CN107333386B - Heat dissipation structure and method of PCB - Google Patents
Heat dissipation structure and method of PCB Download PDFInfo
- Publication number
- CN107333386B CN107333386B CN201710561964.7A CN201710561964A CN107333386B CN 107333386 B CN107333386 B CN 107333386B CN 201710561964 A CN201710561964 A CN 201710561964A CN 107333386 B CN107333386 B CN 107333386B
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 110
- 238000000034 method Methods 0.000 title claims abstract description 29
- 239000000758 substrate Substances 0.000 claims abstract description 138
- 229910052751 metal Inorganic materials 0.000 claims abstract description 123
- 239000002184 metal Substances 0.000 claims abstract description 123
- 238000010438 heat treatment Methods 0.000 claims abstract description 31
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 9
- 229910052802 copper Inorganic materials 0.000 claims description 9
- 239000010949 copper Substances 0.000 claims description 9
- 229910000838 Al alloy Inorganic materials 0.000 claims description 3
- 238000002360 preparation method Methods 0.000 claims 1
- 239000000463 material Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 3
- 239000004519 grease Substances 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 230000005669 field effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/066—Heatsink mounted on the surface of the printed circuit board [PCB]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention relates to a heat dissipation structure of a PCB (printed circuit board), wherein the PCB comprises a heating device and a substrate, the heating device is arranged on the substrate, the heating device can generate heat in the working process, and a metal layer is covered on the surface of the substrate; the heat dissipation structure comprises a metal heat dissipation layer, the metal heat dissipation layer is arranged on the side surface of the substrate, is attached to the substrate and is used for dissipating heat generated by a heating device on the substrate from the side surface of the substrate; the metal layer on the surface of the substrate extends to the side face of the substrate and is connected with the metal radiating layer, and heat generated by a heating device on the substrate is transferred to the metal radiating layer through the metal layer and then is radiated out through the metal radiating layer. The heat dissipation structure and the method can quickly dissipate the heat generated by the heating device, do not increase the thickness of the module, are convenient and flexible, and reduce the heat dissipation cost.
Description
Technical Field
The invention relates to the technical field of electronic devices, in particular to a heat dissipation structure and a heat dissipation method of a PCB (printed circuit board).
Background
The power module and the power components generate heat to cause the problems of overheating of the module, reduction of reliability and the like, under the condition of working environment temperature, the power components are limited in self-radiating capacity and are arranged tightly, the heat concentration is formed on the PCB along with the increase of the power density and the current output, and the local temperature is too high to trigger the temperature protection function of the module, so that the conversion efficiency of the module in the working process and the service life of the components are influenced. In order to ensure the overall efficiency and stability of the module, the heat generated by the heating device during operation needs to be dissipated quickly and effectively.
The conventional heat dissipation method of the PCB mainly includes heat dissipation of the device by attaching a heat sink or a heat sink to the top of the device, or conduction to the outside of the metal case through a metal bracket. The mode of adopting radiator or fin to paste at the device top not only cost is too high and occupation space is great, and the mode of conducting to the metal-back through the metal support can lead to module thickness to increase, is not suitable for the demand to miniaturized, high density of module.
Therefore, how to effectively dissipate the heat generated by the power device without increasing the thickness of the module and reducing the heat dissipation cost is a technical problem to be solved.
Disclosure of Invention
Therefore, it is necessary to provide a heat dissipation structure and a method of a PCB that can reduce the heat dissipation cost without increasing the thickness of the module, aiming at the problems of the conventional PCB that the cost is too high and the occupied space is large.
A heat dissipation structure of a PCB board comprises a heating device and a substrate, wherein the heating device is arranged on the substrate, the heating device can generate heat in the working process, and a metal layer covers the surface of the substrate;
the heat dissipation structure comprises a metal heat dissipation layer, the metal heat dissipation layer is arranged on the side surface of the substrate, is attached to the substrate and is used for dissipating heat generated by a heating device on the substrate from the side surface of the substrate;
the metal layer on the surface of the substrate extends to the side face of the substrate and is connected with the metal radiating layer, and heat generated by a heating device on the substrate is transferred to the metal radiating layer through the metal layer and then is radiated out through the metal radiating layer.
In one embodiment, the PCB further comprises a magnetic core mounted on the substrate for providing a magnetic field to the magnetic device on the PCB.
In one embodiment, the magnetic core further comprises a heat conducting medium, wherein the heat conducting medium is filled in a gap between the magnetic core and the substrate and is used for conducting heat generated by the magnetic core to the metal layer on the surface of the substrate.
In one embodiment, the heat conducting medium is heat conducting paste, heat conducting mud or heat conducting silicone grease.
In one embodiment, the shape of the metal heat sink layer matches the edges of the substrate sides.
In one embodiment, the metal layer on the surface of the substrate is a copper layer.
In one embodiment, the substrate is provided with a plurality of metal layers, each metal layer extends to the side surface of the substrate and is connected with the metal heat dissipation layer, and heat generated by the magnetic core and the heating device which are installed on the substrate is transferred to the metal heat dissipation layer on the side surface of the substrate.
In one embodiment, the pins of the heat generating device are soldered on the metal layer on the surface of the substrate, and the heat generated by the heat generating device is transferred to the metal layer on the surface of the substrate through the pins.
A heat dissipation method of a PCB board comprises a heating device and a substrate, wherein the heating device is arranged on the substrate, the heating device can generate heat in the working process, and a metal layer is covered on the surface of the substrate; the method comprises the following steps:
arranging a metal heat dissipation layer on the side face of the substrate, and attaching the metal heat dissipation layer to the substrate;
and extending the metal layer on the surface of the substrate to the side surface of the substrate to connect the metal layer on the surface of the substrate with the metal heat dissipation layer.
In one embodiment, the PCB board further includes a magnetic core mounted on the substrate, and the method further includes:
and filling a heat-conducting medium into the gap between the magnetic core and the substrate.
According to the heat dissipation structure and the method of the PCB, the metal heat dissipation layer attached to the substrate is arranged on the side face of the substrate, the metal layer on the surface of the substrate extends to the side face of the substrate and is connected with the metal heat dissipation layer, heat generated by the heating device on the substrate is transferred to the metal heat dissipation layer through the metal layer, and then the heat is dissipated through the metal heat dissipation layer. The heat dissipation structure and the method can quickly dissipate the heat generated by the heating device, do not increase the thickness of the module, are convenient and flexible, and reduce the heat dissipation cost.
Drawings
FIG. 1 is a schematic structural diagram of a heat dissipation structure of a PCB board according to an embodiment;
FIG. 2 is a three-dimensional view of the heat dissipation structure shown in FIG. 1;
FIG. 3 is a schematic diagram of an embodiment of a core heat sink;
FIG. 4 is a schematic diagram of heat dissipation of a heat generating device in one embodiment;
FIG. 5 is a flow chart of a method for dissipating heat from a PCB board according to one embodiment.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Referring to fig. 1, the heat dissipation structure of the PCB is shown in a schematic structural diagram, the PCB includes a heat generating device 150, a magnetic core 110 and a substrate 130, the heat generating device 150 and the magnetic core 110 are mounted on the substrate 130, the heat generating device 150 and the magnetic core 110 generate heat during operation, the magnetic core 110 is used for providing a magnetic field for a magnetic device on the PCB, and a metal layer is covered on the surface of the substrate 130.
The heat dissipation structure includes a metal heat dissipation layer 140, wherein the metal heat dissipation layer 140 is disposed on a side surface of the substrate 130 and attached to the substrate 130, and is used for dissipating heat generated by the heat generating device 150 on the substrate 130 from the side surface of the substrate 130. Further, the metal layer on the surface of the substrate 130 extends to the side of the substrate 130 and is connected to the metal heat dissipation layer 140, and the heat generated by the heat generating device 150 on the substrate 130 is transferred to the metal heat dissipation layer 140 through the metal layer and then dissipated by the metal heat dissipation layer 140.
Further, the heat dissipation structure further includes a heat conducting medium 120, and the heat conducting medium 120 is filled in a gap between the magnetic core 110 and the substrate 130 and is used for conducting heat generated by the magnetic core 110 to the metal layer on the surface of the substrate 130.
In one embodiment, as shown in fig. 2, the metal heat dissipation layer 140 is disposed on a side of the substrate 130, and the metal heat dissipation layer 140 may be disposed on all four sides of the substrate 130. In order not to increase the volume of the PCB, the metal heat dissipation layer 140 may be shaped to match the edge of the side surface of the substrate 130, and the metal heat dissipation area of the substrate 130 is increased by attaching the metal heat dissipation layer to the side surface of the substrate 130, so that heat generated by the heat generating device 150 and the magnetic core 110 on the substrate 130 can be dissipated more quickly. In other embodiments, the metal heat dissipation layer 140 may also extend on the side of the substrate 130, so as to further enlarge the heat dissipation area without affecting the placement of the PCB. Alternatively, the metal heat dissipation layer 140 may employ an aluminum alloy heat dissipation fin.
In one embodiment, the metal layer 131 covering the surface of the substrate 130 is a copper layer, and the substrate 130 has a multi-layer metal layer structure, but epoxy resin with poor thermal conductivity is sandwiched between the metal layers, so that the substrate 130 has a limited ability to transfer heat downward. Therefore, the metal layer 131 on the surface of the substrate 130 is extended to the side of the substrate 130 to connect with the metal heat dissipation layer 140, so that the heat generated by the heat generating device 150 and the magnetic core 110 mounted on the substrate 130 during operation can be transferred to the metal layer 131 on the surface of the substrate, and the metal layer 131 transfers the heat to the metal heat dissipation layer 140 on the side of the substrate 130, thereby forming an effective heat dissipation path. In other embodiments, depending on the specific design, the remaining copper layers on the substrate 130 except the surface copper layer may also extend to the side of the substrate 130 and be connected to the metal heat dissipation layer 140 to increase the heat dissipation path.
In one embodiment, as shown in fig. 3, the heat conducting medium 120 is filled in the gap between the magnetic core 110 and the substrate 130, so that the heat generated by the magnetic core 110 is conducted to the metal heat dissipation layer 140 through the metal layer 131 on the surface of the substrate 130. The heat conducting medium 120 may be a heat conducting interface material, such as a heat conducting paste, a heat conducting mud, a heat conducting silicone grease, and other insulating materials with good heat conductivity. Because the magnetic core 110 is installed on base plate 130 back, the edge part of magnetic core 110 can have certain space with base plate 130 for magnetic core 110 can not the in close contact with base plate 130, and the air is hot bad conductor, can seriously hinder the transmission of heat between the contact surface, consequently install heat conduction interface material additional between source and the heat dissipation interface and can extrude the contact surface with the air, thereby make and generate heat and can fully contact through heat conduction interface material between source and the heat dissipation interface, the reaction in the temperature can reach the difference in temperature as little as possible. In other embodiments, the heat conducting medium 120 may also be applied in the case where the heat generating device 150 does not directly contact with the heat dissipation interface or the heat conduction is insufficient.
In one embodiment, as shown in fig. 4, the pins 151 of the heat generating device 150 are soldered on the metal layer 131 on the surface of the substrate 130, heat generated by the heat generating device 150 is transferred to the metal layer 131 through the pins 151, and the metal layer 131 diffuses the heat to the metal heat dissipation layer 140. The heating device 150 is mainly a metal-oxide semiconductor field effect transistor (MOSFET) in a Printed Circuit Board (PCB), the MOSFET is distributed on the substrate 130 relatively intensively and generates heat obviously, and the heat accumulated in the MOSFET can be diffused to the metal heat dissipation layer 140 on the side surface through the copper layer by the heat dissipation method, so that the situation of over-high local temperature is avoided.
Based on the same inventive concept, the following provides a heat dissipation method of a PCB, which is used for manufacturing the heat dissipation structure of the PCB in the above embodiments. Referring to fig. 5, a flowchart of a heat dissipation method of a PCB board is shown, the method includes the following steps S110 to S130.
S110: and arranging a metal heat dissipation layer on the side surface of the substrate, and attaching the metal heat dissipation layer to the substrate.
Specifically, the metal heat dissipation layer is provided on the side of the substrate, and the metal heat dissipation layer may be provided on all four sides of the substrate. In order not to increase the volume of the PCB, the shape of the metal heat dissipation layer can be matched with the edge of the side face of the substrate, and the metal heat dissipation area of the substrate is increased by attaching the metal heat dissipation layer to the side face of the substrate, so that heat emitted by the heating device and the magnetic core on the substrate can be dissipated more quickly. In other embodiments, the metal heat dissipation layer may also extend on the side of the substrate, further enlarging the heat dissipation area without affecting the placement of the PCB board. Alternatively, the metal heat dissipation layer may employ an aluminum alloy heat dissipation fin.
S120: and extending the metal layer on the surface of the substrate to the side surface of the substrate to connect the metal layer on the surface of the substrate with the metal heat dissipation layer.
Specifically, the metal layer covered on the surface of the substrate is a copper layer, and the substrate has a multi-layer metal layer structure, but epoxy resin with poor heat conductivity is sandwiched between the metal layers, so that the capability of the substrate for transferring heat downwards is limited. Therefore, the metal layer on the surface of the substrate extends to the side face of the substrate to be connected with the metal heat dissipation layer, so that heat generated by the heating device and the magnetic core arranged on the substrate in the working process can be transferred to the metal layer on the surface of the substrate, and the metal layer transfers the heat to the metal heat dissipation layer on the side face of the substrate, and an effective heat dissipation way is formed. In other embodiments, depending on the specific design, the remaining copper layers on the substrate except the surface copper layer may also extend to the side of the substrate and be connected to the metal heat dissipation layer to increase the heat dissipation path.
S130: and filling a heat-conducting medium into the gap between the magnetic core and the substrate.
Specifically, the heat conducting medium is filled in the gap between the magnetic core and the substrate, so that the heat generated by the magnetic core is conducted to the metal heat dissipation layer through the metal layer on the surface of the substrate. The heat conducting medium can be a heat conducting interface material, such as a heat conducting paste, a heat conducting mud, a heat conducting silicone grease and other insulating materials with good heat conductivity. Because the magnetic core is installed on the base plate after, the edge part of magnetic core can have certain space with the base plate for magnetic core and base plate can not in close contact, and the air is hot bad conductor, can seriously hinder the transmission of heat between the contact surface, consequently install heat conduction interface material additional between source and the heat dissipation interface and can extrude the contact surface with the air, thereby make and generate heat between source and the heat dissipation interface through heat conduction interface material can fully contact, reaction in the temperature can reach the difference in temperature of minimizing. In other embodiments, the heat conducting medium may also be applied in the case that the heat generating device is not in direct contact with the heat dissipation interface or the heat conduction is insufficient.
According to the heat dissipation structure and the method of the PCB, the metal heat dissipation layer attached to the substrate is arranged on the side face of the substrate, the metal layer on the surface of the substrate extends to the side face of the substrate and is connected with the metal heat dissipation layer, heat generated by the heating device on the substrate is transferred to the metal heat dissipation layer through the metal layer, and then the heat is dissipated through the metal heat dissipation layer. The heat dissipation structure and the method can quickly dissipate the heat generated by the heating device and the magnetic core, do not increase the thickness of the module, are convenient and flexible, and reduce the heat dissipation cost.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (8)
1. A heat dissipation structure of a PCB board comprises a heating device and a substrate, wherein the heating device is arranged on the substrate, the heating device can generate heat in the working process, and a metal layer covers the surface of the substrate; it is characterized in that the preparation method is characterized in that,
the heat dissipation structure includes:
the metal heat dissipation layer is arranged on the side face of the substrate, is attached to the substrate and is used for dissipating heat generated by a heating device on the substrate from the side face of the substrate, and the metal heat dissipation layer is made of aluminum alloy heat dissipation fins;
the metal layer on the surface of the substrate extends to the side face of the substrate and is connected with the metal radiating layer, and heat generated by a heating device on the substrate is transferred to the metal radiating layer through the metal layer and then is radiated out through the metal radiating layer;
the metal layer on the surface of the substrate is a copper layer, the substrate is provided with a plurality of metal layers, and each metal layer extends to the side face of the substrate and is connected with the metal heat dissipation layer.
2. The heat dissipating structure of a PCB of claim 1, further comprising a magnetic core mounted on the substrate for providing a magnetic field to the magnetic device on the PCB.
3. The heat dissipation structure of a PCB of claim 2, further comprising a heat conductive medium filled in a gap between the magnetic core and the substrate for conducting heat generated from the magnetic core to the metal layer on the surface of the substrate.
4. The heat dissipation structure of a PCB board according to claim 3, wherein the heat conductive medium is a heat conductive paste.
5. The heat dissipation structure of PCB board as claimed in claim 1, wherein the metal heat dissipation layer is shaped to match the edge of the substrate side.
6. The heat dissipation structure of a PCB as claimed in claim 1, wherein the pins of the heat generating device are soldered to the metal layer on the surface of the substrate, and heat generated from the heat generating device is transferred to the metal layer on the surface of the substrate through the pins.
7. A heat dissipation method of a PCB board comprises a heating device and a substrate, wherein the heating device is arranged on the substrate, the heating device can generate heat in the working process, and a metal layer is covered on the surface of the substrate; the method comprises the following steps:
arranging a metal heat dissipation layer on the side face of the substrate, and attaching the metal heat dissipation layer to the substrate;
and extending the metal layer on the surface of the substrate to the side surface of the substrate to connect the metal layer on the surface of the substrate with the metal heat dissipation layer.
8. The method for dissipating heat of a PCB board according to claim 7, wherein the PCB board further comprises a magnetic core mounted on the substrate, the method further comprising:
and filling a heat-conducting medium into the gap between the magnetic core and the substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710561964.7A CN107333386B (en) | 2017-07-11 | 2017-07-11 | Heat dissipation structure and method of PCB |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710561964.7A CN107333386B (en) | 2017-07-11 | 2017-07-11 | Heat dissipation structure and method of PCB |
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| CN107333386A CN107333386A (en) | 2017-11-07 |
| CN107333386B true CN107333386B (en) | 2020-07-28 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP3982876B2 (en) * | 1997-06-30 | 2007-09-26 | 沖電気工業株式会社 | Surface acoustic wave device |
| CN101290429B (en) * | 2007-04-19 | 2011-12-28 | 奇美电子股份有限公司 | LCD device and its backlight module group |
| CN203812879U (en) * | 2014-01-26 | 2014-09-03 | 北京京东方显示技术有限公司 | Array substrate and display device |
| DE102015223551A1 (en) * | 2015-11-27 | 2017-06-01 | Robert Bosch Gmbh | Circuit carrier for an electrical circuit and associated manufacturing method |
| CN105764244B (en) * | 2016-04-19 | 2019-06-11 | 泰和电路科技（惠州）有限公司 | Wiring board and its manufacturing method |
| CN106449440B (en) * | 2016-10-20 | 2019-02-01 | 江苏长电科技股份有限公司 | A kind of manufacturing method of the encapsulating structure with electro-magnetic screen function |
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Effective date of registration: 20201218 Address after: 510700 Room 101, building 4, No. 10, Nanxiang 2nd Road, Huangpu District, Guangzhou City, Guangdong Province Patentee after: FENGHUA RESEARCH INSTITUTE (GUANGZHOU) Co.,Ltd. Address before: 510663 No. 101, 102, 201, 202, phase II plant, No. 10, Nanxiang 2nd Road, Guangzhou hi tech Industrial Development Zone, Guangdong Province (office use only) Patentee before: FENGHUA RESEARCH INSTITUTE (GUANGZHOU) Co.,Ltd. Patentee before: Guangdong Fenghua Advanced Technology Holding Co.,Ltd. |
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Address after: 510700 Room 101, building 4, No. 10, Nanxiang 2nd Road, Huangpu District, Guangzhou City, Guangdong Province Patentee after: Guangdong Xintao Microelectronics Co.,Ltd. Address before: 510700 Room 101, building 4, No. 10, Nanxiang 2nd Road, Huangpu District, Guangzhou City, Guangdong Province Patentee before: FENGHUA RESEARCH INSTITUTE (GUANGZHOU) Co.,Ltd. |