CN106125862A - Computer water-cooling radiating device - Google Patents
Computer water-cooling radiating device Download PDFInfo
- Publication number
- CN106125862A CN106125862A CN201610455673.5A CN201610455673A CN106125862A CN 106125862 A CN106125862 A CN 106125862A CN 201610455673 A CN201610455673 A CN 201610455673A CN 106125862 A CN106125862 A CN 106125862A
- Authority
- CN
- China
- Prior art keywords
- radiating fin
- heat radiation
- circular hole
- abaculus
- radiating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
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Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
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- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a kind of computer water-cooling radiating device, described computer water-cooling radiating device comprises a cover plate, a heat radiation abaculus and a heat radiation matrix, described heat dispersion substrate is provided with a pair the first radiating fin array being made up of the first radiating fin, second radiating fin array being made up of the second radiating fin it is provided with between the first described radiating fin array, the first described radiating fin is vertical bar shape, and the second described radiating fin is in " S " font.Utilizing the first radiating fin array on heat radiation matrix and the second radiating fin array, coolant, after the first radiating fin, is passed through second radiating fin of " S " font and forms flow-disturbing, the most again through another first radiating fin.Owing to coolant forms flow-disturbing, substantially increase the liquid heat exchange efficiency with heat radiation matrix of colding pressing, thus be effectively increased the radiating efficiency of this computer water-cooling radiating device, simple in construction, practical.
Description
Technical field
The present invention relates to a kind of computer equipment, more precisely, be a kind of computer water-cooling radiating device.
Background technology
Along with the power consumption of computer is on the increase, heat dissipation problem seems especially prominent, and computer water-cooling heat dissipation technology is
A kind of effective technical scheme.Current radiating module generally uses straight fin fin, and radiating efficiency needs further
Raising.
Summary of the invention
The present invention mainly solves the technical problem existing for prior art, thus provides a kind of computer water-cooling heat radiation dress
Put.
The above-mentioned technical problem of the present invention is mainly addressed by following technical proposals:
A kind of computer water-cooling radiating device, described computer water-cooling radiating device comprises a cover plate, a heat radiation abaculus and
Heat radiation matrix, the middle part of described cover plate is provided with a pair connection circular hole, and the corner of described cover plate is respectively equipped with a cover plate circle
Hole, the center of described heat radiation abaculus is provided with a hexagonal embedding hole, the corner of described heat radiation abaculus is respectively equipped with one embedding
Block circular hole, the upper and lower surface of upper surface of described heat radiation abaculus is respectively equipped with a hexagonal closure gasket groove, and described is close
Being respectively equipped with a hexagonal sealing ring bar in seal ring groove, described heat radiation matrix comprises the heat dispersion substrate of a square piece shape, described
Heat dispersion substrate corner on be respectively equipped with a locking circular hole, described locking circular hole, abaculus circular hole and cover plate circular hole lead to respectively
Cross a locking screw rod and a locking nut is connected.Described heat dispersion substrate is provided be made up of the first radiating fin a pair
One radiating fin array, is provided with second heat radiating fin being made up of the second radiating fin between the first described radiating fin array
Chip arrays, the first described radiating fin is vertical bar shape, and the second described radiating fin is in " S " font.
As preferred embodiment of the present invention, described heat radiation matrix is that copper is one-body molded.
The advantage of the computer water-cooling radiating device of the present invention is: during use, and heat radiation matrix is installed to needs by user
Above the chip module of heat radiation, and the water nozzle of coolant pump is directly inserted in the connection circular hole of cover plate.Utilize heat radiation matrix
On the first radiating fin array and the second radiating fin array, coolant is after the first radiating fin, through " S " font
Second radiating fin also forms flow-disturbing, the most again through another first radiating fin.Owing to coolant forms flow-disturbing, it is greatly improved
Cold pressing the liquid heat exchange efficiency with heat radiation matrix, thus be effectively increased the radiating efficiency of this computer water-cooling radiating device, knot
Structure is simple, practical.
Accompanying drawing explanation
In order to be illustrated more clearly that the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
In having technology to describe, the required accompanying drawing used is briefly described, it should be apparent that, the accompanying drawing in describing below is only this
Some embodiments of invention, for those of ordinary skill in the art, on the premise of not paying creative work, it is also possible to
Other accompanying drawing is obtained according to these accompanying drawings.
Fig. 1 is the perspective view of the computer water-cooling radiating device of the present invention;
Fig. 2 is the stereochemical structure decomposing schematic representation of the computer water-cooling radiating device in Fig. 1;
Fig. 3 is the details enlarged diagram of the a-quadrant of the computer water-cooling radiating device in Fig. 2;
Fig. 4 is the details enlarged diagram in the B region of the computer water-cooling radiating device in Fig. 2;
Fig. 5 is the perspective view of the heat radiation matrix of the computer water-cooling radiating device in Fig. 2, now regards for another
Angle;
Wherein,
1, computer water-cooling radiating device;2, cover plate;21, circular hole is connected;22, cover plate circular hole;3, heat radiation abaculus;30, embedding hole;
31, closure gasket groove;32, abaculus circular hole;4, heat radiation matrix;41, heat dispersion substrate;42, the first radiating fin;43, the second heat radiating fin
Sheet;44, locking circular hole;5, sealing ring bar;6, locking screw rod;7, locking nut.
Detailed description of the invention
Below in conjunction with the accompanying drawings the preferred embodiments of the present invention are described in detail, so that advantages and features of the invention energy
It is easier to be readily appreciated by one skilled in the art, thus protection scope of the present invention is made apparent clear and definite defining.
As shown in Figures 1 to 5, this computer water-cooling radiating device 1 comprises cover plate 2, heat radiation abaculus 3 and a heat radiation base
Block 4, the middle part of this cover plate 2 is provided with a pair connection circular hole 21, and the corner of this cover plate 2 is respectively equipped with a cover plate circular hole 22, and this dissipates
The center of hot abaculus 3 is provided with a hexagonal embedding hole 30, and the corner of this heat radiation abaculus 3 is respectively equipped with an abaculus circular hole 32, should
It is respectively equipped with a hexagonal closure gasket groove 31, on the upper and lower surface of upper surface of heat radiation abaculus 3 in this closure gasket groove 31 respectively
Being provided with a hexagonal sealing ring bar 5, this heat radiation matrix 4 comprises the heat dispersion substrate 41 of a square piece shape, the four of this heat dispersion substrate 41
Being respectively equipped with a locking circular hole 44 on angle, this locking circular hole 44, abaculus circular hole 32 and cover plate circular hole 22 are respectively by a locking spiral shell
Bar 6 is connected with a locking nut 7.This heat dispersion substrate 41 is provided with a pair the first heat radiating fin being made up of the first radiating fin 42
Chip arrays, is provided with second radiating fin array being made up of the second radiating fin 43 between this first radiating fin array, should
First radiating fin 42 is in vertical bar shape, and this second radiating fin 43 is in " S " font.
This heat radiation matrix 4 is that copper is one-body molded.
During use, as depicted in figs. 1 and 2, heat radiation matrix 4 is installed to need above the chip module of heat radiation by user,
And the water nozzle of coolant pump is directly inserted in the connection circular hole 21 of cover plate 2.Utilize the first radiating fin on heat radiation matrix 4
Array and the second radiating fin array, coolant is after the first radiating fin 42, through second radiating fin 43 of " S " font
And form flow-disturbing, the most again through another first radiating fin 42.Due to coolant formed flow-disturbing, substantially increase cold pressing liquid with
The heat exchange efficiency of heat radiation matrix 4, thus it is effectively increased the radiating efficiency of this computer water-cooling radiating device 1, simple in construction, real
Strong by property.
It is not limited to this, any change expected without creative work or replacement, all should contain the guarantor in the present invention
Within the scope of protecting.Therefore, protection scope of the present invention should be as the criterion with the protection domain that claims are limited.
Claims (2)
1. a computer water-cooling radiating device, it is characterised in that described computer water-cooling radiating device (1) comprises a cover plate
(2), one heat radiation abaculus (3) and one dispel the heat matrix (4), the middle part of described cover plate (2) is provided with a pair connection circular hole (21), described
Cover plate (2) corner on be respectively equipped with a cover plate circular hole (22), it is hexagonal that the center of described heat radiation abaculus (3) is provided with one
Embedding hole (30), the corner of described heat radiation abaculus (3) is respectively equipped with an abaculus circular hole (32), described heat radiation abaculus (3)
It is respectively equipped with a hexagonal closure gasket groove (31) on the upper and lower surface of upper surface, is respectively equipped with in described closure gasket groove (31)
One hexagonal sealing ring bar (5), described heat radiation matrix (4) comprises the heat dispersion substrate (41) of a square piece shape, described heat radiation
A locking circular hole (44), described locking circular hole (44), abaculus circular hole (32) and cover plate it is respectively equipped with on the corner of substrate (41)
Circular hole (22) is connected with a locking nut (7) by a locking screw rod (6) respectively, and described heat dispersion substrate (41) is provided with one
To the first radiating fin array being made up of the first radiating fin (42), be provided with between the first described radiating fin array one by
The second radiating fin array that second radiating fin (43) forms, described the first radiating fin (42) is in vertical bar shape, described
Second radiating fin (43) is in " S " font.
Computer water-cooling radiating device the most according to claim 1, it is characterised in that described heat radiation matrix (4) is copper
One-body molded.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610455673.5A CN106125862A (en) | 2016-06-22 | 2016-06-22 | Computer water-cooling radiating device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610455673.5A CN106125862A (en) | 2016-06-22 | 2016-06-22 | Computer water-cooling radiating device |
Publications (1)
Publication Number | Publication Date |
---|---|
CN106125862A true CN106125862A (en) | 2016-11-16 |
Family
ID=57268838
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201610455673.5A Withdrawn CN106125862A (en) | 2016-06-22 | 2016-06-22 | Computer water-cooling radiating device |
Country Status (1)
Country | Link |
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CN (1) | CN106125862A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2020244543A1 (en) * | 2019-06-04 | 2020-12-10 | 姜海波 | Modularized case |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102155851A (en) * | 2011-04-01 | 2011-08-17 | 株洲时代金属制造有限公司 | Water-cooling heat dissipater |
CN204087111U (en) * | 2014-09-24 | 2015-01-07 | 郑莹 | Alternating expression computer water cooler |
CN104298327A (en) * | 2014-09-24 | 2015-01-21 | 齐齐哈尔大学 | Computer water-cooling heat exchange device and computer adopting same |
CN104333999A (en) * | 2014-10-24 | 2015-02-04 | 常州格力博有限公司 | Novel combined radiator applied to water cooling device |
CN205003613U (en) * | 2015-09-13 | 2016-01-27 | 湖北工程职业学院 | Computer water cooling plant |
CN205880800U (en) * | 2016-06-22 | 2017-01-11 | 顺德职业技术学院 | Computer water -cooling radiating device |
-
2016
- 2016-06-22 CN CN201610455673.5A patent/CN106125862A/en not_active Withdrawn
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102155851A (en) * | 2011-04-01 | 2011-08-17 | 株洲时代金属制造有限公司 | Water-cooling heat dissipater |
CN204087111U (en) * | 2014-09-24 | 2015-01-07 | 郑莹 | Alternating expression computer water cooler |
CN104298327A (en) * | 2014-09-24 | 2015-01-21 | 齐齐哈尔大学 | Computer water-cooling heat exchange device and computer adopting same |
CN104333999A (en) * | 2014-10-24 | 2015-02-04 | 常州格力博有限公司 | Novel combined radiator applied to water cooling device |
CN205003613U (en) * | 2015-09-13 | 2016-01-27 | 湖北工程职业学院 | Computer water cooling plant |
CN205880800U (en) * | 2016-06-22 | 2017-01-11 | 顺德职业技术学院 | Computer water -cooling radiating device |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2020244543A1 (en) * | 2019-06-04 | 2020-12-10 | 姜海波 | Modularized case |
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SE01 | Entry into force of request for substantive examination | ||
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WW01 | Invention patent application withdrawn after publication |
Application publication date: 20161116 |