CN107946900A - A kind of semiconductor laser module - Google Patents
A kind of semiconductor laser module Download PDFInfo
- Publication number
- CN107946900A CN107946900A CN201711474060.7A CN201711474060A CN107946900A CN 107946900 A CN107946900 A CN 107946900A CN 201711474060 A CN201711474060 A CN 201711474060A CN 107946900 A CN107946900 A CN 107946900A
- Authority
- CN
- China
- Prior art keywords
- semiconductor laser
- heat sink
- plug connector
- module
- connection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 108
- 238000005057 refrigeration Methods 0.000 claims description 17
- 238000000605 extraction Methods 0.000 claims description 11
- 238000009413 insulation Methods 0.000 claims description 10
- 239000004020 conductor Substances 0.000 claims description 6
- 238000003780 insertion Methods 0.000 claims description 4
- 230000037431 insertion Effects 0.000 claims description 4
- 230000005611 electricity Effects 0.000 claims description 3
- 239000012774 insulation material Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 8
- 239000013013 elastic material Substances 0.000 description 7
- 230000000694 effects Effects 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 238000005086 pumping Methods 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 239000013078 crystal Substances 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 239000004696 Poly ether ether ketone Substances 0.000 description 2
- 230000005489 elastic deformation Effects 0.000 description 2
- 229920002530 polyetherether ketone Polymers 0.000 description 2
- 238000011084 recovery Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- JUPQTSLXMOCDHR-UHFFFAOYSA-N benzene-1,4-diol;bis(4-fluorophenyl)methanone Chemical compound OC1=CC=C(O)C=C1.C1=CC(F)=CC=C1C(=O)C1=CC=C(F)C=C1 JUPQTSLXMOCDHR-UHFFFAOYSA-N 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000007710 freezing Methods 0.000 description 1
- 230000008014 freezing Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 125000003367 polycyclic group Chemical group 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0233—Mounting configuration of laser chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0235—Method for mounting laser chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/023—Mount members, e.g. sub-mount members
Abstract
The embodiment of the present invention provides a kind of new semiconductor laser module, and the module includes：At least one semiconductor laser element, each semiconductor laser element include multiple semiconductor lasers, plug connector and radiate for the multiple semiconductor laser heat sink；Wherein, multiple open slots are offered on the heat sink inner wall, multiple semiconductor lasers are bonded to the heat sink inner wall between adjacent apertures groove respectively；The plug connector, for by be inserted into the open slot realize semiconductor laser and it is heat sink between fixation.Based on semiconductor laser module provided by the invention, positioning accuracy can be effectively improved, assembling is simple, easily operated.
Description
Technical field
The present invention relates to field of semiconductor lasers, more particularly to a kind of pumping and the new of other field can be used for partly to lead
Body laser module.
Background technology
Semiconductor laser has the advantages that small, light-weight, reliability is high, service life is long, extensive at present
Applied to the every field of national economy, it is used for light-pumped solid state laser for example as pumping source.In semiconductor laser conduct
In the application of side pumping source, current existing side pump module is frequently with semiconductor laser in positive triangle, Zheng Wujiao, positive heptangle
Deng formal distribution around crystal bar, and radiated by heat sink for semiconductor laser and crystal bar.
At present, with the solutions for refrigeration of upper module more using setting multigroup waterway in heat sink main body, and by refrigerant
The mode for being passed through waterway is freezed for module, as shown in Figure 1.But this mode is there are some drawbacks, such as：Waterway
Design introduces excessive sealing ring, causes assembling complicated；Each laser in each annular module is consolidated by Outer screw
It is fixed, cause annular module Outer screw quantity more, and the protrusion influence of screw is overall beautiful；Connection electrode and extraction electricity
Pole needs to wind insulating tape to prevent short circuit, causes to introduce excessive insulating tape；During polycyclic assembling, in each annular module
Waterway need to align one by one, it is higher to positioning requirements.
The content of the invention
For above-mentioned technical problem, one of the main purpose of the embodiment of the present invention is that providing a kind of new semiconductor swashs
Light device module, by designing a kind of new plug connector, can realize each semiconductor laser, connection electrode and it is heat sink etc. at least
Spacing fixation between three, also, the refrigerating part of the module is arranged on outside semiconductor laser element, solves tradition
Scheme is difficult to the problem of precise positioning, and assembling is simple, easily operated, has larger application prospect and market prospects.
The technical proposal of the invention is realized in this way：
The embodiment of the present invention provides a kind of semiconductor laser module, and the module includes：At least one semiconductor laser list
Member, each semiconductor laser element include multiple semiconductor lasers, plug connector and are the multiple semiconductor laser
What is radiated is heat sink；Wherein, multiple open slots are offered on the heat sink inner wall, multiple semiconductor lasers are bonded to adjacent respectively
Heat sink inner wall between open slot；The plug connector, for realizing semiconductor laser and heat by being inserted into the open slot
Fixation between heavy.
In such scheme, the plug connector is all elastic materials of insulation or SI semi-insulation；Wherein, when the plug connector
For SI semi-insulation when, the surface of the plug connector or be internally provided with current-carrying part, for adjacent semiconductor laser phase
Contact, realizes the electrical connection between adjacent semiconductor laser；When the plug connector is all insulate, the module further includes
Connection electrode with through hole, for being in contact with adjacent semiconductor laser, is realized between adjacent semiconductor laser
It is electrically connected.
In such scheme, the plug connector includes：Planar section and grafting part；The plug division point includes：From institute
At least one of lower surface extension for stating planar section is in hook-shaped connection-peg.
In such scheme, the open slot on the heat sink inner wall includes：Opening portion and base part；Wherein, it is described
The internal diameter of base part is more than the internal diameter of opening portion, and the connection-peg is inserted into the open slot through the through hole in connection electrode
Base part.
In such scheme, the outside diameter of the connection-peg is more than the internal diameter of the opening portion of open slot so that hook-shaped grafting
Head is connected in the side wall of open slot base part, realizes that plug connector is connected and fixed with heat sink.
In such scheme, the outside diameter of the planar section of the plug connector is more than the internal diameter of the through hole of connection electrode, for reality
Existing spacing fixation between plug connector and semiconductor laser, connection electrode.
In such scheme, the module further includes：At least two cold-making blocks being arranged at outside semiconductor laser element；
Wherein, the inner surface of the cold-making block is provided with the card slot to match with heat sink shape, is used for realization heat sink between cold-making block
Fixation；Multiple liquid-passing holes, the position of the liquid-passing hole and the position of each semiconductor laser are provided with the refrigeration block main body
Put corresponding.
In such scheme, the cold-making block also has screw hole, for realizing that each cold-making block swashs with each semiconductor by screw
Fixation between light device unit.
In such scheme, it is described it is heat sink including：Circular heat sink or polygon is heat sink, the multiple semiconductor laser hair
The laser beam gone out converges at the center that the annular shape is heat sink or polygon is heat sink.
In such scheme, the module further includes extraction electrode, and the extraction electrode is arranged at the semiconductor laser
Inside unit, for the electrode of the semiconductor laser element to be led to outside.
The advantageous effects of technical solution of the present invention are as follows：
1st, the design of plug connector and dependency structure so that realized each semiconductor laser inside semiconductor laser element
The scheme being fixedly connected between device, connection electrode and at least three such as heat sink, fixed effect is preferable, and assembling is more convenient, has
Higher operability.
2nd, refrigeration water route is arranged on the cold-making block outside each semiconductor laser element so that each semiconductor laser list
Member is separate, non-interference, and assembling can be directly clamped in assembling, thoroughly solves water route of freezing in traditional scheme and is located at
During heat sink caused each ring group dress, introduce excessive sealing ring and the positioning of each waterway is directed at the problem of difficulty is high.
3rd, extraction electrode, without positioning, is solved in traditional scheme and drawn by being directly led out inside semiconductor laser element
The problem of going out orientation problem caused by electrode sets external connection block and introducing excessive insulating tape, it is simple and convenient, have more
High practicality.
Brief description of the drawings
Fig. 1 is the structure diagram of prior art semiconductor laser module；
Fig. 2 is the dimensional structure diagram of cold-making block of the present invention；
Fig. 3 is the dimensional structure diagram of semiconductor laser module of the present invention；
Fig. 4 is the partial structural diagram of semiconductor laser element of the present invention；
Fig. 5 is structure diagram of the plug connector with heat sink spacing fixation of the present invention；
Fig. 6 is another partial structural diagram of semiconductor laser element of the present invention.
Drawing reference numeral explanation：1 is semiconductor laser element, and 11 be semiconductor laser, and 111 be semiconductor laser core
Piece, 112 be substrate, and 12 be plug connector, and 121 be planar section, and 122 be grafting part, and 13 be heat sink, and 131 be mounting platform, 14
It is opening portion for open slot, 141,142 be base part, and 15 be connection electrode, and 151 through holes, 16 be cold-making block, and 161 lead to liquid
Hole.
Embodiment
Following embodiments of the present invention provide a kind of new semiconductor laser module, and main thought is：It is a kind of by designing
New plug connector, realizes at least three such as each semiconductor laser, connection electrode, heat sink inside semiconductor laser element
Between spacing fixation, and will refrigeration water route be arranged on the cold-making block outside semiconductor laser element, high cooling efficiency,
And assembling is simple.
Technical solution of the present invention is described in further details below in conjunction with drawings and the specific embodiments.
In the embodiment of the present invention, each semiconductor laser module can include at least one semiconductor laser element 1,
Fig. 4 is the partial structural diagram of semiconductor laser element of the present invention.As shown in figure 4, each semiconductor laser element is again
It can include：Multiple semiconductor lasers 11, plug connector 12 and for the multiple semiconductor laser heat dissipation heat sink 13.
Here, described heat sink 13 can include but is not limited to：Circular heat sink or polygon is heat sink, and the annulus simultaneously differs
It is set to positive round, or non-positive round；The polygon can include triangle, quadrangle, pentagon etc..Preferably, it is hot
Heavy 13 is heat sink for positive circular heat sink or regular polygon.The multiple semiconductor laser implement body can be bonded to the annular shape
Heat sink or heat sink polygon inner wall, its laser beam sent converge at that the annular shape is heat sink or polygon it is heat sink in
The heart, drawings and the specific embodiments of the present invention are illustrated so that described heat sink 13 is heat sink for positive annular shape as an example.Based on above-mentioned,
It is recognised that one of main application of semiconductor laser module of the present invention can be as the side of fixed laser
Face-pumping source, the gain media of solid state laser（Such as crystal bar）May be disposed at circular heat sink or polygon it is heat sink in
The heart.
The semiconductor laser 11 can be included at least but is not limited to：Laser chip, substrate；The laser chip can be with
For edge transmitting type semiconductor laser chip, in certain embodiments, it can also be vertical-cavity surface-emitting type semiconductor laser
Device chip；Laser chip is bonded on the substrate, and the substrate has the thermal coefficient of expansion to match with laser chip.
Specifically, can offer multiple open slots 14 on the heat sink inner wall, multiple semiconductor lasers 11 distinguish key
Together in the heat sink inner wall between adjacent apertures groove；The plug connector 12 is used for by being inserted into the open slot 14, and realization is partly led
Fixation between body laser 11 and heat sink 13.
In such scheme, the plug connector 12 is insulation or the elastic material of SI semi-insulation, such as PEEK（Polyether-ether-ketone）.
When the plug connector is SI semi-insulation, the surface of the plug connector or current-carrying part is internally provided with, for adjacent half
Conductor laser is in contact, and realizes the electrical connection between adjacent semiconductor laser；What the plug connector of SI semi-insulation mainly considered
It is：The plug connector can also use as connection electrode when spacing function is fixed in realization, not introduce connection electrode at the same time
In the case of i.e. can be achieved fifty-fifty conductor laser between electrical connection.The conducting function of the plug connector 12 can specifically pass through
Realized using in the other modes such as plug connector surface selective coated conductive layer or internal setting conductive channel.
Specifically, the plug connector 12 can include planar section 121 and grafting part 122；Here, the grafting
It is that elastic material can produce certain elastic deformation that part 12, which selects the consideration of elastic material, and open slot is inserted into plug connector 12
When 14, it can be in the case where producing certain deformation quantity（Shrink）Insertion, and recover the shape to a certain extent after such insertion
Variable, such as recover to reset condition, the recovery of deformation quantity can be the spacing offer guarantee of fixation of the plug connector in open slot.
In such scheme, the grafting part 122 can include：From the extension of the lower surface of the planar section 121 extremely
Few one is in hook-shaped connection-peg, and the embodiment of the present invention is illustrated using the quantity of the connection-peg as 2.The plug connector
12 can be integrated injection molding part, can also be consolidated after 122 each self-forming of planar section 121 and grafting part using machinery
Both are secured together by the modes such as fixed or chemical adhesive.
Further, when the plug connector is the elastic material all to insulate, the module can also include：With logical
The connection electrode 15 in hole, the connection electrode 15 are used to be in contact with adjacent semiconductor laser, realize that adjacent semiconductor swashs
Electrical connection between light device 11, the embodiment of the present invention by taking the plug connector is the elastic material all to insulate as an example illustrate
It is bright.
Fig. 5 is structure diagram of the plug connector with heat sink spacing fixation of the present invention, and Fig. 6 is semiconductor laser of the present invention
Another partial structural diagram of unit.As shown in Figure 5, Figure 6, in such scheme, the opening that is opened up on heat sink 13 inner wall
Groove 14 can have opening portion 141 and base part 142, and the internal diameter of the base part 142 is more than opening portion 141
Internal diameter, base part 142 described here and the internal diameter of opening portion 141 refer to both length in certain same direction.
The connection-peg can be inserted into the base part of the open slot 14 through the through hole 151 in the connection electrode 15
142, since the grafting part 122 is that can be connected in base part 142 in hook-shaped connection-peg, the hook-shaped connection-peg
Side wall on, realize that grafting part 12 is connected and fixed with heat sink 13.
Specifically, in order to ensure that grafting part 122 is firmly plugged in the base part 142, in practical applications, institute
The outside diameter for stating connection-peg should be greater than the internal diameter of opening portion 141, and here, the outside diameter of the connection-peg refers to：What plug connector had
The length of all connection-pegs on the whole in one direction；The internal diameter of opening portion 141 refers to：Equidirectional upper shed part
141 length.
Since the plug connector 12 is elastic material, when the outside diameter of connection-peg is more than the internal diameter of opening portion 141,
The connection-peg can be also inserted into open slot 14 in the case of with certain amount of elastic deformation by opening portion 141, the bullet
Property deformation quantity has a degree of recovery after connection-peg insertion opening groove 14, and based in above base part 142
Footpath is more than the internal diameter of opening portion 141 so that hook-shaped connection-peg can be connected in base part behind basement part 142
142 side wall, and will not departing from from opening portion 141, realizes that plug connector 12 is connected and fixed with heat sink 13 with this.
Further, for the plug connector 12, since its connection-peg can be through the through hole 151 in the connection electrode 15
It is inserted into the open slot 14, therefore, the outside diameter of the planar section 121 of the plug connector should also be more than the logical of connection electrode 15
The internal diameter in hole 151, to ensure that the planar section 121 of plug connector will not depart from the through hole 151 of connection electrode, it is ensured that fixed matter
Amount.The outside diameter of planar section 121 described here refers to the length of planar section 121 in one direction, the through hole 151
Internal diameter refers to the diameter of through hole in the same direction.In this way, since both plug connector 12 and connection electrode 15 are fixed, connection electricity
Pole 15 is connected with adjacent semiconductor laser 11, therefore can realize plug connector 12 and semiconductor laser 11, connection electrode
Spacing fixation between 15 threes.
In addition, being additionally provided with mounting platform 131 on heat sink 13 inner wall in the embodiment of the present invention, mounting platform 131 is set
It is placed between adjacent apertures groove, which is particularly used in bonding semiconductor laser, as shown in fig. 6, Fig. 6 only shows
Go out part semiconductor laser, connection electrode and plug connector, part is not shown with having shown that part is similar.
Consider how to realize lifting positioning accuracy, this point is conveniently installed, included by above semiconductor laser element
Heat sink 13 on and be not provided with chilled water road, but refrigeration water route is set outside semiconductor laser element.
Further, semiconductor laser module described above can also include being arranged at outside semiconductor laser element
At least two cold-making blocks 16.Fig. 2 is the dimensional structure diagram of cold-making block of the present invention, and Fig. 3 is semiconductor laser of the present invention
The dimensional structure diagram of module, as shown in Figure 2 and Figure 3, the embodiment of the present invention is lifted using the quantity of the cold-making block 16 as 2
Example explanation, the inner surface of the cold-making block 16 are provided with the card slot to match with heat sink shape（Not shown in figure）, multiple half
When conductor laser unit is assembled, each semiconductor laser element can be corresponded in corresponding card slot respectively, used
It is heat sink with cold-making block fixation in realizing.
Further, high thermal conductivity layer, such as indium film layer can be set at the card slot of the cold-making block 16, are mainly used for reality
Existing heat exchange between heat sink 13 and cold-making block 16, to improve the effect of the heat conduction between cold-making block 16 and semiconductor laser element
Rate.
Specifically, the refrigeration modes of the cold-making block 16 can include：Refrigeration mode, liquid refrigerating type are conducted, wherein, work as institute
State refrigeration modes for conduction refrigeration mode when, the cold-making block is made of a highly heat conductive material, for example, the high-thermal conductive metal such as copper, and/or
Nonmetallic materials；When the refrigeration modes are liquid refrigerating type, multiple liquid-passing holes are provided with the refrigeration block main body；This hair
Bright embodiment carries out citing signal so that the refrigeration modes are liquid refrigerating type as an example.
As shown in Figure 2 and Figure 3, multiple liquid-passing holes 161 can be provided with the refrigeration block main body, it is preferred that in order to reach
More efficient refrigeration effect, the position of the liquid-passing hole can be corresponding with the position of each semiconductor laser.The liquid-passing hole
161 form can include but is not limited to：The various forms such as fin, micro through hole array.
Also, the cold-making block also has screw hole（Not shown in figure）, by screw can realize each cold-making block with it is fifty-fifty
Fixation between conductor laser unit.As shown in figure 3, in embodiments of the present invention, each semiconductor laser element is located at two
The center cavity region that a cold-making block 16 is formed, screw can be screwed in screw hole possessed by two cold-making blocks 16, so i.e.
Realize and be secured together cold-making block and each semiconductor laser element.
Refrigeration water route is arranged on heat sink outside by the such scheme of the present invention, and will freeze water route and heat sink separate design,
Separate type refrigeration water route structure design cause waterway structure is not present in the heat sink main body of semiconductor laser element, this
Sample, when multigroup semiconductor laser element is assembled, is directly clamped into respective card slot, each semiconductor laser
Between device unit independently of each other, no interference, is easily assembled to and dismantles.Also, due to mutual between each semiconductor laser element
It is independent, therefore in assembling, there may be certain dislocation between each semiconductor laser element, to realize each semiconductor laser
The angled arrangement of unit.
The module further includes extraction electrode, and the extraction electrode is arranged inside the semiconductor laser element, uses
In the electrode of the semiconductor laser element is led to outside, specifically heat sink outside, i.e. extraction electrode can be led to through described
By being directly led out inside semiconductor laser element.In order to avoid short circuit, can make in extraction electrode surface setting unit insulating layer
It insulate in path is drawn with heat sink wait, and such a electrode lead-out mode solves extraction electrode in traditional scheme without positioning
It is the problem of orientation problem caused by external connection block is set and introducing excessive insulating tape, convenient and practical.
The foregoing is only a preferred embodiment of the present invention, is not intended to limit the scope of the present invention.For
For those skilled in the art, the invention may be variously modified and varied.Institute within the spirit and principles of the invention
Any modification, equivalent substitution, improvement and etc. done, should all be included in the protection scope of the present invention.
Claims (10)
1. a kind of semiconductor laser module, it is characterised in that the module includes：At least one semiconductor laser element,
Each semiconductor laser element includes multiple semiconductor lasers, plug connector and is dissipated for the multiple semiconductor laser
Hot is heat sink；Wherein,
Multiple open slots are offered on the heat sink inner wall, multiple semiconductor lasers are bonded between adjacent apertures groove respectively
Heat sink inner wall；
The plug connector, for by be inserted into the open slot realize semiconductor laser and it is heat sink between fixation.
2. module according to claim 1, it is characterised in that the plug connector is all elasticity of insulation or SI semi-insulation
Material；Wherein,
When the plug connector is SI semi-insulation, the surface of the plug connector or be internally provided with current-carrying part, for it is adjacent
Semiconductor laser be in contact, realize the electrical connection between adjacent semiconductor laser；
When the plug connector for all insulation when, the module further includes the connection electrode with through hole, for adjacent half
Conductor laser is in contact, and realizes the electrical connection between adjacent semiconductor laser.
3. module according to claim 2, it is characterised in that the plug connector includes：Planar section and plug division
Point；The plug division point includes：At least one from the extension of the lower surface of the planar section is in hook-shaped connection-peg.
4. module according to claim 3, it is characterised in that the open slot on the heat sink inner wall includes：Opening portion,
And base part；Wherein,
The internal diameter of the base part is more than the internal diameter of opening portion, and the connection-peg is through described in the through hole insertion in connection electrode
The base part of open slot.
5. the module stated according to claim 4, it is characterised in that the outside diameter of the connection-peg is more than the opening portion of open slot
Internal diameter so that hook-shaped connection-peg is connected in the side wall of open slot base part, realizes that plug connector is connected and fixed with heat sink.
6. module according to claim 3, it is characterised in that the outside diameter of the planar section of the plug connector is more than connection electricity
The internal diameter of the through hole of pole, the spacing fixation being used for realization between plug connector and semiconductor laser, connection electrode.
7. module according to claim 1, it is characterised in that the module further includes：It is arranged at semiconductor laser list
At least two cold-making blocks outside member；Wherein,
The inner surface of the cold-making block is provided with the card slot to match with heat sink shape, is used for realization heat sink between cold-making block
It is fixed；
Multiple liquid-passing holes, the position of the liquid-passing hole and the position phase of each semiconductor laser are provided with the refrigeration block main body
It is corresponding.
8. module according to claim 7, it is characterised in that the cold-making block also has screw hole, for real by screw
The now fixation between each cold-making block and each semiconductor laser element.
9. according to claim 1 to 8 any one of them module, it is characterised in that it is described it is heat sink including：It is circular heat sink or more
Side shape is heat sink, and the laser beam that the multiple semiconductor laser is sent converges at that the annular shape is heat sink or polygon is heat sink
Center.
10. the module stated according to claim 9, it is characterised in that the module further includes extraction electrode, and the extraction electrode is set
It is placed in inside the semiconductor laser element, for the electrode of the semiconductor laser element to be led to outside.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711474060.7A CN107946900B (en) | 2017-12-29 | 2017-12-29 | Semiconductor laser module |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711474060.7A CN107946900B (en) | 2017-12-29 | 2017-12-29 | Semiconductor laser module |
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| CN107946900A true CN107946900A (en) | 2018-04-20 |
| CN107946900B CN107946900B (en) | 2024-02-13 |
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| CN201711474060.7A Active CN107946900B (en) | 2017-12-29 | 2017-12-29 | Semiconductor laser module |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110224293A (en) * | 2019-05-23 | 2019-09-10 | 杨伟锋 | A kind of pumping source Semiconductor Laser disposably encapsulated |
| CN114361934A (en) * | 2022-01-07 | 2022-04-15 | 无锡亮源激光技术有限公司 | Novel high-power semiconductor laser device |
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| CN203967508U (en) * | 2014-06-25 | 2014-11-26 | 西安炬光科技有限公司 | A kind of liquid refrigerating type semiconductor laser side pump module |
| CN206806722U (en) * | 2017-06-08 | 2017-12-26 | 西安域视光电科技有限公司 | A kind of new semiconductor laser side pump module |
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| CN110224293A (en) * | 2019-05-23 | 2019-09-10 | 杨伟锋 | A kind of pumping source Semiconductor Laser disposably encapsulated |
| CN110224293B (en) * | 2019-05-23 | 2021-02-23 | 威海沃驰智能技术有限公司 | Semiconductor laser for disposable encapsulated pump source |
| CN114361934A (en) * | 2022-01-07 | 2022-04-15 | 无锡亮源激光技术有限公司 | Novel high-power semiconductor laser device |
| CN114361934B (en) * | 2022-01-07 | 2024-02-13 | 无锡亮源激光技术有限公司 | Novel high-power semiconductor laser device |
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