CN215871992U

CN215871992U - Circuit board with high-efficient heat dissipation

Info

Publication number: CN215871992U
Application number: CN202122497239.2U
Authority: CN
Inventors: 王蝉娟
Original assignee: Xiamen Hongjing Microelectronics Technology Co ltd
Current assignee: Xiamen Hongjing Microelectronics Technology Co ltd
Priority date: 2021-10-18
Filing date: 2021-10-18
Publication date: 2022-02-18
Anticipated expiration: 2031-10-18

Abstract

The utility model discloses a circuit board with efficient heat dissipation, and relates to the technical field of circuit boards. The heat dissipation structure comprises an insulation board, wherein a circuit board and a first heat dissipation plate are arranged on the upper side of the insulation board, two conductive columns are arranged on the lower sides of two ends of the circuit board, a plurality of air inlet fans are uniformly distributed in the first heat dissipation plate, two sides of the first heat dissipation plate are matched with a second heat dissipation plate in a sliding mode, a plurality of heat dissipation fans are uniformly distributed in the second heat dissipation plate, an aluminum box is arranged above the first heat dissipation plate, and a cooling pipe is arranged in the aluminum box; a plurality of heat dissipation holes are formed in the insulating plate. The heat dissipation plate is provided with the heat dissipation holes, so that the auxiliary circuit board can conveniently dissipate heat, the circuit board can be conveniently in a grounding state in the installation process through the conductive posts arranged on the lower side of the circuit board, the circuit board can be conveniently adjusted according to different heat generated by the circuit board through the second heat dissipation plates in sliding fit with the two sides of the first heat dissipation plate, and the heat dissipation effect of the circuit board is further conveniently improved.

Description

Circuit board with high-efficient heat dissipation

Technical Field

The utility model belongs to the technical field of circuit boards, and particularly relates to a circuit board with efficient heat dissipation.

Background

With the development of electronic information, a wiring board has become an indispensable component in many electronic devices. The circuit board has integrateed many songs electron device, therefore is small to use a plurality of circuit boards are integrated, can integrate more functions, however because the electron device inner space is comparatively narrow and small, the electrical components heat dissipation on the circuit board is comparatively difficult, leads to the circuit board in the use easily, the possibility of shut down appears, and then influences mechanical normal use.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a circuit board with efficient heat dissipation, and solves the technical problem that the existing circuit board is difficult to dissipate heat.

In order to solve the technical problems, the utility model is realized by the following technical scheme:

a circuit board with efficient heat dissipation comprises an insulation board, wherein a circuit board and a first heat dissipation plate are arranged on the upper side of the insulation board, two conductive columns are arranged on the lower sides of two ends of the circuit board, a plurality of air inlet fans are uniformly distributed in the first heat dissipation plate, two sides of the first heat dissipation plate are matched with a second heat dissipation plate in a sliding mode, a plurality of heat dissipation fans are uniformly distributed in the second heat dissipation plate, an aluminum box is arranged above the first heat dissipation plate, and a cooling pipe is arranged in the aluminum box;

a plurality of louvres have been seted up to the inside of insulation board, and the downside of insulation board is equipped with four supporting mechanism, and four supporting mechanism are located four corners of insulation board downside respectively.

Optionally, the supporting mechanism includes a spring slide bar arranged on the lower side of the insulating plate, a base is fixed at one end of the spring slide bar, and a plurality of mounting holes are formed in the base.

Optionally, four bakelite insulating blocks are arranged between the circuit board and the insulating plate, and the four bakelite insulating blocks are respectively located at corners of the lower side of the circuit board.

Optionally, four electric push rods are arranged between the first heat dissipation plate and the insulating plate.

Optionally, four cushion blocks are arranged between the aluminum box and the first heat dissipation plate, and the positions of the four cushion blocks correspond to the positions of the four electric push rods.

Optionally, the lower side sliding fit of first heating panel has four sliders, and one side of four sliders all is fixed with the bracing piece, and the second heating panel is installed in one side of every two adjacent bracing pieces.

The embodiment of the utility model has the following beneficial effects:

in one embodiment of the utility model, the heat dissipation holes are formed in the insulating plate, so that the auxiliary circuit board can conveniently dissipate heat, the conductive post arranged on the lower side of the circuit board is convenient for leading the circuit board to be in a grounding state in the installation process, the second heat dissipation plate which is in sliding fit with the two sides of the first heat dissipation plate is convenient to adjust according to different heat generated by the circuit board, thereby conveniently improving the heat dissipation effect of the circuit board, conveniently transmitting cold airflow to the aluminum box through the effect of the cooling pipe, meanwhile, the aluminum box can transmit the received cold air flow to the lower side of the aluminum box, the cold air flow is conveniently blown to the surface of the circuit board through the action of the air inlet fan in the first heat dissipation plate, the effect of cooling the circuit board is achieved, through the effect of the heat dissipation fan in the second heat dissipation plate, the gas after heat exchange is conveniently discharged, and further the heat dissipation effect of the circuit board is improved.

Of course, it is not necessary for any product in which the utility model is practiced to achieve all of the above-described advantages at the same time.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.

FIG. 1 is a schematic perspective view of an embodiment of the present invention;

FIG. 2 is a schematic top perspective view of an embodiment of the present invention;

fig. 3 is a schematic cross-sectional structure diagram according to an embodiment of the utility model.

Wherein the figures include the following reference numerals:

insulation board 1, spring slide 2, base 3, circuit board 4, lead electrical pillar 5, electric putter 6, first heating panel 7, admit air fan 8, spout 9, slider 10, bracing piece 11, second heating panel 12, heat dissipation fan 13, cushion 14, aluminium box 15, cooling tube 16, louvre 17.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the utility model, its application, or uses.

To maintain the following description of the embodiments of the present invention clear and concise, a detailed description of known functions and known components of the utility model have been omitted.

Referring to fig. 1-3, in the present embodiment, a circuit board with high efficiency heat dissipation is provided, including an insulating board 1, a circuit board 4 and a first heat dissipation plate 7 are disposed on an upper side of the insulating board 1, two conductive posts 5 are disposed on lower sides of two ends of the circuit board 4, a plurality of air inlet fans 8 are uniformly distributed inside the first heat dissipation plate 7, two sides of the first heat dissipation plate 7 are slidably matched with a second heat dissipation plate 12, a plurality of heat dissipation fans 13 are uniformly distributed inside the second heat dissipation plate 12, an aluminum box 15 is disposed above the first heat dissipation plate 7, and a cooling tube 16 is disposed inside the aluminum box 15;

a plurality of louvres 17 have been seted up to the inside of insulation board 1, and the downside of insulation board 1 is equipped with four supporting mechanism, and four supporting mechanism are located four corners of insulation board 1 downside respectively.

The application of one aspect of the embodiment is as follows: when using, earlier with circuit board 4 through the preliminary fixing of base 3 on quick-witted case, then adjust and lead electrical pillar 5 and make to lead electrical pillar 5 and can contact the quick-witted case board of quick-witted case, and then accomplish the installation to circuit board 4, when circuit board 4 produced the heat not high, one side of circuit board 4 is kept away from to two second heating panels 12, the heat that circuit board 4 produced can be released through louvre 17 and the all side gaps of circuit board 4, when circuit board 4 produced the heat and is too high, slide two second heating panels 12, make two second heating panels 12 be close to the both sides of circuit board 4, then the inside of cooling tube 16 can flow the cooling water, the cold air current of cooling tube 16 conduction can be blown to the surface of circuit board 4 to the fan of admitting air 8 of installing inside first heating panel 7, heat dissipation fan 13 in the second heating panel 12 can discharge the air current after the exchange simultaneously. It should be noted that all the electric devices referred to in this application may be powered by a storage battery or an external power source.

The heat dissipation holes 17 arranged in the insulating plate 1 are convenient for the auxiliary circuit board 4 to dissipate heat, the conductive posts 5 arranged on the lower side of the circuit board 4 are convenient for the circuit board 4 to be in a grounding state in the installation process, the second heat dissipation plate 12 which is in sliding fit with the two sides of the first heat dissipation plate 7 is convenient to adjust according to different heat generated by the circuit board 4, thereby improving the heat dissipation effect of the circuit board 4, transmitting cold air flow to the aluminum box 15 conveniently through the function of the cooling pipe 16, meanwhile, the aluminum box 15 can transmit the received cold air flow to the lower side of the aluminum box 15, the cold air flow is conveniently blown to the surface of the circuit board 4 through the action of the air inlet fan 8 in the first heat dissipation plate 7, the effect of cooling the circuit board 4 is achieved, through the effect of the heat dissipation fan 13 in the second heat dissipation plate 12, the gas after heat exchange is conveniently discharged, and further the heat dissipation effect on the circuit board 4 is improved.

Referring to fig. 3, the supporting mechanism of the present embodiment includes a spring slide bar 2 installed on the lower side of an insulating plate 1, a base 3 is fixed to one end of the spring slide bar 2, a plurality of mounting holes are formed inside the base 3, four bakelite insulation blocks are installed between a circuit board 4 and the insulating plate 1, and the four bakelite insulation blocks are respectively located at corners of the lower side of the circuit board 4.

Referring to fig. 2, in the embodiment, four electric push rods 6 are installed between the first heat sink 7 and the insulating plate 1, four cushion blocks 14 are installed between the aluminum box 15 and the first heat sink 7, and the positions of the four cushion blocks 14 correspond to the positions of the four electric push rods 6, so that the height of the first heat sink 7 from the circuit board 4 can be conveniently adjusted through the action of the electric push rods 6, and the heat dissipation effect on the circuit board 4 can be conveniently controlled.

Please refer to fig. 3, the lower side of the first heat dissipating plate 7 of the present embodiment is slidably fitted with four sliding blocks 10, specifically, the lower side of the first heat dissipating plate 7 is provided with four sliding grooves 9, the four sliding blocks 10 are slidably fitted inside the sliding grooves 9, one side of each of the four sliding blocks 10 is fixed with a supporting rod 11, the second heat dissipating plate 12 is mounted on one side of each two adjacent supporting rods 11, and the distance between the second heat dissipating plate 12 and the circuit board 4 is conveniently controlled by the sliding effect of the sliding blocks 10 in the sliding grooves 9, so as to conveniently control the heat dissipating strength.

The above embodiments may be combined with each other.

It should be noted that in the description of the present specification, descriptions such as "first", "second", etc. are only used for distinguishing features, and do not have an actual order or meaning, and the present application is not limited thereto.

In the description herein, references to the description of "one embodiment," "an example," "a specific example" or the like are intended to mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the utility model. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

The preferred embodiments of the utility model disclosed above are intended to be illustrative only. The preferred embodiments are not intended to be exhaustive or to limit the utility model to the precise embodiments disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the utility model and the practical application, to thereby enable others skilled in the art to best utilize the utility model. The utility model is limited only by the claims and their full scope and equivalents.

Claims

1. A circuit board with efficient heat dissipation, comprising: the heat dissipation structure comprises an insulation board (1), wherein a circuit board (4) and a first heat dissipation plate (7) are arranged on the upper side of the insulation board (1), two conductive columns (5) are arranged on the lower sides of two ends of the circuit board (4), a plurality of air inlet fans (8) are uniformly distributed in the first heat dissipation plate (7), two sides of the first heat dissipation plate (7) are in sliding fit with a second heat dissipation plate (12), a plurality of heat dissipation fans (13) are uniformly distributed in the second heat dissipation plate (12), an aluminum box (15) is arranged above the first heat dissipation plate (7), and a cooling pipe (16) is arranged in the aluminum box (15);

a plurality of louvres (17) have been seted up to the inside of insulation board (1), and the downside of insulation board (1) is equipped with four supporting mechanism, and four supporting mechanism are located four corners of insulation board (1) downside respectively.

2. The circuit board with high-efficiency heat dissipation of claim 1, wherein the supporting mechanism comprises a spring slide rod (2) arranged on the lower side of the insulating plate (1), a base (3) is fixed at one end of the spring slide rod (2), and a plurality of mounting holes are formed in the base (3).

3. A circuit board with high efficiency heat dissipation according to claim 1, characterized in that four bakelite insulation blocks are arranged between the circuit board (4) and the insulation board (1), and the four bakelite insulation blocks are respectively arranged at the corners of the lower side of the circuit board (4).

4. A circuit board with high efficiency heat dissipation according to claim 1, characterized in that four electric push rods (6) are arranged between the first heat dissipation plate (7) and the insulation plate (1).

5. A circuit board with high efficiency heat dissipation as defined in claim 1, wherein four spacers (14) are installed between the aluminum case (15) and the first heat dissipation plate (7), and the positions of the four spacers (14) correspond to the positions of the four electric push rods (6).

6. A circuit board with high efficiency heat dissipation as defined in claim 1, wherein the first heat dissipation plate (7) has four sliding blocks (10) sliding fitted on its lower side, and supporting rods (11) are fixed on one side of each of the four sliding blocks (10), and the second heat dissipation plate (12) is installed on one side of each two adjacent supporting rods (11).