CN203967508U - A kind of liquid refrigerating type semiconductor laser side pump module - Google Patents
A kind of liquid refrigerating type semiconductor laser side pump module Download PDFInfo
- Publication number
- CN203967508U CN203967508U CN201420342155.9U CN201420342155U CN203967508U CN 203967508 U CN203967508 U CN 203967508U CN 201420342155 U CN201420342155 U CN 201420342155U CN 203967508 U CN203967508 U CN 203967508U
- Authority
- CN
- China
- Prior art keywords
- liquid
- semiconductor laser
- hole
- quartz tube
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000007788 liquid Substances 0.000 title claims abstract description 185
- 239000004065 semiconductor Substances 0.000 title claims abstract description 63
- 239000010453 quartz Substances 0.000 claims abstract description 43
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 43
- 239000013078 crystal Substances 0.000 claims abstract description 35
- 238000005057 refrigeration Methods 0.000 claims description 31
- 238000001816 cooling Methods 0.000 claims description 16
- 238000007789 sealing Methods 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 2
- 239000012530 fluid Substances 0.000 abstract description 5
- 239000003708 ampul Substances 0.000 abstract 2
- 239000013049 sediment Substances 0.000 abstract 2
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 abstract 1
- 230000017525 heat dissipation Effects 0.000 description 7
- 239000000463 material Substances 0.000 description 6
- 239000000110 cooling liquid Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 3
- 239000002775 capsule Substances 0.000 description 3
- 239000003507 refrigerant Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000000498 cooling water Substances 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 238000012937 correction Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 229910052743 krypton Inorganic materials 0.000 description 1
- DNNSSWSSYDEUBZ-UHFFFAOYSA-N krypton atom Chemical compound [Kr] DNNSSWSSYDEUBZ-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Lasers (AREA)
Abstract
The utility model has designed a kind of liquid refrigerating type semiconductor laser side pump module, comprises semiconductor laser element, pedestal, reflection cavity and logical liquid plate.Described logical liquid plate comprises into/fluid hole, at least two liquid-through holes and a light hole, liquid-through hole is communicated with the liquid refrigerating passage of semiconductor laser thermal sediment and the fluid passage of quartz ampoule respectively, form liquid refrigerating access structure in parallel, by adjusting the internal diameter of quartz ampoule, adjust the refrigerating fluid flow on the each road of liquid refrigerating path in parallel, not only effectively ensure the heat-sinking capability of semiconductor laser thermal sediment, and improve the radiating efficiency of crystal bar, thereby improved the efficiency of laser.
Description
Technical Field
The utility model relates to a semiconductor laser technical field, concretely relates to liquid refrigeration type semiconductor laser side pump module.
Background
With the continuous development of semiconductor lasers in recent years, lasers using semiconductor lasers as side pump modules instead of traditional krypton lamps or xenon lamps have the advantages of high efficiency, long service life, high beam quality, good stability, compact structure and miniaturization.
One of the important technical problems of the semiconductor side pump module is the heat dissipation cooling problem, and the cooling methods commonly used at present are conduction cooling and liquid cooling. The conduction cooling method adopts metal materials with high heat conduction performance or other materials as heat conduction media, and heat dissipation is carried out in a direct contact mode, so that the heat dissipation capacity is limited, and the conduction cooling method is not suitable for high-power semiconductor lasers. The liquid cooling method is to select a liquid refrigeration type semiconductor laser as a side pump module and to use a cooling water path communicated with a cooling liquid in a quartz tube as a crystal rod, and at present, the cooling water path of a semiconductor laser heat sink and the water path of the crystal rod are usually designed as a series water path, namely the cooling liquid flows in from a liquid refrigeration channel of the semiconductor laser heat sink and flows out from a liquid refrigeration channel in the quartz tube. Compared with a conduction cooling type cooling method, the liquid cooling method has the advantages that the cooling effect is greatly improved, but the method also has the problems that: on one hand, the liquid for cooling the crystal bar is the liquid after the heat sink of the semiconductor laser, and the temperature of the cooling liquid is higher than the set temperature at the moment, so that the cooling of the crystal bar is not facilitated, and the conversion efficiency and the beam quality of output laser are influenced; on the other hand, the structure of a semiconductor side pumped solid-state laser designed by such a liquid cooling method is bulky, and market application of the laser using such a cooling method is restricted.
SUMMERY OF THE UTILITY MODEL
In order to overcome the defects of the prior art, the utility model discloses a liquid refrigeration type semiconductor laser side pump module, this side pump module has proposed a parallelly connected liquid refrigeration passageway structure, can improve the heat-sinking capability of crystal stick. The specific technical scheme is as follows:
the utility model provides a liquid refrigeration type semiconductor laser side pump module includes semiconductor laser unit, base, reflection chamber and logical liquid board.
The semiconductor laser units can be single or multiple and are uniformly distributed on the outer wall of the reflecting cavity (namely on the outer wall of the quartz tube), each semiconductor laser unit comprises a heat sink and a laser chip welded on the heat sink, each laser chip is a chip of the multi-light-emitting unit, and liquid refrigerating channels are distributed in the heat sink.
One end of the two ends of the base is a liquid inlet end, and the other end of the base is a liquid outlet end.
The liquid passing plates are provided with 2 liquid passing plates A and 2 liquid passing plates B in a matched mode, the liquid passing plates A are vertically fixed at the liquid inlet end of the base and are provided with liquid inlet holes, at least two liquid passing holes and one light passing hole, the liquid passing plates B are vertically fixed at the liquid outlet end of the base and are provided with liquid outlet holes, at least two liquid passing holes and one light passing hole, and the liquid passing holes and the light passing holes are respectively located on two parallel side faces of the liquid passing plates; the liquid through holes of the liquid through plate A and the liquid through holes of the liquid through plate B have a one-to-one corresponding position relationship.
The reflection cavity comprises a hollow quartz tube and a crystal rod, the crystal rod is coaxially arranged at the center of the hollow quartz tube, two ends of the crystal rod penetrate through light through holes of the liquid through plate A and the liquid through plate B, a liquid channel is formed between the crystal rod and the quartz tube and used for allowing cooling liquid to flow through, and the inner diameter d (unit: meter) of the quartz tube needs to satisfy the following formula:
wherein, L Tis the length of the quartz tube, and the unit is meter; r is a refrigerant temperature correction coefficient and R is a constant; pi is a constant; qL Total flow of liquid in heat sink for single semiconductor laser unitTIs the total amount of liquid flow in the quartz tube,d gis the diameter of the crystal rod, HTThe liquid resistance of a liquid refrigeration channel in the heat sink of a single semiconductor laser unit is related to factors such as flow speed, materials, cold length and inner diameter in the liquid refrigeration channel.
A liquid flow passage is arranged in the liquid passing plate, the liquid passing hole can be divided into a liquid passing hole C and a liquid passing hole D, the liquid flow passage is communicated with a liquid refrigeration channel of the semiconductor laser heat sink through the liquid passing hole D, and is communicated with a liquid channel of the quartz tube through the liquid passing hole C to form a parallel liquid refrigeration passage structure; the refrigerating fluid can enter the liquid flow channel inside the liquid passing plate through the liquid inlet hole of the liquid passing plate A, flow into the liquid flow channel inside the liquid passing plate B through the liquid refrigerating channel connected in parallel (the liquid refrigerating channel of the semiconductor laser heat sink and the liquid channel of the quartz tube are in a parallel channel structure), and finally flow out of the liquid outlet hole; the size of the liquid through hole communicated with the liquid channel of the quartz tube is slightly larger than the outer diameter of the quartz tube, so that the quartz tube can be inserted into the liquid through hole, the sealing device is added for sealing, and the sealing connection of the quartz tube and the liquid through hole is ensured. And the liquid passing plate is provided with a fixing frame for fixing the reflecting cavity and the semiconductor laser unit.
The diameter of the light through hole is larger than the diameter of the crystal rod and smaller than the inner diameter of the quartz tube, the light through hole is used for fixing the crystal rod, light generated by the crystal rod can be emitted through the light through hole, the sealing device is additionally arranged between the crystal rod and the light through hole for sealing, and the sealing performance of the light through hole is guaranteed.
The material of the heat sink of the semiconductor laser unit can be metal copper and metal aluminum.
The transistor material can be Nd: YAG, Yb: YAG, Nd: YLF, Nd: YV 04.
The utility model provides a liquid refrigeration type semiconductor laser side pump module has following advantage:
1) the liquid refrigeration type semiconductor laser side pump module effectively ensures the flow of the refrigerating liquid in the heat sink of the semiconductor laser, and is beneficial to the semiconductor laser to work on the required working wavelength, thereby improving the efficiency of the laser;
2) the liquid refrigeration type semiconductor laser side pump module in the utility model adopts a parallel liquid refrigeration passage structure, and the refrigerant liquid resistance of each liquid refrigeration passage is equal by setting the inner diameter of the quartz tube, thereby avoiding the uneven heat dissipation of the crystal bar and the semiconductor laser heat sink, being beneficial to improving the heat dissipation efficiency of the crystal bar, and the system has compact structure and being beneficial to reducing the equipment volume;
3) the utility model provides a side pump module simple structure, simple to operate is favorable to improving production efficiency.
Drawings
Fig. 1 is a schematic structural diagram of a side pump module of a liquid refrigeration type semiconductor laser according to the present invention.
FIG. 2 is a schematic view of the distribution of the liquid passing holes of the liquid passing plate B.
The reference numbers illustrate: 1 is the base, 2 is leading to liquid board A, 3 is the reflection chamber, 4 is semiconductor laser unit, 5 is leading to liquid board B, 6 is the inlet opening, 7 is the apopore, 8 is the crystal stick, 9 is leading to liquid hole D, 10 is leading to liquid hole C, 11 is the light-emitting hole, 12 is the mount.
Detailed Description
A liquid refrigeration type semiconductor laser side pump module comprises a semiconductor laser unit 4, a base 1, a reflecting cavity 3 and liquid passing plates (2 and 5). The present invention will be further described with reference to fig. 1 by taking three groups of semiconductor laser units as an example. As shown in fig. 1, the semiconductor laser units 4 are uniformly distributed along the circumferential outer wall of the reflective cavity 3 (i.e. on the outer wall of the quartz tube), the three groups of semiconductor laser units mutually form an included angle of 120 degrees, each semiconductor laser unit comprises a heat sink and at least one laser chip, the laser chip is welded on the heat sink, the laser chip is a chip of a multi-light-emitting unit, and liquid refrigeration channels are distributed in the heat sink.
One end of the two ends of the base 1 is a liquid inlet end, and the other end of the base is a liquid outlet end.
Lead to the liquid board to pair and set up 2, be respectively for leading to liquid board A2 and lead to liquid board B5, lead to liquid board A2 vertical fixation at the feed liquor end of base 1, lead to liquid board B5 vertical fixation at the play liquid end of base 1, refer to figure 2, the side that leads to liquid board B5 sets up out liquid hole 7, set up 3 logical liquid hole 9 in the front that leads to liquid board B5, set up one logical unthreaded hole 11 at the front center that leads to liquid board B5, the same way, locate to set up feed liquor hole 6 at the side position that leads to liquid board A2, 3 logical liquid hole 9 and one logical unthreaded hole 11, lead to liquid board A and lead to liquid board B and be mirror symmetry, lead to liquid hole 9 and lead to unthreaded hole 11 and be located respectively on two sides that lead to liquid board mutually parallel mutually.
The reflecting cavity 3 comprises a hollow quartz tube and a crystal rod 8, the crystal rod 8 is coaxially arranged at the center of the hollow quartz tube, two ends of the crystal rod penetrate through light through holes of the liquid through plate A2 and the liquid through plate B5, and a liquid channel is formed between the crystal rod 8 and the quartz tube and used for allowing cooling liquid to flow through.
In practical application, because different semiconductor lasers need different heat dissipation capacities, the liquid resistance value and the total liquid flow of a semiconductor laser heat sink liquid refrigeration channel can be obtained according to test or simulation after the semiconductor laser heat sink design is completed, the flow of the refrigeration liquid in the quartz tube is controlled and adjusted according to requirements, and then the heat dissipation capacity of a crystal rod in the quartz tube is controlled. The inner diameter d (unit: m) of the quartz tube is required to satisfy the following equation:
wherein, L Tis the length of the quartz tube, and the unit is meter; r is a refrigerant temperature correction coefficient and R is a constant; pi is a constant; qL Total flow of liquid in heat sink for single semiconductor laser unitTIs the total amount of liquid flow in the quartz tube,d gis the diameter of the crystal rod, HTThe liquid resistance of a liquid refrigeration channel in the heat sink of a single semiconductor laser unit is related to factors such as flow speed, materials, cold length and inner diameter in the liquid refrigeration channel.
Lead to liquid board (2 and 5) inside have flow path, the liquid hole can divide into liquid hole C10 and liquid hole D9, this flow path is through the liquid refrigeration passageway intercommunication that leads to liquid hole D9 and semiconductor laser unit are thermal-arrest, simultaneously through the liquid channel intercommunication of liquid hole C10 and quartz capsule, liquid gets into then shunts to the liquid refrigeration passageway of semiconductor laser unit thermal-arrest and the liquid channel of quartz capsule through leading to liquid board A2 for the liquid refrigeration passageway of semiconductor laser unit thermal-arrest and the liquid channel of quartz capsule are parallelly connected. The refrigerating fluid can enter the liquid flow channel inside the liquid passing plate through the liquid inlet hole 6 of the liquid passing plate A2, flow into the liquid flow channel inside the liquid passing plate B through the liquid refrigerating channel connected in parallel (the liquid refrigerating channel of the heat sink of the semiconductor laser and the liquid channel of the quartz tube are in a parallel channel structure), and finally flow out from the liquid outlet hole 7. The size of a liquid through hole communicated with a liquid channel of the quartz tube is slightly larger than the outer diameter of the quartz tube, so that the quartz tube can be inserted into the liquid through hole, and the sealing of a sealing device is increased. The liquid passing plate is provided with a fixing frame 12 for fixing the reflecting cavity and the semiconductor laser unit.
The diameter of the light through hole 11 is larger than the diameter of the crystal rod and smaller than the inner diameter of the quartz tube, the light through hole is used for fixing the crystal rod 8, light generated by the crystal rod 8 can be emitted through the light through hole, the sealing device is additionally arranged between the crystal rod 8 and the light through hole 11 for sealing, and the sealing performance of the light through hole is guaranteed.
The material of the semiconductor laser heat sink can be metal copper and metal aluminum.
The crystal rod 8 can be made of Nd: YAG, Yb: YAG, Nd: YLF and Nd: YV 04.
Claims (3)
1. A liquid refrigeration type semiconductor laser side pump module comprises a semiconductor laser unit, a base and a reflecting cavity; the semiconductor laser units can be single or multiple and are uniformly distributed on the outer wall of the reflecting cavity, each semiconductor laser unit comprises a heat sink and a laser chip welded on the heat sink, and liquid refrigerating channels are distributed in the heat sink; one end of each of the two ends of the base is a liquid inlet end, and the other end of each of the two ends of the base is a liquid outlet end; the method is characterized in that:
the liquid cooling type semiconductor laser side pump module further comprises a liquid passing plate, wherein 2 liquid passing plates are arranged in a matched mode and respectively comprise a liquid passing plate A and a liquid passing plate B, the liquid passing plate A is vertically fixed at the liquid inlet end of the base, a liquid inlet hole, 2 or more liquid passing holes and 1 light passing hole are formed in the liquid passing plate A, the liquid passing plate B is vertically fixed at the liquid outlet end of the base, a liquid outlet hole, 2 or more liquid passing holes and 1 light passing hole are formed in the liquid passing plate B;
the reflection cavity comprises a hollow quartz tube and a crystal rod, the crystal rod is coaxially arranged in the hollow quartz tube, two ends of the crystal rod penetrate through light through holes of the liquid through plate A and the liquid through plate B, and the inner diameter d (unit: meter) of the quartz tube meets the following formula:
wherein, L Tis the length of the quartz tube, and the unit is meter; r is a constant; qL Total flow of liquid in heat sink for single semiconductor laser unitTIs the total amount of liquid flow in the quartz tube,d gis the diameter of the crystal rod, HT The liquid resistance of a liquid refrigeration channel in the heat sink of a single semiconductor laser unit is pi is a constant.
2. The liquid-cooled semiconductor laser-side pump module as claimed in claim 1, wherein: the liquid flow channel is arranged in the liquid passing plate and is respectively communicated with the liquid refrigeration channel of the heat sink of the semiconductor laser unit and the liquid channel of the quartz tube through the liquid passing hole to form a liquid refrigeration channel structure connected in parallel, and the liquid passing hole is sealed by a sealing device.
3. The liquid-cooled semiconductor laser-side pump module as claimed in claim 1, wherein: the diameter of the light through hole of the liquid through plate is larger than the diameter of the crystal rod and smaller than the inner diameter of the quartz tube, and a sealing device is arranged between the crystal rod and the light through hole for sealing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420342155.9U CN203967508U (en) | 2014-06-25 | 2014-06-25 | A kind of liquid refrigerating type semiconductor laser side pump module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420342155.9U CN203967508U (en) | 2014-06-25 | 2014-06-25 | A kind of liquid refrigerating type semiconductor laser side pump module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203967508U true CN203967508U (en) | 2014-11-26 |
Family
ID=51928052
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420342155.9U Expired - Lifetime CN203967508U (en) | 2014-06-25 | 2014-06-25 | A kind of liquid refrigerating type semiconductor laser side pump module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203967508U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107946900A (en) * | 2017-12-29 | 2018-04-20 | 西安炬光科技股份有限公司 | A kind of semiconductor laser module |
| CN114142337A (en) * | 2021-11-10 | 2022-03-04 | 中国电子科技集团公司第十一研究所 | Semiconductor laser wavelength self-locking device and method |
-
2014
- 2014-06-25 CN CN201420342155.9U patent/CN203967508U/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107946900A (en) * | 2017-12-29 | 2018-04-20 | 西安炬光科技股份有限公司 | A kind of semiconductor laser module |
| CN107946900B (en) * | 2017-12-29 | 2024-02-13 | 西安炬光科技股份有限公司 | Semiconductor laser module |
| CN114142337A (en) * | 2021-11-10 | 2022-03-04 | 中国电子科技集团公司第十一研究所 | Semiconductor laser wavelength self-locking device and method |
| CN114142337B (en) * | 2021-11-10 | 2023-12-26 | 中国电子科技集团公司第十一研究所 | Semiconductor laser wavelength self-locking device and method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN109119887B (en) | Heat dissipation device and method for packaging high-power semiconductor laser | |
| CN103779782B (en) | A kind of high-average power diode-pumped nd yag laser module and preparation method thereof | |
| CN208508222U (en) | A kind of heat dissipation clamping device of laser crystal | |
| KR20080070001A (en) | Liquid cooling for backlit displays | |
| CN203967508U (en) | A kind of liquid refrigerating type semiconductor laser side pump module | |
| CN106647019A (en) | Water cooling system for LED display module and LED display module | |
| CN102437499A (en) | Cooling system of medium-high-power fiber laser | |
| CN102820610A (en) | Diode pumping laser gain module and preparation method thereof | |
| CN104078824A (en) | Full-cavity water-cooling solid laser | |
| CN101464618B (en) | Projection apparatus with cooling structure | |
| CN109411997B (en) | Laminated repetition frequency sheet amplifier for xenon lamp pumping liquid cooling | |
| CN201821000U (en) | High-power laser diode horizontal line array pump solid state laser cavity | |
| CN103047629A (en) | Large-diameter high-power sunflower composite heat radiator | |
| CN108957920B (en) | Circulating foam material liquid cooling device for high-power lighting DMD chip | |
| CN101527424A (en) | Laser light source | |
| CN115774353B (en) | Integrated liquid-cooled heat dissipation module, backlight module using same and display device | |
| CN107272308B (en) | Laser projection device | |
| CN211040854U (en) | High-power-density light-emitting device adopting circulating fluorescent liquid | |
| CN101964496B (en) | High-power laser diode horizontal linear array pumped solid laser cavity | |
| CN203491503U (en) | Nd:YAG laser | |
| RU166589U1 (en) | OPTICAL AMPLIFIER HEAD WITH DIODE PUMPING | |
| CN205901066U (en) | Conduction cooling high-power semiconductor laser | |
| CN112968342A (en) | End-pumped laser crystal microchannel water-cooling structure for heat dissipation | |
| CN202395300U (en) | Cooling system of optical fiber laser with medium and high power | |
| CN110911953A (en) | Water-cooling semiconductor light source side pump solid laser module |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: 710077 Xi'an hi tech Zone 56, Xi'an, Shaanxi Province, No. 56 Patentee after: Focuslight Technologies Inc. Address before: 710119 Third Floor, Building 10, 17 Information Avenue, New Industrial Park, Xi'an High-tech Zone, Shaanxi Province Patentee before: XI'AN FOCUSLIGHT TECHNOLOGIES Co.,Ltd. |
|
| CP03 | Change of name, title or address | ||
| CX01 | Expiry of patent term |
Granted publication date: 20141126 |
|
| CX01 | Expiry of patent term |