JPH1168263A - Electronic circuit board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic circuit board, capable of being miniaturized more than before, protecting components from heat stress, prolonging the service life, substantially improving the reliability of an electronic equipment and improving mass productivity. SOLUTION: By working the two or more kinds of the conductor materials 1 and 2 of different thickness corresponding to the current capacity of respective circuits into a circuit pattern by a pressing method or an etching method and then integrating them with an insulation material 3, in the circuit pattern formed by the thick conductor material 1, a large current is coped with, even when the pattern width is narrowed, the heat capacity is enlarged and rapid heat generation from the component by the large current is sufficiently adsorbed.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic circuit board for mounting components constituting a circuit of an electronic device.

[0002]

2. Description of the Related Art Conventionally, an electronic device on which a heat-generating component is mounted is used as an electronic circuit board for mounting the component on an aluminum plate 4 as shown in FIG. 2 in order to improve the thermal conductivity of the substrate. After forming an insulating layer 5 made of an insulating material, a copper foil as a conductor material is attached on the insulating layer 5,
An aluminum substrate having a circuit pattern 6 formed on an insulating layer 5 by etching the copper foil is generally widely used.

[0003]

However, in a conventional electronic circuit board such as the above-mentioned aluminum board, the copper pattern cannot be made thick because the circuit pattern 6 is formed by etching. It needs to be expanded, and there is a limit to reducing the size of electronic devices. Also,
When the thickness of the insulating layer 5 is also increased, the thermal resistance there increases, and the heat conduction characteristics as a substrate deteriorate. In addition, the thickness of the insulating layer 5 is around 100 μm, and the insulating characteristics are poor. Had problems.

[0004] In addition, the above-mentioned aluminum substrate has a problem that the cost is high and even under the current cost competition, no matter how much rationalization is carried out, the problem cannot be solved. Therefore, there is a strong demand for the development of an electronic circuit board with a completely new concept that has a heat conduction characteristic equal to or higher than that of an aluminum substrate, allows a narrower pattern width, allows a large current to flow, has good insulation characteristics, and overcomes cost competition. It is the present situation.

SUMMARY OF THE INVENTION The present invention solves the above-mentioned conventional problems. The present invention can reduce the size, protect components from thermal stress, extend the life of components, and improve the reliability of electronic devices. Provided is an electronic circuit board capable of greatly improving the productivity and improving mass productivity.

[0006]

In order to solve the above-mentioned problems, an electronic circuit board according to the present invention is characterized in that two or more conductive materials having different thicknesses corresponding to the current capacity of each circuit are formed by pressing or etching. After being processed into a pattern pattern, it is integrated with the insulating material, and the insulating material is composed of multiple insulating materials with different thermal conductivity according to the heat generation of the circuit pattern and parts, so that the thickness is Circuit patterns made of thick conductive material can respond to large currents even if the pattern width is reduced, and their heat capacity is increased, so that sudden heat generation from components due to large currents is sufficient. It is characterized by absorption.

[0007] As described above, the size can be reduced as compared with the conventional one, the parts can be protected from thermal stress, the life can be extended, and the reliability of the electronic device can be greatly improved. Performance can be improved.

[0008]

DETAILED DESCRIPTION OF THE INVENTION An electronic circuit board according to claim 1 of the present invention is obtained by processing a conductive material into a pattern of a circuit pattern by a pressing method or an etching method, and then integrating it with an insulating material. An electronic circuit board in which the conductor material is formed to have a plurality of types of thicknesses, for example, a circuit pattern is formed of a thick conductor material for a large current circuit, and a thickness is formed for a small current circuit. The circuit pattern is formed of a thin conductive material.

According to this structure, in a circuit pattern formed of a thick conductor material, it is possible to cope with a large current even if the pattern width is reduced, and the heat capacity thereof is increased, so that a large current is generated. It also absorbs heat from sudden parts sufficiently.

According to a second aspect of the present invention, in the electronic circuit board, the conductor material is processed into a pattern of a circuit pattern by a pressing method or an etching method and then integrated with an insulating material. In an electronic circuit board in which a material is formed into a plurality of regions made of a plurality of materials having different physical properties, for example, a region requiring tracking resistance (hereinafter abbreviated as CTI) has excellent CTI characteristics. An insulating material is used, and a region where arc resistance is required is formed using an insulating material having excellent arc resistance.

According to this structure, the characteristics obtained by the type of the insulating material formed in each region on the substrate provide excellent tracking resistance to the region where the tracking resistance is required, and the arc resistance is required. By providing excellent resistance to arcing to a particular region, an optimum characteristic is given to each region on the substrate.

According to a third aspect of the present invention, in the electronic circuit board according to the third aspect, the conductive material is processed into a pattern of a circuit pattern by a pressing method or an etching method, and then integrated with an insulating material. An electronic circuit board in which a material is formed into a plurality of regions made of a plurality of materials having different thermal conductivities. For example, in a region where a large number of heat-generating components are present, heat conduction is performed to quickly diffuse generated heat. Use an insulating material with a high rate, and conversely, in areas where there are many weak heat-resistant components such as electrolytic capacitors, in order to prevent the heat generated by the heat-generating components from passing through the board and prevent the temperature of the weak heat-resistant components from rising, The structure is formed using an insulating material having low thermal conductivity.

According to this configuration, a region having a high thermal conductivity and a region having a low thermal conductivity are simultaneously formed in the same substrate, so that the temperature distribution and the direction of heat transmission of the substrate can be controlled. An electronic circuit board according to claim 4 of the present invention is an electronic circuit board formed by processing a conductive material into a pattern of a circuit pattern by a pressing method or an etching method, and then integrating the same with an insulating material. An electronic circuit board characterized in that the insulating material in the lower part of the land where the heat-generating component is mounted and its peripheral region is formed of a different material for the other region. The lower part of the land to be mounted and its peripheral region are formed using an insulating material having particularly high heat resistance and excellent long-term thermal stability.

According to this structure, the lower part of the land on which the heat-generating component is mounted and the peripheral area thereof are given higher heat resistance than the other areas, thereby providing high-temperature thermal stability to the entire substrate. .

According to a fifth aspect of the present invention, there is provided an electronic circuit board comprising: a lower portion of a land on which the heat-generating component is mounted; The structure is made of a material.

According to this structure, the heat from the heat-generating component is unilaterally transmitted only to the lower part of the land having a high thermal conductivity, thereby preventing the heat from being generated through the substrate to the adjacent weak heat-resistant component. .

According to a sixth aspect of the present invention, there is provided an electronic circuit board, wherein an insulating material at a lower portion of a land on which the heat-generating component according to the fourth aspect is mounted and a peripheral region thereof are formed of a thermoplastic resin having high thermal conductivity. An electronic circuit board formed of a thermoplastic resin having a lower thermal conductivity than the insulating material in the lower part of the land and the surrounding area, and the insulating material in the other region, for example, the lower part of the land on which the heat generating component is mounted and the lower part thereof. The surrounding area is made of highly thermally conductive thermoplastic resin, which is highly filled with highly thermally conductive fillers such as alumina, aluminum nitride, and magnesia.
The other regions are formed by using a thermoplastic resin having a lower thermal conductivity than the high thermal conductive thermoplastic resin used for the lower part of the land and its peripheral region.

According to this configuration, the area formed by using the thermoplastic resin having a lower thermal conductivity than the lower part of the land formed by the high thermal conductive thermoplastic resin and the peripheral area thereof,
It functions as a heat insulating area that prevents the heat of the heat generating component from diffusing to other areas.

According to a seventh aspect of the present invention, there is provided an electronic circuit board, wherein an insulating material at a lower portion of a land on which the heat-generating component according to the fourth aspect is mounted and a peripheral region thereof are formed of a thermosetting resin having high thermal conductivity. An electronic circuit board in which the insulating material in the other region is formed of a thermoplastic resin having a lower thermal conductivity than the insulating material in the lower part of the land and the peripheral region, and particularly, the heat-generating component generates a large amount of heat and becomes high in temperature. In this case, the lower part of the land on which the heat-generating component is mounted and its peripheral area are formed of a highly heat-conductive thermosetting resin.

According to this configuration, the area formed of the thermoplastic resin having a lower thermal conductivity than the lower part of the land formed of the high heat conductive thermosetting resin and the peripheral area thereof is formed by the heat generated by the heat generating component. It functions as a heat-insulating area that prevents diffusion to the surface.

According to an eighth aspect of the present invention, there is provided an electronic circuit board, wherein an insulating material at a lower portion of a land on which the heat-generating component according to the fourth aspect is mounted and a peripheral region thereof are formed of a thermoplastic resin having high thermal conductivity. An electronic circuit board formed of an insulating material in a region other than the thermosetting resin having a lower thermal conductivity than the insulating material in the lower part of the land and the peripheral region, and in particular, has a lower heat generation compared to other components. When a precision component such as a bare IC is mounted in an area other than the lower part of the land where the heat generation component is mounted and a peripheral area thereof, the area is configured as a heat generation part having a relatively large amount of heat generation. The structure is made of a thermosetting resin having a lower thermal conductivity than the high thermal conductive thermoplastic resin used for the lower part of the land and its peripheral region.

According to this structure, the area formed of the thermosetting resin having a lower thermal conductivity than the lower part of the land formed of the high thermal conductive thermoplastic resin and the surrounding area is formed by the heat generated by the heat generating component. It functions as a heat-insulating area that prevents diffusion to the surface.

According to a ninth aspect of the present invention, there is provided an electronic circuit board, wherein an insulating material at a lower portion of a land on which the heat-generating component according to the fourth aspect is mounted and a peripheral region thereof are formed of a thermosetting resin having high thermal conductivity. An electronic circuit board in which the insulating material in the other area is formed of a thermosetting resin having a lower thermal conductivity than the insulating material in the lower part of the land and the surrounding area, and in particular, the heat generating component generates a large amount of heat and has a high temperature. In addition to the above, when a bare IC is mounted, the lower part of the land where the heat-generating component is mounted and the surrounding area are molded at a relatively low temperature and have high thermal conductivity with excellent thermal stability in a high temperature atmosphere. A resin is used, and the other area is formed using a thermosetting resin having a lower thermal conductivity than the high thermoconductive thermosetting resin used for the lower part of the land and its peripheral area.

According to this structure, the area formed of the thermosetting resin having a lower thermal conductivity than the lower part of the land formed of the high heat conductive thermosetting resin and the peripheral area thereof is formed by the heat of the heat generating component. It functions as a heat insulating region that prevents diffusion to the region.

An electronic circuit board according to claim 10 of the present invention, wherein the conductor material is processed into a pattern of a circuit pattern by a pressing method or an etching method, and then integrated with an insulating material. A heat-insulating layer is formed around the lower part of the land where the heat-generating component is mounted, which is a part of the pattern, and the surrounding area.

According to this configuration, the heat insulating layer prevents the heat from the heat-generating component from diffusing to the lower part of the land where the heat-generating component is mounted and the surrounding area. An electronic circuit board according to claim 11 of the present invention is an electronic circuit board formed by processing a conductive material into a pattern of a circuit pattern by a pressing method or an etching method and then integrating the same with an insulating material. An electronic circuit board in which a heat insulating layer is formed between lands on which parts are mounted, for example, the heat insulating layer is used as an anisotropic heat conductive substrate, and heat of all parts is transferred to other parts. Configure to have no effect.

According to this configuration, the heat insulating layer suppresses heat conduction through the substrate between the lands on which the components are mounted, and the heat generated from the components mounted on each land is applied to the mounted components on the adjacent lands. Prevent impact.

According to a twelfth aspect of the present invention, in the electronic circuit board according to the first aspect, the conductor material is processed into a pattern of a circuit pattern by a press method or an etching method, and then integrated with an insulating material. The insulating material in the lower part of the land and the peripheral area where the heat-generating component is mounted as a part of the pattern is formed of a high thermal conductive insulating material, A heat sink is provided so as to be in contact with the heat sink, and the heat sink is configured to transmit heat generated from the heat generating component in a certain direction.

According to this configuration, after the heat generated from the heat-generating component is transmitted in a certain direction through the high heat conductive insulating material,
The heat is released to the atmosphere via a heat sink such as a radiation fin.

An electronic circuit board according to a thirteenth aspect of the present invention, wherein the conductor material is processed into a pattern of a circuit pattern by a press method or an etching method, and then integrated with an insulating material. The insulating material in the lower part of the land where the heat-generating component is mounted and the peripheral area thereof is formed of a high heat conductive insulating material, and the insulating material area is formed on the back side of the insulating material in the lower part of the land and the peripheral area. A heat sink is provided so as to be in contact with only the heat sink, and the heat sink is configured to transmit heat generated from the heat generating component in a certain direction.

According to this configuration, it is possible to set a large radiating fin below a component that generates a large amount of heat, and to set a small radiating fin below a component that generates a small amount of heat.
Hereinafter, an electronic circuit board according to an embodiment of the present invention will be specifically described with reference to the drawings.

FIG. 1 is a sectional view showing the structure of the electronic circuit board according to the first embodiment. This electronic circuit board comprises a thick conductive material 1 and a thin conductive material 2
It is the one integrated.

As the material of the thick conductive material 1 and the thin conductive material 2, a copper plate, a rinsed copper plate, an iron plate can be used, and nickel plating, tin plating, silver plating, gold plating, etc. are performed for the surface protection. . In order to improve the adhesion between the conductor materials 1 and 2 and the insulating material 3, it is also effective to roughen the surfaces of the conductor materials 1 and 2 by sandblasting or etching. Further, a silane treatment or the like can be performed.

As the insulating material 3, a thermoplastic resin or a thermosetting resin can be used. PPS or a liquid crystal polymer is preferable for the thermoplastic resin in view of heat resistance, and an unsaturated polyester is used for the thermosetting resin. Resins, phenolic resins, diallyl phthalate resins, epoxy resins and the like can be used.

According to the structure of the electronic circuit board of the first embodiment, the circuit pattern formed of the thick conductive material 1 can cope with a large current even if the pattern width is reduced. By increasing the heat capacity, it is possible to sufficiently absorb sudden heat generation from a component due to a large current.

As a result, it is possible to protect components from thermal stress in each circuit on the board and extend the life of the components, thereby improving the reliability of the electronic device. FIG. 3 is a cross-sectional view illustrating the configuration of the electronic circuit board according to the second embodiment. The electronic circuit board includes an insulating material 10 between the conductor materials 7 and 8.
Is made of an insulating material having particularly good CTI characteristics, and the insulating material 11 between the conductor materials 8 and 9 is made of an insulating material having particularly good arc resistance characteristics. There are unsaturated polyester resin, diallyl phthalate resin, and the like. Examples of the insulating material 11 having good arc resistance include PPS, liquid crystal polymer, diallyl phthalate resin, and epoxy resin.

Further, an insulating material 12 can be provided to integrate the insulating material 10 and the insulating material 11. With the configuration of the electronic circuit board according to the second embodiment, an excellent tracking resistance is given to a region where the tracking resistance is required by the characteristics obtained by the type of the insulating material formed in each region on the substrate, By giving excellent arc resistance to a region where arc resistance is required, it is possible to provide an optimum characteristic for each region on the substrate. As a result, the reliability of the electronic device can be improved.

FIG. 4 is a sectional view showing the structure of an electronic circuit board according to the third embodiment. In this electronic circuit board, heat generated from the heat generating component 13 mounted on the conductive material 16 is transmitted through the high thermal conductive insulating material 20 to the weak heat resistant component 14 mounted on the conductive materials 15 and 17. In order to prevent the occurrence of the
Insulating material 1 having lower thermal conductivity than high thermal conductive insulating material 20
8, 19 are installed.

Examples of the high thermal conductive insulating material 20 include PPS filled with alumina, aluminum nitride, and magnesia, liquid crystal polymer, unsaturated polyester resin, phenol resin, and the like.
Diallyl phthalate resin, epoxy resin and the like can be used. As the insulating materials 18 and 19 having low thermal conductivity, thermoplastic materials such as PPS and liquid crystal polymer, and thermosetting resins such as epoxy resin, unsaturated polyester resin and diallyl phthalate resin can be used.

With the structure of the electronic circuit board according to the third embodiment, a region having a high thermal conductivity and a region having a low thermal conductivity are simultaneously formed in the same substrate, so that the temperature distribution of the substrate and the direction of heat transmission can be controlled. be able to.

As a result, sufficient heat radiation design can be easily performed for heat generated from the heat-generating components, and the size of the electronic device can be further reduced, and the reliability of the electronic device can be improved.

FIG. 5 is a sectional view showing the structure of an electronic circuit board according to the fourth embodiment. In this electronic circuit board, the heat-generating component 21 is mounted on a conductor material 25, and the conductor material 25 is integrated with a high heat-resistant insulating material 27 that sufficiently withstands the heat generated from the heat-generating component 21. It has higher heat resistance than the material 28.

As the high heat resistant insulating material 27, a thermoplastic resin such as PPS or liquid crystal polymer, diallyl phthalate resin or epoxy resin can be used, and as the insulating material 28, syndiotactic polystyrene resin or polybutylene terephthalate can be used. Thermoplastic resins, unsaturated polyester resins, phenol resins and the like can be used.

With the structure of the electronic circuit board according to the fourth embodiment, the lower part of the land made of the conductive material 25 on which the heat-generating component 21 is mounted and the peripheral area thereof are given higher heat resistance than the other areas. In addition, thermal stability at a high temperature can be given to the entire substrate.

As a result, the thermal stability of the substrate can be obtained for a long time, and the reliability of the electronic device can be improved. FIG. 6 is a sectional view showing a configuration of an electronic circuit board according to the fifth embodiment. The electronic circuit board includes a heating component 30.
Is mounted on the conductor material 33, and the insulating material 3 having high thermal conductivity
5 and has higher thermal conductivity than other insulating materials 36.

Examples of the high thermal conductive insulating material 35 include PPS filled with a high thermal conductive material such as alumina, aluminum nitride, silicon nitride, and magnesia; thermoplastic materials such as liquid crystal polymer; epoxy resin; diallyl phthalate resin; A thermosetting resin such as a resin or an unsaturated polyester resin is suitable, and other insulating materials 36 include thermoplastic materials such as PPS and liquid crystal polymer, diallyl phthalate resin, and the like.
Epoxy resin, phenol resin, unsaturated polyester resin, etc. can be used.

According to the structure of the electronic circuit board of the fifth embodiment, the heat generated from the heat-generating component 30 is unidirectionally transmitted only below the land made of the conductive material 33 having a high thermal conductivity, and is generated through the board. It is possible to prevent heat transfer to the low heat-resistant components that are the mounting components 29 and 31 arranged adjacent to each other.

As a result, even when the heat-generating component and the weak heat-resistant component are mixedly mounted on the substrate, the heat-resistant component can be prevented from being thermally degraded by the heat from the heat-generating component, and the component can be protected and the service life can be extended. The reliability of the electronic device can be improved.

FIG. 7 is a sectional view showing the structure of an electronic circuit board according to the sixth to ninth embodiments. In this electronic circuit board, a conductor material 40 on which a heat-generating component (not shown) is mounted and an insulating material 37 having high thermal conductivity, and a conductor material 39 on which other components are mounted and an insulating material 38 are respectively integrated. And
As the high thermal conductive insulating material 37, a thermoplastic resin or a thermosetting resin highly filled with a high thermal conductive material such as alumina, aluminum nitride, silicon nitride, and magnesia can be used. Further, as the thermoplastic resin, PPS or liquid crystal polymer can be used. And thermosetting resins such as epoxy resin, diallyl phthalate resin, phenol resin, and unsaturated polyester. Further, in the embodiment of the electronic circuit board as described above, the respective conductor materials 40, 39
Combinations of the insulating materials 37 and 38 are shown in the following table.

[0050]

[Table 1]

According to the structure of the electronic circuit board of the sixth embodiment, as the high thermal conductive insulating material 37, a thermoplastic resin having a lower thermal conductivity than the lower part of the land and its peripheral region formed of a thermoplastic resin having a high thermal conductivity is used. The region of the insulating material 38 formed by using can function as a heat insulating region that prevents heat generated from the heat-generating component from diffusing to another region.

As a result, even when a heat-generating component and a weak heat-resistant component are mixedly mounted on a substrate, the heat-resistant component prevents the heat-resistant component from being thermally degraded, thereby protecting the component and extending the life of the electronic device. The reliability can be improved, and injection molding can be performed with a thermoplastic resin, the molding tact can be shortened, the productivity can be improved, and the cost can be reduced.

Further, according to the structure of the electronic circuit board of the seventh embodiment, the heat conductivity is lower than that of the lower part of the land and its peripheral region formed of the high heat conductive thermosetting resin as the high heat conductive insulating material 37. The region of the insulating material 38 formed of the plastic resin can function as a heat insulating region that prevents the heat generated from the heat-generating component from diffusing to other regions.

As a result, even when a heat-generating component and a weak heat-resistant component are mixedly mounted on a substrate, the heat-resistant component prevents the heat-resistant component from being thermally degraded, thereby protecting the component and extending the life of the electronic device. It is possible to improve the reliability and to reduce the influence of impurity ions in the lower part of the land made of high heat conductive thermosetting resin and its surrounding area when converting the heat-generating component into a bare IC, and Reliability can be further improved. In addition, injection molding can be performed using a thermoplastic resin, the molding tact can be shortened, the productivity can be improved, and the cost can be reduced.

Further, according to the structure of the electronic circuit board of the eighth embodiment, the thermosetting material having a lower thermal conductivity than the lower portion of the land and its peripheral region formed of the high thermal conductive thermoplastic resin as the high thermal conductive insulating material 37. The region of the insulating material 38 formed of the conductive resin can function as a heat-insulating region that prevents heat generated from the heat-generating component from diffusing into other regions.

As a result, even if a heat-generating component and a weak heat-resistant component are mixedly mounted on a substrate, the heat-generating component prevents the heat-resistant component from deteriorating due to heat, thereby protecting the component and extending the life of the electronic device. The reliability can be improved, and injection molding can be performed with a thermoplastic resin, the molding tact can be shortened, the productivity can be improved, and the cost can be reduced.

Further, according to the structure of the electronic circuit board of the ninth embodiment, the heat conductivity is lower than that of the lower part of the land and its peripheral region formed of the high heat conductive thermosetting resin as the high heat conductive insulating material 37. The region of the insulating material 38 formed of the curable resin can function as a heat insulating region that prevents the heat generated from the heat-generating component from diffusing to other regions.

As a result, even if a heat-generating component and a weak heat-resistant component are mixedly mounted on a substrate, the heat-resistant component prevents the heat-resistant component from being thermally degraded, thereby protecting the component and extending its life.
A device such as a bear IC, which particularly dislikes impurities, can be mounted with confidence, and the electronic device can be reduced in size and its reliability can be improved.

FIG. 8 is a sectional view showing the structure of an electronic circuit board according to the tenth embodiment. In this electronic circuit board, a conductive material 43 on which a heat-generating component 41 is mounted and an insulating material 44 having a high thermal conductivity formed under the conductive material 43 are integrated, and a heat insulating layer 45 is formed around the insulating material 44. The heat insulating layer 45 prevents heat generated from the heat-generating component 41 from being transmitted to the weak heat-resistant component 42 mounted on the conductor material 43 through the insulating material 46. The heat insulating layer 45 is made of a bakelite plate, a thermoplastic resin having a low thermal conductivity, or a thermosetting resin.

According to the structure of the electronic circuit board of the tenth embodiment, the heat generated from the heat-generating component 41 is distributed by the heat-insulating layer 45 to the periphery of the lower part of the land made of the conductive material 43 on which the heat-generating component 41 is mounted and the peripheral area thereof. Can be suppressed.

As a result, even if the heat-generating component and the weak heat-resistant component are mixedly mounted on the board, the heat conduction from the heat-generating component through the board prevents the adjacent weak heat-resistant component from increasing in temperature and transmits heat. The direction can be controlled, the design of the radiator fins can be simplified, and the thermal deterioration of the components can be significantly reduced to protect the components and extend the service life, thereby improving the reliability of the electronic device. .

FIG. 9 is a sectional view showing the structure of an electronic circuit board according to the eleventh embodiment. In this electronic circuit board, a heat-generating component 47 is mounted on a conductor material 48 and is integrated with a high heat conductive insulating material 50.
A heat insulating layer 49 is provided between the heat generating parts 47 so that the heat generated from each heat generating component 47 is transmitted only in a certain direction.

According to the structure of the electronic circuit board of the eleventh embodiment, the heat insulating layer 49 suppresses heat conduction through the board between the lands made of the conductive material 48 on which the heat-generating component 47 is mounted, and mounts on each land. It is possible to prevent the heat generated from the generated heat-generating components from affecting the mounted components on adjacent lands.

As a result, even if the heat-generating component and the weak heat-resistant component are mixedly mounted on the board, the heat conduction from the heat-generating component through the board prevents the adjacent weak heat-resistant component from increasing in temperature and transmits heat. The direction can be controlled, and the thermal deterioration of the component can be significantly reduced, the component can be protected and the life can be extended, and the reliability of the electronic device can be improved.

FIG. 10 is a sectional view showing the structure of an electronic circuit board according to the twelfth embodiment. This electronic circuit board is configured such that the heat of the heat-generating component 51 mounted on the conductor material 53 is transmitted through the highly heat-conductive insulating material 54 and transmitted to the radiation fins 56 to radiate heat into the air. This prevents the heat generated from the heat-generating component 51 from being transmitted to the adjacent weak heat-resistant component 52 mounted on the conductor material 53 through the insulating material 55.

According to the structure of the electronic circuit board of the twelfth embodiment, after the heat generated from the heat-generating component 51 is transmitted in a certain direction through the highly heat-conductive insulating material 54, the heat is transmitted via the heat sink such as the radiation fin 56. Can be released to the atmosphere.

As a result, by suppressing the rise in temperature of the entire substrate due to the heat generated from the heat-generating components, the rise in the resistance value due to the rise in the temperature of the conductive material is greatly reduced, thereby improving the operation efficiency of the circuit and improving its operation characteristics. Can be stabilized, the thermal deterioration of the components can be significantly reduced, the components can be protected and the service life can be extended, and the reliability of the electronic device can be improved.

FIG. 11 is a sectional view showing the structure of an electronic circuit board according to the thirteenth embodiment. In this electronic circuit board, a heat-generating component 58 having a large heat value, a heat-generating component 60 having a small heat value, and a weak heat-resistant component 59 mounted on a conductive material 57 are mounted on the same substrate. 60
The heat generated from the heat generating component 58 is transmitted to the radiating fins 63 through the high heat conductive insulating material 61 so that the heat generated from the heat generating component 60 is not transmitted to the weak heat resistant component 59 through the insulating material 62. The heat is transmitted to the radiating fins 64 through the high thermal conductive insulating material 61 and is radiated to the atmosphere. The weak heat-resistant component 59 is protected by an insulating material 62 having a low thermal conductivity so that heat generated from the heat-generating component 58 and the heat-generating component 60 is not transmitted.

Examples of the high thermal conductive insulating material 61 include alumina, aluminum nitride, silicon nitride, and the like, which are high thermal conductive fillers.
Thermoplastic resins such as PPS and liquid crystal polymers which are highly filled with magnesia and the like, and thermosetting resins such as epoxy resins, diallyl phthalate resins, phenol resins, and unsaturated polyester resins can be used.

According to the structure of the electronic circuit board of the thirteenth embodiment, it is possible to set a large radiating fin under a component having a large amount of heat generation and a small radiating fin under a component having a small amount of heat generation. It can be.

As a result, the size of the radiating fins can be set according to the amount of heat generated by each component, and the increase in the temperature of the entire substrate due to the heat generated from the heat-generating components can be suppressed. Significantly improve the operating efficiency of the circuit and stabilize its operating characteristics.Dramatically reduce thermal degradation of components, protect components and extend their life, and reduce the size of electronic devices. And its reliability can be improved.

[0072]

As described above, according to the first aspect of the present invention,
A circuit pattern made of thick conductor material enables it to cope with large currents even if the pattern width is narrowed, and also has a large heat capacity so that rapid heat generation from components due to the large current is sufficient. Can be absorbed.

As a result, the components can be protected from the thermal stress in each circuit on the substrate, the life can be extended, and the reliability of the electronic device can be improved. According to the second aspect of the present invention, an excellent tracking resistance is provided in a region where the tracking resistance is required by the characteristics obtained depending on the type of the insulating material formed in each region on the substrate. By giving an excellent arc resistance to a region where characteristics are required, an optimum characteristic can be given to each region on the substrate.

Therefore, the reliability of the electronic device can be improved. According to the invention of claim 3, a region having a high thermal conductivity and a region having a low thermal conductivity are simultaneously formed in the same substrate,
It is possible to control the temperature distribution of the substrate and the direction of heat transmission.

Therefore, it is possible to easily design a heat radiation sufficient for the heat generated from the heat-generating components, to further reduce the size of the electronic device, and to improve the reliability of the electronic device.

According to the fourth aspect of the present invention, the lower portion of the land on which the heat-generating component is mounted and the peripheral region thereof are given higher heat resistance than the other regions, so that the entire substrate can be heated at a high temperature. Thermal stability.

Therefore, the thermal stability of the substrate can be obtained for a long time, and the reliability of the electronic device can be improved. According to the fifth aspect of the present invention, heat from the heat-generating component is unilaterally transmitted only below the land having a high thermal conductivity, and is transmitted through the substrate to the adjacent weak heat-resistant component. Can be prevented.

Therefore, even when the heat-generating component and the weak heat-resistant component are mixedly mounted on the substrate, the heat-resistant component can be prevented from being thermally degraded due to the heat from the heat-generating component, thereby protecting the component and extending the service life. The reliability of the device can be improved.

According to the sixth aspect of the present invention, the lower portion of the land made of the thermoplastic resin having a high thermal conductivity and the region formed by using the thermoplastic resin having a lower thermal conductivity than the peripheral region are formed by the heat generation. It can function as a heat insulating area that prevents the heat of the component from diffusing to other areas.

Therefore, even if a heat-generating component and a weak heat-resistant component are mixedly mounted on a substrate, the heat-generating component prevents the heat-resistant component from deteriorating due to heat, thereby protecting the component and prolonging the life of the component. In addition to being able to improve the productivity, it is possible to perform injection molding with a thermoplastic resin, shortening the molding tact time, improving productivity and reducing costs.

According to the seventh aspect of the present invention, the lower part of the land formed of the high heat conductive thermosetting resin and the area formed of the thermoplastic resin having a lower thermal conductivity than the surrounding area are formed by the heat generating component. Can function as a heat-insulating region that prevents heat from diffusing to other regions.

Therefore, even if a heat-generating component and a weak heat-resistant component are mixedly mounted on a substrate, the deterioration of the weak heat-resistant component due to the heat from the heat-generating component is prevented, thereby protecting the component and extending the service life of the component. In addition to improving the heat resistance, the effect of impurity ions in the lower part of the land made of thermosetting resin with high thermal conductivity and its surrounding area can be reduced when the heat-generating component is made into a bare IC, and the Reliability can be further improved. In addition, injection molding can be performed using a thermoplastic resin, the molding tact can be shortened, the productivity can be improved, and the cost can be reduced.

Further, according to the invention of claim 8, the lower part of the land formed of the thermoplastic resin having high thermal conductivity and the area formed of the thermosetting resin having a lower thermal conductivity than the peripheral area thereof are formed by the heat generating component. Can function as a heat-insulating region that prevents heat from diffusing to other regions.

Therefore, even if a heat-generating component and a weak heat-resistant component are mixedly mounted on a substrate, the heat-generating component prevents the heat-resistant component from being thermally degraded, thereby protecting the component and extending the life of the component. In addition to being able to improve the productivity, it is possible to perform injection molding with a thermoplastic resin, shortening the molding tact time, improving productivity and reducing costs.

According to the ninth aspect of the present invention, the area formed of the thermosetting resin having a lower thermal conductivity than the lower part of the land formed of the high heat conductive thermosetting resin and the peripheral area thereof is heated. It can function as a heat insulating area that prevents the heat of the component from diffusing to other areas.

Therefore, even if the heat-generating component and the weak heat-resistant component are mixedly mounted on the substrate, the heat-generating component is prevented from being thermally degraded by the heat from the heat-generating component, thereby protecting the component and extending the service life.
A device such as a bear IC, which particularly dislikes impurities, can be mounted with confidence, and the electronic device can be reduced in size and its reliability can be improved.

Further, according to the tenth aspect of the present invention, the heat insulating layer can prevent the heat from the heat-generating component from diffusing to the lower part of the land where the heat-generating component is mounted and the surrounding area.

Therefore, even when the heat-generating component and the weak heat-resistant component are mixedly mounted on the substrate, the heat from the heat-generating component prevents the temperature of the adjacent weak heat-resistant component from rising due to the heat conduction through the substrate, and the heat transfer direction. This facilitates the design of the radiating fins, significantly reduces the thermal degradation of the components, protects the components, extends the life of the components, and improves the reliability of the electronic device.

According to the eleventh aspect of the present invention, the heat conduction through the board between the lands on which the components are mounted is suppressed by the heat insulating layer, and the adjacent lands are generated by the heat generated from the components mounted on each land. It is possible to prevent the influence on the above mounted components.

Therefore, even if the heat-generating component and the weak heat-resistant component are mixedly mounted on the substrate, the heat from the heat-generating component prevents the temperature of the adjacent weak heat-resistant component from rising due to the heat conduction through the substrate, and the heat transfer direction. Can be controlled, the thermal deterioration of the components can be significantly reduced, the components can be protected and the service life can be extended, and the reliability of the electronic device can be improved.

According to the twelfth aspect of the present invention, after the heat generated from the heat-generating component is transmitted in a certain direction through the high heat conductive insulating material, the heat is released to the atmosphere via a heat sink such as a radiation fin. be able to.

Therefore, by suppressing the rise in the temperature of the entire substrate due to the heat generated from the heat-generating components, the rise in the resistance value due to the rise in the temperature of the conductive material is greatly reduced, and the operating efficiency of the circuit is improved and the operating characteristics are improved. It is possible to stabilize, significantly reduce thermal degradation of components, protect components and extend their life, and improve the reliability of electronic devices.

According to the thirteenth aspect of the present invention, it is possible to set a large radiating fin under a component that generates a large amount of heat and a small radiating fin under a component that generates a small amount of heat. be able to.

Therefore, the size of the radiating fins can be set according to the heat value of each component, and the rise in the temperature of the entire board due to the heat generated from the heat-generating components is suppressed. This greatly reduces the circuit's operating efficiency and stabilizes its operating characteristics.It also significantly reduces thermal degradation of parts, protects parts and extends their life, and reduces the size of electronic devices. And its reliability can be improved. As described above, it is possible to reduce the size, to protect components from thermal stress and to extend the life of the components, to significantly improve the reliability of electronic devices, and to improve mass productivity as compared with the past. can do.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view illustrating a configuration of an electronic circuit board according to Embodiment 1 of the present invention.

FIG. 2 is a sectional view showing a configuration of a conventional electronic circuit board.

FIG. 3 is a cross-sectional view illustrating a configuration of an electronic circuit board according to Embodiment 2 of the present invention.

FIG. 4 is a cross-sectional view illustrating a configuration of an electronic circuit board according to Embodiment 3 of the present invention.

FIG. 5 is a sectional view showing a configuration of an electronic circuit board according to a fourth embodiment of the present invention.

FIG. 6 is a sectional view showing a configuration of an electronic circuit board according to a fifth embodiment of the present invention.

FIG. 7 is a sectional view showing a configuration of an electronic circuit board according to Embodiments 6 to 9 of the present invention.

FIG. 8 is a sectional view showing a configuration of an electronic circuit board according to a tenth embodiment of the present invention.

FIG. 9 is a sectional view showing a configuration of an electronic circuit board according to Embodiment 11 of the present invention.

FIG. 10 is a sectional view showing a configuration of an electronic circuit board according to a twelfth embodiment of the present invention.

FIG. 11 is a sectional view showing a configuration of an electronic circuit board according to Embodiment 13 of the present invention.

[Explanation of symbols]

1, 2, 7, 8, 9, 15, 16, 17, 24, 25,
26 Conductor material 32, 33, 34, 39, 40, 43, 48, 53, 5
7 Conductive material 3, 10, 11, 12, 18, 19 Insulating material 28, 36, 38, 46, 55, 62 Insulating material 13, 21, 30, 41, 47, 51, 58, 60
Heat generating parts 14, 42, 52, 59 Low heat resistant parts 20, 35, 37, 44, 50, 54, 61 High heat conductive insulating materials 22, 23, 29, 31 Mounting parts 27 High heat resistant insulating materials 45, 49 Heat insulating layer 56, 63, 64 Heat radiation fins

Claims (13)

[Claims] 1. An electronic circuit board formed by processing a conductor material into a circuit pattern pattern by a pressing method or an etching method, and then integrating the conductor material with a plurality of kinds of thicknesses. The formed electronic circuit board. 2. An electronic circuit board formed by integrating a conductor material into a circuit pattern pattern by a pressing method or an etching method and then integrating the insulating material from a plurality of materials having different physical properties. An electronic circuit board formed to have a plurality of regions. 3. An electronic circuit board formed by processing a conductor material into a circuit pattern pattern by a pressing method or an etching method and then integrating the insulating material with a plurality of materials having different thermal conductivities. An electronic circuit board formed to have a plurality of regions. 4. An electronic circuit board formed by integrating a conductor material into a pattern of a circuit pattern by a pressing method or an etching method and then integrating it with an insulating material, wherein a heat-generating component which is a part of the circuit pattern is mounted. An electronic circuit board, wherein the insulating material in the lower part of the land and its peripheral area is formed of a different material for the other area. 5. The electronic circuit board according to claim 4, wherein the insulating material in the lower part of the land on which the heat-generating component is mounted and the peripheral area thereof are formed of a material having a higher thermal conductivity than the other area. . 6. An insulating material in a lower part of a land on which a heat-generating component is mounted and a peripheral area thereof is formed of a thermoplastic resin having high thermal conductivity, and an insulating material in the other area is insulated in the lower part of the land and a peripheral area thereof. The electronic circuit board according to claim 4, wherein the electronic circuit board is formed of a thermoplastic resin having a lower thermal conductivity than the material. 7. An insulating material in a lower portion of a land on which a heat-generating component is mounted and a peripheral region thereof is formed of a thermosetting resin having high thermal conductivity, and an insulating material in the other region is formed of a lower portion of the land and a peripheral region thereof. The electronic circuit board according to claim 4, wherein the electronic circuit board is formed of a thermoplastic resin having a lower thermal conductivity than the insulating material. 8. An insulating material in a lower part of a land on which a heat-generating component is mounted and a peripheral area thereof are formed of a thermoplastic resin having high thermal conductivity, and an insulating material in other areas is insulated in the lower part of the land and a peripheral area thereof. The electronic circuit board according to claim 4, wherein the electronic circuit board is formed of a thermosetting resin having a lower thermal conductivity than the material. 9. An insulating material in a lower portion of a land on which a heat-generating component is mounted and a peripheral region thereof is formed of a thermosetting resin having high thermal conductivity, and an insulating material in other regions is formed of a lower portion of the land and a peripheral region thereof. The electronic circuit board according to claim 4, wherein the electronic circuit board is formed of a thermosetting resin having a lower thermal conductivity than the insulating material. 10. An electronic circuit board integrated with an insulating material after processing a conductive material into a pattern of a circuit pattern by a press method or an etching method, and a heat-generating component which is a part of the circuit pattern is mounted. An electronic circuit board having a heat insulating layer formed around a lower part of a land and a peripheral area thereof. 11. An electronic circuit board formed by processing a conductor material into a pattern of a circuit pattern by a press method or an etching method, and then integrating the same with an insulating material. An electronic circuit board with a heat insulating layer between them. 12. An electronic circuit board integrated with an insulating material after processing a conductive material into a pattern of a circuit pattern by a press method or an etching method, on which a heat-generating component is mounted as a part of the circuit pattern. The insulating material in the lower part of the land and its peripheral area is formed of a high thermal conductive insulating material, and a heat sink is provided on the back side of the insulating material in the lower part of the land and its peripheral area so as to be in contact with the insulating material. An electronic circuit board configured to transfer heat generated from a heat generating component in a certain direction. 13. An electronic circuit board formed by integrating a conductor material into a pattern of a circuit pattern by a pressing method or an etching method and then integrating it with an insulating material, wherein a heat-generating component which is a part of the circuit pattern is mounted. The insulating material in the lower part of the land and its peripheral region is formed of a high thermal conductive insulating material, and a heat sink is provided on the back side of the insulating material in the lower part of the land and its peripheral region so as to contact only the insulating material region. An electronic circuit board configured to transmit heat generated from the heat-generating component in a certain direction.