305, then heat in the circuit board body 1 is led out through the first heat conducting sheets 304 on the first protection plate 201 and the second protection plate 202, and heat dissipation of the circuit board body 1 is accelerated through the micro heat dissipation fan 303 on the fixing plate 301, therefore, the heat dissipation effect of the circuit board body 1 can be effectively improved, and the short circuit of the circuit board caused by overhigh temperature is reduced.
The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.
Claims (6)
1. A communication electronic printed circuit board comprises a circuit board body (1), and is characterized in that protection mechanisms (2) are arranged at the top end and the bottom end of the circuit board body (1), the protection mechanisms (2) are used for protecting the circuit board body (1), heat dissipation mechanisms (3) are arranged at the top end and the side walls of the circuit board body (1), and the heat dissipation mechanisms (3) are used for guiding out heat generated by the circuit board body (1);
protection machanism (2) are including first guard plate (201), second guard plate (202), spacing groove (203), pull ring (204), fixture block (205), expanding spring (206) and spacing hole (207), first guard plate (201) is located the top of circuit board body (1), second guard plate (202) is located the bottom of circuit board body (1), spacing groove (203) is located the one end that first guard plate (201) and second guard plate (202) are close to circuit board body (1).
2. The communication electronic printed circuit board according to claim 1, wherein the top end of the first protection plate (201) and the bottom end of the second protection plate (202) are both provided with a limiting hole (207), one end of each of the two limiting holes (207) respectively penetrates through the first protection plate (201) and the second protection plate (202) to extend to the outside, the fixture block (205) is located inside the first protection plate (201) and the second protection plate (202), and one end of each of the two fixture blocks (205) penetrates through the first protection plate (201) and the second protection plate (202) to extend to the inside of the circuit board body (1).
3. The communication electronic printed circuit board according to claim 1, wherein the expansion springs (206) are sleeved on the circumferential side wall of the fixture block (205), one ends of the two expansion springs (206) are respectively connected with the first protection plate (201) and the second protection plate (202), one ends of the expansion springs (206) far away from the first protection plate (201) and the second protection plate (202) are connected with the fixture block (205), and the pull ring (204) is located at one end of the fixture block (205) far away from the circuit board body (1).
4. The communication electronic printed circuit board of claim 1, wherein the heat dissipation mechanism (3) comprises a fixing plate (301), a threaded rod (302), a micro heat dissipation fan (303), a first heat conduction fin (304) and a second heat conduction fin (305), one end of the fixing plate (301) is connected with the second protection plate (202), the end of the first heat conduction fin (304) is connected with the first protection plate (201) and the second protection plate (202), and the second heat conduction fin (305) is located at the top end of the circuit board body (1).
5. The communication electronic printed circuit board of claim 4, wherein the micro heat dissipation fan (303) is located at the top end of the fixing plate (301), the micro heat dissipation fan (303) is symmetrically arranged around the central axis of the fixing plate (301), the threaded rod (302) is located at the top end of the fixing plate (301), and one end of the threaded rod (302) passes through the fixing plate (301) and extends to the outside.
6. The communication electronic printed circuit board according to claim 1, wherein the circuit board body (1) comprises an insulating layer (4), a signal layer (5) and a power layer (6), the insulating layer (4) is located between the signal layer (5) and the power layer (6), the top end and the bottom end of the circuit board body (1) are provided with clamping grooves (7), and the clamping grooves (7) are matched with the clamping blocks (205).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220273646.7U CN217183537U (en) | 2022-02-10 | 2022-02-10 | Communication electronic printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220273646.7U CN217183537U (en) | 2022-02-10 | 2022-02-10 | Communication electronic printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217183537U true CN217183537U (en) | 2022-08-12 |
Family
ID=82738170
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220273646.7U Active CN217183537U (en) | 2022-02-10 | 2022-02-10 | Communication electronic printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217183537U (en) |
-
2022
- 2022-02-10 CN CN202220273646.7U patent/CN217183537U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN201467613U (en) | Combined radiator for electronic device with enclosed shell | |
| CN217183537U (en) | Communication electronic printed circuit board | |
| CN210349974U (en) | Novel battery module heat dissipation device | |
| CN216566116U (en) | PCB packaging and heat dissipation structure for power supply of lighting device | |
| CN210182847U (en) | Intelligent power distribution box convenient to heat dissipation and equipment fixing | |
| CN210133520U (en) | Circuit board with plastic package structure | |
| CN218941613U (en) | Power device with heat dissipation device | |
| CN215010025U (en) | High power density's miniaturized power module | |
| CN212629005U (en) | Conveniently-installed heat dissipation structure and router | |
| CN220399474U (en) | Cable sheath circulation monitoring device | |
| CN218831039U (en) | Power supply main board with heat dissipation device | |
| CN219780500U (en) | Ultra-thick copper circuit board | |
| CN219019125U (en) | PCB (printed circuit board) | |
| CN219960383U (en) | High-frequency power supply device | |
| CN219536698U (en) | High-power router heat radiation structure convenient to it is fixed | |
| CN219496740U (en) | Optical communication module with high heat dissipation rate | |
| CN213426782U (en) | Aluminum substrate assembly easy to dissipate heat | |
| CN213484328U (en) | Heat dissipation device for power distribution | |
| CN220525906U (en) | Current induction device | |
| CN219124529U (en) | High-frequency high-speed circuit board for 5G communication | |
| CN219437378U (en) | High-frequency microwave printing high-density HDI circuit board | |
| CN216134759U (en) | Hardware firewall for base station energy management | |
| CN212875671U (en) | Possesses multiport power electronic transformer | |
| CN220667927U (en) | Radiator fan of easy to assemble | |
| CN220137647U (en) | CPU radiator convenient to maintain |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20221228 Address after: No. 25, Digital Industrial Park, Building 3, Huicheng District, Huizhou City, Guangdong Province (Plant A), (Plant B) Patentee after: Huizhou Junya precision circuit Co.,Ltd. Address before: 516000 area 25, digital industrial park, Huicheng District (Sandong), Huizhou City, Guangdong Province Patentee before: GUANGDONG CHAMPION ASIA ELECTRONICS Co.,Ltd. |