CN106125862A - Computer water-cooling radiating device - Google Patents

Computer water-cooling radiating device Download PDF

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Publication number
CN106125862A
CN106125862A CN201610455673.5A CN201610455673A CN106125862A CN 106125862 A CN106125862 A CN 106125862A CN 201610455673 A CN201610455673 A CN 201610455673A CN 106125862 A CN106125862 A CN 106125862A
Authority
CN
China
Prior art keywords
radiating fin
heat radiation
circular hole
abaculus
radiating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
CN201610455673.5A
Other languages
Chinese (zh)
Inventor
余学文
周伟光
欧阳文
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shunde Vocational and Technical College
Original Assignee
Shunde Vocational and Technical College
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shunde Vocational and Technical College filed Critical Shunde Vocational and Technical College
Priority to CN201610455673.5A priority Critical patent/CN106125862A/en
Publication of CN106125862A publication Critical patent/CN106125862A/en
Withdrawn legal-status Critical Current

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Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The invention discloses a kind of computer water-cooling radiating device, described computer water-cooling radiating device comprises a cover plate, a heat radiation abaculus and a heat radiation matrix, described heat dispersion substrate is provided with a pair the first radiating fin array being made up of the first radiating fin, second radiating fin array being made up of the second radiating fin it is provided with between the first described radiating fin array, the first described radiating fin is vertical bar shape, and the second described radiating fin is in " S " font.Utilizing the first radiating fin array on heat radiation matrix and the second radiating fin array, coolant, after the first radiating fin, is passed through second radiating fin of " S " font and forms flow-disturbing, the most again through another first radiating fin.Owing to coolant forms flow-disturbing, substantially increase the liquid heat exchange efficiency with heat radiation matrix of colding pressing, thus be effectively increased the radiating efficiency of this computer water-cooling radiating device, simple in construction, practical.

Description

Computer water-cooling radiating device
Technical field
The present invention relates to a kind of computer equipment, more precisely, be a kind of computer water-cooling radiating device.
Background technology
Along with the power consumption of computer is on the increase, heat dissipation problem seems especially prominent, and computer water-cooling heat dissipation technology is A kind of effective technical scheme.Current radiating module generally uses straight fin fin, and radiating efficiency needs further Raising.
Summary of the invention
The present invention mainly solves the technical problem existing for prior art, thus provides a kind of computer water-cooling heat radiation dress Put.
The above-mentioned technical problem of the present invention is mainly addressed by following technical proposals:
A kind of computer water-cooling radiating device, described computer water-cooling radiating device comprises a cover plate, a heat radiation abaculus and Heat radiation matrix, the middle part of described cover plate is provided with a pair connection circular hole, and the corner of described cover plate is respectively equipped with a cover plate circle Hole, the center of described heat radiation abaculus is provided with a hexagonal embedding hole, the corner of described heat radiation abaculus is respectively equipped with one embedding Block circular hole, the upper and lower surface of upper surface of described heat radiation abaculus is respectively equipped with a hexagonal closure gasket groove, and described is close Being respectively equipped with a hexagonal sealing ring bar in seal ring groove, described heat radiation matrix comprises the heat dispersion substrate of a square piece shape, described Heat dispersion substrate corner on be respectively equipped with a locking circular hole, described locking circular hole, abaculus circular hole and cover plate circular hole lead to respectively Cross a locking screw rod and a locking nut is connected.Described heat dispersion substrate is provided be made up of the first radiating fin a pair One radiating fin array, is provided with second heat radiating fin being made up of the second radiating fin between the first described radiating fin array Chip arrays, the first described radiating fin is vertical bar shape, and the second described radiating fin is in " S " font.
As preferred embodiment of the present invention, described heat radiation matrix is that copper is one-body molded.
The advantage of the computer water-cooling radiating device of the present invention is: during use, and heat radiation matrix is installed to needs by user Above the chip module of heat radiation, and the water nozzle of coolant pump is directly inserted in the connection circular hole of cover plate.Utilize heat radiation matrix On the first radiating fin array and the second radiating fin array, coolant is after the first radiating fin, through " S " font Second radiating fin also forms flow-disturbing, the most again through another first radiating fin.Owing to coolant forms flow-disturbing, it is greatly improved Cold pressing the liquid heat exchange efficiency with heat radiation matrix, thus be effectively increased the radiating efficiency of this computer water-cooling radiating device, knot Structure is simple, practical.
Accompanying drawing explanation
In order to be illustrated more clearly that the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing In having technology to describe, the required accompanying drawing used is briefly described, it should be apparent that, the accompanying drawing in describing below is only this Some embodiments of invention, for those of ordinary skill in the art, on the premise of not paying creative work, it is also possible to Other accompanying drawing is obtained according to these accompanying drawings.
Fig. 1 is the perspective view of the computer water-cooling radiating device of the present invention;
Fig. 2 is the stereochemical structure decomposing schematic representation of the computer water-cooling radiating device in Fig. 1;
Fig. 3 is the details enlarged diagram of the a-quadrant of the computer water-cooling radiating device in Fig. 2;
Fig. 4 is the details enlarged diagram in the B region of the computer water-cooling radiating device in Fig. 2;
Fig. 5 is the perspective view of the heat radiation matrix of the computer water-cooling radiating device in Fig. 2, now regards for another Angle;
Wherein,
1, computer water-cooling radiating device;2, cover plate;21, circular hole is connected;22, cover plate circular hole;3, heat radiation abaculus;30, embedding hole; 31, closure gasket groove;32, abaculus circular hole;4, heat radiation matrix;41, heat dispersion substrate;42, the first radiating fin;43, the second heat radiating fin Sheet;44, locking circular hole;5, sealing ring bar;6, locking screw rod;7, locking nut.
Detailed description of the invention
Below in conjunction with the accompanying drawings the preferred embodiments of the present invention are described in detail, so that advantages and features of the invention energy It is easier to be readily appreciated by one skilled in the art, thus protection scope of the present invention is made apparent clear and definite defining.
As shown in Figures 1 to 5, this computer water-cooling radiating device 1 comprises cover plate 2, heat radiation abaculus 3 and a heat radiation base Block 4, the middle part of this cover plate 2 is provided with a pair connection circular hole 21, and the corner of this cover plate 2 is respectively equipped with a cover plate circular hole 22, and this dissipates The center of hot abaculus 3 is provided with a hexagonal embedding hole 30, and the corner of this heat radiation abaculus 3 is respectively equipped with an abaculus circular hole 32, should It is respectively equipped with a hexagonal closure gasket groove 31, on the upper and lower surface of upper surface of heat radiation abaculus 3 in this closure gasket groove 31 respectively Being provided with a hexagonal sealing ring bar 5, this heat radiation matrix 4 comprises the heat dispersion substrate 41 of a square piece shape, the four of this heat dispersion substrate 41 Being respectively equipped with a locking circular hole 44 on angle, this locking circular hole 44, abaculus circular hole 32 and cover plate circular hole 22 are respectively by a locking spiral shell Bar 6 is connected with a locking nut 7.This heat dispersion substrate 41 is provided with a pair the first heat radiating fin being made up of the first radiating fin 42 Chip arrays, is provided with second radiating fin array being made up of the second radiating fin 43 between this first radiating fin array, should First radiating fin 42 is in vertical bar shape, and this second radiating fin 43 is in " S " font.
This heat radiation matrix 4 is that copper is one-body molded.
During use, as depicted in figs. 1 and 2, heat radiation matrix 4 is installed to need above the chip module of heat radiation by user, And the water nozzle of coolant pump is directly inserted in the connection circular hole 21 of cover plate 2.Utilize the first radiating fin on heat radiation matrix 4 Array and the second radiating fin array, coolant is after the first radiating fin 42, through second radiating fin 43 of " S " font And form flow-disturbing, the most again through another first radiating fin 42.Due to coolant formed flow-disturbing, substantially increase cold pressing liquid with The heat exchange efficiency of heat radiation matrix 4, thus it is effectively increased the radiating efficiency of this computer water-cooling radiating device 1, simple in construction, real Strong by property.
It is not limited to this, any change expected without creative work or replacement, all should contain the guarantor in the present invention Within the scope of protecting.Therefore, protection scope of the present invention should be as the criterion with the protection domain that claims are limited.

Claims (2)

1. a computer water-cooling radiating device, it is characterised in that described computer water-cooling radiating device (1) comprises a cover plate (2), one heat radiation abaculus (3) and one dispel the heat matrix (4), the middle part of described cover plate (2) is provided with a pair connection circular hole (21), described Cover plate (2) corner on be respectively equipped with a cover plate circular hole (22), it is hexagonal that the center of described heat radiation abaculus (3) is provided with one Embedding hole (30), the corner of described heat radiation abaculus (3) is respectively equipped with an abaculus circular hole (32), described heat radiation abaculus (3) It is respectively equipped with a hexagonal closure gasket groove (31) on the upper and lower surface of upper surface, is respectively equipped with in described closure gasket groove (31) One hexagonal sealing ring bar (5), described heat radiation matrix (4) comprises the heat dispersion substrate (41) of a square piece shape, described heat radiation A locking circular hole (44), described locking circular hole (44), abaculus circular hole (32) and cover plate it is respectively equipped with on the corner of substrate (41) Circular hole (22) is connected with a locking nut (7) by a locking screw rod (6) respectively, and described heat dispersion substrate (41) is provided with one To the first radiating fin array being made up of the first radiating fin (42), be provided with between the first described radiating fin array one by The second radiating fin array that second radiating fin (43) forms, described the first radiating fin (42) is in vertical bar shape, described Second radiating fin (43) is in " S " font.
Computer water-cooling radiating device the most according to claim 1, it is characterised in that described heat radiation matrix (4) is copper One-body molded.
CN201610455673.5A 2016-06-22 2016-06-22 Computer water-cooling radiating device Withdrawn CN106125862A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201610455673.5A CN106125862A (en) 2016-06-22 2016-06-22 Computer water-cooling radiating device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201610455673.5A CN106125862A (en) 2016-06-22 2016-06-22 Computer water-cooling radiating device

Publications (1)

Publication Number Publication Date
CN106125862A true CN106125862A (en) 2016-11-16

Family

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Family Applications (1)

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CN201610455673.5A Withdrawn CN106125862A (en) 2016-06-22 2016-06-22 Computer water-cooling radiating device

Country Status (1)

Country Link
CN (1) CN106125862A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020244543A1 (en) * 2019-06-04 2020-12-10 姜海波 Modularized case

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102155851A (en) * 2011-04-01 2011-08-17 株洲时代金属制造有限公司 Water-cooling heat dissipater
CN204087111U (en) * 2014-09-24 2015-01-07 郑莹 Alternating expression computer water cooler
CN104298327A (en) * 2014-09-24 2015-01-21 齐齐哈尔大学 Computer water-cooling heat exchange device and computer adopting same
CN104333999A (en) * 2014-10-24 2015-02-04 常州格力博有限公司 Novel combined radiator applied to water cooling device
CN205003613U (en) * 2015-09-13 2016-01-27 湖北工程职业学院 Computer water cooling plant
CN205880800U (en) * 2016-06-22 2017-01-11 顺德职业技术学院 Computer water -cooling radiating device

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102155851A (en) * 2011-04-01 2011-08-17 株洲时代金属制造有限公司 Water-cooling heat dissipater
CN204087111U (en) * 2014-09-24 2015-01-07 郑莹 Alternating expression computer water cooler
CN104298327A (en) * 2014-09-24 2015-01-21 齐齐哈尔大学 Computer water-cooling heat exchange device and computer adopting same
CN104333999A (en) * 2014-10-24 2015-02-04 常州格力博有限公司 Novel combined radiator applied to water cooling device
CN205003613U (en) * 2015-09-13 2016-01-27 湖北工程职业学院 Computer water cooling plant
CN205880800U (en) * 2016-06-22 2017-01-11 顺德职业技术学院 Computer water -cooling radiating device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020244543A1 (en) * 2019-06-04 2020-12-10 姜海波 Modularized case

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Application publication date: 20161116