CN218788904U - Heat radiator for frequency conversion fan power device - Google Patents
Heat radiator for frequency conversion fan power device Download PDFInfo
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- CN218788904U CN218788904U CN202222859687.7U CN202222859687U CN218788904U CN 218788904 U CN218788904 U CN 218788904U CN 202222859687 U CN202222859687 U CN 202222859687U CN 218788904 U CN218788904 U CN 218788904U
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- power device
- radiator
- base board
- aluminium base
- heat
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Abstract
The utility model discloses a heat abstractor of frequency conversion fan power device, include the mainboard, install power device module, installation casing and radiator on the mainboard, the installation casing is used for the installation mainboard and radiator, power device module includes power device and aluminium base board, power device pastes the dress on aluminium base board, the radiator laminating is on aluminium base board. The utility model discloses in, through pasting aluminium base board in power device, conduct the heat to the radiator through aluminium base board, later distribute away the heat through the radiator, here pasted aluminium base board in power device, the thermal resistance is little, has improved the radiating efficiency greatly.
Description
Technical Field
The utility model relates to a heat abstractor of frequency conversion fan power device.
Background
There is power device in the current frequency conversion fan mainboard, and power device can generate heat in work, usually need dispel the heat (the powerful fan of especially) to it, otherwise can cause power device to damage easily.
Disclosure of Invention
An object of the utility model is to provide a heat abstractor of frequency conversion fan power device to solve the problem that proposes in the above-mentioned background art. In order to achieve the above object, the utility model provides a following technical scheme:
the heat dissipation device comprises a mainboard, a power device module arranged on the mainboard, an installation shell and a heat radiator, wherein the installation shell is used for installing the mainboard and the heat radiator, the power device module comprises a power device and an aluminum substrate, the power device is attached to the aluminum substrate, and the heat radiator is attached to the aluminum substrate.
Further, the radiator is provided with a heat dissipation contact piece, and the heat dissipation contact piece is attached to the aluminum substrate.
Furthermore, the mounting shell is provided with an avoiding hole, the mainboard is arranged on the inner side of the mounting shell, the radiator is arranged on the outer side of the mounting shell, and the radiating contact piece of the radiator is attached to the aluminum substrate through the avoiding hole.
Further, the power device is mounted on the aluminum substrate through an SMT process.
The beneficial effects of the utility model reside in that: the utility model discloses in, through pasting aluminium base board in power device, conduct the heat to the radiator through aluminium base board, later distribute away the heat through the radiator, here pasted aluminium base board in power device, the thermal resistance is little, has improved the radiating efficiency greatly.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is the structure schematic diagram of the heat dissipation device of the frequency conversion fan power device of the present invention.
It is noted that the drawings are not necessarily to scale and are merely illustrative in nature and not intended to obscure the reader.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In the present invention, the terms "upper", "lower", "left", "right", "front", "rear", "top", "bottom", "inner", "outer", "middle", "vertical", "horizontal", "lateral", "longitudinal", and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. These terms are used primarily to better describe the invention and its embodiments, and are not intended to limit the indicated devices, elements or components to a particular orientation or to be constructed and operated in a particular orientation.
Moreover, some of the above terms may be used to indicate other meanings besides the orientation or positional relationship, for example, the term "on" may also be used to indicate some kind of attachment or connection relationship in some cases. The specific meaning of these terms in the present invention can be understood by those of ordinary skill in the art as appropriate.
Furthermore, the terms "mounted," "disposed," "provided," "connected," and "connected" are to be construed broadly. For example, it may be a fixed connection, a removable connection, or a unitary construction; can be a mechanical connection, or an electrical connection; may be directly connected, or indirectly connected through intervening media, or may be in internal communication between two devices, elements or components. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
Furthermore, the terms "first," "second," and the like, are used primarily to distinguish one device, element, or component from another (the specific nature and configuration may be the same or different), and are not used to indicate or imply the relative importance or number of the indicated devices, elements, or components. "plurality" means two or more unless otherwise specified.
It is also to be understood that the terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used in the specification and the appended claims, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.
It should be further understood that the term "and/or" as used in the specification and the appended claims refers to any and all possible combinations of one or more of the associated listed items, and includes such combinations.
As shown in fig. 1, the utility model provides a heat abstractor of frequency conversion fan power device, including mainboard 1, install power device module 2, installation casing 3 and radiator 4 on mainboard 1, installation casing 4 is used for the installation mainboard 1 and radiator 4, power device module 2 includes power device 21 and aluminium base board 22, power device 21 pastes the dress and is in on aluminium base board 22, radiator 4 laminates on aluminium base board 22.
The utility model discloses in, through adorning aluminium base board 22 in power device 21, conduct the heat to radiator 4 through aluminium base board 22, later distribute away the heat through radiator 4, here adorned aluminium base board 22 in power device 21, the thermal resistance is little, has improved the radiating efficiency greatly.
As a further aspect of the present invention: the heat sink 4 is provided with a heat radiating contact piece 41, and the heat radiating contact piece 41 is attached to the aluminum substrate 22.
As the utility model discloses in the further scheme: the mounting shell 3 is provided with an avoiding hole 31, the main board 1 is arranged on the inner side of the mounting shell 4, the radiator 4 is arranged on the outer side of the mounting shell 3, and the heat dissipation contact piece 41 of the radiator 4 is attached to the aluminum substrate 22 through the avoiding hole 31. The heat radiator is arranged outside the mounting shell, so that heat of the power device can be directly guided to the outside of the mounting shell, and the heat radiation effect is higher.
As a further aspect of the present invention: the power device 21 is attached to the aluminum substrate 22 by an SMT process. The utility model discloses well adoption SMT technology, processing is simple, and the cost is lower.
For the embodiments of the present invention, it should be further explained that, under the condition of no conflict, the features in the embodiments and embodiments of the present invention can be combined with each other to obtain a new embodiment.
The above description is only a preferred embodiment of the present invention, and should not be taken as limiting the invention in any way, and the scope of the present invention should be defined by the appended claims. Although the present invention has been described in terms of the preferred embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, and that various modifications, equivalent variations and modifications may be made by those skilled in the art without departing from the scope of the invention.
Claims (4)
1. The utility model provides a heat abstractor of frequency conversion fan power device which characterized in that: the power device module comprises a power device and an aluminum substrate, wherein the power device is mounted on the main board, the mounting shell is used for mounting the main board and the radiator, the power device module comprises a power device and the aluminum substrate, the power device is mounted on the aluminum substrate in an attached mode, and the radiator is mounted on the aluminum substrate in an attached mode.
2. The heat dissipation device of a variable frequency fan power device as claimed in claim 1, wherein: the radiator is provided with a heat dissipation contact piece, and the heat dissipation contact piece is attached to the aluminum substrate.
3. The heat dissipation device of the variable frequency fan power device according to claim 2, wherein: the mounting shell is provided with an avoiding hole, the mainboard is arranged on the inner side of the mounting shell, the radiator is arranged on the outer side of the mounting shell, and the radiating contact piece of the radiator is attached to the aluminum substrate through the avoiding hole.
4. The heat dissipation device of the variable frequency fan power device according to any one of claims 1 to 3, wherein: the power device is attached to the aluminum substrate through an SMT process.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202222859687.7U CN218788904U (en) | 2022-10-28 | 2022-10-28 | Heat radiator for frequency conversion fan power device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202222859687.7U CN218788904U (en) | 2022-10-28 | 2022-10-28 | Heat radiator for frequency conversion fan power device |
Publications (1)
Publication Number | Publication Date |
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CN218788904U true CN218788904U (en) | 2023-04-04 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN202222859687.7U Active CN218788904U (en) | 2022-10-28 | 2022-10-28 | Heat radiator for frequency conversion fan power device |
Country Status (1)
Country | Link |
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CN (1) | CN218788904U (en) |
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2022
- 2022-10-28 CN CN202222859687.7U patent/CN218788904U/en active Active
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