CN215774078U - Platform district is split type radiator for terminal - Google Patents
Platform district is split type radiator for terminal Download PDFInfo
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- CN215774078U CN215774078U CN202122199108.6U CN202122199108U CN215774078U CN 215774078 U CN215774078 U CN 215774078U CN 202122199108 U CN202122199108 U CN 202122199108U CN 215774078 U CN215774078 U CN 215774078U
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Abstract
The utility model discloses a split type radiator for a terminal of a transformer area, belongs to the technical field of intelligent fusion terminals of transformer areas, and aims to provide an integrated radiator which is convenient to detach and install, has a good radiating effect and enables electrical components in the terminal of the transformer area to be difficult to damage; the heat conduction module is arranged between the connector and the chip of the platform area terminal, and the heat conduction module is abutted against the connector and the chip.
Description
Technical Field
The utility model relates to an intelligent platform area convergence terminal, in particular to a split type radiator for a platform area terminal.
Background
The intelligent station area fusion terminal is edge equipment of an intelligent Internet of things system, has the functions of information acquisition, Internet of things agent and edge calculation, is installed on the power supply side of a distribution transformer of a distribution station area, and realizes online management and remote operation and maintenance of various edge Internet of things agents and intelligent terminals.
The platform district terminal has electrical components such as circuit board, chip and electric capacity in it, after long-time work, can produce higher temperature in its casing, if can not distribute away this heat, leads to electrical component's damage easily.
SUMMERY OF THE UTILITY MODEL
Aiming at the defects in the prior art, the utility model aims to provide the integrated radiator which is convenient to disassemble and install and good in radiating effect, and enables electrical components in the platform area terminal not to be damaged easily.
In order to achieve the purpose, the utility model provides the following technical scheme:
a split type radiator for a terminal of a transformer area comprises a radiating module and a heat conducting module, wherein the radiating module comprises a detachably connected connector and a radiator, the connector is arranged in a shell of the terminal of the transformer area, the radiator is embedded in the shell, and the connector and the radiator are both made of heat conducting materials; the heat conduction module is arranged between the connector and the chip of the platform area terminal, and the heat conduction module is abutted against the connector and the chip.
Furthermore, the connecting body and the heat radiating body are both made of aluminum materials and are fixedly connected through screws.
Further, a heat conduction silica gel gasket is arranged between the connecting body and the heat radiation body.
Further, the heat conduction module comprises a first heat conduction silica gel layer, a ceramic sheet layer and a second heat conduction silica gel layer which are connected in sequence, the first heat conduction silica gel layer is abutted against the chip, and the second heat conduction silica gel layer is abutted against the connector.
Furthermore, a plurality of criss-cross radiating grooves are formed in the radiating body, and a plurality of radiating channels which are uniformly distributed are formed in the connecting body.
Furthermore, an embedding opening is formed in the shell, a supporting plate is arranged at the embedding opening, and the heat dissipation body is arranged in the embedding opening and arranged on the supporting plate.
Further, the ceramic sheet is alumina ceramic or aluminum nitride ceramic.
Furthermore, a sealing ring is arranged between the supporting plate and the heat radiation body and is made of rubber materials.
Furthermore, foam rubber is filled between the supporting plate and the heat radiating body.
By adopting the technical scheme, the utility model has the beneficial effects that:
1. the radiator is abutted against the chip, and heat generated by the chip is transferred out through heat conduction, so that the temperature of the chip is greatly reduced, and the service life of the chip is greatly prolonged;
2. the radiator and the shell are more firmly fixed and are not easy to loosen or separate under the action of external force, so that stable heat dissipation of the chip is ensured;
3. the heat dissipation module is matched with the heat conduction module, so that the heat dissipation effect on the chip is further improved, and the heat conduction module is used as a buffer, so that the chip is not easy to damage;
4. the sealing effect between the radiator and the shell is good, so that foreign matters are not easy to enter the shell to damage electrical elements;
5. the heat dissipation module can be detached, so that the heat dissipation module is more convenient to replace and install, and meanwhile, the corresponding connector and the corresponding heat dissipation body can be freely matched according to shells of different specifications, so that the heat dissipation module is not limited any more.
Drawings
Fig. 1 is a schematic cross-sectional structure diagram of a platform terminal.
Fig. 2 is a schematic structural diagram of a heat sink.
FIG. 3 is a schematic view of the structure of the linker.
Fig. 4 is a partial sectional structural view of the housing.
Detailed Description
Embodiments of the present invention are further described with reference to fig. 1 to 4.
An integrated radiator which is convenient to detach and install, has a good radiating effect and enables electrical components in a platform area terminal not to be damaged easily.
Specific embodiments of the utility model: the heat dissipation module 1 comprises a connector 11 and a heat dissipation body 12 which are detachably connected, the connector 11 is arranged in a shell 3 of a platform area terminal, the heat dissipation body 12 is embedded in the shell 3, and the connector 11 and the heat dissipation body 12 are both made of heat conduction materials; the heat conduction module 2 is arranged between the connecting body 11 and the chip 4 of the platform area terminal, and the heat conduction module 2 is abutted against the connecting body 11 and the chip 4; the heat conducting module 2 is composed of a first heat conducting silica gel layer 21, a ceramic plate 22 layer and a second heat conducting silica gel layer 23 which are sequentially connected, the first heat conducting silica gel layer 21 is abutted with the chip 4, the second heat conducting silica gel layer 23 is abutted with the connector 11, and the ceramic plate 22 is made of alumina ceramics or aluminum nitride ceramics.
The heat conduction module 2 is arranged between the chip 4 and the heat dissipation module 1, and the heat conduction module 2 consisting of the first heat conduction silica gel layer 21, the ceramic sheet 22 layer and the second heat conduction silica gel layer 23 has a good heat conduction effect, so that the heat on the chip 4 is transmitted to the heat dissipation module 1, and the heat dissipation effect on the chip 4 is ensured; the first heat-conducting silica gel layer 21 and the second heat-conducting silica gel layer 23 are respectively abutted against the chip 4 and the connector 11, so that the chip 4 is not easily extruded and damaged when the heat dissipation module 1 is installed on the shell 3; the heat conduction module 2 has good static electricity removing effect, and the safety performance is greatly improved;
the heat radiation module 1 is composed of a connector 11 and a heat radiation body 12 which are detachably connected, so that the heat radiation module 1 is more convenient to replace and install, and meanwhile, the connector 11 and the heat radiation body 12 which correspond to each other can be freely matched according to shells 3 of different specifications, so that the heat radiation module 1 is not limited any more.
The connecting body 11 and the heat radiating body 12 are both made of aluminum materials or other materials with good heat conductivity, the connecting body 11 and the heat radiating body 12 are fixedly connected through screws, an embedding opening 301 is formed in the shell 3, a supporting plate 3a is arranged at the embedding opening 301, and the heat radiating body 12 is arranged in the embedding opening 301 and is arranged on the supporting plate 3 a; a heat-conducting silica gel gasket 5 is arranged between the connecting body 11 and the heat radiating body 12.
When the radiator is installed, the first heat-conducting silica gel layer 21 is firstly bonded with the chip 4, so that the heat-conducting module 2 is fixed on the circuit board, and then the heat-radiating module 1 is installed;
when the heat dissipation module 1 is mounted on the housing 3, the heat dissipation body 12 enters the insertion opening 301 and is placed on the support plate 3 a; then adhering the heat-conducting silica gel gasket 5 to the bottom of the heat radiator 12, abutting the connecting body 11 against the heat-conducting silica gel gasket 5, wherein the connecting body 11 corresponds to the heat radiator 12, and then fixing the connecting body 11 and the heat radiator 12 together through screws;
the cross-sectional area of the connecting body 11 is larger than the area of the embedding opening 301, so that the connecting body 11 is not easy to fall out of the embedding opening 301 when being connected with the heat radiation body 12, and the heat radiation module 1 is stably fixed on the shell 3; the heat-conducting silica gel gasket 5 is not easy to influence the heat dissipation effect of the heat dissipation module 1, and has certain elasticity, so that the connector 11 and the heat dissipation body 12 are more stable and firm in connection and are not easy to loosen;
the connector 11 and the heat radiator 12 can be fixedly connected through a work piece such as a hoop, and the like, so that the detachable purpose is achieved.
The heat dissipation body 12 is provided with a plurality of criss-cross heat dissipation grooves 12a, and the connector 11 is provided with a plurality of heat dissipation channels 11a which are uniformly distributed.
The heat radiation body 12 is provided with a plurality of criss-cross heat radiation grooves 12a, so that the heat radiation effect of the heat radiation module 1 is increased, and the heat radiation of the chip 4 is further enhanced; the connector 11 is provided with a plurality of heat dissipation channels 11a, which further enhance the heat dissipation effect of the heat dissipation module 1 on the chip 4.
A sealing ring 6 is arranged between the supporting plate 3a and the heat radiation body 12 or is filled with foam rubber, and the sealing ring is made of rubber;
the embedding opening 301 is sealed through the rubber sealing ring 6 or the foaming rubber, so that foreign matters such as water or dust are ensured to be not easy to enter the shell 3, and the electric appliance element is effectively prevented from being damaged.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the present invention, and those skilled in the art should be able to make general changes and substitutions within the technical scope of the present invention.
Claims (9)
1. A split type radiator for a platform area terminal is characterized by comprising
The heat dissipation module comprises a detachably connected connector and a heat dissipation body, the connector is arranged in a shell of the terminal of the transformer area, the heat dissipation body is embedded in the shell, and the connector and the heat dissipation body are both made of heat conduction materials;
and the heat conduction module is arranged between the connector and the chip at the platform area terminal, and is abutted against the connector and the chip.
2. The split type heat sink for the platform terminal according to claim 1, wherein: the connector and the heat radiator are both made of aluminum materials and are fixedly connected through screws.
3. The split type heat sink for the platform terminal according to claim 2, wherein: and a heat-conducting silica gel gasket is arranged between the connecting body and the heat radiation body.
4. The split type heat sink for the platform terminal according to claim 3, wherein: the heat conduction module comprises a first heat conduction silica gel layer, a ceramic sheet layer and a second heat conduction silica gel layer which are connected in sequence, the first heat conduction silica gel layer is abutted against the chip, and the second heat conduction silica gel layer is abutted against the connector.
5. The split type heat sink for the platform terminal according to claim 3, wherein: the heat radiation body is provided with a plurality of criss-cross heat radiation grooves, and the connecting body is provided with a plurality of heat radiation channels which are uniformly distributed.
6. The split type heat sink for the platform terminal according to any one of claims 1 to 5, wherein: the shell is provided with an embedding opening, a supporting plate is arranged at the embedding opening, and the heat dissipation body is arranged in the embedding opening and arranged on the supporting plate.
7. The split type heat sink for the platform terminal according to claim 4, wherein: the ceramic plate is alumina ceramic or aluminum nitride ceramic.
8. The split type heat sink for the platform terminal according to claim 6, wherein: and a sealing ring is arranged between the supporting plate and the heat radiation body and is made of rubber materials.
9. The split type heat sink for the platform terminal according to claim 6, wherein: and foam rubber is filled between the supporting plate and the heat radiation body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122199108.6U CN215774078U (en) | 2021-09-10 | 2021-09-10 | Platform district is split type radiator for terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122199108.6U CN215774078U (en) | 2021-09-10 | 2021-09-10 | Platform district is split type radiator for terminal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215774078U true CN215774078U (en) | 2022-02-08 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122199108.6U Active CN215774078U (en) | 2021-09-10 | 2021-09-10 | Platform district is split type radiator for terminal |
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| Country | Link |
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| CN (1) | CN215774078U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116860094A (en) * | 2023-09-05 | 2023-10-10 | 北京华鲲振宇智能科技有限责任公司 | Intelligent terminal |
-
2021
- 2021-09-10 CN CN202122199108.6U patent/CN215774078U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116860094A (en) * | 2023-09-05 | 2023-10-10 | 北京华鲲振宇智能科技有限责任公司 | Intelligent terminal |
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