CN218514722U

CN218514722U - Heat radiation structure and CORS receiver that CORS receiver was used

Info

Publication number: CN218514722U
Application number: CN202222048060.3U
Authority: CN
Inventors: 潘军兆; 周光海; 王江林; 潘伟锋; 余定麟
Original assignee: South GNSS Navigation Co Ltd
Current assignee: South GNSS Navigation Co Ltd
Priority date: 2022-08-04
Filing date: 2022-08-04
Publication date: 2023-02-21
Anticipated expiration: 2032-08-04

Abstract

The utility model relates to the technical field of receiving equipment, and discloses a heat dissipation structure for a CORS receiver, which comprises a casing, a main board and a heat conduction device; the main board is arranged in the shell; the heat conduction device is arranged in the shell and is respectively contacted with the main board and the inner wall of the shell. The utility model discloses heat radiation structure that CORS receiver was used is through setting up heat-transfer device in the casing, and heat-transfer device contacts with mainboard and casing respectively, and at this moment, heat-transfer device can take away the mainboard heat with the heat transfer of mainboard to the casing through the casing, so, except that the inside air flow of casing, can also conduct the heat dissipation, improves heat dispersion to can prolong during operation. The utility model also discloses a CORS receiver.

Description

Heat radiation structure and CORS receiver that CORS receiver was used

Technical Field

The utility model relates to a receiving equipment technical field especially relates to a heat radiation structure and CORS receiver that CORS receiver used.

Background

A continuously operating Reference station System (CORS) can be defined as: one or several fixed, continuously operating satellite reference stations, using a network of modern computer, data communication and internet (LAN/WLAN) technologies, automatically provide a system of checked different types of data to users of different types, different needs, different levels in real time, requiring the use of a CORS receiver in a continuously operating reference station system.

The mainboard of the conventional CORS receiver drives heat through air to realize heat dissipation, and the heat dissipation performance is poor, so that when the temperature of the internal mainboard is high, the mainboard needs to stop working and enter a protection state after continuing working for a short time to provide enough time for the CORS receiver to dissipate heat, and the working efficiency is low; therefore, it is desirable to solve the problem of poor heat dissipation of the CORS receiver.

SUMMERY OF THE UTILITY MODEL

In order to overcome the defects of the prior art, the utility model aims to provide a heat radiation structure and CORS receiver that CORS receiver was used, its homoenergetic improves heat dispersion.

The purpose of the utility model is realized by adopting the following technical scheme:

a heat dissipation structure for a CORS receiver, comprising:

a housing;

the main board is arranged in the shell;

and the heat conduction device is arranged in the shell and is respectively contacted with the main board and the inner wall of the shell.

Further, the main board is adjacent to the top wall of the housing.

Further, the heat conduction device comprises a first heat dissipation piece and a first heat dissipation paste layer, the first heat dissipation piece is in contact with the mainboard, and the first heat dissipation paste layer is in contact with the first heat dissipation piece and the inner wall of the machine shell respectively.

Further, the first heat dissipation member is in contact with a top surface of the main board.

Further, the first thermal grease layer is respectively contacted with the top surface of the mainboard and the top wall of the casing.

Further, the first heat sink is made of any one of red copper, silver, and an aluminum alloy.

Further, the heat conduction device comprises a second heat dissipation piece and a second heat dissipation paste layer, the second heat dissipation piece is in contact with the bottom surface of the mainboard, and the second heat dissipation paste layer is in contact with the second heat dissipation piece and the inner wall of the case respectively.

Further, the second heat dissipation element comprises a first contact section extending laterally, a connection section formed by extending upwards from one side of the first contact section, and a second contact section formed by extending laterally from the connection section; the top surface of the first contact section is in contact with the bottom surface of the main plate; the connecting section is positioned on the outer side of the main board; the second heat-dissipating paste layer is in contact with the top surface of the second contact section and the top wall of the chassis, respectively.

Further, the connecting section is close to the outer side of the main board.

a CORS receiver comprises the heat dissipation structure for the CORS receiver.

Compared with the prior art, the beneficial effects of the utility model reside in that:

the utility model discloses heat radiation structure that CORS receiver was used is through setting up heat-transfer device in the casing, and heat-transfer device contacts with mainboard and casing respectively, and at this moment, heat-transfer device can take away the mainboard heat with the heat transfer of mainboard to the casing through the casing, so, except that the inside air flow of casing, can also conduct the heat dissipation, improves heat dispersion to can prolong during operation.

The utility model discloses CORS receiver is owing to including the heat radiation structure that foretell CORS receiver was used, and can improve heat dispersion.

Drawings

Fig. 1 is a schematic diagram of a split structure of the CORS receiver of the present invention;

fig. 2 is a cross-sectional view of the CORS receiver of the present invention;

fig. 3 is an enlarged view of a portion a of fig. 2 according to the present invention.

In the figure: 10. a housing; 20. a main board; 30. a heat conducting device; 31. a first heat sink; 32. a first heat dissipating paste layer; 33. a second heat sink; 331. a first contact section; 332. a connecting section; 333. a second contact section; 34. a second thermal grease layer.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.

Referring to fig. 1 to 3, the present invention discloses a heat dissipation structure for a CORS receiver, which includes a housing 10, a main board 20 and a heat conduction device 30; the main board 20 is arranged in the casing 10; the heat conducting device 30 is arranged in the casing 10 and is respectively contacted with the main board 20 and the inner wall of the casing 10; therefore, the heat generated by the motherboard 20 can be conducted to the casing 10 through the heat conduction device 30 and dissipated from the casing 10, so that the heat of the motherboard 20 can be conducted and dissipated by the air flowing in the casing 10, the heat dissipation performance can be improved, and the working time can be prolonged.

The main board 20 of the present embodiment is close to the top wall of the casing 10, so as to shorten the path of heat transfer from the main board 20 to the casing 10.

The heat conduction device 30 of the present embodiment includes a first heat dissipation member 31 and a first heat dissipation paste layer 32, the first heat dissipation member 31 is in contact with the main board 20, and the first heat dissipation paste layer 32 is in contact with the first heat dissipation member 31 and the inner wall of the housing 10, respectively; thus, the heat of the motherboard 20 is transferred to the first heat dissipating paste layer 32 through the first heat dissipating member 31 and then transferred to the housing, and at this time, the first heat dissipating paste layer 32 has a good heat conduction effect to ensure the heat dissipating effect; specifically, the first heat dissipation paste layer 32 is coated on the first heat dissipation member 31, and the first heat dissipation paste layer 32 can be arranged by coating, so that fixation by screws and the like is not required, and the mounting is simplified.

The first heat dissipation element 31 of the present embodiment is made of a high thermal conductivity metal material, and specifically, the high thermal conductivity metal material may be, but not limited to, any one of red copper, silver and aluminum alloy.

Specifically, the first heat dissipation element 31 contacts the top surface of the motherboard 20, and the surface area of the top surface of the motherboard 20 is larger, so that the contact area between the first heat dissipation element 31 and the top surface of the motherboard 20 can be increased as much as possible, thereby further ensuring the heat dissipation effect.

More specifically, the first heat dissipating paste layer 32 is in contact with the top surface of the motherboard 20 and the top wall of the casing 10, and at this time, when the motherboard 20 is disposed close to the top wall of the casing 10, the path of the top surface heat of the motherboard 20 to the housing can be shortened, the heat transfer efficiency can be improved, and at the same time, the total thickness of the first heat dissipating member 31 and the first heat dissipating paste layer 32 can be reduced, so that the space, the material and the cost can be saved.

The heat conducting device 30 of the present embodiment includes a second heat dissipating member 33 and a second heat dissipating paste layer 34, the second heat dissipating member 33 contacts with the bottom surface of the motherboard 20, at this time, the surface area of the bottom surface of the motherboard 20 is larger, so that the contact area between the first heat dissipating member 31 and the bottom surface of the motherboard 20 can be increased as much as possible, thereby further ensuring the heat dissipating effect; the second heat dissipation paste layer 34 is in contact with the second heat dissipation member 33 and the inner wall of the case 10, respectively.

It should be noted that when the first heat dissipation member 31 and the second heat dissipation member 33 are combined to contact the top surface and the bottom surface of the motherboard 20, respectively, the heat dissipation speed can be increased.

The second heat dissipation element 33 of the present embodiment includes a first contact section 331 extending laterally, a connection section 332 formed by extending upward from one side of the first contact section 331, and a second contact section 333 formed by extending laterally from the connection section 332; the top surface of the first contact section 331 is in contact with the bottom surface of the main board 20; the connecting section 332 is located outside the main board 20; the second heat dissipation paste layer 34 is in contact with the top surface of the second contact section 333 and the top wall of the casing 10, respectively; in this case, when the main board 20 is disposed close to the top wall of the casing 10, the heat of the bottom surface of the main board 20 is conducted to the top wall of the casing 10 by the design of the second heat dissipating member 33, and the path for transferring the heat of the bottom surface of the main board 20 to the housing can be shortened as compared with the case of conducting the second heat dissipating paste layer 34 to the bottom wall of the casing 10, and the heat transfer efficiency can be improved.

The connecting section 332 of this embodiment is close to the outer side of the main board 20, so that the overall structure is more compact.

The second heat dissipation member 33 may be made of a high thermal conductivity material, which may be, but is not limited to, any one of red copper, silver, and aluminum alloy.

The embodiment also discloses a CORS receiver, which comprises the heat dissipation structure for the CORS receiver, and has the same technical effect as the heat dissipation structure for the CORS receiver, and it can be understood that the CORS receiver further comprises other functional components, and the functional components are arranged in the casing 10.

The above embodiments are only preferred embodiments of the present invention, and the protection scope of the present invention cannot be limited thereby, and any insubstantial changes and substitutions made by those skilled in the art based on the present invention are all within the protection scope of the present invention.

Claims

1. A heat radiation structure for a CORS receiver, comprising:

a housing (10);

a main board (20) disposed in the housing (10);

and the heat conduction device (30) is arranged in the machine shell (10) and is respectively contacted with the main board (20) and the inner wall of the machine shell (10).

2. A heat dissipating structure for a CORS receiver according to claim 1, wherein the main board (20) is adjacent to a top wall of the housing (10).

3. A heat dissipating structure for a CORS receiver according to any one of claims 1 to 2, wherein the heat conducting means (30) comprises a first heat dissipating member (31) and a first heat dissipating paste layer (32), the first heat dissipating member (31) being in contact with the main board (20), the first heat dissipating paste layer (32) being in contact with the first heat dissipating member (31) and an inner wall of the casing (10), respectively.

4. A heat dissipating structure for a CORS receiver according to claim 3, characterized in that the first heat dissipating member (31) is in contact with the top surface of the main plate (20).

5. A heat dissipating structure for a CORS receiver according to claim 4, wherein the first heat dissipating paste layer (32) is in contact with the top surface of the main board (20) and the top wall of the casing (10), respectively.

6. A heat dissipating structure for a CORS receiver according to claim 3, wherein the first heat dissipating member (31) is made of any one of red copper, silver, and an aluminum alloy.

7. A heat dissipating structure for a CORS receiver according to any one of claims 1 to 2, wherein the heat conducting means (30) comprises a second heat dissipating member (33) and a second heat dissipating paste layer (34), the second heat dissipating member (33) being in contact with the bottom surface of the main board (20), and the second heat dissipating paste layer (34) being in contact with the second heat dissipating member (33) and the inner wall of the casing (10), respectively.

8. A heat dissipating structure for a CORS receiver according to claim 7, wherein the second heat dissipating member (33) comprises a first contact section (331) extending laterally, a connection section (332) formed by extending upwardly from a side of the first contact section (331), and a second contact section (333) formed by extending laterally from the connection section (332); the top surface of the first contact section (331) is in contact with the bottom surface of the main board (20); the connecting section (332) is positioned outside the main board (20); the second thermal grease layer (34) is in contact with the top surface of the second contact section (333) and the top wall of the casing (10), respectively.

9. A heat dissipating structure for a CORS receiver according to claim 8, characterized in that the connecting section (332) is located near the outside of the main plate (20).

10. A CORS receiver comprising a heat dissipating structure for a CORS receiver as claimed in any one of claims 1 to 9.