CN116860094A - Intelligent terminal - Google Patents
Intelligent terminal Download PDFInfo
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- CN116860094A CN116860094A CN202311135753.9A CN202311135753A CN116860094A CN 116860094 A CN116860094 A CN 116860094A CN 202311135753 A CN202311135753 A CN 202311135753A CN 116860094 A CN116860094 A CN 116860094A
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- plate
- heat dissipation
- intelligent terminal
- main radiator
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 71
- 239000000919 ceramic Substances 0.000 claims abstract description 36
- 238000010438 heat treatment Methods 0.000 claims abstract description 23
- 230000005855 radiation Effects 0.000 claims description 17
- 230000002708 enhancing effect Effects 0.000 claims description 9
- 230000001965 increasing effect Effects 0.000 claims description 8
- 229910000838 Al alloy Inorganic materials 0.000 claims description 7
- 230000003647 oxidation Effects 0.000 claims description 7
- 238000007254 oxidation reaction Methods 0.000 claims description 7
- 230000000694 effects Effects 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 5
- 230000010354 integration Effects 0.000 abstract description 8
- 238000001816 cooling Methods 0.000 abstract description 2
- 230000009467 reduction Effects 0.000 abstract description 2
- 238000004088 simulation Methods 0.000 description 9
- 230000004927 fusion Effects 0.000 description 8
- 238000013461 design Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 230000006835 compression Effects 0.000 description 3
- 238000007906 compression Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000004364 calculation method Methods 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 238000012938 design process Methods 0.000 description 2
- 230000002035 prolonged effect Effects 0.000 description 2
- RVCKCEDKBVEEHL-UHFFFAOYSA-N 2,3,4,5,6-pentachlorobenzyl alcohol Chemical group OCC1=C(Cl)C(Cl)=C(Cl)C(Cl)=C1Cl RVCKCEDKBVEEHL-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000013480 data collection Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000010249 in-situ analysis Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000006855 networking Effects 0.000 description 1
- 230000011664 signaling Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0217—Mechanical details of casings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
- H05K7/20418—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing the radiating structures being additional and fastened onto the housing
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
Abstract
The application belongs to the technical field of intelligent terminals, and particularly relates to an intelligent terminal which comprises an upper shell, a lower shell, a computing plate and a heat dissipation device, wherein the heat dissipation device comprises a main radiator, a heat dissipation plate, a heat conduction pad and a ceramic plate. In cooling system's course of working, the heat that the chip that generates heat in the complete machine produced loops through heat conduction pad, heating panel, potsherd and main radiator and transmits to the whole machine outside of intelligent integration terminal, through the cooperation between heat conduction pad, the heating panel, potsherd and the main radiator, the radiating efficiency of intelligent integration terminal complete machine has been improved, the service environment temperature of intelligent integration terminal complete machine has been improved, make intelligent integration terminal complete machine can adapt to the abominable scene of higher ambient temperature, main chip can normally work under more abominable environment, guarantee its work efficiency, and simultaneously, prolong its life, the reduction equipment input cost.
Description
Technical Field
The application belongs to the technical field of intelligent terminals, and particularly relates to an intelligent terminal.
Background
The intelligent fusion terminal is edge equipment of an intelligent Internet of things system 'cloud management edge end' framework, has the functions of information acquisition, internet of things proxy and edge calculation, and supports marketing, power distribution and emerging services. The intelligent fusion terminal equipment integrating functions of hardware platform, functional software, structural modularization, software and hardware decoupling, communication protocol self-adapting design, high-performance concurrency, large-capacity storage and multi-acquisition object requirements, power distribution station power supply and electricity consumption acquisition, data collection of each acquisition terminal or electric energy meter, equipment state monitoring, communication networking, in-situ analysis decision, collaborative calculation and the like is adopted.
At present, along with the demands of people on the intelligent integrated terminal, the intelligent integrated terminal has more diversified use scenes, more severe use environments, namely, higher use environment temperature, and therefore, the intelligent integrated terminal has higher requirements on a whole heat dissipation system. The existing intelligent terminal can only be used in a scene of 60 ℃ in environment, and for severe scenes with higher environmental temperature, the working efficiency of a main chip of a complete terminal system is reduced, and the main chip can not work seriously.
Therefore, improvement on the heat dissipation system of the existing intelligent fusion terminal is needed to solve the technical problem that the existing intelligent terminal can only be used in an environment scene below 60 ℃, and the working efficiency of a main chip of the severe scene with higher temperature can be reduced, so that the main chip cannot work normally.
Disclosure of Invention
The application aims to provide an intelligent terminal which is used for solving the technical problems that the existing intelligent terminal can only be used in an environment scene below 60 ℃, and the working efficiency of a main chip of the intelligent terminal can be reduced for a severe scene with higher temperature, so that the main chip can not work normally.
In order to solve the technical problems, the application adopts the following technical scheme:
the intelligent terminal comprises an upper shell, a lower shell and a computing plate, wherein the upper shell and the lower shell form an inner space of the intelligent terminal, the computing plate is arranged in the inner space, the intelligent terminal further comprises a heat dissipation device, the heat dissipation device comprises a main heat radiator, a heat dissipation plate, a heat conduction pad and ceramic plates, and the heat conduction pad is provided with at least three plates;
the ceramic plate and the radiating plate are sequentially arranged at the lower part of the main radiator, the ceramic plate is close to the main radiator, and heat conduction pads are arranged between the ceramic plate and the main radiator, between the ceramic plate and the radiating plate and between the radiating plate and the computing plate;
the main radiator penetrates through the upper shell and extends out of the whole machine, and is used for radiating heat in the whole machine to the outside of the whole machine so as to radiate the heat in the whole machine;
the ceramic plate is used for radiating heat in the whole machine;
the heat dissipation plate is used for enhancing the heat dissipation effect by increasing the heat dissipation area so as to assist heat dissipation;
the heat conducting pad is used for filling gaps among the main radiator, the ceramic plate and the radiating plate, and reducing contact thermal resistance so as to assist in increasing heat conductivity.
Preferably, the upper part of the heat radiation plate is provided with bosses matched with the quantity, the size and the shape of the heat radiation chips.
Preferably, a heat conducting pad matched with the boss and the heating chip is attached between the boss and the heating chip.
Preferably, the heat dissipation plate is fixedly connected with the computing plate through screws, the heat dissipation plate is made of aluminum alloy, and the surface of the heat dissipation plate is subjected to black conductive oxidation treatment for enhancing radiation heat dissipation.
Preferably, the thickness of the heat dissipation plate is 5mm, and the length and width dimensions thereof are 135mm and 63mm, respectively.
Preferably, the main radiator and the upper shell are fixedly connected through screws, the main radiator is made of aluminum alloy, and black anodic oxidation treatment is adopted for enhancing radiation heat exchange.
Preferably, the ceramic plate is fixedly connected with the upper shell through a screw and is contacted with the lower surface of the main radiator, and the heat conducting pad is attached between the ceramic plate and the lower surface of the main radiator and is used for filling a contact gap between the ceramic plate and the lower surface of the main radiator, so that contact thermal resistance is reduced.
Preferably, the thickness of the heat conducting pad is 1mm, and the heat conducting coefficient is 6W/m.k.
Preferably, the main radiator comprises a substrate and radiating teeth, and the radiating teeth are uniformly distributed on the substrate.
Preferably, the thickness of the substrate is 4mm, the height of the heat dissipation teeth is 2mm, the distance between the bottoms of the adjacent heat dissipation teeth is 3mm, and the distance between the tops of the adjacent heat dissipation teeth is 5mm.
The beneficial effects of the application include:
the application provides an intelligent terminal which comprises an upper shell, a lower shell, a computing plate and a heat radiating device, wherein the heat radiating device comprises a main heat radiator, a heat radiating plate, a heat conducting pad and a ceramic plate. In cooling system's course of working, the heat that the chip that generates heat in the complete machine produced loops through heat conduction pad, heating panel, potsherd and main radiator and transmits to the whole machine outside of intelligent integration terminal, through the cooperation between heat conduction pad, the heating panel, potsherd and the main radiator, the radiating efficiency of intelligent integration terminal complete machine has been improved, the service environment temperature of intelligent integration terminal complete machine has been improved, make intelligent integration terminal complete machine can adapt to the abominable scene of higher ambient temperature, main chip can normally work under more abominable environment, guarantee its work efficiency, and simultaneously, prolong its life, the reduction equipment input cost.
Drawings
Fig. 1 is a schematic structural diagram of an intelligent terminal according to the present application.
Fig. 2 is a schematic structural diagram of a heat dissipation plate of the intelligent terminal according to the present application.
Fig. 3 is a schematic structural diagram of a main heat sink of the intelligent terminal according to the present application.
Reference numerals: 1. a lower housing; 2. exchanging the collecting plates; 3. a computing board; 4. a thermal pad; 5. a heat dissipation plate; 50. a boss; 51. a screw; 6. a ceramic sheet; 7. an upper housing; 8. a main radiator; 80. heat dissipation teeth.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present application more apparent, the technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application, and it is apparent that the described embodiments are only some embodiments of the present application, not all embodiments. The components of the embodiments of the present application generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations. Thus, the following detailed description of the embodiments of the application, as presented in the figures, is not intended to limit the scope of the application, as claimed, but is merely representative of selected embodiments of the application. All other embodiments, which can be made by a person skilled in the art without making any inventive effort, are intended to be within the scope of the present application.
The present application will present various aspects, embodiments, or features about a system that may include a plurality of devices, components, modules, etc. It is to be understood and appreciated that the various systems may include additional devices, components, modules, etc. and/or may not include all of the devices, components, modules etc. discussed in connection with the figures. Furthermore, combinations of these schemes may also be used.
In addition, in the embodiments of the present application, words such as "exemplary," "for example," and the like are used to indicate an example, instance, or illustration. Any embodiment or design described herein as "exemplary" is not necessarily to be construed as preferred or advantageous over other embodiments or designs. Rather, the term use of an example is intended to present concepts in a concrete fashion.
In the embodiment of the present application, "information", "signal", "message", "channel", and "signaling" may be used in a mixed manner, and it should be noted that the meaning of the expression is consistent when the distinction is not emphasized. "of", "corresponding" and "corresponding" are sometimes used in combination, and it should be noted that the meaning of the expression is consistent when the distinction is not emphasized.
The application is further described in detail below with reference to fig. 1 to 3:
referring to fig. 1-3, an intelligent terminal comprises an upper shell 7, a lower shell 1 and a computing plate 3, wherein the upper shell 7 and the lower shell 1 form an inner space of the intelligent terminal, the computing plate 3 is arranged in the inner space, the intelligent terminal further comprises a heat dissipation device, the heat dissipation device comprises a main heat radiator 8, a heat dissipation plate 5, a heat conduction pad 4 and ceramic plates 6, and the heat conduction pad 4 is provided with at least three heat dissipation plates.
The ceramic plate 6 and the heat dissipation plate 5 are sequentially arranged at the lower part of the main heat radiator 8, the ceramic plate 6 is close to the main heat radiator 8, and the heat conduction pads 4 are arranged between the ceramic plate 6 and the main heat radiator 8, between the ceramic plate 6 and the heat dissipation plate 5 and between the heat dissipation plate 5 and the computing plate 3.
The main radiator 8 penetrates through the upper shell 7 and extends out of the whole machine, and is used for radiating heat in the whole machine to the outside of the whole machine so as to radiate the heat in the whole machine; the ceramic sheet 6 is used for radiating heat in the whole machine; the heat dissipation plate 5 is used for enhancing the heat dissipation effect by increasing the heat dissipation area so as to assist heat dissipation; the heat conducting pad 4 is used for filling gaps among the main radiator 8, the ceramic sheet 6 and the heat radiating plate 5, and reducing contact thermal resistance so as to assist in increasing heat conductivity.
In intelligent terminal working process, the heat that its inside chip that generates heat produced loops through heat conduction pad 4, heating panel 5, potsherd 6 and main radiator 8 and transmits the whole outside of intelligent fusion terminal, through the cooperation between heat conduction pad 4, heating panel 5, potsherd 6 and the main radiator 8, the radiating efficiency of intelligent fusion terminal complete machine has been improved, the service environment temperature of intelligent fusion terminal complete machine has been improved, make intelligent fusion terminal complete machine can adapt to the abominable scene of higher ambient temperature, main chip can normally work under harsher environment, guarantee its work efficiency, and simultaneously, its life is prolonged, the cost of equipment input is reduced.
The upper part of the heat radiation plate 5 is provided with bosses 50 matched with the number, the size and the shape of the heat radiation chips, and a heat conduction pad 4 matched with the bosses 50 and the heat radiation chips is attached between the bosses 50 and the heat radiation chips. The heat dissipation plate 5 is fixedly connected with the computing plate 3 through a screw 51, an intersection plate is arranged between the computing plate and the lower shell, the heat dissipation plate 5 is made of aluminum alloy, and the surface of the heat dissipation plate is subjected to black conductive oxidation treatment for enhancing radiation heat dissipation.
Other heating chips such as CPU (central processing unit) are attached to the PCBA in a soldering tin mode, in order to match the heating chips, bosses 50 are matched and arranged on the heat dissipation plate 5, the shape and the size of the bosses 50 are matched and designed according to the height difference of different heating chips, the matched bosses 50 are machined in the heat dissipation plate 5 in a machining mode, a gap of 0.7mm can be reserved between the bosses 50 and the upper surface of the heating chips, a heat conduction pad 4 with the thickness of 1mm is attached between the heating chips and the bosses 50 of the heat dissipation plate 5, the compression amount of the heat conduction pad 4 is 0.3mm, and the heat conduction effect can be effectively enhanced.
The heat dissipation plate 5 and the computing plate 3 are fixed through 5 screws 51, a good fixing effect is achieved, the heat dissipation plate 5 is guaranteed to press the heat conduction pad 4 in the assembly process, and the heat conduction pad 4 has a compression amount of 0.3mm, so that the heat conduction pad 4 and the heat dissipation plate 5 are in good contact.
The thickness of heating panel 5 is 5mm, and its length and wide size are 135mm and 63mm respectively, and heating panel 5 adopts the aluminum alloy material for heating panel 5 possesses good machinability, so that processing boss 50 possesses high heat conductivility, in order to realize good heat dissipation. The surface of the boss 50, which is contacted with the heat conducting pad 4, of the heat radiating plate 5, the surface, which is contacted with the heat conducting pad 4, of the upper surface of the heat radiating plate 5 has higher processing flatness, so that the heat radiating plate can be effectively attached to the heat conducting pad 4, and the surface treatment of the heat radiating plate 5 adopts black conductive oxidation treatment to enhance radiation and heat radiation.
The main radiator 8 is fixedly connected with the upper shell 7 through screws, the main radiator 8 is made of aluminum alloy, and black anodic oxidation treatment is adopted for enhancing radiation heat exchange. The lower surface of the main heat spreader 8 ensures a high degree of processing planarity, enabling it to effectively bond with the thermal pad 4 to reduce thermal contact resistance.
The ceramic plate 6 is fixedly connected with the upper shell 7 through screws and is contacted with the lower surface of the main radiator 8, the heat conduction pad 4 with the thickness of 1mm and the heat conduction coefficient of 6W/m.k is attached between the ceramic plate 6 and the lower surface of the main radiator 8, the compression amount is 0.3mm, and the heat conduction pad is used for filling a contact gap between the ceramic plate 6 and the lower surface of the main radiator 8 and reducing contact thermal resistance.
The main radiator 8 comprises a base plate and radiating teeth 80, the radiating teeth 80 are uniformly distributed on the base plate, the thickness of the base plate is 4mm, the height of the radiating teeth 80 is 2mm, the distance between the bottoms of adjacent radiating teeth 80 is 3mm, the distance between the tops of adjacent radiating teeth 80 is 5mm, and the size design can increase the whole area of the radiator and enhance the radiation. The dimension is subjected to thermal simulation analysis in the design process, the thickness of the substrate, the height of the heat dissipation teeth 80, the distance between the bottoms of the adjacent heat dissipation teeth 80, the distance between the tops of the adjacent heat dissipation teeth 80 and the taper of the heat dissipation teeth 80 are continuously optimized and adjusted, and in the dimension design, the temperature of the chip can meet the requirement of normal operation.
In the design process of an actual heat dissipation system, the heat dissipation path of the heating chip in the whole intelligent fusion terminal is from the chip to the heat conduction pad 4, from the heat conduction pad 4 to the heat dissipation plate 5, from the heat dissipation plate 5 to the heat conduction pad 4, from the heat conduction pad 4 to the ceramic plate, from the ceramic plate to the heat conduction pad 4, from the heat conduction pad 4 to the main heat radiator 8, and from the main heat radiator 8 to the air. And then performing simulation analysis by using thermal simulation software, setting the ambient temperature to 70 ℃, and checking the temperature of the heating chip according to the thermal simulation analysis result. When the temperature of the heating chip does not meet the requirement, the heat dissipation system is optimized.
According to the thermal simulation result, the thermal resistance diagram of the heat dissipation path is analyzed, and the component with larger thermal resistance influence is optimized. The result shows that the thermal resistance of the heat conducting pad 4 between the heating chip and the heat radiating plate 5 is larger, the thermal resistance is reduced by selecting the parameters of the heat conducting pad 4, the heat conducting coefficient of the heat conducting pad 4 is increased to 6W/m.k from the original 3W/m.k, the thickness is reduced to 1mm from the original 2mm, and then the thermal simulation analysis is carried out to check the simulation analysis result.
According to the above thermal simulation result, the main radiator 8 is optimized, and the heat is finally transferred out by convective heat exchange between the surface of the radiating teeth 80 of the main radiator 8 and the surrounding air. To increase the convective heat transfer coefficient, it is first of all to increase the contact area of the heat radiating teeth 80 of the entire main radiator 8 with air and to optimize the spacing of the heat radiating teeth 80. On the basis of not changing the structure of the whole machine shell, the size and the spacing of the heat dissipation teeth 80 are optimized through simulation analysis, so that the optimal size and spacing of the heat dissipation teeth 80 are obtained, and the heat convection coefficient is increased. The design result of the main radiator 8, which finally meets the operating temperature requirement, is: the thickness of the base plate of the main radiator 8 is 4mm, the height of the radiating teeth 80 is 2mm, the interval between the bottoms of the adjacent radiating teeth 80 is 3mm, and the interval between the tops of the adjacent radiating teeth 80 is 5mm.
In summary, in the working process of the heat radiation system, the heat generated by the heating chip in the whole intelligent terminal is transmitted to the outside of the whole intelligent terminal through the heat conducting pad 4, the heat radiating plate 5, the ceramic plate 6 and the main heat radiator 8, the heat radiation efficiency of the whole intelligent terminal is improved through the cooperation among the heat conducting pad 4, the heat radiating plate 5, the ceramic plate 6 and the main heat radiator 8, the use environment temperature of the whole intelligent terminal is improved, the whole intelligent terminal can adapt to a severe scene with higher environment temperature, the main chip can work normally in a severe environment, the result of thermal simulation is provided, the intelligent terminal can work normally in a severe environment with the temperature of 70 ℃, the working efficiency is effectively ensured, the service life is prolonged, and the equipment input cost is reduced.
The above examples merely illustrate specific embodiments of the application, which are described in more detail and are not to be construed as limiting the scope of the application. It should be noted that it is possible for a person skilled in the art to make several variants and modifications without departing from the technical idea of the application, which fall within the scope of protection of the application.
Claims (10)
1. The intelligent terminal comprises an upper shell (7), a lower shell (1) and a computing plate (3), wherein the upper shell (7) and the lower shell (1) form an inner space of the intelligent terminal, and the computing plate (3) is arranged in the inner space;
the ceramic plate (6) and the radiating plate (5) are sequentially arranged at the lower part of the main radiator (8), the ceramic plate (6) is close to the main radiator (8), and heat conduction pads (4) are arranged between the ceramic plate (6) and the main radiator (8), between the ceramic plate (6) and the radiating plate (5) and between the radiating plate (5) and the radiating teeth (80);
the main radiator (8) penetrates through the upper shell (7) and extends out of the whole machine, and is used for radiating heat in the whole machine to the outside of the whole machine so as to radiate the heat in the whole machine;
the ceramic sheet (6) is used for radiating heat in the whole machine;
the heat dissipation plate (5) is used for enhancing the heat dissipation effect by increasing the heat dissipation area so as to assist heat dissipation;
the heat conducting pad (4) is used for filling gaps among the main radiator (8), the ceramic sheet (6) and the radiating plate (5), and reducing contact thermal resistance so as to assist in increasing heat conductivity.
2. An intelligent terminal according to claim 1, characterized in that the upper part of the heat dissipation plate (5) is provided with bosses (50) matching the number, size and shape of the heat dissipation chips.
3. An intelligent terminal according to claim 2, characterized in that a heat conducting pad (4) matched with the boss (50) and the heating chip is attached between the boss (50) and the heating chip.
4. An intelligent terminal according to claim 3, wherein the heat dissipation plate (5) is fixedly connected with the heat dissipation teeth (80) through screws (51), the heat dissipation plate (5) is made of aluminum alloy, and the surface of the heat dissipation plate is subjected to black conductive oxidation treatment for enhancing radiation heat dissipation.
5. An intelligent terminal according to claim 4, characterized in that the thickness of the heat-dissipating plate (5) is 5mm, and the length and width dimensions thereof are 135mm and 63mm, respectively.
6. The intelligent terminal according to claim 1, wherein the main radiator (8) is fixedly connected with the upper shell (7) through a screw (51), the main radiator (8) is made of aluminum alloy, and black anodic oxidation treatment is adopted for enhancing radiation heat exchange.
7. The intelligent terminal according to claim 6, wherein the ceramic plate (6) is fixedly connected with the upper shell (7) through a screw (51) and is in contact with the lower surface of the main radiator (8), and the heat conducting pad (4) is attached between the ceramic plate (6) and the lower surface of the main radiator (8) and is used for filling a contact gap between the ceramic plate (6) and the lower surface of the main radiator (8) so as to reduce contact thermal resistance.
8. An intelligent terminal according to claim 7, characterized in that the thermal pad (4) has a thickness of 1mm and a thermal conductivity of 6W/m.k.
9. An intelligent terminal according to claim 1, characterized in that the main heat sink (8) comprises a base plate and heat dissipating teeth (80), the heat dissipating teeth (80) being evenly arranged on the base plate.
10. An intelligent terminal according to claim 9, wherein the thickness of the substrate is 4mm, the height of the heat dissipation teeth (80) is 2mm, the spacing between the bottoms of adjacent heat dissipation teeth (80) is 3mm, and the spacing between the tops of adjacent heat dissipation teeth (80) is 5mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311135753.9A CN116860094A (en) | 2023-09-05 | 2023-09-05 | Intelligent terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311135753.9A CN116860094A (en) | 2023-09-05 | 2023-09-05 | Intelligent terminal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116860094A true CN116860094A (en) | 2023-10-10 |
Family
ID=88219495
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311135753.9A Pending CN116860094A (en) | 2023-09-05 | 2023-09-05 | Intelligent terminal |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116860094A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002184920A (en) * | 2000-12-12 | 2002-06-28 | Matsushita Electric Ind Co Ltd | Heat dissipating structure for heat generating component |
| CN207706614U (en) * | 2018-01-03 | 2018-08-07 | 江苏和正特种装备有限公司 | One kind being tethered at unmanned aerial vehicle onboard power-supply radiator bottom plate |
| CN215774078U (en) * | 2021-09-10 | 2022-02-08 | 浙江尼肯电气科技股份有限公司 | Platform district is split type radiator for terminal |
| CN216626417U (en) * | 2021-09-10 | 2022-05-27 | 浙江尼肯电气科技股份有限公司 | Integrated radiator for platform area terminal |
-
2023
- 2023-09-05 CN CN202311135753.9A patent/CN116860094A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002184920A (en) * | 2000-12-12 | 2002-06-28 | Matsushita Electric Ind Co Ltd | Heat dissipating structure for heat generating component |
| CN207706614U (en) * | 2018-01-03 | 2018-08-07 | 江苏和正特种装备有限公司 | One kind being tethered at unmanned aerial vehicle onboard power-supply radiator bottom plate |
| CN215774078U (en) * | 2021-09-10 | 2022-02-08 | 浙江尼肯电气科技股份有限公司 | Platform district is split type radiator for terminal |
| CN216626417U (en) * | 2021-09-10 | 2022-05-27 | 浙江尼肯电气科技股份有限公司 | Integrated radiator for platform area terminal |
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