CN215647579U - Packaging ceramic substrate with good heat dissipation effect - Google Patents
Packaging ceramic substrate with good heat dissipation effect Download PDFInfo
- Publication number
- CN215647579U CN215647579U CN202121675179.2U CN202121675179U CN215647579U CN 215647579 U CN215647579 U CN 215647579U CN 202121675179 U CN202121675179 U CN 202121675179U CN 215647579 U CN215647579 U CN 215647579U
- Authority
- CN
- China
- Prior art keywords
- heat dissipation
- bottom plate
- ceramic substrate
- dissipation effect
- vertical portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000000694 effects Effects 0.000 title claims abstract description 31
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 31
- 239000000758 substrate Substances 0.000 title claims abstract description 26
- 239000000919 ceramic Substances 0.000 title claims abstract description 25
- 238000004806 packaging method and process Methods 0.000 title abstract description 9
- 238000005452 bending Methods 0.000 claims abstract description 10
- 238000009423 ventilation Methods 0.000 claims abstract description 9
- 239000003292 glue Substances 0.000 claims description 3
- 239000000428 dust Substances 0.000 abstract description 5
- 238000007599 discharging Methods 0.000 abstract description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model provides a packaging ceramic substrate with good heat dissipation effect, which comprises a bottom plate and a surrounding plate arranged at the edge of the bottom plate, wherein a plurality of heat dissipation holes are formed in the bottom end of the bottom plate, transverse ventilation holes are formed in the lower ends of the heat dissipation holes of the bottom plate, each heat dissipation hole comprises a first vertical portion, a bending portion arranged at the lower end of the first vertical portion, and a second vertical portion arranged at the lower end of the bending portion, and the second vertical portion is connected with the transverse ventilation holes. Above-mentioned packaging ceramic substrate that radiating effect is good through setting up the louvre for heat on the bottom plate is through the louvre during the lateral vent hole looses, and then outside the bottom plate of discharging, wherein, through the flexion of louvre, prevents that the dust from getting into the bottom plate from the louvre in, plays dustproof effect, both can improve the radiating effect, can guarantee dustproof performance again.
Description
Technical Field
The utility model relates to the technical field, in particular to a packaging ceramic substrate with a good heat dissipation effect.
Background
The ceramic substrate means that a copper foil is directly bonded to alumina (Al) at a high temperature2O3) Or a special process plate on the surface (single or double side) of an aluminum nitride (AlN) ceramic substrate. The manufactured ultrathin composite substrate has excellent electrical insulation performance, high heat conduction characteristic, excellent soft solderability and high adhesion strength, can be etched into various patterns like a PCB (printed circuit board), and has great current carrying capacity. Therefore, the ceramic substrate has become a basic material for high-power electronic circuit structure technology and interconnection technology.
The surface of the existing ceramic substrate is bonded with a large amount of copper foil, so that a large amount of heat can be generated during working, the heat is not easy to dissipate, and the ceramic substrate is easy to damage due to high temperature.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a packaging ceramic substrate with good heat dissipation effect, and aims to solve the problem that the existing ceramic substrate is poor in heat dissipation effect.
The utility model provides a packaging ceramic substrate with good heat dissipation effect, which comprises a bottom plate and a surrounding plate arranged at the edge of the bottom plate, wherein a plurality of heat dissipation holes are formed in the bottom end of the bottom plate, transverse ventilation holes are formed in the lower ends of the heat dissipation holes of the bottom plate, each heat dissipation hole comprises a first vertical portion, a bending portion arranged at the lower end of the first vertical portion, and a second vertical portion arranged at the lower end of the bending portion, and the second vertical portion is connected with the transverse ventilation holes.
Above-mentioned packaging ceramic substrate that radiating effect is good through setting up the louvre for heat on the bottom plate is through the louvre during the lateral vent hole looses, and then outside the bottom plate of discharging, wherein, through the flexion of louvre, prevents that the dust from getting into the bottom plate from the louvre in, plays dustproof effect, both can improve the radiating effect, can guarantee dustproof performance again.
Further, a first filter screen is arranged in the middle of the bending portion.
Furthermore, two ends of the transverse ventilation hole are respectively provided with a second filter screen.
Furthermore, the upper end of the bottom plate is provided with a supporting block.
Furthermore, the upper end of the supporting block is provided with a glue containing groove.
Furthermore, both ends of the transverse vent hole are trumpet-shaped.
Furthermore, heat conducting wires are arranged in the heat radiating holes, and the lower ends of the heat conducting wires extend into the transverse ventilation holes.
Drawings
FIG. 1 is a schematic structural diagram of a packaged ceramic substrate with a good heat dissipation effect according to a first embodiment of the present invention;
FIG. 2 is an enlarged schematic view of the structure of FIG. 1 at circle A;
FIG. 3 is a schematic structural diagram of a packaged ceramic substrate with a good heat dissipation effect according to a second embodiment of the present invention;
fig. 4 is an enlarged schematic view of the structure of fig. 3 at circle B.
Description of the main element symbols:
| |
10 | Second vertical part | 113 | |
40 |
| |
11 | |
12 | |
50 |
| First vertical part | 111 | |
20 | ||
| Bending part | 112 | Supporting |
30 |
The following detailed description will further illustrate the utility model in conjunction with the above-described figures.
Detailed Description
To facilitate an understanding of the utility model, the utility model will now be described more fully with reference to the accompanying drawings. Several embodiments of the utility model are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the utility model herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Referring to fig. 1 and 2, a packaged ceramic substrate with a good heat dissipation effect according to a first embodiment of the present invention includes a bottom plate 10 and a surrounding plate 20 disposed at an edge of the bottom plate 10, wherein a plurality of heat dissipation holes 11 are disposed at a bottom end of the bottom plate 10, a lateral vent hole 12 is disposed at a lower end of the bottom plate 10 at the plurality of heat dissipation holes 11, each heat dissipation hole 11 includes a first vertical portion 111, a bending portion 112 disposed at a lower end of the first vertical portion 111, and a second vertical portion 113 disposed at a lower end of the bending portion 112, and the second vertical portion 113 is connected to the lateral vent hole 12.
Above-mentioned packaging ceramic substrate that radiating effect is good through setting up louvre 11 for heat on the bottom plate 10 is through louvre 11 during the lateral vent hole 12 of scattering into, and then outside discharging bottom plate 10, wherein, through the flexion 112 of louvre 11, prevents that the dust from getting into bottom plate 10 from louvre 11 in, plays dustproof effect, both can improve the radiating effect, can guarantee dustproof performance again.
Specifically, in this embodiment, the upper end of the bottom plate 10 is provided with a supporting block 30, so as to mount other components, and a gap exists between the other components and the heat dissipation hole 11, so that hot air enters the heat dissipation hole 11, thereby improving the heat dissipation effect, specifically, in this embodiment, the upper end of the supporting block 30 is provided with a glue accommodating groove (not shown) so as to fix the other components.
Referring to fig. 3 and 4, a first filter screen 40 is disposed in the middle of the bending portion 112 to further prevent dust from entering the bottom plate 11, so as to improve the dust-proof effect.
Specifically, in this embodiment, two ends of the lateral vent hole 12 are respectively provided with a second filter screen 50, so as to further prevent dust from entering the bottom plate 11, and improve the dustproof effect.
Specifically, in an embodiment of the present invention, both ends of the transverse vent 12 are in a horn shape, so as to increase the air intake of the transverse vent 12, thereby increasing the heat dissipation effect.
Specifically, in this embodiment, all be equipped with heat conduction wire (not shown in the figure) in the louvre 11, the lower extreme of heat conduction wire extends to in the lateral vent 12 to distribute away in leading-in lateral vent 12 of heat with in the louvre 11 fast, improved the radiating effect.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (7)
1. The utility model provides a packaged ceramic substrate that radiating effect is good, its characterized in that includes the bottom plate and locates the bounding wall at bottom plate edge, the bottom of bottom plate is equipped with a plurality of louvres, the bottom plate is located a plurality of the lower extreme of louvre is equipped with the horizontal ventilation hole, the louvre includes first vertical portion, locates the flexion of first vertical portion lower extreme, and locates the second vertical portion of flexion lower extreme, the vertical portion of second with the horizontal ventilation hole is connected.
2. The packaged ceramic substrate with good heat dissipation effect of claim 1, wherein a first filter screen is disposed in the middle of the bending portion.
3. The packaged ceramic substrate with good heat dissipation effect as claimed in claim 1, wherein a second filter is disposed at each end of the lateral vent.
4. The packaged ceramic substrate with good heat dissipation effect as claimed in claim 1, wherein a support block is disposed at an upper end of the bottom plate.
5. The packaged ceramic substrate with good heat dissipation effect as claimed in claim 4, wherein the supporting block is provided with a glue receiving groove at an upper end thereof.
6. The packaged ceramic substrate with good heat dissipation effect as claimed in claim 1, wherein both ends of the lateral vent are trumpet-shaped.
7. The packaged ceramic substrate with good heat dissipation effect of claim 1, wherein the heat dissipation holes are all provided with heat conduction wires, and the lower ends of the heat conduction wires extend into the transverse ventilation holes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121675179.2U CN215647579U (en) | 2021-07-22 | 2021-07-22 | Packaging ceramic substrate with good heat dissipation effect |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121675179.2U CN215647579U (en) | 2021-07-22 | 2021-07-22 | Packaging ceramic substrate with good heat dissipation effect |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215647579U true CN215647579U (en) | 2022-01-25 |
Family
ID=79891567
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121675179.2U Expired - Fee Related CN215647579U (en) | 2021-07-22 | 2021-07-22 | Packaging ceramic substrate with good heat dissipation effect |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215647579U (en) |
-
2021
- 2021-07-22 CN CN202121675179.2U patent/CN215647579U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20220125 |