CN207884066U - A kind of novel semiconductor laser module - Google Patents
A kind of novel semiconductor laser module Download PDFInfo
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- CN207884066U CN207884066U CN201721899473.5U CN201721899473U CN207884066U CN 207884066 U CN207884066 U CN 207884066U CN 201721899473 U CN201721899473 U CN 201721899473U CN 207884066 U CN207884066 U CN 207884066U
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- heat sink
- semiconductor laser
- cold
- making block
- plug connector
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model embodiment provides a kind of novel semiconductor laser module, and the module includes：Cold-making block and at least one semiconductor laser element, each semiconductor laser element include multiple semiconductor lasers, connection electrode and radiate for the multiple semiconductor laser heat sink；Wherein, the multiple semiconductor laser is bonded to the heat sink surface, described heat sink to include：Circular heat sink or polygon is heat sink, and the connection electrode is for realizing the electrical connection between multiple semiconductor lasers；The cold-making block is set to the heat sink outside of the semiconductor laser element, for being the heat sink heat dissipation.Based on semiconductor laser module provided by the utility model, positioning accuracy can be effectively improved, assembly is simple, easily operated.
Description
Technical field
The utility model is related to field of semiconductor lasers more particularly to it is a kind of can be used for pump and other field it is novel
Semiconductor laser module.
Background technology
Semiconductor laser has many advantages, such as that small, light-weight, reliability is high, service life is long, extensively at present
Applied to the every field of national economy, light-pumped solid state laser is used for for example as pumping source.In semiconductor laser conduct
In the application of side pumping source, current existing side pump module is frequently with semiconductor laser in positive triangle, Zheng Wujiao, positive heptangle
Equal formal distributions radiate around crystal bar, and by heat sink for semiconductor laser and crystal bar.
Multigroup waterway is set in heat sink main body currently, being mostly used with the solutions for refrigeration of upper module, and by refrigerant
The mode for being passed through waterway is that module is freezed, as shown in Figure 1.But there are some drawbacks for this mode, such as：Waterway
Design introduces excessive sealing ring, causes assembly complicated；Each laser in each annular module is solid by Outer screw
It is fixed, cause annular module Outer screw quantity more, and the protrusion influence of screw is overall beautiful；Connection electrode and extraction electricity
Pole needs to wind insulating tape to prevent short circuit, causes to introduce excessive insulating tape；When polycyclic assembling, in each annular module
Waterway need to be aligned one by one, it is higher to positioning requirements.
Invention content
In view of the above technical problems, one of the main purpose of the utility model embodiment, which is to provide, a kind of novel partly leads
Body laser module fundamentally solves biography by being arranged cold-making block in circular heat sink or heat sink polygon outside
The problem of system scheme is difficult to precise positioning, and there is excellent refrigeration effect；In addition, one kind has also been devised newly in the utility model
The plug connector of type can realize that the limit between each semiconductor laser, connection electrode and at least three such as heat sink is fixed, assemble
Simply, easily operated, there is larger application prospect and market prospects.
What the technical solution of the utility model was realized in：
The utility model embodiment provides a kind of novel semiconductor laser module, and the module includes：Cold-making block, with
And at least one semiconductor laser element, each semiconductor laser element include multiple semiconductor lasers, connection electrode,
And it is the heat sink of the multiple semiconductor laser heat dissipation；Wherein, the multiple semiconductor laser is bonded to described heat sink
Surface, it is described heat sink to include：Circular heat sink or polygon is heat sink；The connection electrode is for realizing multiple semiconductor lasers
Between electrical connection；The cold-making block is set to the heat sink outside of the semiconductor laser element, for being described heat sink scattered
Heat.
In said program, the multiple semiconductor laser implement body is bonded to that the annular shape is heat sink or polygon is heat sink
Inner wall, the laser beam sent out converge at the center that the annular shape is heat sink or polygon is heat sink.
In said program, the cold-making block at least two, and its inner surface has the card slot to match with heat sink shape, uses
In the heat sink fixation between cold-making block of realization.
In said program, the card slot surface is provided with high thermal conductivity layer, is handed over for realizing the heat sink heat between cold-making block
It changes.
In said program, the refrigeration modes of the cold-making block include：Conduct refrigeration mode or liquid refrigerating type, wherein work as institute
It is when conducting refrigeration mode to state refrigeration modes, and the cold-making block is made of a highly heat conductive material；When the refrigeration modes are liquid refrigerating
When type, multiple liquid-passing holes, the position of the position of the liquid-passing hole and each semiconductor laser are provided in the refrigeration block main body
It is corresponding.
In said program, the cold-making block also has screw hole, realizes that each cold-making block swashs with each semiconductor for passing through screw
Fixation between light device unit.
In said program, the module further includes plug connector, and offers multiple open slots on the heat sink inner wall, multiple
Semiconductor laser is bonded to the heat sink inner wall between adjacent apertures slot respectively；Through-hole is provided in the connection electrode, it is described
Plug connector be used for by the through-hole in connection electrode be inserted into the open slot realize semiconductor laser and it is heat sink between consolidate
It is fixed.
In said program, the plug connector includes：Planar section and grafting part；Wherein, the plug division subpackage
It includes：At least one from the extension of the lower surface of the planar section is in hook-shaped connection-peg, the planar section of the plug connector
Outer diameter is more than the internal diameter of the through-hole of connection electrode, for realizing the limit between plug connector and semiconductor laser, connection electrode
It is fixed.
In said program, the open slot on the heat sink inner wall includes：Opening portion and base part；Wherein, described
The internal diameter of base part is more than the internal diameter of opening portion, and the outer diameter of the connection-peg is more than the interior of the opening portion of open slot
Diameter so that hook-shaped connection-peg is connected in the side wall of open slot base part, realizes that plug connector is connected and fixed with heat sink.
In said program, the module further includes extraction electrode, and the extraction electrode is set to the semiconductor laser
Inside unit, for the electrode of the semiconductor laser element to be led to outside.
The advantageous effects of technical solutions of the utility model are as follows：
1, refrigeration water route is arranged on the cold-making block of the heat sink outside of each semiconductor laser element so that each semiconductor swashs
Light device unit is mutual indepedent, non-interference, and assembling can directly be clamped in assembling, thoroughly solve chilled water in traditional scheme
When road is located at heat sink caused each ring assembling, introduces excessive sealing ring and the positioning of each waterway is directed at the high problem of difficulty.
2, the design of plug connector and dependency structure so that realized inside semiconductor laser element and swash each semiconductor
The scheme being fixedly connected between light device, connection electrode and at least three such as heat sink, fixed effect is preferable, and assembling is more convenient, tool
There is higher operability.
3, extraction electrode, without positioning, is solved in traditional scheme and is drawn by being directly led out inside semiconductor laser element
The problem of going out orientation problem caused by electrode setting external connection block and introducing excessive insulating tape, it is simple and convenient, have more
High practicability.
Description of the drawings
Fig. 1 is the structural schematic diagram of prior art semiconductor laser module；
Fig. 2 is the dimensional structure diagram of the utility model cold-making block；
Fig. 3 is the dimensional structure diagram of the utility model semiconductor laser module；
Fig. 4 is the partial structural diagram of the utility model semiconductor laser element；
Fig. 5 is the plug connector of the utility model and the heat sink fixed structural schematic diagram of limit；
Fig. 6 is another partial structural diagram of semiconductor laser element of the present invention.
Drawing reference numeral explanation：1 is semiconductor laser element, and 11 be semiconductor laser, and 111 be semiconductor laser core
Piece, 112 be substrate, and 12 be plug connector, and 121 be planar section, and 122 be grafting part, and 13 be heat sink, and 131 be mounting platform, 14
It is opening portion for open slot, 141,142 be base part, and 15 be connection electrode, and 151 through-holes, 16 be cold-making block, and 161 be logical
Fluid apertures.
Specific implementation mode
The utility model following embodiment provides a kind of novel semiconductor laser module, and main thought is：Pass through
Cold-making block is arranged in circular heat sink or heat sink polygon outside, solve be arranged in heat sink main body in traditional scheme it is multigroup
The problem of being difficult to precise positioning when refrigeration water route, high cooling efficiency；Further, the utility model has also been devised a kind of novel
Plug connector, may be implemented inside semiconductor laser element at least three such as each semiconductor laser, connection electrode, heat sink it
Between limit fix, assembly is simple.
Below in conjunction with drawings and the specific embodiments, technical solutions of the utility model are described in further details.
Fig. 2 is the dimensional structure diagram of the utility model cold-making block, and Fig. 3 is the utility model semiconductor laser module
Dimensional structure diagram.As shown in Figure 2 and Figure 3, it is contemplated that how to realize and promote positioning accuracy, facilitate installation this point, partly lead
Included by body laser unit heat sink 13 on setting refrigeration water route, but outside semiconductor laser element be arranged system
Cold water road.
Specifically, in the utility model embodiment, each semiconductor laser module may include：Cold-making block 16 and
At least one semiconductor laser element 1, each semiconductor laser element may include again：Multiple semiconductor lasers 11,
Connection electrode 15 and be the multiple semiconductor laser heat dissipation heat sink 13, the multiple semiconductor laser 11 be bonded
In heat sink 13 surface, the connection electrode 15 is for realizing the electrical connection between multiple semiconductor lasers 11；The system
It is set to for cold piece 16 outside heat sink the 13 of the semiconductor laser element, for radiating for described heat sink 13.
Here, it described heat sink 13 can include but is not limited to：Circular heat sink or polygon is heat sink, and the annulus simultaneously differs
It is set to positive round, or non-positive round；The polygon may include triangle, quadrangle, pentagon etc..Preferably, hot
Heavy 13 is heat sink for positive circular heat sink or regular polygon.The multiple semiconductor laser implement body can be bonded to the annular shape
Heat sink or heat sink polygon inner wall, the laser beam sent out converge at that the annular shape is heat sink or polygon it is heat sink in
The heart, the utility model drawings and the specific embodiments are illustrated so that described heat sink 13 is heat sink for positive annular shape as an example.It is based on
It is above-mentioned, it can be appreciated that one of main application of semiconductor laser module described in the utility model can be used as and fix
The side pumping source of laser, the gain media of solid state laser（Such as crystal bar）It may be disposed at circular heat sink or polygon
Heat sink center.
The semiconductor laser 11 can include, but is not limited to：Laser chip, substrate；The laser chip can be with
May be in certain embodiments vertical-cavity surface-emitting type semiconductor laser for edge transmitting type semiconductor laser chip
Device chip；Laser chip is bonded on the substrate, and the substrate has the coefficient of thermal expansion to match with laser chip.
In said program, the cold-making block 16 at least two, the utility model embodiment is with the number of the cold-making block 16
Amount is illustrated for 2, such as Fig. 2, Fig. 3.Specifically, the inner surface of the cold-making block 16 is provided with and heat sink 13 shape phase
The card slot matched（It is not shown in figure）, can be by each semiconductor laser when multiple semiconductor laser elements are assembled
Heat sink the 13 of unit are corresponded to respectively in corresponding card slot, to realize the fixation between heat sink 13 and cold-making block 16.
Preferably, can high thermal conductivity layer, such as indium film layer be set on the card slot surface of the cold-making block, is mainly used for realizing
The heat sink heat exchange between cold-making block, to improve the heat transfer efficiency between cold-making block and semiconductor laser element.
Specifically, the refrigeration modes of the cold-making block may include：Conduct refrigeration mode or liquid refrigerating type, wherein work as institute
State refrigeration modes be conduction refrigeration mode when, the cold-making block is made of a highly heat conductive material, for example, the high-thermal conductive metals such as copper, and/or
Nonmetallic materials；When the refrigeration modes are liquid refrigerating type, multiple liquid-passing holes 161 are provided in the refrigeration block main body；
The utility model embodiment carries out citing signal so that the refrigeration modes are liquid refrigerating type as an example.
Preferably, in order to reach more efficient refrigeration effect, as shown in Figure 2 and Figure 3, the position of the liquid-passing hole 161 can be with
It is corresponding with the position of each semiconductor laser.The form of the liquid-passing hole can include but is not limited to：Fin, micro through hole battle array
The various forms such as row.
Further, the cold-making block also has screw hole（It is not shown in figure）, by screw may be implemented each cold-making block with
Fixation between each semiconductor laser element.As shown in figure 3, in the utility model embodiment, each semiconductor laser list
Member is located at the center cavity region that two cold-making blocks 16 are constituted, and screw can screw in screw hole possessed by two cold-making blocks 16
In, it realizes be secured together cold-making block and each semiconductor laser element in this way.
The said program of the utility model will freeze water route setting in heat sink outside, i.e., set in refrigeration water route with heat sink detach
It counts, the structure design in separate type refrigeration water route so that waterway structure is not present in the heat sink main body of semiconductor laser element,
In this way, when multigroup semiconductor laser element is assembled, directly it is clamped into respective card slot, each semiconductor swashs
Between light device unit independently of each other, no interference is easily assembled to and dismantles.Also, due to phase between each semiconductor laser element
It is mutually independent, therefore in assembling, there may be certain dislocation between each semiconductor laser element, to realize each semiconductor laser
The angled arrangement of device unit.
In said program, the module can further include plug connector 12, meanwhile, it can be opened on the heat sink inner wall
Equipped with multiple open slots 14, multiple semiconductor lasers 11 are bonded to the heat sink inner wall between adjacent apertures slot respectively；It is described to insert
Fitting 12 is used to, by being inserted into the open slot 14, realize the fixation between semiconductor laser 11 and heat sink 13.
In said program, the plug connector 12 is the elastic material of insulation or SI semi-insulation, such as PEEK（Polyether-ether-ketone）.
When the plug connector is SI semi-insulation, the surface of the plug connector or it is internally provided with current-carrying part, is used for and adjacent half
Conductor laser is in contact, and realizes the electrical connection between adjacent semiconductor laser；What the plug connector of SI semi-insulation mainly considered
It is：The plug connector can also use simultaneously as connection electrode when realizing the function of fixed limit, not introduce connection electrode
In the case of electrical connection between each semiconductor laser can be realized.The conducting function of the plug connector 12 can specifically pass through
It is realized using in the other modes such as plug connector surface selective coated conductive layer or internal setting conductive channel.When the grafting
When part is the material all to insulate, then need to introduce connection electrode, to realize the electrical connection between adjacent semiconductor laser, this reality
It is illustrated so that the plug connector is the elastic material all to insulate as an example with new embodiment.
Specifically, the plug connector 12 may include planar section 121 and grafting part 122；Here, the grafting
It is that elastic material can generate certain elastic deformation that part 12, which selects the considerations of elastic material, and open slot is inserted into plug connector 12
It, can be in the case where generating certain deformation quantity when 14（It shrinks）It is inserted into, and restores the shape to a certain extent after such insertion
Variable, such as restore to reset condition, the fixed limit that the recovery of deformation quantity can be plug connector in open slot provide guarantee.
In said program, the grafting part 122 may include：Extend extremely from the lower surface of the planar section 121
Few one is in hook-shaped connection-peg, and the utility model embodiment is illustrated with the quantity of the connection-peg for 2.It is described to insert
Fitting 12 can be integrated injection molding part, can also utilize machine by after 122 each self-forming of planar section 121 and grafting part
Tool is fixed or the two is secured together by the modes such as chemical adhesive.
Fig. 4 is the partial structural diagram of the utility model semiconductor laser element, and Fig. 5 is the grafting of the utility model
Part and the heat sink fixed structural schematic diagram of limit.As shown in Figure 4, Figure 5, in said program, what is opened up on the heat sink inner wall opens
Mouth slot 14 can have opening portion 141 and base part 142, and the internal diameter of the base part 142 is more than opening portion 141
Internal diameter, the internal diameter of base part described here 142 and opening portion 141 both refers to the length in certain same direction.
The connection-peg can be inserted into the base part of the open slot 14 through the through-hole 151 in the connection electrode 15
142, since the grafting part 122 is in hook-shaped connection-peg, which can be connected in base part 142
Side wall on, realize that grafting part 12 is connected and fixed with heat sink 13.
Specifically, in order to ensure that grafting part 122 is firmly plugged in the base part 142, in practical applications, institute
The outer diameter for stating connection-peg should be greater than the internal diameter of opening portion 141, and here, the outer diameter of the connection-peg refers to：What plug connector had
The length of all connection-pegs on the whole in one direction；The internal diameter of opening portion 141 refers to：Opening portion on the same direction
141 length.
Since the plug connector 12 is elastic material, when the outer diameter of connection-peg is more than the internal diameter of opening portion 141,
The connection-peg with certain amount of elastic deformation also can opening points 141 be inserted into open slot 14, the bullet
Property deformation quantity has a degree of recovery after connection-peg insertion opening slot 14, and based in the above base part 142
Diameter is more than the internal diameter of opening portion 141 so that hook-shaped connection-peg can be connected in base part behind basement part 142
142 side wall, and will not being detached from from opening portion 141 realizes that plug connector 12 is connected and fixed with heat sink 13 with this.
Further, for the plug connector 12, since its connection-peg can be through the through-hole 151 in the connection electrode 15
It is inserted into the open slot 14, therefore, the outer diameter of the planar section 121 of the plug connector should also be more than the logical of connection electrode 15
The internal diameter in hole 151, to ensure that the planar section 121 of plug connector will not be detached from from the through-hole 151 of connection electrode, it is ensured that fixed matter
Amount.The outer diameter of planar section 121 described here refers to the length of planar section 121 in one direction, the through-hole 151
Internal diameter refers to the diameter of through-hole in the same direction.In this way, since both plug connector 12 and connection electrode 15 are fixed, connection electricity
Pole 15 is connect with adjacent semiconductor laser 11, therefore plug connector 12 and semiconductor laser 11, connection electrode may be implemented
Limit between 15 threes is fixed.
In addition, being additionally provided with mounting platform 131, mounting platform on heat sink 13 inner wall in the utility model embodiment
131 are set between adjacent apertures slot, which is particularly used in bonding semiconductor laser, as shown in fig. 6, Fig. 6
Part semiconductor laser, connection electrode and plug connector are only shown, it is similar with part is had shown that part is not shown.
The module further includes extraction electrode, and the extraction electrode is set to inside the semiconductor laser element, is used
In the electrode of the semiconductor laser element is led to outside, specifically heat sink outside, i.e. extraction electrode can be led to through described
By being directly led out inside semiconductor laser element.To avoid short circuit, can make in extraction electrode surface setting unit insulating layer
It solves extraction electrode in traditional scheme with heat sink equal insulation, such electrode lead-out mode in drawing path without positioning
The problem of orientation problem caused by external connection block is set and introduces excessive insulating tape, it is convenient and practical.
The above, the only preferred embodiment of the utility model, are not intended to limit the protection of the utility model
Range.For those skilled in the art, the present invention may have various modifications and changes.It is all in the utility model
Any modification, equivalent substitution, improvement and etc. done within spirit and principle, should be included in the scope of protection of the utility model it
It is interior.
Claims (10)
1. a kind of novel semiconductor laser module, which is characterized in that the module includes：Cold-making block and at least one
Semiconductor laser element, each semiconductor laser element include multiple semiconductor lasers, connection electrode and are described
Multiple semiconductor lasers radiate heat sink；Wherein,
The multiple semiconductor laser is bonded to the heat sink surface, described heat sink to include：Circular heat sink or polygon is warm
It is heavy；
The connection electrode is for realizing the electrical connection between multiple semiconductor lasers；
The cold-making block is set to the heat sink outside of the semiconductor laser element, for being the heat sink heat dissipation.
2. module according to claim 1, which is characterized in that the multiple semiconductor laser implement body is bonded to the circle
Cyclic annular heat sink or heat sink polygon inner wall, the laser beam sent out converge at that the annular shape is heat sink or polygon is heat sink
Center.
3. module according to claim 1, the cold-making block at least two, and its inner surface have and heat sink shape phase
The card slot matched, for realizing the heat sink fixation between cold-making block.
4. module according to claim 3, which is characterized in that the card slot surface is provided with high thermal conductivity layer, for realizing
The heat sink heat exchange between cold-making block.
5. module according to claim 3, which is characterized in that the refrigeration modes of the cold-making block include：Conduction refrigeration mode,
Or liquid refrigerating type, wherein
When the refrigeration modes are conduction refrigeration mode, the cold-making block is made of a highly heat conductive material；
When the refrigeration modes are liquid refrigerating type, multiple liquid-passing holes, the position of the liquid-passing hole are provided on the cold-making block
It sets corresponding with the position of each semiconductor laser.
6. module according to claim 3, which is characterized in that the cold-making block also has screw hole, for passing through screw reality
The now fixation between each cold-making block and each semiconductor laser element.
7. module according to claim 1, which is characterized in that the module further includes plug connector, and the heat sink inner wall
On offer multiple open slots, multiple semiconductor lasers are bonded to the heat sink inner wall between adjacent apertures slot respectively；
Through-hole is provided in the connection electrode, the plug connector is used to be inserted into the open slot by the through-hole in connection electrode
It is middle realize semiconductor laser and it is heat sink between fixation.
8. module according to claim 7, which is characterized in that the plug connector includes：Planar section and plug division
Point；Wherein,
The plug division point includes：At least one from the extension of the lower surface of the planar section is in hook-shaped connection-peg, described
The outer diameter of the planar section of plug connector is more than the internal diameter of the through-hole of connection electrode, for realizing plug connector and semiconductor laser,
Limit between connection electrode is fixed.
9. module according to claim 8, which is characterized in that the open slot on the heat sink inner wall includes：Opening portion,
And base part；Wherein,
The internal diameter of the base part is more than the internal diameter of opening portion, and the outer diameter of the connection-peg is more than the opening portion of open slot
The internal diameter divided so that hook-shaped connection-peg is connected in the side wall of open slot base part, realizes that plug connector is solid with heat sink clamping
It is fixed.
10. module according to claim 9, which is characterized in that the module further includes extraction electrode, the extraction electrode
It is set to inside the semiconductor laser element, for the electrode of the semiconductor laser element to be led to outside.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721899473.5U CN207884066U (en) | 2017-12-29 | 2017-12-29 | A kind of novel semiconductor laser module |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721899473.5U CN207884066U (en) | 2017-12-29 | 2017-12-29 | A kind of novel semiconductor laser module |
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| CN207884066U true CN207884066U (en) | 2018-09-18 |
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| CN201721899473.5U Active CN207884066U (en) | 2017-12-29 | 2017-12-29 | A kind of novel semiconductor laser module |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110224293A (en) * | 2019-05-23 | 2019-09-10 | 杨伟锋 | A kind of pumping source Semiconductor Laser disposably encapsulated |
-
2017
- 2017-12-29 CN CN201721899473.5U patent/CN207884066U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110224293A (en) * | 2019-05-23 | 2019-09-10 | 杨伟锋 | A kind of pumping source Semiconductor Laser disposably encapsulated |
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