CN109585435B

CN109585435B - Power device

Info

Publication number: CN109585435B
Application number: CN201710897025.XA
Authority: CN
Inventors: 胡长风; 石廷昌; 陈燕平; 黄南; 蒋云富; 熊辉; 邵强; 王世平; 忻兰苑; 刘敏安; 李保国
Original assignee: Zhuzhou CRRC Times Electric Co Ltd
Current assignee: Zhuzhou CRRC Times Semiconductor Co Ltd
Priority date: 2017-09-28
Filing date: 2017-09-28
Publication date: 2020-07-03
Anticipated expiration: 2037-09-28
Also published as: CN109585435A

Abstract

The invention provides a power device, which comprises an IGBT module; the FRD module is correspondingly connected with the IGBT module in parallel, and the FRD module and the IGBT module form a half-bridge circuit structure; the power device is a radiating component for radiating the IGBT module and the FRD module, and is good in stability.

Description

Power device

Technical Field

The invention relates to the technical field of power electronic devices, in particular to a power device.

Background

With the continuous expansion of the application field of the IGBT, the performance requirement on the IGBT device is higher and higher. Higher power grade and high reliability of the IGBT device are the development trend of the IGBT device.

From this, it is for the technical problem to be solved to design a power device that works stably.

Disclosure of Invention

The present invention is directed to a power device that solves some or all of the above-mentioned problems of the prior art. The power device is of a half-bridge circuit structure, and is provided with a heat dissipation component for dissipating heat of the IGBT module and the FRD module, so that the power device is stable in work.

According to the invention, a power device is proposed, comprising:

an IGBT module group is arranged on the base plate,

the FRD module is correspondingly connected with the IGBT module in parallel, the FRD module and the IGBT module form a half-bridge circuit structure,

the heat dissipation component is used for dissipating heat of the IGBT module and the FRD module.

In one embodiment, at least one of the IGBT module and the FRD module includes:

an upper end plate is arranged on the upper side of the main body,

a lower end plate is arranged at the lower end of the lower end plate,

a power module disposed between the upper end plate and the lower end plate, the power module having an even number of power sub-units connected in series, a first electrical connection member contactingly disposed between adjacent power sub-units, a second electrical connection member contactingly disposed on an upper surface of an uppermost power sub-unit, and a third electrical connection member contactingly disposed on a lower surface of a lowermost power sub-unit,

an upper insulating plate disposed between the upper end plate and the second electrical connector,

a lower insulating plate disposed between the lower end plate and the third electrical connector,

a connecting rod for connecting the upper end plate and the lower end plate.

In one embodiment, an upper bearing assembly is disposed between the upper insulating plate and the upper end plate, the upper bearing assembly having a first bearing disk,

and a lower bearing disc is arranged between the lower insulating plate and the lower end plate.

In one embodiment, the upper bearing assembly further comprises a second bearing disc disposed opposite to the first bearing disc and a ball member embedded between the first bearing disc and the second bearing disc.

In one embodiment, a cushion is disposed between the upper bearing assembly and the upper end plate.

In one embodiment, the upper insulating plate is configured with a first circumferentially extending groove on its outer circumferential surface,

and/or a second groove extending along the circumferential direction is formed on the outer circumferential surface of the lower insulating plate.

In one embodiment, the upper end surface of the upper insulating plate is configured with a first groove for embedding the first bearing assembly,

and/or the lower end face of the lower insulating plate is configured with a second groove for embedding the lower bearing disc.

In one embodiment, at least one of the first electrical connector, the second electrical connector, and the third electrical connector is configured as a case, and an inlet and an outlet are configured on a sidewall of the case, and a flow passage for communicating the inlet and the outlet is configured inside the case.

In one embodiment, a heat dissipation assembly comprises:

a heat-dissipating source for dissipating heat from the heat-dissipating source,

a heat radiation pipe communicated with the heat radiation source and the box body,

wherein, the cooling tube is connected with the heat dissipation source and the box body by a first joint.

In one embodiment, a pin for positioning is provided between the second electrical connector and the upper insulating plate.

Compared with the prior art, the power device has the advantages that the power device adopts the press-mounting type arrangement of the upper end plate and the lower end plate, so that the power device has higher pressure resistance and current capacity.

Drawings

Preferred embodiments of the present invention will be described in detail below with reference to the attached drawing figures, wherein:

FIG. 1 shows a perspective view of a power device according to an embodiment of the invention;

fig. 2 shows a circuit configuration of a power device according to an embodiment of the present invention;

fig. 3 shows a cross-sectional view of an IGBT module according to an embodiment of the invention;

fig. 4 illustrates a heat pipe coupling diagram of a power device according to an embodiment of the present invention;

in the drawings, like parts are provided with like reference numerals. The figures are not drawn to scale.

Detailed Description

The invention will be further explained with reference to the drawings.

Fig. 1 shows a power plant 200 according to the invention. As shown in fig. 1, the power device 200 includes an IGBT module 100, an FRD module 90, and a heat sink 80. The FRD module 90 and the IGBT module 100 are correspondingly connected in parallel to form a half-bridge circuit structure, as shown in fig. 2. The heat dissipation assembly 80 is used for dissipating heat of the IGBT module 100 and the FRD module 90 to ensure normal operation of the power device 200.

In one embodiment, as shown in fig. 3, the IGBT module 100 or the FRD module 90 includes an upper terminal plate 2, a lower terminal plate 3, a power module 20, an upper insulating plate 11, a lower insulating plate 12, and a connection rod 1. For convenience of expression, the IGBT module 100 is described as an example. Wherein the upper end plate 2 and the lower end plate 3 are each constructed in a plate-like structure for fixing and connecting the respective components or parts therein. The power module 20 is disposed between the upper end plate 2 and the lower end plate 3. The power assembly 20 has an even number of power sub-units 14 connected in series, a first electrical connection 13 arranged in contact between adjacent power sub-units 14, a second electrical connection 13' arranged in contact on the upper surface of the uppermost power sub-unit 14 and a third electrical connection 13 "arranged in contact on the lower surface of the lowermost power sub-unit 14. The upper insulating plate 11 is arranged between the upper end plate 2 and the second electrical connector 13' for insulating isolation. The lower insulating plate 12 is arranged between the lower end plate 3 and the third electrical connector 13 "and also provides an insulating and isolating effect. The connection rod 1 connects the upper end plate 2 and the lower end plate 3 to press-fit components such as the power module 20, the upper insulation plate 11, and the lower insulation plate 12 between the upper end plate 2 and the lower end plate 3.

In the production process, the IGBT module 100 applied with pretightening force is placed on a press machine, the upper end plate 2 and the lower end plate 3 are sequentially aligned to the upper pressure column and the lower pressure column of the press machine, the required pressure value is set, and the IGBT module 100 is pressed in place at one time. Therefore, the IGBT module 100 has very good withstand voltage and current capability.

In one embodiment, an upper pressure bearing assembly 30 is disposed between upper insulating plate 11 and upper end plate 2. The upper bearing assembly 30 has a first bearing disc 7. In addition, a lower pressure bearing disk 8 is disposed between the lower insulation plate 12 and the lower end plate 3. Preferably, the first pressure bearing disk 7 and the lower pressure bearing disk 8 are made of a high-strength carbon steel material, for example, 1Cr18Ni9 Ti. The structure is not easy to deform under the action of pressure, and the uniform pressure distribution of the whole IGBT module 100 is ensured.

In a preferred embodiment, the upper bearing assembly 30 further comprises a second bearing disc 6 and a spherical member 9. Wherein, the second bearing plate 6 is arranged opposite to the first bearing plate 7 and is positioned at the upper end of the first bearing plate 7. The ball 9 is embedded between the first pressure bearing disk 7 and the second pressure bearing disk 6 for equalizing pressure. Thus, the upper pressure bearing assembly 30 functions to equalize pressure during pressure transmission. In particular, the ball members 9 provide a transition between the first pressure bearing disk 7 and the second pressure bearing disk 6, thereby improving the pressure balance transmission effect of the upper pressure bearing assembly 30.

In a particular embodiment, a buffer 10 is provided between the upper bearing assembly 30 and the upper end plate 2. Preferably, the buffer member 10 may be a disc spring, and the number of the disc springs may be selected to be one or more according to specific needs. The cushion member 10 plays a role of pressure holding and deformation adjustment by its own elasticity. It should be noted that if the upper bearing assembly 30 includes only the first bearing disk 7, the buffer 10 is disposed between the upper end plate 2 and the first bearing disk 7. And when the upper bearing assembly 30 includes the second bearing disc 6, the buffer 10 is disposed between the upper end plate 2 and the second bearing disc 6.

In addition, in a specific embodiment, the upper end face of the second pressure bearing disc 6 is configured with two steps, i.e., a first step 32 and a second step 33. Wherein the upper end of the first step 32 is embedded in the lower end face of the upper end plate 2 to form a concavo-convex fit with the upper end plate 2. The matching mode is convenient to install and is beneficial to the pressure balance transmission between the upper end plate 2 and the second pressure bearing disc 6. In addition, the disc spring is sleeved on the outer wall of the second pressure bearing disc 6 between the first step 32 and the second step 33, the upper end face of the disc spring is abutted with the upper end plate 2, and the lower end face of the disc spring is abutted with the second pressure bearing disc 6, so that the effect of buffering the uniform pressure is achieved. The structure is convenient to position and simplifies installation.

In one embodiment, the upper insulating plate 11 is configured with a circumferentially extending first groove 34 on its outer circumferential surface. Similarly, a second groove 35 extending in the circumferential direction is formed on the outer circumferential surface of the lower insulating plate 12. Also, a plurality of first grooves 34 and second grooves 35 may be provided on the outer circumferential surface of the upper insulating plate 11 and the outer circumferential surface of the lower insulating plate 12, respectively. The above arrangement ensures creepage distance requirements between different potentials. In addition, the upper end surface of the upper insulating plate 11 is configured with a first groove 36 for embedding the first pressure bearing assembly 30 to form a male-female fit. Similarly, the lower end surface of the lower insulating plate 12 is configured with a second groove 37 for embedding the lower bearing disk 8 and forming a concave-convex fit. The concave-convex arrangement helps to improve the uniformity of pressure distribution and is convenient to position. Preferably, the ratio of the depth of the first groove 34 to the radius of the first groove 36 is 1.5-4, for example a ratio of 2. The structure of IGBT module 100 can be optimized in the aforesaid setting, when guaranteeing the creepage distance demand between the different electric potentials, improves pressure transmission homogeneity. Similarly, the relationship between the second groove 35 and the second groove 37 can also refer to the above arrangement.

In one embodiment, as shown in fig. 3, at least one of the first electrical connector 13, the second electrical connector 13' and the third electrical connector 13 "is configured as a box. And an inlet 16 and an outlet 18 are formed on a side wall of the case, as seen in fig. 4, and a flow passage (not shown) for communicating the inlet 16 and the outlet 18 is formed inside the case, so that the case functions as a cooling means. Specifically, a cooling medium (which may be a liquid, such as deionized water, or a gas) may be supplied into the box through the inlet 16, and the cooling medium circulates in the flow channel to cool the power sub-unit 14 disposed outside the box. Preferably, the first electrical connector 13, the second electrical connector 13' and the third electrical connector 13 ″ are all configured as a box, and the upper and lower surfaces of any power subunit 14 are abutted against the box, so as to achieve the effect of double-sided heat dissipation. In addition, a plate-shaped connecting portion 17 is provided on the side wall of the case to protrude outward. Meanwhile, a connection hole 19 is formed on the connection portion 17, as seen in fig. 1, to facilitate electrical connection. The structure of the first electrical connector 13, the second electrical connector 13' and the third electrical connector 13 ″ described above realizes dual functions of heat dissipation and electrical connection, simplifies the design, and has a very good heat dissipation effect at the same time.

In one embodiment, in order to ensure accurate alignment of the devices of the IGBT module 100 and ensure structural stability during long-term operation of the IGBT module 100, pins 15 may be used to position the devices, as shown in fig. 3. For example, a pin 15 for positioning is provided between the second electrical connector 13' and the upper insulating plate 11. As another example, a pin 15 may also be provided between the power sub-unit 14 and the second electrical connector 13', as desired. So that the pins 15 can be arranged between different devices according to different needs. The arrangement structure can maintain the long-term operation stability of the IGBT module 100, and can effectively protect the power subunit 14 to meet various operating conditions of the power subunit.

In one embodiment, as shown in fig. 4, an insulating sleeve 5 is sleeved on the outer wall of the connecting rod 1 for high potential isolation between the connecting rod 1 and the power subunit 14, so as to ensure the safety of the IGBT module 100 in use. In addition, the connecting rod 1 can be a screw rod, and in the assembling process, after the press machine presses the IGBT module 100 in place, the IGBT module is locked by the locking nut 4, and the pressing is completed.

That is, the structures of the IGBT module 100 and the FRD module 90 may be the same or similar, except that in the IGBT module 100, the power subcell 14 is an IGBT power subcell, and in the FRD module 90, the power subcell 14 is an FRD power subcell. And in a unitary structure, power device 200 includes IGBT module 100 and FRD module 90 press-fitted up and down. Specifically, the lower end plate 3 of the IGBT module 100 is connected in an abutting manner to the upper end plate 2 of the FRD module 90. In addition, the connection between the power sub-units 14 is realized through the copper bar 70. The connection mode is simple, and the structure is optimized and distributed integrally.

Taking the example that the IGBT module 100 and the FRD module 90 each include two power sub-units 14, as shown in fig. 1 and 2, after one IGBT power sub-unit is connected in parallel with the corresponding FRD power sub-unit, the IGBT power sub-unit and the FRD power sub-unit connected in parallel are connected in series with each other.

The heat radiating assembly 80 includes a heat radiating source 81 and a heat radiating pipe 82. Wherein the heat radiating pipe 82 is used to communicate the heat radiating source 81 with the above-mentioned case for radiating heat (the first electrical connector 13, the second electrical connector 13', and the third electrical connector 13 "). The heat dissipation source 81 may be configured as a box body, and structurally, may be fixed on the upper end plate 2 of the IGBT module 100. The heat dissipation pipe 82 is connected with the heat dissipation source 81 and the tank body by a first joint 83. Preferably, the first fitting 83 is a quick fitting, for example, a CONEX push-in fitting manufactured by Statobel. This arrangement allows for easy assembly and disassembly for maintenance of the power device 200.

The arrangement of the radiating pipe 82 can be optimized. In order to improve the heat dissipation effect, a plurality of heat dissipation circuits may be provided to communicate with the heat dissipation source 81, and the number and power of the power sub-units 14 corresponding to each heat dissipation circuit are equal or similar as much as possible. In one specific embodiment, as shown in fig. 4, the heat dissipation assembly 80 has two heat dissipation loops. Wherein, the flow path of the first heat dissipation loop is: a1-a2-h2-h1-e2-e1-d2-d 1. That is, the deionized water flows to a first electrical connection 13 of the FRD module 90, then to a first electrical connection 13 of the IGBT module 100, then to a second electrical connection 13' of the IGBT module 100, and finally back to the heat sink 81. The flow path of the second heat dissipation loop is as follows: c1-c2-f1-f2-g2-g1-b2-b 1. That is, the deionized water flows to a third electrical connection 13 "of IGBT module 100, then to a third electrical connection 13" of FRD module 90, and then to a second electrical connection 13' of FRD module 90. Wherein the letters on the heat dissipation pipe 82 correspond to the electrical connectors and the heat dissipation source 81 to indicate the connection correspondence. In the connection process, each heat dissipation loop is connected with three electrical connectors, and the three electrical connectors are located in different modules. The arrangement is favorable for improving the heat dissipation efficiency, and simultaneously, the arrangement of pipelines is optimized, so that the purpose of structural optimization is achieved.

The above is only a preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily make changes or variations within the technical scope of the present invention disclosed, and such changes or variations should be covered within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims

1. A power device, comprising:

an IGBT module group is arranged on the base plate,

a heat dissipation component for dissipating heat of the IGBT module and the FRD module,

wherein at least one of the IGBT module and the FRD module comprises:

an upper end plate is arranged on the upper side of the main body,

a lower end plate is arranged at the lower end of the lower end plate,

a power module disposed between the upper end plate and the lower end plate, the power module having an even number of power sub-units connected in series, a first electrical connection member contactingly disposed between the adjacent power sub-units, a second electrical connection member contactingly disposed on an upper surface of the uppermost power sub-unit, and a third electrical connection member contactingly disposed on a lower surface of the lowermost power sub-unit,

a connecting rod for connecting the upper end plate and the lower end plate,

an upper bearing assembly is arranged between the upper insulating plate and the upper end plate, the upper bearing assembly is provided with a first bearing disc,

a lower bearing disc is arranged between the lower insulating plate and the lower end plate,

the upper end surface of the upper insulation plate is configured with a first groove so that the lower end of the first pressure bearing disc is inserted into the first groove, the lower end surface of the lower insulation plate is configured with a second groove, and meanwhile, an abutting surface which reduces the radial sectional area of the upper end of the lower pressure bearing disc is configured on the outer wall of the lower pressure bearing disc so that the upper end of the lower pressure bearing disc can be inserted into the second groove and the abutting surface abuts against the lower end surface of the lower insulation plate.

2. The power plant of claim 1, wherein the upper bearing assembly further comprises a second bearing disk disposed opposite the first bearing disk and a ball member disposed between the first bearing disk and the second bearing disk in an embedded manner.

3. The power plant of claim 1, wherein a buffer is disposed between the upper bearing assembly and the upper end plate.

4. The power device according to claim 1, characterized in that the upper insulating plate is configured on its outer circumferential surface with a first groove extending circumferentially,

and/or a second groove extending along the circumferential direction is configured on the outer circumferential surface of the lower insulating plate.

5. The power device according to claim 1, wherein at least one of the first electrical connector, the second electrical connector, and the third electrical connector is configured as a case, and an inlet and an outlet are configured on a side wall of the case, and a flow passage for communicating the inlet and the outlet is configured inside the case.

6. The power device of claim 5, wherein the heat sink assembly comprises:

a heat radiation pipe for communicating the heat radiation source with the box body,

the radiating pipe is connected with the radiating source and the box body through a first joint.

7. A power device according to any one of claims 1 to 6, characterized in that a pin for positioning is provided between the second electrical connector and the upper insulating plate.