CN216626417U - Integrated radiator for platform area terminal - Google Patents
Integrated radiator for platform area terminal Download PDFInfo
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- CN216626417U CN216626417U CN202122199160.1U CN202122199160U CN216626417U CN 216626417 U CN216626417 U CN 216626417U CN 202122199160 U CN202122199160 U CN 202122199160U CN 216626417 U CN216626417 U CN 216626417U
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Abstract
The utility model discloses an integrated radiator for a platform terminal, belongs to the technical field of platform intelligent fusion terminals, and aims to provide an integrated radiator which has a good radiating effect and can ensure that electrical components in the platform terminal are not easily damaged; the heat conduction module is arranged between the heat dissipation module and the chip at the platform area terminal, the heat conduction module is abutted against the heat dissipation module and the chip, the heat dissipation module comprises an integrally formed connector and a heat dissipation body, the connector extends into the shell at the platform area terminal, the heat dissipation body is embedded in the shell, and the shell and the connector are fixed through the connecting assembly.
Description
Technical Field
The utility model relates to an intelligent platform area convergence terminal, in particular to an integrated radiator for a platform area terminal.
Background
The intelligent station area fusion terminal is edge equipment of an intelligent Internet of things system, has the functions of information acquisition, Internet of things agent and edge calculation, is installed on the power supply side of a distribution transformer of a distribution station area, and achieves online management and remote operation and maintenance of various edge Internet of things agents and intelligent terminals.
The platform district terminal has electrical components such as circuit board, chip and electric capacity in it, after long-time work, can produce higher temperature in its casing, if can not distribute away this heat, leads to electrical component's damage easily.
SUMMERY OF THE UTILITY MODEL
Aiming at the defects in the prior art, the utility model aims to provide an integrated radiator which has a good radiating effect and enables electrical components in a platform area terminal not to be damaged easily.
In order to achieve the purpose, the utility model provides the following technical scheme:
an integrated radiator for a platform terminal comprises a radiating module and a heat conducting module, wherein the radiating module is made of heat conducting materials and is embedded on a shell of the platform terminal; the heat conduction module is arranged between the heat dissipation module and the chip of the platform area terminal, and the heat conduction module is abutted against the heat dissipation module and the chip.
Further, the heat dissipation module comprises an integrally formed connector and a heat dissipation body, the connector extends into the shell of the platform area terminal, the heat dissipation body is embedded in the shell, and the shell and the connector are fixed through the connecting component.
Furthermore, the both sides of connector are opened and are had the draw-in groove, include the round pin pipe that corresponds with the draw-in groove in the shell, coupling assembling include with round pin pipe threaded connection's screw and with draw-in groove complex connection piece, open on the connection piece have with the through-hole that the round pin pipe corresponds, the tip of connection piece stretches into in the draw-in groove, and the connection piece is arranged in on the round pin pipe, screw and round pin pipe threaded connection and with the connection piece be fixed in on the round pin pipe.
Further, the heat conduction module comprises a first heat conduction silica gel layer, a ceramic sheet layer and a second heat conduction silica gel layer which are connected in sequence, the first heat conduction silica gel layer is abutted against the chip, and the second heat conduction silica gel layer is abutted against the connector.
Furthermore, a plurality of criss-cross radiating grooves are formed in the radiating body.
Furthermore, an embedding opening matched with the heat dissipation module is formed in the shell, the connector penetrates through the embedding opening, and a supporting plate used for supporting the heat dissipation body is arranged at the embedding opening.
Further, the ceramic sheet is alumina ceramic or aluminum nitride ceramic.
Furthermore, a sealing ring is arranged between the supporting plate and the heat radiation body and is made of rubber materials.
Furthermore, foam rubber is filled between the supporting plate and the heat radiating body.
Furthermore, the heat dissipation module is made of aluminum.
By adopting the technical scheme, the utility model has the beneficial effects that:
1. the radiator is abutted against the chip, and heat generated by the chip is transferred out through heat conduction, so that the temperature of the chip is greatly reduced, and the service life of the chip is greatly prolonged;
2. the radiator and the shell are more firmly fixed and are not easy to loosen or separate under the action of external force, so that stable heat dissipation of the chip is ensured;
3. the heat dissipation module is matched with the heat conduction module, so that the heat dissipation effect on the chip is further improved, and the heat conduction module is used as a buffer, so that the chip is not easy to damage;
4. the sealing effect between the radiator and the shell is good, so that foreign matters are not easy to enter the shell to damage electrical elements.
Drawings
Fig. 1 is a schematic structural diagram of a station terminal.
Fig. 2 is a schematic structural diagram of a heat dissipation module.
Fig. 3 is a schematic view of the structure of the heat sink and the housing.
Fig. 4 is a schematic cross-sectional view of the heat conduction module.
Detailed Description
Embodiments of the present invention are further described with reference to fig. 1 to 4.
An integrated radiator which has good radiating effect and ensures that electrical components in a platform terminal are not easy to damage.
Specific embodiments of the utility model: the heat dissipation module 1 is made of heat conduction materials and is embedded on a shell 3 of a platform area terminal; the heat conduction module 2 is arranged between the heat dissipation module 1 and the chip 4 of the platform area terminal, the heat conduction module 2 is abutted against the heat dissipation module 1 and the chip 4, the heat dissipation module 1 comprises a connecting body 11 and a heat dissipation body 12 which are integrally formed, the heat conduction module 2 is composed of a first heat conduction silica gel layer 21, a ceramic sheet layer 22 and a second heat conduction silica gel layer 23 which are sequentially connected, the first heat conduction silica gel layer 21 is abutted against the chip 4, the second heat conduction silica gel layer 23 is abutted against the connecting body 11, and the heat dissipation body 12 is provided with a plurality of criss-cross heat dissipation grooves 12 a; the heat dissipation module 1 is made of aluminum, which may be made of other good heat conductive materials.
The heat conduction module 2 is arranged between the chip 4 and the heat dissipation module 1, and the heat conduction module 2 consisting of the first heat conduction silica gel layer 21, the ceramic sheet layer 22 and the second heat conduction silica gel layer 23 has a good heat conduction effect, so that heat on the chip 4 is transmitted to the heat dissipation module 1, and the heat dissipation effect on the chip 4 is ensured; the first heat-conducting silica gel layer 21 and the second heat-conducting silica gel layer 23 are respectively abutted against the chip 4 and the connector 11, so that the chip 4 is not easily extruded and damaged when the heat-radiating module 1 is installed on the shell 3; the heat conduction module 2 has good static electricity removing effect, and the safety performance is greatly improved;
the heat radiation module 1 is composed of a connector 11 and a heat radiation body 12 which are integrally connected, so that the heat conduction effect is better; the heat radiation body 12 is provided with a plurality of criss-cross heat radiation grooves 12a, so that the heat radiation effect of the heat radiation module 1 is increased, and the heat radiation of the chip 4 is further enhanced.
The connecting body 11 extends into the shell 3 of the platform terminal, the heat radiator 12 is embedded on the shell 3, the shell 3 and the connecting body 11 are fixed through the connecting component 5, the two sides of the connecting body 11 are provided with clamping grooves 11a, the shell 3 is internally provided with a pin tube 31a corresponding to the clamping grooves 11a, the connecting component 5 comprises a screw 51 in threaded connection with the pin tube 31a and a connecting sheet 52 matched with the clamping grooves 11a, the connecting sheet 52 is provided with a through hole 52a corresponding to the pin tube 31a, the end part of the connecting sheet 52 extends into the clamping groove 11a, the connecting sheet 52 is arranged on the pin tube 31a, the screw 51 is in threaded connection with the pin tube 31a and fixes the connecting sheet 52 on the pin tube 31a, the shell 3 is provided with an embedding opening 301 matched with the heat radiation module 1, the connecting body 11 passes through the embedding opening 301, the embedding opening 301 is provided with a supporting plate 31b for supporting the heat radiator 12, and the ceramic plate is made of alumina ceramic or aluminum nitride ceramic, a sealing ring 6 is arranged between the supporting plate 31b and the heat radiating body 12 or filled with foam rubber, and the sealing ring is made of rubber.
When the radiator is installed, the first heat-conducting silica gel layer 21 is firstly bonded with the chip 4, so that the heat-conducting module 2 is fixed on the circuit board, and then the heat-radiating module 1 is installed;
when the heat dissipation module 1 is installed on the housing 3, the connector 11 is first inserted into the housing 3 through the insertion opening 301 until the heat dissipation body 12 enters the insertion opening 301 and is placed on the support plate 31 b; inserting the end of the connecting plate 52 into the slot 11a to make the through hole 52a correspond to the pin hole of the pin tube 31a, and finally, threading the screw 51 through the through hole 52a and connecting with the pin hole of the pin tube 31a in a threaded manner, thereby fixing the connecting plate and the pin tube 31a together; both sides of the heat dissipation module 1 are matched and fixed with the pin pipes 31a through the connecting components 5, so that the heat dissipation module 1 is stably fixed on the shell 3 and is not easy to loosen;
the embedding opening 301 is sealed through the rubber sealing ring 6 or the foaming rubber, so that foreign matters such as water or dust are ensured to be not easy to enter the shell 3, and the electric appliance element is effectively prevented from being damaged.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the present invention, and those skilled in the art should be able to make general changes and substitutions within the technical scope of the present invention.
Claims (10)
1. An integrated radiator for a platform area terminal is characterized by comprising
The heat dissipation module is made of a heat conducting material and is embedded on the shell of the platform area terminal;
and the heat conduction module is arranged between the heat dissipation module and the chip of the platform area terminal, and is abutted against the heat dissipation module and the chip.
2. The integrated heat sink for a platform terminal according to claim 1, wherein: the heat dissipation module comprises an integrally formed connector and a heat dissipation body, the connector extends into the shell of the terminal of the transformer area, the heat dissipation body is embedded in the shell, and the shell and the connector are fixed through the connecting assembly.
3. The integrated heat sink for a platform terminal as claimed in claim 2, wherein: the connecting structure is characterized in that clamping grooves are formed in two sides of the connecting body, a pin pipe corresponding to the clamping grooves is arranged in the shell, the connecting assembly comprises a screw in threaded connection with the pin pipe and a connecting sheet matched with the clamping grooves, through holes corresponding to the pin pipe are formed in the connecting sheet, the end portion of the connecting sheet extends into the clamping grooves, the connecting sheet is arranged on the pin pipe, and the screw is in threaded connection with the pin pipe and fixes the connecting sheet on the pin pipe.
4. The integrated heat sink for a platform terminal according to claim 3, wherein: the heat conduction module comprises a first heat conduction silica gel layer, a ceramic sheet layer and a second heat conduction silica gel layer which are connected in sequence, the first heat conduction silica gel layer is abutted against the chip, and the second heat conduction silica gel layer is abutted against the connector.
5. The integrated heat sink for a platform terminal according to claim 3, wherein: the heat radiation body is provided with a plurality of criss-cross heat radiation grooves.
6. The integrated heat sink for a platform terminal according to any one of claims 1 to 5, wherein: the shell is provided with an embedding opening matched with the heat dissipation module, the connector penetrates through the embedding opening, and a supporting plate used for supporting the heat dissipation body is arranged at the embedding opening.
7. The integrated heat sink for a platform terminal according to claim 4, wherein: the ceramic plate is alumina ceramic or aluminum nitride ceramic.
8. The integrated heat sink for a platform terminal according to claim 6, wherein: and a sealing ring is arranged between the supporting plate and the heat radiation body and is made of rubber materials.
9. The integrated heat sink for a platform terminal according to claim 6, wherein: and foam rubber is filled between the supporting plate and the heat radiation body.
10. The integrated heat sink for a platform terminal according to any one of claims 8 or 9, wherein: the heat dissipation module is made of aluminum materials.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122199160.1U CN216626417U (en) | 2021-09-10 | 2021-09-10 | Integrated radiator for platform area terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122199160.1U CN216626417U (en) | 2021-09-10 | 2021-09-10 | Integrated radiator for platform area terminal |
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| Publication Number | Publication Date |
|---|---|
| CN216626417U true CN216626417U (en) | 2022-05-27 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122199160.1U Active CN216626417U (en) | 2021-09-10 | 2021-09-10 | Integrated radiator for platform area terminal |
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| Country | Link |
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| CN (1) | CN216626417U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116860094A (en) * | 2023-09-05 | 2023-10-10 | 北京华鲲振宇智能科技有限责任公司 | Intelligent terminal |
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2021
- 2021-09-10 CN CN202122199160.1U patent/CN216626417U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116860094A (en) * | 2023-09-05 | 2023-10-10 | 北京华鲲振宇智能科技有限责任公司 | Intelligent terminal |
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