CN206806722U - A kind of new semiconductor laser side pump module - Google Patents
A kind of new semiconductor laser side pump module Download PDFInfo
- Publication number
- CN206806722U CN206806722U CN201720662389.5U CN201720662389U CN206806722U CN 206806722 U CN206806722 U CN 206806722U CN 201720662389 U CN201720662389 U CN 201720662389U CN 206806722 U CN206806722 U CN 206806722U
- Authority
- CN
- China
- Prior art keywords
- side pump
- semiconductor laser
- heat sink
- water flowing
- pump unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model provides a kind of new semiconductor laser side pump module, including：At least one semiconductor laser side pump unit；The semiconductor laser side pump unit includes multiple semiconductor lasers, metal contiguous block and radiated for the semiconductor laser heat sink；Wherein, the multiple semiconductor laser, for launching laser；The metal contiguous block, for realizing the electrical connection between adjacent semiconductor laser；It is described it is heat sink be used for the passages of refrigerant of circulating with multiple, the passage runs through the heat sink upper surface and lower surface.Based on Semiconductor Laser side pump module provided by the utility model, heat sink heat-sinking capability can be increased substantially, and the series connection of more side pump units can be realized.
Description
Technical field
It the utility model is related to diode-end-pumped field, more particularly to a kind of new semiconductor laser side pump
Module.
Background technology
Semiconductor laser has the advantages that small volume, in light weight, reliability is high, service life is long, extensive at present
Applied to the every field of national economy, such as diode-end-pumped solid state laser.In semiconductor laser as side
In the application in face-pumping source, current existing side pump module is frequently with semiconductor laser in positive triangle, Zheng Wujiao, positive heptangle etc.
Formal distribution radiates around crystal bar, and by heat sink for semiconductor laser and crystal bar.
At present, it is more using it is heat sink it is internal straight through water passage is set, and it is heat that refrigerant is passed through into the mode of straight through water passage
Heavy radiating, as shown in figure 1, but this mode some drawbacks be present, such as：
First, the flow direction of refrigerant is along heat sink circumferencial direction, the waterway radiating ratio of bypass structure in straight through water passage
Surface area is smaller, and water flow velocity is relatively low, and heat-sinking capability is limited；
Second, monocyclic interior, the water-carrying capacity in straight through water passage is limited to monocyclic water flowing aperture, if water-carrying capacity need to be increased,
The aperture of apopore and blasthole, and the sectional area of water flowing must then be increased, this will cause the heat sink volume increase of ring-type,
The requirement of compactedness can not be met；
3rd, because water-carrying capacity directly affects heat-sinking capability, therefore, this structure not only limits heat sink heat radiation energy
Power, it also limit in the series connection number of rings allowed during polycyclic series connection；
4th, this kind of structure needs to seal to monocyclic, i.e., must increase cover plate in monocyclic upper and lower surface,
This make it that monocyclic thickness is larger；And when carrying out polycyclic series connection, the white space between each ring is more, have impact on hot spot
Uniformity.
The content of the invention
In view of this, the utility model provides a kind of new semiconductor laser side pump module, by setting penetration heat
The passage of heavy upper and lower surface, can increase substantially heat sink heat-sinking capability, and can realize more side pump units
Series connection.
To achieve the above objectives, the technical solution of the utility model is realized in：
The utility model provides a kind of new semiconductor laser side pump module, including：At least one semiconductor laser
Device side pump unit；The semiconductor laser side pump unit includes multiple semiconductor lasers, metal contiguous block and is described
Semiconductor laser radiates heat sink；Wherein, the multiple semiconductor laser, for launching laser；The metal contiguous block,
For realizing the electrical connection between adjacent semiconductor laser；It is described it is heat sink be used for the passages of refrigerant of circulating with multiple,
The passage runs through the heat sink upper surface and lower surface.
Preferably, described heat sink heat sink for ring-type, the multiple semiconductor laser is located at the heat sink inwall of the ring-type,
Its laser beam sent converges at the heat sink center of the ring-type.
Preferably, the heat sink inwall of the ring-type is provided with, installation is flat correspondingly with the multiple semiconductor laser
Platform, the insertion heat sink inwall of ring-type is provided between adjacent mounting platform to the mounting hole of outer wall, for by metal contiguous block with
The mode of mechanical connection be fixed on the ring-type it is heat sink on.
Preferably, the multiple passage is along the heat sink lower end for being radially disposed at multiple semiconductor lasers of the ring-type,
And be arranged in array along the heat sink central axis of the ring-type, the upper and lower surface heat sink through the ring-type.
Preferably, the structure of the passage includes：Hole type, fin-type.
Preferably, described hole type is：The passage is loose structure；The fin-type is：The passage is ripple wing
Piece or ring-like fin or rectangular fin.
Preferably, at the heat sink lower surface, the region corresponding with the passage is provided with groove structure, for putting
Put seal washer；The seal washer, for realizing the sealing between adjacent semiconductor laser side pump unit.
Preferably, the module also includes：It is adapted with the upper surface size of semiconductor laser side pump unit upper logical
Water block, the lower water flowing block adaptable with the lower surface size of semiconductor laser side pump unit；The upper water flowing block, is arranged at side
At the upper surface of the semiconductor laser side pump unit of pump module head end, refrigerant is formed between upper water flowing block inwall and outer wall
Circulation passage, the lower surface of upper water flowing block are in contact with semiconductor laser side pump unit upper surface, the lower surface of upper water flowing block
It is upper that there are multiple through holes, for the refrigerant in upper water flowing block to be delivered in heat sink multiple passages, the through hole
Quantity and position, match with the quantity through heat sink passage and position；The lower water flowing block, is arranged at side pump mould
Refrigerant circulation is formed at the lower surface of the semiconductor laser side pump unit of block end, between lower water flowing block inwall and outer wall
Passage, the lower surface of lower water flowing block are in contact with the lower surface of semiconductor laser side pump unit, on the lower surface of lower water flowing block
With multiple through holes, for will be that the refrigerant that side pump module freezes is exported to lower water flowing block；The quantity of the through hole and
Position, match with the quantity through heat sink passage and position.
Preferably, at the lower surface of the upper water flowing block and lower water flowing block, the region corresponding with the multiple through hole point
Groove structure is not provided with it；The groove structure is used to place seal washer, the seal washer be used to realizing water flowing block with
Between the semiconductor laser side pump unit of head end and between lower water flowing block and the semiconductor laser side pump unit of end
Sealing.
Preferably, at least one semiconductor laser side pump unit, adjacent semiconductor laser side pump unit
Between the circulate passage of refrigerant of being used for interconnect.
Semiconductor Laser side pump module provided by the utility model, it is multiple through heat sink by being set on heat sink
Upper surface and the passage of lower surface, it can substantially increase water flowing area and water-carrying capacity, be effectively improved heat sink heat-sinking capability；
The passage is directly arranged at the lower end of multiple semiconductor lasers so that radiating is more directly effectively；Further, it is described logical
Road can be hole type or fin-type, and this structure has bigger specific surface area compared to traditional straight through water passage, be larger journey
Heat sink heat-sinking capability is improved on degree and provides guarantee.
In addition, compared to existing structure, in side pump module described in the utility model, each side pump unit eliminates lid
The sealing of plate and lower cover so that the external diameter and thickness of product are obviously reduced, and when carrying out multiple side pump unit series connection, are reduced
White space between each side pump unit, improve the uniformity of hot spot.
Brief description of the drawings
Fig. 1 is semiconductor laser side pump module structural representation in the prior art；
Fig. 2 a-2d are the utility model channel design schematic diagram；
Fig. 3 is the utility model semiconductor laser side pump cellular construction schematic diagram；
Fig. 4 a-4b are water flowing block or lower water flowing block structure schematic diagram on the utility model；
Fig. 5 is the multiple semiconductor laser side pump unit cascaded structure schematic diagrames of the utility model.
Drawing reference numeral explanation：1 is semiconductor laser side pump unit, and 2 be semiconductor laser, and 3 be metal contiguous block, 4
To be heat sink, 5 be passage, and 6 be upper water flowing block, and 7 be lower water flowing block, and 8 be through hole, and 9 be groove, and 10 be semiconductor laser side pump mould
Block, 11 be mounting hole, and 12 be blasthole, and 13 be apopore, and 14 be the inwall of upper water flowing block or lower water flowing block, and 15 be upper water flowing block
Or the outer wall of lower water flowing block, 16 be the lower surface of upper water flowing block or lower water flowing block, and 17 be heat sink inwall, and 18 be heat sink outer wall, 19
For positioning hole.
Embodiment
Technical solutions of the utility model are described in further detail below in conjunction with drawings and the specific embodiments.
The utility model embodiment provides a kind of new semiconductor laser side pump module, and the side pump module includes：
At least one semiconductor laser side pump unit 1.Fig. 3 is the utility model semiconductor laser side pump cellular construction schematic diagram,
As shown in figure 3, the semiconductor laser side pump unit includes multiple semiconductor lasers 2（Semiconductor laser side pump in Fig. 3
Unit is sequentially connected in series by 9 semiconductor lasers and formed）, metal contiguous block 3 and for the semiconductor laser radiate
Heat sink 4；Wherein, the multiple semiconductor laser 2, for launching laser；The metal contiguous block 3 is adjacent for realizing
Electrical connection between semiconductor laser 2；Described heat sink 4 have multiple passages 5 for the refrigerant that circulates, the passage 5
Through described heat sink 4 upper surface and lower surface.In above-mentioned at least one semiconductor laser side pump unit, adjacent semiconductor
The passage of the refrigerant that is used to circulate between laser side pump unit interconnects.
The refrigerant can include but is not limited to：Water（Deionized water）, liquid nitrogen, liquefied ammonia etc., the utility model implemented
Example illustrates so that refrigerant is deionized water as an example.
So that described heat sink 4 is heat sink for ring-type as an example（It is merely illustrative, it is not intended to limit the utility model）, the multiple half
Conductor laser 2 is located at the inwall of the ring-type heat sink 4, and the laser beam that multiple semiconductor lasers 2 are sent converges at described
Ring-type is heat sink 4 center, namely the installing zone of crystal bar.
Corresponded specifically, the inwall 17 of the ring-type heat sink 4 can be provided with above-mentioned multiple semiconductor lasers 2
Mounting platform, insertion heat sink 4 inwall 17 of ring-type is provided between adjacent mounting platform to the mounting hole 11 of outer wall 18, installation
Hole 11 is used to metal contiguous block 3 being fixed on the ring-type heat sink 4 in a manner of mechanical connection.
Preferably, the metal contiguous block 3 can be T-shaped that metal contiguous block 3 is except that can realize adjacent semiconductor laser
Outside electrical connection between device, the fixation between semiconductor laser and ring-type heat sink 4 can also be realized to a certain extent（Gold
The top of category contiguous block 3 can press adjacent semiconductor laser to the heat sink direction of ring-type）, the metal contiguous block 3
Mounting hole 11 of the bottom with ring-type heat sink 4 by way of mechanical connection is connected, and realizes that metal contiguous block 3 and ring-type are heat sink with this
Fixation between 4.
In the utility model embodiment, ring-type is heat sink to have multiple passages 5 on 4, and the multiple passage 5 is heat sink along ring-type
4 radial direction, the lower end of multiple semiconductor lasers 2 is arranged at, and is arranged in array along the central axis of ring-type heat sink 4, it is multiple
Passage 5 runs through the upper and lower surface of ring-type heat sink 4.
Fig. 2 a-2d are the utility model channel design schematic diagram, and the structure of the passage 5 can include but is not limited to：Hole
Hole type, fin-type, specific four kinds of embodiments of passage 5 are shown in figure：
Embodiment one：As shown in Figure 2 a, the passage 5 is the form of ring-like fin；
Embodiment two：As shown in Figure 2 b, the passage 5 is the form of rectangular fin；
Embodiment three：As shown in Figure 2 c, the passage 5 is the form of corrugated fin；
Example IV：As shown in Figure 2 d, the passage 5 is the form of loose structure.
By each embodiment of above-mentioned passage 5, it is apparent that fin-type and the passage of hole type have than straight-through water
The bigger specific surface area in road.Compared to prior art, the increasing number of the waterway of scheme described in the utility model, water flowing area
Also increase, and then cause water-carrying capacity increase, heat sink heat-sinking capability is so greatly improved；Also, multiple passages 5 distinguish position
In the positive lower end of bar bar group of multiple semiconductor lasers 2, so that radiating is more directly effectively.
Preferably, in the utility model embodiment, at heat sink 4 lower surface, the area corresponding with the passage 5
Domain is provided with groove structure 9（It is similar with the groove at upper water flowing block and lower water flowing block lower surface）, for placing seal washer；Institute
Seal washer is stated, for realizing the sealing between adjacent semiconductor laser side pump unit.
Further, side pump module described in the utility model, can also include：With semiconductor laser side pump unit
The adaptable upper water flowing block 6 of upper surface size, the lower water flowing adaptable with the lower surface size of semiconductor laser side pump unit
Block 7.
Here it should be noted that, the structure of upper water flowing block 6 and lower water flowing block 7 is basically identical, and difference is that water flowing block 6 is set
The head end in the side pump module being made up of multiple semiconductor laser side pump units is put, and lower water flowing block 7 is arranged on by multiple half
The end for the side pump module that conductor laser side pump unit is formed.
Fig. 4 a are the structural representation at the upper surface of water flowing block or lower water flowing block on the utility model, as shown in fig. 4 a,
The upper water flowing block 6, is arranged at the upper surface of semiconductor laser side pump unit of side pump module head end, upper water flowing block inwall
Form refrigerant circulation passage between 14 and outer wall 15, the lower surface 16 of upper water flowing block with semiconductor laser side pump unit
Surface is in contact, and has multiple through holes 8 on the lower surface 16 of upper water flowing block, for the refrigerant in upper water flowing block to be delivered to
In heat sink multiple passages 5.The quantity of the through hole 8 and position, quantity and position phase with the passage 5 through heat sink 4
Matching.
The lower water flowing block 7, is arranged at the lower surface of semiconductor laser side pump unit of side pump module end, lower logical
Refrigerant circulation passage, the lower surface 16 of lower water flowing block and semiconductor laser side are formed between water block inwall 14 and outer wall 15
The lower surface of pump unit is in contact, and has multiple through holes 8 on the lower surface 16 of lower water flowing block, for will be that side pump module freezes
Refrigerant export to lower water flowing block.The quantity of the through hole 8 and position, quantity and position with the passage 5 through heat sink 4
Match.
Fig. 4 b are the structural representation at the lower surface of water flowing block or lower water flowing block on the utility model, as shown in Figure 4 b,
At the lower surface 16 of the upper water flowing block 6 and lower water flowing block 7, the region corresponding with the multiple through hole 8 is respectively arranged with recessed
Slot structure 9；The groove structure 9 is used to place seal washer, and the seal washer is used to realize water flowing block 6 and the half of head end
Sealing between the pump unit of conductor laser side and between lower water flowing block 7 and the semiconductor laser side pump unit of end.
Further, the upper water flowing block 6 and lower water flowing block 7 can also have blasthole 12 and apopore 13 respectively.
Fig. 5 is the multiple semiconductor laser side pump unit cascaded structure schematic diagrames of the utility model.As shown in figure 5, nine groups
Central shaft of the semiconductor laser side pump unit along ring-type heat sink 4 carries out axially stacking, also sets up multiple positioning on ring-type is heat sink
Hole 19, the location and installation for multiple semiconductor laser side pump units.Upper water flowing block 6 is located at the head end of side pump unit, lower logical
Water block 7 is located at the end of side pump unit, and the refrigerant in upper water flowing block 6 is through the through hole 8 at the upper lower surface of water flowing block 6, conveying
In the passage 5 heat sink to corresponding ring-type, in the passage 5, the side pump unit through head end flows into next refrigerant successively
Individual side pump unit, until the side pump unit of end, after through hole 8 at the lower surface through lower water flowing block 7 export to lower water flowing block,
Apopore output through lower water flowing block.
, it is apparent that the scheme in the utility model embodiment, can realize the series connection of more polycyclic structures, and
Because heat sink heat-sinking capability increases substantially so that the temperature difference between each ring is smaller；Also, only in semiconductor laser side
The top and bottom of pump module set water flowing block, compared to existing structure, eliminate each semiconductor laser side pump unit
The sealing of upper and lower cover plates so that the external diameter and thickness of product are obviously reduced, so when carrying out polycyclic series connection, the sky between each ring
White region is smaller, so as to improve the uniformity of hot spot.
It is described above, preferred embodiment only of the present utility model, it is not intended to limit protection of the present utility model
Scope.For those skilled in the art, the utility model can have various modifications and variations.It is all of the present utility model
Any modification, equivalent substitution and improvements for being done etc. within spirit and principle, should be included in the scope of protection of the utility model it
It is interior.
Claims (10)
- A kind of 1. new semiconductor laser side pump module, it is characterised in that including：At least one semiconductor laser side pump Unit；The semiconductor laser side pump unit includes multiple semiconductor lasers, metal contiguous block and is the semiconductor Laser radiates heat sink；Wherein, the multiple semiconductor laser, for launching laser；The metal contiguous block, for reality Electrical connection between existing adjacent semiconductor laser；It is described heat sink with multiple passages for the refrigerant that circulates, it is described logical Road runs through the heat sink upper surface and lower surface.
- 2. side pump module according to claim 1, it is characterised in that it is described it is heat sink for ring-type it is heat sink, it is the multiple partly to lead Body laser is located at the heat sink inwall of the ring-type, and its laser beam sent converges at the heat sink center of the ring-type.
- 3. side pump module according to claim 2, it is characterised in that the inwall that the ring-type is heat sink be provided with it is described more The individual one-to-one mounting platform of semiconductor laser, the insertion heat sink inwall of ring-type is provided between adjacent mounting platform to outer The mounting hole of wall, it is heat sink for metal contiguous block to be fixed on into the ring-type in a manner of mechanically connecting.
- 4. side pump module according to claim 2, it is characterised in that the multiple passage is along the heat sink radial direction of the ring-type The lower end of multiple semiconductor lasers is arranged at, and is arranged in array along the heat sink central axis of the ring-type, through the ring The upper and lower surface that shape is heat sink.
- 5. side pump module according to claim 1, it is characterised in that the structure of the passage includes：Hole type, fin Type.
- 6. side pump module according to claim 5, it is characterised in thatDescribed hole type is：The passage is loose structure；The fin-type is：The passage is corrugated fin or ring-like fin or rectangular fin.
- 7. side pump module according to claim 1, it is characterised in that at the heat sink lower surface, with the passage phase Corresponding region is provided with groove structure, for placing seal washer；The seal washer, for realizing adjacent semiconductor laser Sealing between the pump unit of device side.
- 8. according to the side pump module described in any one of claim 1 to 7, it is characterised in that the module also includes：With semiconductor The adaptable upper water flowing block of the upper surface size of laser side pump unit, the lower surface size with semiconductor laser side pump unit Adaptable lower water flowing block；The upper water flowing block, is arranged at the upper surface of semiconductor laser side pump unit of side pump module head end, upper water flowing block Refrigerant circulation passage, lower surface and the semiconductor laser side pump unit upper table of upper water flowing block are formed between inwall and outer wall Face is in contact, and has multiple through holes on the lower surface of upper water flowing block, runs through for the refrigerant in upper water flowing block to be delivered to In heat sink multiple passages, the quantity of the through hole and position, match with the quantity through heat sink passage and position；The lower water flowing block, is arranged at the lower surface of semiconductor laser side pump unit of side pump module end, lower water flowing block Form refrigerant circulation passage between inwall and outer wall, the lower surface of lower water flowing block with semiconductor laser side pump unit Surface is in contact, and has multiple through holes on the lower surface of lower water flowing block, for that will be that the refrigerant that side pump module freezes is defeated Go out to lower water flowing block；The quantity of the through hole and position, match with the quantity through heat sink passage and position.
- 9. side pump module according to claim 8, it is characterised in that the lower surface of the upper water flowing block and lower water flowing block Place, the region corresponding with the multiple through hole is respectively arranged with groove structure；The groove structure is used to place seal washer, The seal washer is used to realize between water flowing block and the semiconductor laser side pump unit of head end and lower water flowing block and end Sealing between the semiconductor laser side pump unit at end.
- 10. side pump module according to claim 1, it is characterised in that at least one semiconductor laser side pump In unit, the passage of the refrigerant that is used to circulate between adjacent semiconductor laser side pump unit interconnects.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720662389.5U CN206806722U (en) | 2017-06-08 | 2017-06-08 | A kind of new semiconductor laser side pump module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720662389.5U CN206806722U (en) | 2017-06-08 | 2017-06-08 | A kind of new semiconductor laser side pump module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206806722U true CN206806722U (en) | 2017-12-26 |
Family
ID=60745731
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720662389.5U Active CN206806722U (en) | 2017-06-08 | 2017-06-08 | A kind of new semiconductor laser side pump module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206806722U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107946900A (en) * | 2017-12-29 | 2018-04-20 | 西安炬光科技股份有限公司 | A kind of semiconductor laser module |
-
2017
- 2017-06-08 CN CN201720662389.5U patent/CN206806722U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107946900A (en) * | 2017-12-29 | 2018-04-20 | 西安炬光科技股份有限公司 | A kind of semiconductor laser module |
| CN107946900B (en) * | 2017-12-29 | 2024-02-13 | 西安炬光科技股份有限公司 | Semiconductor laser module |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN205211737U (en) | Water -filled radiator for IGBT module | |
| CN206353592U (en) | A kind of cold pipe joint of liquid, the cold pipe of liquid and liquid cooling apparatus | |
| CN105977578A (en) | Liquid cooling flat tube encapsulation structure and power device | |
| CN107046144A (en) | Supply unit and electric power system | |
| CN107666202B (en) | Cooling device for new energy automobile motor | |
| CN106972218A (en) | The cooling device and method of a kind of cylinder-type power battery group | |
| CN101814470A (en) | Micro-channel heat sink for electronic encapsulation device | |
| CN106876825A (en) | Heat management device and supply unit | |
| CN106299539A (en) | Battery bag and dispel the heat module and heat-conducting piece | |
| CN106299544A (en) | Battery modules and battery bag | |
| RU175877U1 (en) | CASE OF AN ACTIVE PHASED ANTENNA ARRAY MODULE | |
| CN206806722U (en) | A kind of new semiconductor laser side pump module | |
| CN201655785U (en) | Micro-channel heat sink for electronic packaging device | |
| CN204014395U (en) | Heat radiation module | |
| CN210220286U (en) | Heat exchanger structure | |
| CN209880681U (en) | Battery package of new energy automobile | |
| CN206893766U (en) | A kind of battery case heat-dissipating cover plate | |
| CN204421682U (en) | A kind of automobile radiators | |
| CN107134975B (en) | Multichannel manifold system for heat dissipation of concentrating photovoltaic cell | |
| CN206451790U (en) | A kind of heat-transfer device | |
| CN206742329U (en) | Battery case | |
| US20100154865A1 (en) | Photovoltaic-thermal hybrid apparatus | |
| CN208608328U (en) | A kind of battery water-cooled plate and heat radiation module | |
| CN204256648U (en) | Computer chip water cooling plant | |
| CN204441395U (en) | A kind of lithium ion battery |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20230802 Address after: 710077 Xi'an hi tech Zone 56, Xi'an, Shaanxi Province, No. 56 Patentee after: Focuslight Technologies Inc. Address before: 710077 2nd Floor, Building 1, No. 56 Zhangbaliu Road, High tech Zone, Xi'an City, Shaanxi Province Patentee before: XI'AN YUSHI PHOTOELECTRIC SCIENCE & TECHNOLOGY Co.,Ltd. |