CN204256648U - Computer chip water cooling plant - Google Patents
Computer chip water cooling plant Download PDFInfo
- Publication number
- CN204256648U CN204256648U CN201420751382.7U CN201420751382U CN204256648U CN 204256648 U CN204256648 U CN 204256648U CN 201420751382 U CN201420751382 U CN 201420751382U CN 204256648 U CN204256648 U CN 204256648U
- Authority
- CN
- China
- Prior art keywords
- conservancy diversion
- substrate
- water conservancy
- radiating fin
- radiating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a kind of computer chip water cooling plant, described computer chip water cooling plant comprises a criss-cross fixed support, described support bracket fastened top is provided with a seal cover board, and described support bracket fastened below is provided with a water conservancy diversion substrate and a heat-radiating substrate.The advantage of computer chip water cooling plant of the present utility model is: because the first radiating fin and this second radiating fin are crisscross arranged, refrigerating fluid is through twice shunting, substantially increase the heat exchange efficiency of refrigerating fluid and heat-radiating substrate, further increase the radiating effect of water-cooling heat radiating system.This computer chip water cooling plant structure is simple, with low cost, and successful is practical.
Description
Technical field
The utility model relates to a kind of computer equipment, or rather, is a kind of computer chip water cooling plant.
Background technology
Along with the continuous enhancing with video card capabilities that improves constantly of computer main frequency, the heat radiation of computer chip is increasing, and water-cooling is the active heat removal mode of at present comparatively main flow, with low cost and successful.Existing water-cooling sheet mostly is strip fin, and refrigerating fluid forms single cycle, and radiating effect still has much room for improvement.
Utility model content
The utility model mainly solves the technical matters existing for prior art, thus provides a kind of computer chip water cooling plant.
Above-mentioned technical matters of the present utility model is mainly solved by following technical proposals:
A kind of computer chip water cooling plant, described computer chip water cooling plant comprises a criss-cross fixed support, described support bracket fastened top is provided with a seal cover board, described support bracket fastened below is provided with a water conservancy diversion substrate and a heat-radiating substrate, described support bracket fastened center is provided with the fixing square hole of a quadrilateral, the corner of described fixing square hole is respectively equipped with a holding flange, described holding flange is respectively equipped with a fixed via, described seal cover board comprises a first square hermetic sealing substrate, the first described hermetic sealing substrate is provided with one second hermetic sealing substrate, the second described hermetic sealing substrate is provided with an entrance and an outlet, described water conservancy diversion substrate comprises a flat water conservancy diversion main body, the inside of described water conservancy diversion main body is provided with a square injection projection, described injection projection is provided with an injection and gives prominence to, described injection is outstanding is provided with an injection circular hole, described injection circular hole matches with described entrance, the bottom of described water conservancy diversion main body is provided with the baffle liner of an annular, water conservancy diversion notch is formed between described baffle liner and described injection projection, described heat-radiating substrate comprises a square heat sink body, the center of described heat sink body is provided with the water conservancy diversion cylinder of a taper, the first radiating fin array that the circumference of described water conservancy diversion cylinder is provided with the annular setting be made up of the first radiating fin and the second radiating fin array that the annular be made up of the second radiating fin is arranged, the first described radiating fin and the second described radiating fin are crisscross arranged.
As the utility model preferred embodiment, the length of the first described radiating fin is greater than the second described radiating fin.
As the utility model preferred embodiment, it is one-body molded that described fixed support, seal cover board, water conservancy diversion substrate and heat-radiating substrate are copper.
The advantage of computer chip water cooling plant of the present utility model is: because the first radiating fin and this second radiating fin are crisscross arranged, refrigerating fluid is through twice shunting, substantially increase the heat exchange efficiency of refrigerating fluid and heat-radiating substrate, further increase the radiating effect of water-cooling heat radiating system.This computer chip water cooling plant structure is simple, with low cost, and successful is practical.
Accompanying drawing explanation
In order to be illustrated more clearly in the utility model embodiment or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is only embodiments more of the present utility model, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is the perspective view of computer chip water cooling plant of the present utility model;
Fig. 2 is the spatial structure decomposing schematic representation of the computer chip water cooling plant in Fig. 1;
Fig. 3 is the perspective view of the seal cover board of computer chip water cooling plant in Fig. 2, is now another visual angle;
Fig. 4 be in Fig. 2 the perspective view of water conservancy diversion substrate of computer chip water cooling plant, be now another visual angle;
Fig. 5 is the detailed schematic of the a-quadrant of computer chip water cooling plant in Fig. 2;
Wherein,
1, computer chip water cooling plant; 2, fixed support; 21, fixing square hole; 22, holding flange; 23, fixed via; 3, seal cover board; 31, the first hermetic sealing substrate; 32, the second hermetic sealing substrate; 33, entrance; 34, export; 4, water conservancy diversion substrate; 41, water conservancy diversion main body; 42, projection is injected; 43, injection is outstanding; 44, circular hole is injected; 45, baffle liner; 46, water conservancy diversion notch; 5, heat-radiating substrate; 51, heat sink body; 52, water conservancy diversion cylinder; 53, the first radiating fin; 54, the second radiating fin.
Embodiment
Below in conjunction with accompanying drawing, preferred embodiment of the present utility model is described in detail, to make advantage of the present utility model and feature can be easier to be readily appreciated by one skilled in the art, thus more explicit defining is made to protection domain of the present utility model.
As shown in Figures 1 to 5, computer chip water cooling plant 1 of the present utility model comprises a criss-cross fixed support 2, the top of this fixed support 2 is provided with a seal cover board 3, the below of this fixed support 2 is provided with water conservancy diversion substrate 4 and a heat-radiating substrate 5, the center of this fixed support 2 is provided with the fixing square hole 21 of a quadrilateral, the corner of this fixing square hole 21 is respectively equipped with a holding flange 22, this holding flange 22 is respectively equipped with a fixed via 23, sealing cover plate 3 comprises a first square hermetic sealing substrate 31, this first hermetic sealing substrate 31 is provided with one second hermetic sealing substrate 32, this second hermetic sealing substrate 32 is provided with entrance 33 and an outlet 34, this water conservancy diversion substrate 4 comprises a flat water conservancy diversion main body 41, the inside of this water conservancy diversion main body 41 is provided with a square injection projection 42, this injection projection 42 is provided with an injection outstanding 43, this injection outstanding 43 is provided with an injection circular hole 44, this injection circular hole 44 matches with this entrance 33, the bottom of this water conservancy diversion main body 41 is provided with the baffle liner 45 of an annular, water conservancy diversion notch 46 is formed between this baffle liner 45 and this injection projection 42, this heat-radiating substrate 5 comprises a square heat sink body 51, the center of this heat sink body 51 is provided with the water conservancy diversion cylinder 52 of a taper, the first radiating fin array that the circumference of this water conservancy diversion cylinder 52 is provided with the annular setting be made up of the first radiating fin 53 and the second radiating fin array that the annular be made up of the second radiating fin 54 is arranged, this first radiating fin 53 is crisscross arranged with this second radiating fin 54.
The length of this first radiating fin 53 is greater than this second radiating fin 54.
It is one-body molded that this fixed support 2, seal cover board 3, water conservancy diversion substrate 4 and heat-radiating substrate 5 are copper.
During use, as depicted in figs. 1 and 2, user is by the liquid feeding pipeline access entrance 33 in the coolant circulation system of outside, liquid coolant enters into the injection circular hole 44 injecting outstanding 43, and directly impact the water conservancy diversion cylinder 52 of taper, under the guiding of water conservancy diversion cylinder 52, liquid coolant radially flows to the first radiating fin array and the second radiating fin array, because the first radiating fin 53 is crisscross arranged with this second radiating fin 54, refrigerating fluid is through twice shunting, substantially increase the heat exchange efficiency of refrigerating fluid and heat-radiating substrate 5, further increase the radiating effect of water-cooling heat radiating system.This computer chip water cooling plant 1 structure is simple, with low cost, and successful is practical.
Be not limited to this, any change of expecting without creative work or replacement, all should be encompassed within protection domain of the present utility model.Therefore, the protection domain that protection domain of the present utility model should limit with claims is as the criterion.
Claims (3)
1. a computer chip water cooling plant, it is characterized in that, described computer chip water cooling plant (1) comprises a criss-cross fixed support (2), the top of described fixed support (2) is provided with a seal cover board (3), the below of described fixed support (2) is provided with a water conservancy diversion substrate (4) and a heat-radiating substrate (5), the center of described fixed support (2) is provided with the fixing square hole (21) of a quadrilateral, the corner of described fixing square hole (21) is respectively equipped with a holding flange (22), described holding flange (22) is respectively equipped with a fixed via (23), described seal cover board (3) comprises square first hermetic sealing substrate (31), described the first hermetic sealing substrate (31) is provided with one second hermetic sealing substrate (32), described the second hermetic sealing substrate (32) is provided with an entrance (33) and an outlet (34), described water conservancy diversion substrate (4) comprises a flat water conservancy diversion main body (41), the inside of described water conservancy diversion main body (41) is provided with a square injection projection (42), described injection projection (42) is provided with an injection outstanding (43), described injection outstanding (43) is provided with an injection circular hole (44), described injection circular hole (44) matches with described entrance (33), the bottom of described water conservancy diversion main body (41) is provided with the baffle liner (45) of an annular, water conservancy diversion notch (46) is formed between described baffle liner (45) and described injection projection (42), described heat-radiating substrate (5) comprises a square heat sink body (51), the center of described heat sink body (51) is provided with the water conservancy diversion cylinder (52) of a taper, the first radiating fin array that the circumference of described water conservancy diversion cylinder (52) is provided with the annular setting be made up of the first radiating fin (53) and the second radiating fin array that the annular be made up of the second radiating fin (54) is arranged, described the first radiating fin (53) and described the second radiating fin (54) are crisscross arranged.
2. computer chip water cooling plant according to claim 1, is characterized in that, the length of described the first radiating fin (53) is greater than described the second radiating fin (54).
3. computer chip water cooling plant according to claim 2, is characterized in that, it is one-body molded that described fixed support (2), seal cover board (3), water conservancy diversion substrate (4) and heat-radiating substrate (5) are copper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420751382.7U CN204256648U (en) | 2014-12-04 | 2014-12-04 | Computer chip water cooling plant |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420751382.7U CN204256648U (en) | 2014-12-04 | 2014-12-04 | Computer chip water cooling plant |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204256648U true CN204256648U (en) | 2015-04-08 |
Family
ID=52960934
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420751382.7U Expired - Fee Related CN204256648U (en) | 2014-12-04 | 2014-12-04 | Computer chip water cooling plant |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204256648U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104779227A (en) * | 2015-04-28 | 2015-07-15 | 天津商业大学 | Liquid-cooled chip radiator with annularly-distributed fins |
| CN104779226A (en) * | 2015-04-28 | 2015-07-15 | 天津商业大学 | Liquid-cooled high heating flux device radiator with flow guide channels |
| CN112285532A (en) * | 2020-10-15 | 2021-01-29 | 苏州莱锦机电自动化有限公司 | Electromechanical monitoring device |
-
2014
- 2014-12-04 CN CN201420751382.7U patent/CN204256648U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104779227A (en) * | 2015-04-28 | 2015-07-15 | 天津商业大学 | Liquid-cooled chip radiator with annularly-distributed fins |
| CN104779226A (en) * | 2015-04-28 | 2015-07-15 | 天津商业大学 | Liquid-cooled high heating flux device radiator with flow guide channels |
| CN104779226B (en) * | 2015-04-28 | 2017-06-30 | 天津商业大学 | Liquid-cooled high heat flux device radiator with flow-guiding channel |
| CN104779227B (en) * | 2015-04-28 | 2017-10-10 | 天津商业大学 | Fin annular spread liquid cooling chips type radiator |
| CN112285532A (en) * | 2020-10-15 | 2021-01-29 | 苏州莱锦机电自动化有限公司 | Electromechanical monitoring device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN204256648U (en) | Computer chip water cooling plant | |
| CN206431561U (en) | A kind of cooling circulating water automatic water-replenishing device | |
| CN205750705U (en) | A kind of video card of the air-cooled integration of water-cooled | |
| US20180027697A1 (en) | Cold plate assembly for electrical cabinet | |
| CN205003613U (en) | Computer water cooling plant | |
| CN202977401U (en) | Liquid-cooled heat dissipation module | |
| CN205644413U (en) | Heat sink | |
| CN202433827U (en) | Integral water-cooled radiator | |
| CN204127292U (en) | Gear-box and casing thereof | |
| CN203672212U (en) | Heat storage and exchange device and heat storage tank device | |
| CN203217470U (en) | Computer radiating device | |
| CN204145275U (en) | A kind of water-cooling frequency converter | |
| CN207301952U (en) | A kind of water cooling computer heat-conducting plate | |
| CN205880800U (en) | Computer water -cooling radiating device | |
| CN208346250U (en) | The cooling-cycle device of coating machine | |
| CN204830922U (en) | Vertical condenser | |
| CN205610365U (en) | Liquid cooling motor stator | |
| CN204720858U (en) | Underground substation | |
| CN204272574U (en) | A kind of Liquid cooling chasis cooling fluid high-efficiency heat exchanger | |
| CN206399230U (en) | A kind of Rapid Circulation device | |
| CN205213242U (en) | Liquid cooling device and computer | |
| CN205790283U (en) | Battery cooling apparatus | |
| CN204612136U (en) | New and effective magnetic energy water heater | |
| CN204967604U (en) | A S -shaped water course liquid cooling bottom plate for industry converter | |
| CN106125862A (en) | Computer water-cooling radiating device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150408 Termination date: 20151204 |
|
| EXPY | Termination of patent right or utility model |