CN202455666U - Press fitting power transistor for PCB (printed circuit board) - Google Patents
Press fitting power transistor for PCB (printed circuit board) Download PDFInfo
- Publication number
- CN202455666U CN202455666U CN2012200276516U CN201220027651U CN202455666U CN 202455666 U CN202455666 U CN 202455666U CN 2012200276516 U CN2012200276516 U CN 2012200276516U CN 201220027651 U CN201220027651 U CN 201220027651U CN 202455666 U CN202455666 U CN 202455666U
- Authority
- CN
- China
- Prior art keywords
- power transistor
- pcb
- radiator
- pcb board
- press fitting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Abstract
The utility model discloses a press fitting power transistor for a PCB. The power transistor comprises a power transistor and is characterized by further comprising an epoxy plastic plate, wherein the power transistor is welded in a corresponding bonding pad hole through a pin of the power transistor, and the epoxy plastic plate is positioned between the power transistor and the PCB, and is closely attached to the power transistor. According to a radiating requirement, the power transistor is placed at the center of a radiator, the radiating effect is better, the size of the radiator is reduced, the integrated electrical equipment is compact, and the size of the electrical equipment is smaller.
Description
Technical field
the utility model relates to a kind of transistor, and especially a kind of pcb board is with press-fiting power transistor.
Background technology
Circuit topological structure like frequency converter, inverter, ups etc., need be formed with a plurality of power transistors, to realize certain function in
in some electric equipment.The installation method of these power transistors generally all be with its pin from 90 ° of root bendings, be welded to then on the PCB, its shape is as shown in Figure 1.Because during power transistor work, dissipation power is very big, just caloric value is very big, need radiator be close in its baseplane of dispelling the heat and dispel the heat.For better heat conduction, this transistor bottom is a copper base, during work is to have very high-tensionly, insulate so the very thin heat conductive insulating pad of one deck all is installed between its base copper substrate and the radiator.Power transistor self has an installing hole, if directly pass this installing hole it is press fit on the radiator with screw, and be infeasible, because the distance of the electrical safety between metallic screw and its copper base is not enough, do not meet the safety requirement.The pressing method of power transistor has two kinds usually at present: the first, with resilient metal sheeting it is press fit on the radiator; The second, be pressed onto on the power transistor with the ceramic crystal lid, with screw the ceramic crystal cover lock is tightened on the radiator then.This dual mode all is press fit into power transistor on the radiator well tightly, reaches the heat radiation purpose, has solved Insulation Problems again well.But all exist following not enough: the first, reserve necessary assembly space in order to give metal sheeting or ceramic crystal lid, the necessary design arrangement of power transistor is at the edge of PCB, and this brings limitation just for the design of PCB fabric swatch; The second, because power transistor must be arranged in the edge of PCB, also be exactly the edge of whole big radiator basically, pyrotoxin is not just at the middle position of radiator like this, and radiating effect is bad, influences the effect of power transistor.
Summary of the invention
the utility model purpose is: provide pcb board a kind of simple in structure, easy for installation with press-fiting power transistor.
The technical scheme of
the utility model is: a kind of pcb board is with press-fiting power transistor; Comprise power transistor; The pin of said power transistor through power transistor is welded on the pcb board in the corresponding pad hole; It is characterized in that, also comprise the epoxy plastics plate, said epoxy plastics plate is between power transistor and pcb board and be close to power transistor.
are further, and said epoxy plastics plate is a rectangle.
mounting means pastes the epoxy plastics plate on the position of pcb board back side regulation, then the power transistor pin is inserted PCB and goes up corresponding pad hole; Let the power transistor upper surface be close to the epoxy plastics plate; Weld pin then, good pcb board is placed on the radiator will to assemble welding again, screw is passed the installing hole of epoxy plastics plate; Tighten on the radiator, so just transistor has been press fit on the radiator.
The utility model has the advantages that:
power transistor position does not receive the mounting structure restriction, can power transistor be arranged on the PCB correct position neatly according to circuit structure and the requirement of PCB fabric swatch; Can combine the requirement of dispelling the heat, power transistor is arranged in the middle position of radiator, make radiating effect better, reduce the radiator volume simultaneously, make whole electric equipment compact, it is littler that volume becomes.
Description of drawings
Below in conjunction with accompanying drawing and embodiment the utility model is further described:
Fig. 1 is existing power transistor sketch map.
Fig. 2 for the pcb board of the utility model with press-fiting power transistor.
wherein: 1 epoxy plastics plate; The 2PCB plate; 3 power transistors; 4 radiators; 5 screws.
Embodiment
embodiment: pcb board as shown in Figure 2 is with press-fiting power transistor; Comprise power transistor; The pin of said power transistor through power transistor is welded on the pcb board in the corresponding pad hole; It is characterized in that, also comprise the epoxy plastics plate, said epoxy plastics plate is between power transistor and pcb board and be close to power transistor.In the present embodiment, the epoxy plastics plate is a rectangle, also can be other shapes.During operating state, epoxy plastics plate 1 is pasted on the position of pcb board 2 back sides regulation, then power transistor 3 pins are inserted corresponding pad hole on the pcb board 2; Let power transistor 3 upper surfaces be close to epoxy plastics plate 1; Weld pin then, good pcb board is placed on the radiator 4 will to assemble welding again, screw 5 is passed the installing hole of epoxy plastics plate 1; Tighten on the radiator 4, so just power transistor 3 has been press fit on the radiator 4.
the foregoing description certainly only are the technical conceive and the characteristics of explanation the utility model; Its purpose is to let the people who is familiar with this technology can understand content of the utility model and enforcement according to this, can not limit the protection range of utility model with this.All modifications of doing according to the spirit of the utility model main technical schemes all should be encompassed within the protection range of the utility model.
Claims (2)
1. a pcb board is with press-fiting power transistor; Comprise power transistor; The pin of said power transistor through power transistor is welded on the pcb board in the corresponding pad hole; It is characterized in that, also comprise the epoxy plastics plate, said epoxy plastics plate is between power transistor and pcb board and be close to power transistor.
2. pcb board according to claim 1 is characterized in that with press-fiting power transistor said epoxy plastics plate is a rectangle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012200276516U CN202455666U (en) | 2012-01-20 | 2012-01-20 | Press fitting power transistor for PCB (printed circuit board) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012200276516U CN202455666U (en) | 2012-01-20 | 2012-01-20 | Press fitting power transistor for PCB (printed circuit board) |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202455666U true CN202455666U (en) | 2012-09-26 |
Family
ID=46871484
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012200276516U Expired - Fee Related CN202455666U (en) | 2012-01-20 | 2012-01-20 | Press fitting power transistor for PCB (printed circuit board) |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202455666U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109195307A (en) * | 2018-08-30 | 2019-01-11 | 苏州汇川技术有限公司 | Semiconductor element assembly technology, power module and power electronic equipment |
| CN109219233A (en) * | 2018-09-04 | 2019-01-15 | 合肥巨动力系统有限公司 | Pcb board and IGBT module crimping structure and compression bonding method |
-
2012
- 2012-01-20 CN CN2012200276516U patent/CN202455666U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109195307A (en) * | 2018-08-30 | 2019-01-11 | 苏州汇川技术有限公司 | Semiconductor element assembly technology, power module and power electronic equipment |
| CN109219233A (en) * | 2018-09-04 | 2019-01-15 | 合肥巨动力系统有限公司 | Pcb board and IGBT module crimping structure and compression bonding method |
| CN109219233B (en) * | 2018-09-04 | 2021-01-22 | 合肥巨一动力系统有限公司 | Crimping structure and crimping method for PCB and IGBT module |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5071558B2 (en) | Circuit module | |
| EP3307036B1 (en) | Mobile terminal and heat dissipation shielding structure | |
| CN108702856B (en) | Circuit structure | |
| US10090657B2 (en) | Circuit assembly, connected busbar structure, and electrical junction box | |
| CN102159054B (en) | Electronic package structure | |
| JP2018182147A (en) | Substrate with metal member, circuit configuration body, and electric connection box | |
| CN107925233B (en) | Circuit structure and electrical connection box | |
| CN202455666U (en) | Press fitting power transistor for PCB (printed circuit board) | |
| CN106256063B (en) | circuit structure and electric connection box | |
| US20100110641A1 (en) | Power supply apparatus | |
| CN209983014U (en) | Power type electronic product with multi-surface heat dissipation function | |
| CN202121492U (en) | Power source and power source casing thereof | |
| CN210008110U (en) | High-insulation heat dissipation structure of power modules | |
| CN103384465A (en) | Heat conducting system with electronic power element adhered on circuit board | |
| CN104716823A (en) | DC/DC power module and power system provided with same | |
| CN210839945U (en) | Vehicle-mounted power amplifier case with radiating plate laterally placed and vehicle-mounted display | |
| JP2016119395A (en) | Power supply device | |
| JP2015082960A (en) | Dc-dc converter device | |
| JP2015104183A (en) | Circuit structure body and dc-dc converter device | |
| CN208836465U (en) | A kind of high-power low pressure inverter structure | |
| CN206575756U (en) | Radome radiating product | |
| CN203416495U (en) | Heat conduction system with electronic power components mounted on circuit board | |
| CN202679894U (en) | Heat radiator applied in ultrathin power supply | |
| CN205105500U (en) | Radiator and power module | |
| CN213755478U (en) | Heat radiator |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120926 Termination date: 20200120 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |