CN107946900B - Semiconductor laser module - Google Patents
Semiconductor laser module Download PDFInfo
- Publication number
- CN107946900B CN107946900B CN201711474060.7A CN201711474060A CN107946900B CN 107946900 B CN107946900 B CN 107946900B CN 201711474060 A CN201711474060 A CN 201711474060A CN 107946900 B CN107946900 B CN 107946900B
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- Prior art keywords
- heat sink
- semiconductor laser
- plug
- module
- semiconductor lasers
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 119
- 238000001816 cooling Methods 0.000 claims description 18
- 238000000605 extraction Methods 0.000 claims description 14
- 239000007788 liquid Substances 0.000 claims description 11
- 239000013013 elastic material Substances 0.000 claims description 8
- 230000000694 effects Effects 0.000 claims description 4
- 238000005057 refrigeration Methods 0.000 description 15
- 238000005086 pumping Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 239000000758 substrate Substances 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 239000013078 crystal Substances 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 230000005489 elastic deformation Effects 0.000 description 3
- 239000004696 Poly ether ether ketone Substances 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 2
- 239000000498 cooling water Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229920002530 polyetherether ketone Polymers 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- -1 e.g. Substances 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0235—Method for mounting laser chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0233—Mounting configuration of laser chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/023—Mount members, e.g. sub-mount members
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Semiconductor Lasers (AREA)
Abstract
The embodiment of the invention provides a novel semiconductor laser module, which comprises: at least one semiconductor laser unit, each semiconductor laser unit including a plurality of semiconductor lasers, a plug connector, and a heat sink that dissipates heat for the plurality of semiconductor lasers; the semiconductor laser comprises a heat sink, a plurality of semiconductor lasers, a plurality of light source modules and a plurality of light source modules, wherein the heat sink is provided with a plurality of open slots on the inner wall; the plug connector is used for fixing the semiconductor laser and the heat sink by being inserted into the open slot. The semiconductor laser module provided by the invention can effectively improve the positioning precision, is simple to assemble and is easy to operate.
Description
Technical Field
The invention relates to the field of semiconductor lasers, in particular to a novel semiconductor laser module which can be used in pumping and other fields.
Background
The semiconductor laser has the advantages of small volume, light weight, high reliability, long service life and the like, and is widely applied to various fields of national economy at present, such as being used as a pumping source for pumping a solid laser. In applications where a semiconductor laser is used as a side pumping source, the existing side pumping module generally adopts a form that the semiconductor laser is distributed around a crystal rod in a regular triangle, a regular pentagon, a regular heptagon, etc., and dissipates heat for the semiconductor laser and the crystal rod through a heat sink.
At present, the cooling scheme of the above module mostly adopts a mode of arranging a plurality of groups of water channels on the heat sink main body and introducing a cooling medium into the water channels to cool the module, as shown in fig. 1. However, this approach has several drawbacks, such as: too many sealing rings are introduced in the design of the water passage, so that the assembly is complex; each laser on each annular module is fixed through external screws, so that the number of the external screws of the annular module is large, and the protruding parts of the screws influence the overall appearance; the connecting electrode and the extracting electrode need to be wound with insulating tapes to prevent short circuit, so that excessive insulating tapes are introduced; when multiple rings are assembled, the water channels on each annular module are aligned one by one, and the positioning requirement is high.
Disclosure of Invention
In view of the above technical problems, one of the main objects of the embodiments of the present invention is to provide a novel semiconductor laser module, by designing a novel plug connector, it is possible to realize the limit fixation among at least three of each semiconductor laser, a connection electrode, a heat sink, etc., and the refrigeration part of the module is arranged outside the semiconductor laser unit, so that the problem that the conventional scheme is difficult to accurately position is solved, the assembly is simple, the operation is easy, and the application prospect and the market prospect are large.
The technical scheme of the invention is realized as follows:
an embodiment of the present invention provides a semiconductor laser module, including: at least one semiconductor laser unit, each semiconductor laser unit including a plurality of semiconductor lasers, a plug connector, and a heat sink that dissipates heat for the plurality of semiconductor lasers; the semiconductor laser comprises a heat sink, a plurality of semiconductor lasers, a plurality of light source modules and a plurality of light source modules, wherein the heat sink is provided with a plurality of open slots on the inner wall; the plug connector is used for fixing the semiconductor laser and the heat sink by being inserted into the open slot.
In the above scheme, the plug connector is made of elastic materials which are all insulated or partially insulated; when the plug connector is partially insulated, the surface or the inside of the plug connector is provided with a conductive part which is used for being contacted with the adjacent semiconductor lasers to realize the electrical connection between the adjacent semiconductor lasers; when the plug connector is completely insulated, the module further comprises a connecting electrode with a through hole, and the connecting electrode is used for being in contact with the adjacent semiconductor lasers, so that the electrical connection between the adjacent semiconductor lasers is realized.
In the above scheme, the plug connector includes: a planar portion, and a plug portion; the plug portion includes: at least one hook-shaped spigot extending from the lower surface of the planar portion.
In the above scheme, the open slot on the inner wall of the heat sink comprises: an opening portion, and a base portion; wherein the inner diameter of the base part is larger than that of the opening part, and the plug is inserted into the base part of the opening groove through the through hole on the connecting electrode.
In the scheme, the outer diameter of the plug connector is larger than the inner diameter of the opening part of the opening groove, so that the hook-shaped plug connector is clamped on the side wall of the base part of the opening groove, and the plug connector and the heat sink are clamped and fixed.
In the scheme, the outer diameter of the plane part of the plug connector is larger than the inner diameter of the through hole of the connecting electrode, and the plug connector is used for realizing limit fixation between the plug connector and the semiconductor laser as well as between the plug connector and the connecting electrode.
In the above solution, the module further includes: at least two refrigerating blocks arranged outside the semiconductor laser unit; the inner surface of the refrigerating block is provided with a clamping groove matched with the shape of the heat sink, and the clamping groove is used for fixing the heat sink and the refrigerating block; the refrigerating block body is provided with a plurality of liquid through holes, and the positions of the liquid through holes correspond to the positions of the semiconductor lasers.
In the scheme, the refrigerating blocks are further provided with screw holes, and the screw holes are used for fixing the refrigerating blocks and the semiconductor laser units.
In the above aspect, the heat sink includes: and the laser beams emitted by the semiconductor lasers are converged at the center of the annular heat sink or the polygonal heat sink.
In the above scheme, the module further comprises an extraction electrode, wherein the extraction electrode is arranged inside the semiconductor laser unit and used for leading the electrode of the semiconductor laser unit to the outside.
The technical scheme of the invention has the following beneficial technical effects:
1. the design of the plug connector and the related structure ensures that the scheme of fixedly connecting at least three of each semiconductor laser, the connecting electrode, the heat sink and the like is realized in the semiconductor laser unit, the fixing effect is better, the assembly is more convenient, and the operability is higher.
2. The refrigerating waterway is arranged on the refrigerating block outside each semiconductor laser unit, so that each semiconductor laser unit is mutually independent and noninterfere, and can be directly clamped and assembled during assembly, thereby thoroughly solving the problem that the difficulty of positioning and aligning of too many sealing rings and each water passage is high when each ring is assembled due to the fact that the refrigerating waterway is positioned on the heat sink in the traditional scheme.
3. The extraction electrode is directly extracted from the inside of the semiconductor laser unit without positioning, so that the problems of positioning caused by the arrangement of an external connecting block and excessive introduction of an insulating adhesive tape in the traditional scheme are solved, and the method is simple and convenient and has higher practicability.
Drawings
FIG. 1 is a schematic diagram of a prior art semiconductor laser module;
FIG. 2 is a schematic perspective view of a refrigeration block according to the present invention;
FIG. 3 is a schematic diagram of a semiconductor laser module according to the present invention;
FIG. 4 is a schematic view showing a partial structure of a semiconductor laser unit according to the present invention;
FIG. 5 is a schematic diagram of a plug connector and heat sink spacing and fixing structure of the present invention;
fig. 6 is a schematic view showing another partial structure of the semiconductor laser unit of the present invention.
Reference numerals illustrate: 1 is a semiconductor laser unit, 11 is a semiconductor laser, 111 is a semiconductor laser chip, 112 is a substrate, 12 is a plug connector, 121 is a plane part, 122 is a plug part, 13 is a heat sink, 131 is a mounting platform, 14 is an open slot, 141 is an open part, 142 is a base part, 15 is a connection electrode, 151 through holes, 16 are refrigerating blocks, and 161 through holes.
Detailed Description
The following embodiments of the present invention provide a novel semiconductor laser module, and the main idea is: through designing a novel plug connector, the spacing fixedly among at least three such as each semiconductor laser, connecting electrode, heat sink is realized to inside the semiconductor laser unit to set up the refrigeration water route on the outside refrigeration piece of semiconductor laser unit, refrigeration efficiency is high, and the assembly is simple.
The technical scheme of the invention is further described in detail below with reference to the accompanying drawings and specific embodiments.
In an embodiment of the present invention, each semiconductor laser module may include at least one semiconductor laser unit 1, and fig. 4 is a schematic view of a partial structure of the semiconductor laser unit of the present invention. As shown in fig. 4, each semiconductor laser unit may in turn include: a plurality of semiconductor lasers 11, a plug 12, and a heat sink 13 that dissipates heat from the plurality of semiconductor lasers.
Here, the heat sink 13 may include, but is not limited to: the circular ring-shaped heat sink or polygonal heat sink is not necessarily a perfect circle, but can also be a non-perfect circle; the polygons may include triangles, quadrilaterals, pentagons, and the like. Preferably, the heat sink 13 is a right circular ring-shaped heat sink or a right polygonal heat sink. The plurality of semiconductor lasers can be specifically bonded to the inner wall of the annular heat sink or the polygonal heat sink, and laser beams emitted by the plurality of semiconductor lasers are converged at the center of the annular heat sink or the polygonal heat sink, and the drawings and the specific embodiments of the invention take the heat sink 13 as a right annular heat sink as an example for illustration. Based on the foregoing, it can be appreciated that one of the main applications of the semiconductor laser module of the present invention can be used as a side pumping source of a fixed laser, and a gain medium (e.g. a crystal rod) of the solid laser can be disposed at the center of an annular heat sink or a polygonal heat sink.
The semiconductor laser 11 may include at least, but is not limited to: a laser chip, a substrate; the laser chip may be an edge-emitting semiconductor laser chip, which in some embodiments may also be a vertical cavity surface emitting semiconductor laser chip; the laser chip is bonded to the substrate, and the substrate has a thermal expansion coefficient matched with that of the laser chip.
Specifically, the inner wall of the heat sink may be provided with a plurality of open slots 14, and the plurality of semiconductor lasers 11 are respectively bonded to the inner wall of the heat sink between the adjacent open slots; the plug 12 is used for fixing the semiconductor laser 11 and the heat sink 13 by being inserted into the open slot 14.
In the above-mentioned embodiments, the plug 12 is made of an insulating or partially insulating elastic material, such as PEEK (polyetheretherketone). When the plug connector is partially insulated, the surface or the inside of the plug connector is provided with a conductive part which is used for being contacted with the adjacent semiconductor lasers to realize the electrical connection between the adjacent semiconductor lasers; the main considerations for a partially insulating plug are: when the plug connector realizes the function of fixing and limiting, the plug connector can also be used as a connecting electrode at the same time, and the electric connection between the semiconductor lasers can be realized under the condition that the connecting electrode is not introduced. The conductive function of the connector 12 may be achieved by selectively coating a conductive layer on the surface of the connector, or by providing a conductive channel therein.
In particular, the plug 12 may include a planar portion 121, and a plug portion 122; here, the elastic material is selected for the plug 12, so that the elastic material can generate a certain elastic deformation, and when the plug 12 is inserted into the opening groove 14, the plug can be inserted (contracted) under the condition of generating a set variable, and the deformation is restored to a certain extent after the insertion, for example, the plug is restored to the original state, and the restoration of the deformation can provide guarantee for the fixing and limiting of the plug in the opening groove.
In the above aspect, the plugging portion 122 may include: at least one hook-shaped socket extending from the lower surface of the planar portion 121, the number of the sockets of the embodiment of the present invention is exemplified as 2. The plug 12 may be an integrally injection molded piece, or the planar portion 121 and the plug portion 122 may be fixed together by mechanical fixing or chemical bonding after being molded.
Further, when the plug connector is made of all insulating elastic materials, the module may further include: the connection electrode 15 with a through hole, the connection electrode 15 is used for contacting with the adjacent semiconductor lasers to realize the electrical connection between the adjacent semiconductor lasers 11, and the embodiment of the invention is exemplified by taking the plug connector as an elastic material with all insulation.
Fig. 5 is a schematic structural diagram of the plug connector and the heat sink for limiting and fixing, and fig. 6 is another schematic partial structural diagram of the semiconductor laser unit of the present invention. As shown in fig. 5 and 6, in the above solution, the open slot 14 formed on the inner wall of the heat sink 13 may have an open portion 141 and a base portion 142, and the inner diameter of the base portion 142 is larger than the inner diameter of the open portion 141, where the inner diameters of the base portion 142 and the open portion 141 refer to lengths of both in a certain direction.
The plug may be inserted into the base portion 142 of the opening groove 14 through the through hole 151 on the connection electrode 15, and the hook-shaped plug may be clamped on the side wall of the base portion 142 because the plug portion 122 is a hook-shaped plug, so as to realize the clamping and fixing of the plug portion 12 and the heat sink 13.
Specifically, in order to ensure that the plugging portion 122 is firmly plugged into the base portion 142, in practical applications, the outer diameter of the plugging head should be larger than the inner diameter of the opening portion 141, where the outer diameter of the plugging head refers to: the plug connector has the length of all plug connectors in a certain direction as a whole; the inner diameter of the opening portion 141 means: the length of the opening portion 141 in the same direction.
Because the plug 12 is made of elastic material, when the outer diameter of the plug is larger than the inner diameter of the opening portion 141, the plug can be inserted into the opening groove 14 through the opening portion 141 under the condition of a certain elastic deformation amount, the elastic deformation amount can be recovered to a certain extent after the plug is inserted into the opening groove 14, and based on the fact that the inner diameter of the base portion 142 is larger than the inner diameter of the opening portion 141, the hook-shaped plug can be clamped on the side wall of the base portion 142 after being inserted into the base portion 142, and cannot be separated from the opening portion 141, so that the plug 12 and the heat sink 13 can be clamped and fixed.
Further, for the plug 12, since the plug can be inserted into the open slot 14 through the through hole 151 of the connection electrode 15, the outer diameter of the planar portion 121 of the plug should be larger than the inner diameter of the through hole 151 of the connection electrode 15, so as to ensure that the planar portion 121 of the plug cannot be separated from the through hole 151 of the connection electrode, and ensure the fixing quality. Here, the outer diameter of the planar portion 121 refers to the length of the planar portion 121 in a certain direction, and the inner diameter of the through hole 151 refers to the diameter of the through hole in the same direction. In this way, since the plug 12 and the connection electrode 15 are fixed, and the connection electrode 15 is connected to the adjacent semiconductor laser 11, the plug 12, the semiconductor laser 11, and the connection electrode 15 can be fixed at a limit.
In addition, a mounting platform 131 is further disposed on the inner wall of the heat sink 13 in the embodiment of the present invention, the mounting platform 131 is disposed between adjacent open slots, and the mounting platform 131 may be specifically used for bonding a semiconductor laser, as shown in fig. 6, fig. 6 only shows a part of the semiconductor laser, a connection electrode and a plug connector, and a part not shown is similar to the part already shown.
In view of how to achieve the improvement of positioning accuracy and the easy installation, the above semiconductor laser unit includes the heat sink 13 on which the cooling water path is not provided, but the cooling water path is provided outside the semiconductor laser unit.
Further, the above-described semiconductor laser module may further include at least two cooling blocks 16 provided outside the semiconductor laser unit. Fig. 2 is a schematic perspective view of a cooling block according to the present invention, fig. 3 is a schematic perspective view of a semiconductor laser module according to the present invention, as shown in fig. 2 and 3, in an embodiment of the present invention, the number of cooling blocks 16 is 2, and a clamping groove (not shown in the figure) matching with the shape of a heat sink is provided on an inner surface of the cooling block 16, and when a plurality of semiconductor laser units are assembled, each semiconductor laser unit may be respectively corresponding to a corresponding clamping groove for realizing fixation of the heat sink and the cooling block.
Further, a high heat conduction layer, such as an indium film layer, may be disposed at the clamping groove of the cooling block 16, and is mainly used to realize heat exchange between the heat sink 13 and the cooling block 16, so as to improve the heat conduction efficiency between the cooling block 16 and the semiconductor laser unit.
Specifically, the refrigerating manner of the refrigerating block 16 may include: a conduction refrigeration type, a liquid refrigeration type, wherein when the refrigeration mode is a conduction refrigeration type, the refrigeration block is made of a high heat conduction material, such as a high heat conduction metal, e.g., copper, and/or a nonmetallic material; when the refrigeration mode is a liquid refrigeration mode, a plurality of liquid through holes are formed in the refrigeration block main body; the embodiment of the invention takes the refrigeration mode as a liquid refrigeration mode as an example for illustration.
As shown in fig. 2 and 3, the cooling block body may be provided with a plurality of liquid through holes 161, and preferably, in order to achieve a more efficient cooling effect, the positions of the liquid through holes may correspond to the positions of the semiconductor lasers. The form of the liquid passage hole 161 may include, but is not limited to: fin-like, micro-via arrays, and the like.
And, the cooling blocks also have screw holes (not shown in the drawing), and the fixing between each cooling block and each semiconductor laser unit can be realized by screws. As shown in fig. 3, in the embodiment of the present invention, each semiconductor laser unit is located in a central cavity area formed by two cooling blocks 16, and a screw can be screwed into a screw hole formed in the two cooling blocks 16, so that the cooling blocks and each semiconductor laser unit are fixed together.
According to the scheme, the refrigerating waterway is arranged outside the heat sink, namely, the refrigerating waterway and the heat sink are separated, and the structure design of the separated refrigerating waterway enables the heat sink main body of the semiconductor laser units not to have a water passage structure, so that when a plurality of groups of semiconductor laser units are assembled, the semiconductor laser units are directly clamped into corresponding clamping grooves, the semiconductor laser units are mutually independent, do not interfere, and are easy to assemble and disassemble. In addition, since the semiconductor laser units are independent of each other, a certain misalignment may exist between the semiconductor laser units at the time of assembly, so that the semiconductor laser units are arranged at an angle.
The module further comprises an extraction electrode, wherein the extraction electrode is arranged inside the semiconductor laser unit and used for leading the electrode of the semiconductor laser unit to the outside, and the extraction electrode can be led to the outside through the heat sink, namely, the extraction electrode is directly extracted from the inside of the semiconductor laser unit. In order to avoid short circuit, a part of insulating layer can be arranged on the surface of the extraction electrode, so that the extraction electrode is insulated from a heat sink and the like in an extraction path, the electrode extraction mode does not need to be positioned, the positioning problem caused by the arrangement of an external connecting block on the extraction electrode in the traditional scheme and the problem of introducing excessive insulating adhesive tapes are solved, and the electrode extraction method is convenient and practical.
The foregoing description is only of the preferred embodiments of the present invention, and is not intended to limit the scope of the present invention. Various modifications and variations of the present invention will be apparent to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (8)
1. A semiconductor laser module, characterized in that the module comprises at least one semiconductor laser unit, each semiconductor laser unit comprises a plurality of semiconductor lasers, a plug connector and a heat sink for radiating the semiconductor lasers, wherein a plurality of open slots are formed in the inner wall of the heat sink, and the semiconductor lasers are respectively bonded to the inner wall of the heat sink between the adjacent open slots; the plug connector is used for realizing the fixation between the plurality of semiconductor lasers and the heat sink through inserting into the open slot, and is made of elastic materials which are all insulated or partially insulated, wherein when the plug connector is partially insulated, the surface or the inside of the plug connector is provided with a conductive part which is used for being in contact with the adjacent semiconductor lasers to realize the electric connection between the adjacent semiconductor lasers, and when the plug connector is all insulated, the module further comprises a connecting electrode with a through hole which is used for being in contact with the adjacent semiconductor lasers to realize the electric connection between the adjacent semiconductor lasers, and the plug connector comprises: a planar portion and a plug portion including at least one hooked plug extending from a lower surface of the planar portion.
2. The module of claim 1, wherein the open slot on the inner wall of the heat sink comprises: an opening portion, and a base portion; wherein the inner diameter of the base part is larger than that of the opening part, and the plug is inserted into the base part of the opening groove through the through hole on the connecting electrode.
3. The module of claim 2, wherein the plug has an outer diameter greater than an inner diameter of the open portion of the open slot such that the hooked plug engages the sidewall of the base portion of the open slot to effect a snap-fit attachment of the plug to the heat sink.
4. The module according to claim 1, wherein the planar portion of the plug has an outer diameter larger than an inner diameter of the through hole of the connection electrode for achieving a spacing fixation between the plug and the semiconductor laser, the connection electrode.
5. The module of claim 1, wherein the module further comprises: at least two refrigerating blocks arranged outside the semiconductor laser unit; the inner surface of the refrigerating block is provided with a clamping groove matched with the shape of the heat sink, and the clamping groove is used for fixing the heat sink and the refrigerating block; the refrigerating block body is provided with a plurality of liquid through holes, and the positions of the liquid through holes correspond to the positions of the semiconductor lasers.
6. The module of claim 5, wherein the cooling blocks further have screw holes for securing each cooling block to each semiconductor laser unit by screws.
7. The module of any one of claims 1 to 6, wherein the heat sink comprises: and the laser beams emitted by the semiconductor lasers are converged at the center of the annular heat sink or the polygonal heat sink.
8. The module according to claim 7, further comprising an extraction electrode provided inside the semiconductor laser unit for guiding the electrodes of the semiconductor laser unit to the outside.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711474060.7A CN107946900B (en) | 2017-12-29 | 2017-12-29 | Semiconductor laser module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711474060.7A CN107946900B (en) | 2017-12-29 | 2017-12-29 | Semiconductor laser module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107946900A CN107946900A (en) | 2018-04-20 |
| CN107946900B true CN107946900B (en) | 2024-02-13 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711474060.7A Active CN107946900B (en) | 2017-12-29 | 2017-12-29 | Semiconductor laser module |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112736640A (en) * | 2019-05-23 | 2021-04-30 | 杨伟锋 | Semiconductor laser and method |
| CN114361934B (en) * | 2022-01-07 | 2024-02-13 | 无锡亮源激光技术有限公司 | Novel high-power semiconductor laser device |
| CN118099926A (en) * | 2024-04-24 | 2024-05-28 | 中山大学 | Optical semiconductor device and assembly method |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102820610A (en) * | 2012-09-06 | 2012-12-12 | 中国工程物理研究院应用电子学研究所 | Diode pumping laser gain module and preparation method thereof |
| CN103779782A (en) * | 2014-01-08 | 2014-05-07 | 中国工程物理研究院应用电子学研究所 | High average power diode pumping laser module and preparation method thereof |
| CN203967508U (en) * | 2014-06-25 | 2014-11-26 | 西安炬光科技有限公司 | A kind of liquid refrigerating type semiconductor laser side pump module |
| CN206806722U (en) * | 2017-06-08 | 2017-12-26 | 西安域视光电科技有限公司 | A kind of new semiconductor laser side pump module |
-
2017
- 2017-12-29 CN CN201711474060.7A patent/CN107946900B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102820610A (en) * | 2012-09-06 | 2012-12-12 | 中国工程物理研究院应用电子学研究所 | Diode pumping laser gain module and preparation method thereof |
| CN103779782A (en) * | 2014-01-08 | 2014-05-07 | 中国工程物理研究院应用电子学研究所 | High average power diode pumping laser module and preparation method thereof |
| CN203967508U (en) * | 2014-06-25 | 2014-11-26 | 西安炬光科技有限公司 | A kind of liquid refrigerating type semiconductor laser side pump module |
| CN206806722U (en) * | 2017-06-08 | 2017-12-26 | 西安域视光电科技有限公司 | A kind of new semiconductor laser side pump module |
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| Publication number | Publication date |
|---|---|
| CN107946900A (en) | 2018-04-20 |
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