CN220672570U - Heat radiator with compression resistance - Google Patents
Heat radiator with compression resistance Download PDFInfo
- Publication number
- CN220672570U CN220672570U CN202322171888.2U CN202322171888U CN220672570U CN 220672570 U CN220672570 U CN 220672570U CN 202322171888 U CN202322171888 U CN 202322171888U CN 220672570 U CN220672570 U CN 220672570U
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- Prior art keywords
- heat
- bottom plate
- boss
- heat sink
- compressive properties
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- 230000006835 compression Effects 0.000 title claims abstract description 10
- 238000007906 compression Methods 0.000 title claims abstract description 10
- 230000017525 heat dissipation Effects 0.000 claims abstract description 18
- 238000000034 method Methods 0.000 claims abstract description 4
- 239000007788 liquid Substances 0.000 claims description 10
- 230000000149 penetrating effect Effects 0.000 claims description 5
- 238000005452 bending Methods 0.000 claims description 4
- 239000004519 grease Substances 0.000 claims description 3
- 230000001965 increasing effect Effects 0.000 claims description 3
- 229920001296 polysiloxane Polymers 0.000 claims description 3
- 230000002708 enhancing effect Effects 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 6
- 230000005494 condensation Effects 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000002826 coolant Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000010365 information processing Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Abstract
The utility model provides a heat dissipating device with compression resistance, wherein a boss with an arc-shaped convex surface is additionally arranged at the lower end of a bottom plate. When the bottom plate is connected with a heat source, the bottom plate can generate larger compressive stress at the center of the heat source, the boss is promoted to deform, and the bottom plate can continuously contact with the heat source in the deformation process due to the arrangement of the arc-shaped convex surface, so that the heat dissipation effect of the heat dissipation device is not influenced. In the embodiment, the heat pipe mounting structure is exemplified, the heat on the boss is transferred through the first end, and the heat is distributed to each heat radiating fin through the second end, so that the heat radiating effect and the heat radiating uniformity are further enhanced.
Description
Technical Field
The utility model relates to electronic element heat dissipation equipment, in particular to a heat dissipation device with compression resistance.
Background
The CPU is the operation and control core of the computer system and is the final execution unit for information processing and program running. The integrated circuit of the CPU generates heat during operation, and an excessively high temperature may reduce the service life of the core, and even may cause the CPU to fail, so that a heat sink needs to be configured to dissipate heat from the surface of the CPU.
The heat radiator for the CPU in the prior art generally consists of a bottom plate and heat radiating fins arranged on the bottom plate, and heat on the surface of a core is transferred to the heat radiating fins through the bottom plate to finish cooling. The bottom plate is also generally provided with a heat pipe for transferring heat, a liquid cooling medium is filled in the heat pipe, and the heat on the surface of the electronic element is taken away through the flow of the liquid. Therefore, the base plate and the electronic component need to be in good contact to exert the heat dissipation capability of the heat sink.
In the prior art, the connection between the base plate and the electronic component is usually fixed by means of spring screws. The spring screw is located the four corners position of bottom plate, when tightening the screw, can produce great stress at the bottom plate center, impels the bottom plate center to take place deformation to lead to the bottom plate to break away from the heat source surface, can not form good contact, influence the radiating effect.
Disclosure of Invention
In order to solve the technical problems, the utility model provides a heat dissipating device with compression resistance, which comprises a bottom plate, a fin group connected to the upper end of the bottom plate and a plurality of groups of heat pipes arranged on the bottom plate and used for transferring heat between the bottom plate and the fin group, wherein the fin group consists of a plurality of groups of heat dissipating fins arranged at the upper end of the bottom plate in parallel; the bottom of the bottom plate is provided with a boss, and the boss is provided with an arc-shaped convex surface protruding out of the lower end surface of the bottom plate.
Further, the lower end face of the bottom plate is provided with a lower groove, and the boss is clamped in the lower groove.
Further, the heat pipe is in contact with the upper surface of the boss.
Further, the arc-shaped convex surface is provided with heat conduction silicone grease for enhancing the heat conduction capacity of the boss.
Further, the heat pipe comprises a first end and a second end, the first end is connected with the bottom plate and the fin group in a contact mode, and the second end is connected between the radiating fins in a penetrating mode.
Further, an upper groove is formed in the upper end of the bottom plate, the first end is embedded in the upper groove, and the lower ends of the radiating fins are in contact with the first end.
Further, a connecting hole penetrating through the radiating fins is formed along the thickness direction of the fin group, and the second end penetrates through each radiating fin through the connecting hole.
Further, a plurality of groups of bending parts for increasing the circulation length of the liquid medium are arranged along the extending direction of the heat pipe.
Further, the first ends of the plurality of groups of heat pipes are in contact with each other.
Further, the connecting holes are positioned at the upper end positions of the radiating fins and are uniformly arranged along the length direction of the radiating fins.
The utility model provides a heat dissipating device with compression resistance, wherein a boss with an arc-shaped convex surface is additionally arranged at the lower end of a bottom plate. When the bottom plate is connected with a heat source, the bottom plate can generate larger compressive stress at the center of the heat source, the boss is promoted to deform, and the bottom plate can continuously contact with the heat source in the deformation process due to the arrangement of the arc-shaped convex surface, so that the heat dissipation effect of the heat dissipation device is not influenced.
In the embodiment, the heat pipe mounting structure is exemplified, the heat on the boss is transferred through the first end, and the heat is distributed to each heat radiating fin through the second end, so that the heat radiating effect and the heat radiating uniformity are further enhanced.
Drawings
FIG. 1 is a schematic perspective view of a heat dissipating device with compressive properties according to the present utility model;
FIG. 2 is a front view of a heat sink with compression resistance according to the present utility model;
FIG. 3 is an exploded view of a heat sink with compression resistance according to the present utility model;
FIG. 4 is a schematic view of the structure of the boss and the arc-shaped convex surface;
FIG. 5 is a schematic diagram of the connection of a heat pipe to a base plate;
fig. 6 is a schematic diagram of the connection of the boss to the base plate.
Detailed Description
The heat dissipating device with compression resistance as shown in fig. 1 to 4 comprises a bottom plate 1, a fin group connected to the upper end of the bottom plate 1, and a plurality of heat pipes 5 arranged on the bottom plate 1 for transferring heat between the bottom plate 1 and the fin group, wherein the fin group is composed of a plurality of heat dissipating fins 2 arranged on the upper end of the bottom plate 1 in parallel. One end of the bottom plate 1 far away from the fin group is contacted with a heat source, and heat is transferred to the fin group through the heat pipe 5, so that the heat dissipation of the electronic element is completed. The bottom of the bottom plate 1 is provided with a boss 3, and the boss 3 is provided with an arc-shaped convex surface 4 protruding out of the lower end surface of the bottom plate 1.
The present embodiment is applied to the heat dissipation field of a server CPU, and the server CPU, particularly the core of the CPU, has a heat dissipation requirement, and the CPU and the base plate 1 are usually fixed by a fastener 6 such as a spring screw. The boss 3 is mounted on the surface of the CPU, and the convex surface of the boss 3 is contacted with the core of the CPU. The base plate 1 is approximately square, the fastening pieces 6 are positioned at four corners of the base plate 1, the core of the CPU is positioned at the center of the base plate 1. When the screw is screwed, the base plate 1 generates larger compressive stress at the center of the heat source, so that the boss 3 is promoted to deform; due to the arrangement of the arc-shaped bulge surface 4, the bottom plate 1 can continuously contact with a heat source in the deformation process, and the heat dissipation effect cannot be affected. Further, as shown in fig. 6, a lower end surface of the bottom plate 1 is provided with a lower groove 7, and the boss 3 is clamped in the lower groove 7. Further, the heat pipe 5 is in contact with the upper surface of the boss 3. The boss 3 directly acts as a heat transfer member between the heat source and the heat pipe 5, maintaining good contact with the boss 3 when deformed. Further, the arc-shaped convex surface 4 is provided with heat conduction silicone grease 8 so as to enhance the heat conduction capability of the boss 3 to a heat source.
The heat pipe 5 includes a first end 9 and a second end 10, the first end 9 is connected to the bottom plate 1 and the fin group, and the second end 10 is connected between the heat dissipation fins 2. As shown in fig. 5, an upper groove 11 is formed at the upper end of the bottom plate 1, the first end 9 is embedded in the upper groove 11, the lower end of the heat radiation fin 2 is contacted with the first end 9, and the upper groove 11 can effectively fix the installation position of the heat pipe 5 and save the installation space of the heat pipe 5; a connecting hole 12 penetrating the heat dissipation fins 2 is arranged along the thickness direction of the fin group, and the second end 10 penetrates through each heat dissipation fin 2 through the connecting hole 12. The heat pipe 5 is filled with circulating liquid heat transfer medium, heat is transferred through the liquid medium, and the first end 9 is contacted with a heat source and is an evaporation end of the liquid medium; the second end 10, remote from the heat source, is the condensing end of the liquid medium; the heat transfer and exchange is completed by the circulation of the liquid medium at the evaporation end and the condensation end.
Further, a plurality of groups of bending parts 13 are arranged along the extending direction of the heat pipe 5, the bending parts 13 can be arranged on the bottom plate 1, heat at all positions of the bottom plate 1 is concentrated according to requirements, and the circulation length of liquid medium in the heat pipe 5 can be increased, so that the heat transfer efficiency of the heat pipe 5 is improved. Further, the first ends 9 of the heat pipes 5 are in contact with each other, so that heat transfer can be generated between the heat pipes 5, thereby ensuring the uniformity of heat dissipation of the heat pipes 5 and further improving the heat dissipation efficiency of the heat pipes 5. In the present embodiment, the center of the base plate 1 is the area where the heat transfer demand is highest, and therefore the heat pipes 5 are intensively disposed at the center of the base plate 1. Similarly, the connection holes 12 are located at the upper end positions of the radiator fins 2 and are uniformly arranged along the length direction of the radiator fins 2. The connecting hole 12 is arranged at the upper end position of the radiating fin 2 far away from the heat source, so that the condensation efficiency of the second end 10 can be accelerated; the connecting holes 12 are uniformly arranged in the length direction of the radiating fins 2, so that the uniformity of heat distribution of the radiating fins 2 can be maintained, and the radiating efficiency is further improved.
While embodiments of the present utility model have been shown and described above, it will be understood that the above embodiments are illustrative and not to be construed as limiting the utility model, and that variations, modifications, alternatives and variations may be made to the above embodiments by one of ordinary skill in the art within the scope of the utility model.
Claims (10)
1. The heat dissipation device with the compression resistance comprises a bottom plate, a fin group connected to the upper end of the bottom plate and a plurality of groups of heat pipes arranged on the bottom plate and used for transferring heat between the bottom plate and the fin group, wherein the fin group consists of a plurality of groups of heat dissipation fins arranged at the upper end of the bottom plate in parallel; the method is characterized in that: the bottom of the bottom plate is provided with a boss, and the boss is provided with an arc-shaped convex surface protruding out of the lower end surface of the bottom plate.
2. The heat sink with compressive properties of claim 1, wherein: the lower end face of the bottom plate is provided with a lower groove, and the boss is clamped in the lower groove.
3. The heat sink with compressive properties of claim 1, wherein: the heat pipe is contacted with the upper surface of the boss.
4. The heat sink with compressive properties of claim 1, wherein: and the arc-shaped bulge surface is provided with heat conduction silicone grease for enhancing the heat conduction capacity of the boss.
5. The heat sink with compressive properties of claim 1, wherein: the heat pipe comprises a first end and a second end, wherein the first end is connected with the bottom plate and the fin group in a contact mode, and the second end is connected between the radiating fins in a penetrating mode.
6. The heat sink with compressive properties of claim 5, wherein: the upper end of the bottom plate is provided with an upper groove, the first end is embedded in the upper groove, and the lower ends of the radiating fins are contacted with the first end.
7. The heat sink with compressive properties of claim 5, wherein: and connecting holes penetrating through the radiating fins are formed along the thickness direction of the fin group, and the second ends penetrate through the radiating fins through the connecting holes.
8. The heat sink with compressive properties of claim 5, wherein: and a plurality of groups of bending parts for increasing the circulation length of the liquid medium are arranged along the extending direction of the heat pipe.
9. The heat sink with compressive properties of claim 5, wherein: the first ends of the plurality of groups of heat pipes are in contact with each other.
10. The heat sink with compressive properties of claim 7, wherein: the connecting holes are positioned at the upper end positions of the radiating fins and are uniformly arranged along the length direction of the radiating fins.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322171888.2U CN220672570U (en) | 2023-08-14 | 2023-08-14 | Heat radiator with compression resistance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322171888.2U CN220672570U (en) | 2023-08-14 | 2023-08-14 | Heat radiator with compression resistance |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220672570U true CN220672570U (en) | 2024-03-26 |
Family
ID=90352877
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322171888.2U Active CN220672570U (en) | 2023-08-14 | 2023-08-14 | Heat radiator with compression resistance |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220672570U (en) |
-
2023
- 2023-08-14 CN CN202322171888.2U patent/CN220672570U/en active Active
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