CN215010025U - High power density's miniaturized power module - Google Patents

Abstract

The utility model discloses a high power density's miniaturized power module, including the power module body, the bottom surface of power module body is equipped with heat conduction mechanism, heat conduction mechanism includes fin and first fixed block, the top of power module body is equipped with heat dissipation mechanism, heat dissipation mechanism includes bolt, protecting crust, reference column and second fixed block, the top surface of power module body is equipped with dustproof mechanism, dustproof mechanism is including connecting lath and dustproof frame. A high power density's miniaturized power module, belong to the power module field, through the heat conduction mechanism through setting up, utilize the material characteristic of fin, derive the external world with the produced heat of power module body and cool down, the use of mechanism of cooling of deuterogamying, the louvre that utilizes the distribution law can be fine dispels the heat to the power module body, avoids the heat to cause the damage to the power module body to this life and the heat dispersion that improves the power module body.

Description

High power density's miniaturized power module

Technical Field

The utility model relates to a power module field, in particular to high power density's miniaturized power module.

Background

The power supply is an indispensable part in various electronic equipment, the performance of the power supply is directly related to the technical indexes of the electronic equipment and whether the electronic equipment can work safely and reliably, key components of the power supply module work in a high-frequency switching state, the power consumption is low, the conversion rate is high, the size and the weight of the power supply are only 20% and 30% of those of a linear power supply, and the power supply module becomes a mainstream product of a stabilized voltage power supply.

SUMMERY OF THE UTILITY MODEL

A primary object of the present invention is to provide a miniaturized power module with high power density, which can effectively solve the problems of the prior art.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

the utility model provides a high power density's miniaturized power module, includes the power module body, the bottom surface of power module body is equipped with heat conduction mechanism, heat conduction mechanism includes fin and first fixed block, the top of power module body is equipped with heat dissipation mechanism, heat dissipation mechanism includes bolt, protecting crust, reference column and second fixed block, the top surface of power module body is equipped with dustproof mechanism, dustproof mechanism is including connecting lath and dustproof frame.

Preferably, symmetrical wiring pins are fixedly welded on two sides of the power module body, and through fixing holes are respectively formed in four corner end parts of the top surface of the power module body.

Preferably, the four corner end parts of the top surface of the radiating fin are respectively and fixedly provided with an installation insertion block, the installation insertion blocks correspond to the fixing holes, the side walls of the two sides of the radiating fin are respectively and fixedly provided with a group of symmetrical first fixing blocks, and the first fixing blocks are provided with threaded holes.

Preferably, four inside corner end parts of protecting crust have the reference column of fixed mounting respectively, positioning slot has been seted up to the bottom surface of reference column, the reference column alternates to be installed on the fixed orifices, first fixed block alternates to be installed in positioning slot, fixed mounting has the second fixed block of a set of symmetry respectively on the both sides lateral wall of protecting crust, the second fixed block corresponds each other with first fixed block, also set up threaded hole on the second fixed block, the screw hole of seting up on bolt and the second fixed block and the first fixed block carries out threaded connection.

Preferably, the top surface of the protective shell is provided with a plurality of heat dissipation holes in an array mode, the side walls of the two sides of the protective shell are respectively provided with a group of symmetrical wiring notches, and the wiring notches correspond to the wiring pins.

Preferably, the top surface both sides of protecting crust there are connecting laths fixed mounting respectively, set up the recess on the inside wall of connecting lath, fixed mounting has the dust screen in the frame of dustproof frame, fixed mounting has the card strip on the both sides lateral wall of dustproof frame, the card strip alternates to be installed in the recess, dustproof frame is located between the connecting lath of symmetry, the dust screen is hugged closely with the louvre, fixed mounting has the pull ring on the front end wall of dustproof frame.

Compared with the prior art, the utility model discloses following beneficial effect has:

the utility model discloses in, heat conduction mechanism through setting up, utilize the material characteristic of fin, can be rapid derive the external world with the produced heat of power module body and cool down, so as not to make the temperature of power module body too high, the use of the mechanism that dispels the heat of deuterogamying simultaneously, the louvre that utilizes the distribution law can be fine dispels the heat to the power module body, avoid the heat to cause the damage to the power module body, with this life and the heat dispersion that improves the power module body, the dustproof mechanism of setting, can avoid the dust to enter into the power module body from the louvre on.

Drawings

Fig. 1 is a schematic view of the overall structure of the present invention;

FIG. 2 is a schematic view of the mechanism of the present invention;

fig. 3 is a schematic view of the overall structure of the power module body of the present invention;

fig. 4 is a schematic view of the overall structure of the heat conducting mechanism of the present invention;

fig. 5 is a schematic bottom view of the overall structure of the heat dissipation mechanism of the present invention;

fig. 6 is a schematic view of the structure split of the dustproof mechanism of the present invention.

In the figure: 1. a power module body; 2. a heat conducting mechanism; 3. a heat dissipation mechanism; 4. a dust-proof mechanism; 5. a bolt; 6. a wiring pin; 7. a fixing hole; 8. a heat sink; 9. installing an inserting block; 10. a first fixed block; 11. a protective shell; 12. heat dissipation holes; 13. a positioning column; 14. positioning the slot; 15. a wiring gap; 16. a second fixed block; 17. a threaded hole; 18. connecting the battens; 19. a groove; 20. a dust-proof frame; 21. a dust screen; 22. clamping the strip; 23. and (4) a pull ring.

Detailed Description

In order to make the technical means, creation features, achievement purposes and functions of the present invention easy to understand, the present invention is further described below with reference to the following embodiments.

As shown in fig. 1, a high power density's miniaturized power module, including power module body 1, the bottom surface of power module body 1 is equipped with heat conduction mechanism 2, and heat conduction mechanism 2 includes fin 8 and first fixed block 10, and the top of power module body 1 is equipped with heat dissipation mechanism 3, and heat dissipation mechanism 3 includes bolt 5, protecting crust 11, reference column 13 and second fixed block 16, and the top surface of power module body 1 is equipped with dustproof mechanism 4, and dustproof mechanism 4 is including connecting lath 18 and dust-proof frame 20.

As shown in fig. 2-5, in this embodiment, in order to improve the heat dissipation performance of the power module body 1, symmetrical connection pins 6 are fixedly welded on two sides of the power module body 1, through fixing holes 7 are respectively formed at four corner end portions of the top surface of the power module body 1, mounting plugs 9 are respectively fixedly mounted at four corner end portions of the top surface of the heat sink 8, the mounting plugs 9 correspond to the fixing holes 7, a set of symmetrical first fixing blocks 10 are respectively fixedly mounted on two side walls of the heat sink 8, threaded holes 17 are formed in the first fixing blocks 10, positioning posts 13 are respectively fixedly mounted at four corner end portions inside the protective shell 11, positioning slots 14 are formed in the bottom surfaces of the positioning posts 13, the positioning posts 13 are installed on the fixing holes 7 in an inserting manner, the first fixing blocks 10 are installed in the positioning slots 14 in an inserting manner, a set of symmetrical second fixing blocks 16 are respectively fixedly mounted on two side walls of the protective shell 11, the second fixed block 16 corresponds to the first fixed block 10, the second fixed block 16 is also provided with a threaded hole 17, the bolt 5 is in threaded connection with the threaded hole 17 formed on the second fixed block 16 and the first fixed block 10, the top surface of the protective shell 11 is provided with a plurality of radiating holes 12 in an alignment mode, the side walls of the two sides of the protective shell 11 are respectively provided with a group of symmetrical wiring gaps 15, and the wiring gaps 15 correspond to the wiring pins 6, firstly, when in use, the power module body 1 is placed on the top surface of the radiating fin 8, the mounting plug blocks 9 mounted on the radiating fin 8 penetrate through the fixing holes 7 formed on the power module body 1, then a circuit to be connected is welded on the wiring pins 6, then, the protective shell 11 is placed on the top surface of the power module body 1, and components of the power module body 1 are covered in the protective shell 11, when the operation is executed, the positioning slot 14 arranged on the bottom surface of the positioning column 13 is inserted into the mounting plug block 9, then the circuit is clamped at the wiring gap 15, the first fixing block 10 arranged on the radiating fin 8 and the second fixing block 16 arranged on the protective shell 11 are in the position aligned with each other up and down, then the bolt 5 is sequentially in threaded connection with the second fixing block 16 and the threaded hole 17 arranged on the first fixing block 10, so as to connect the power module body 1, the radiating fin 8 and the protective shell 11 together, when the power module body 1 is used, because of the material characteristics of the radiating fin 8, the heat emitted by the power module body 1 can be absorbed and exhausted outside, and the outside air is introduced to reduce the heat of the power module body 1, so as to realize the cooling of the power module body 1, the heat emitted by the power module body 1 can also be emitted through the radiating hole 12, the purpose of improving the heat dissipation performance is achieved.

As shown in fig. 6, in this embodiment, in order to prevent dust from entering the power module body 1 through the heat dissipation holes 12, two sides of the top surface of the protective casing 11 are respectively and fixedly installed with a connecting lath 18, a groove 19 is opened on the inner side wall of the connecting lath 18, a dust screen 21 is fixedly installed in the frame of the dust screen 20, two side walls of the dust screen 20 are fixedly installed with a clamping strip 22, the clamping strip 22 is inserted and installed in the groove 19, the dust screen 20 is located between the symmetrical connecting laths 18, the dust screen 21 is closely attached to the heat dissipation holes 12, a pull ring 23 is fixedly installed on the front end wall of the dust screen 20, after the connection of the power module body 1, the heat dissipation fins 8 and the protective casing 11 is completed, the dust screen 20 is installed on the top surface of the power module body 1 through the pull ring 23 and the dust screen 20 is located between the symmetrical connecting laths 18, in the installation process, the clamping strips 22 installed on two sides of the dust screen 20 are inserted into the grooves 19 opened on the inner side of the connecting laths 18, at this time, the dust screen 21 is tightly attached to the heat dissipation hole 12, and when dust enters the power module body 1 from the heat dissipation hole 12, the dust screen 21 blocks the dust, thereby achieving the purpose of dust prevention.

While the invention has been described in detail with reference to the preferred embodiments thereof, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted for elements thereof without departing from the scope of the invention, and it is intended that all matter contained in the above description or shown in the accompanying drawings shall be interpreted as illustrative and not in a limiting sense.

Claims (6)

1. A miniaturized power module of high power density characterized in that: including power module body (1), the bottom surface of power module body (1) is equipped with heat conduction mechanism (2), heat conduction mechanism (2) are including fin (8) and first fixed block (10), the top of power module body (1) is equipped with heat dissipation mechanism (3), heat dissipation mechanism (3) are including bolt (5), protecting crust (11), reference column (13) and second fixed block (16), the top surface of power module body (1) is equipped with dustproof mechanism (4), dustproof mechanism (4) are including connecting lath (18) and dustproof frame (20).

2. A high power density, miniaturized power module according to claim 1, characterized in that: the power module is characterized in that symmetrical wiring pins (6) are fixedly welded on two sides of the power module body (1), and through fixing holes (7) are respectively formed in four corner end parts of the top surface of the power module body (1).

3. A high power density, miniaturized power module according to claim 2, characterized in that: four corner end positions on the top surface of fin (8) are fixed mounting respectively have installation inserted block (9), and installation inserted block (9) and fixed orifices (7) correspond each other, respectively fixed mounting has first fixed block (10) of a set of symmetry on the both sides lateral wall of fin (8), set up threaded hole (17) on first fixed block (10).

4. A high power density, miniaturized power module according to claim 3, characterized in that: four inside corner end positions of protecting crust (11) are fixed mounting respectively has reference column (13), positioning slot (14) have been seted up to the bottom surface of reference column (13), reference column (13) alternate and install on fixed orifices (7), first fixed block (10) alternate and install in positioning slot (14), on the both sides lateral wall of protecting crust (11) respectively fixed mounting have second fixed block (16) of a set of symmetry, second fixed block (16) correspond each other with first fixed block (10), threaded hole (17) have also been seted up on second fixed block (16), threaded connection is carried out in screw hole (17) of seting up on bolt (5) and second fixed block (16) and first fixed block (10).

5. A high power density, miniaturized power module according to claim 4, characterized in that: a plurality of heat dissipation holes (12) are formed in the top surface of the protective shell (11) in an aligned mode, a set of symmetrical wiring notches (15) are formed in the side walls of the two sides of the protective shell (11) respectively, and the wiring notches (15) correspond to the wiring pins (6) mutually.

6. A high power density, miniaturized power module according to claim 5, characterized in that: the utility model discloses a dustproof wireless remote control device, including protective housing (11), the top surface both sides of protective housing (11) are fixed mounting respectively has connecting lath (18), set up on the inside wall of connecting lath (18) fluted (19), fixed mounting has dust screen (21) in the frame of dustproof frame (20), fixed mounting has card strip (22) on the both sides lateral wall of dustproof frame (20), card strip (22) alternate and install in recess (19), dustproof frame (20) are located between symmetrical connecting lath (18), dust screen (21) are hugged closely with louvre (12), fixed mounting has pull ring (23) on the front end wall of dustproof frame (20).

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