CN105722371A - Heat conduction assembly and heat radiation device - Google Patents
Heat conduction assembly and heat radiation device Download PDFInfo
- Publication number
- CN105722371A CN105722371A CN201410738217.2A CN201410738217A CN105722371A CN 105722371 A CN105722371 A CN 105722371A CN 201410738217 A CN201410738217 A CN 201410738217A CN 105722371 A CN105722371 A CN 105722371A
- Authority
- CN
- China
- Prior art keywords
- heat
- conducting piece
- radiator
- contact surface
- conduction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention relates to a heat conduction assembly. The heat conduction assembly establishes a heat conduction path between a first radiator and a second radiator, and includes a first heat conduction member and a second heat conduction member, wherein the first heat conduction member is connected with the first radiator, and is provided with a first contact surface; and the second heat conduction member is connected with the second radiator, and is provided with a second contact surface which contacts the first contact surface. The invention also relates to a heat radiation device. The heat radiation device is provided with the first radiator, the second radiator and the heat conduction assembly. The heat conduction assembly and the heat radiation device can establish a heat conduction path between the first radiator and the second radiator through mutual contact between the first contact surface and the second contact surface, and connect the first radiator and the second radiator to enable the second radiator to enlarge and increase the heat radiation and cooling efficiency of the first radiator; and the second radiator can be closely adjacent to the first radiator, so that the overall structure is compact and does not occupy the space.
Description
Technical field
The present invention, about a kind of conduction of heat assembly, refers in particular to a kind of conduction of heat assembly for expanding radiator heat-dissipation usefulness and heat abstractor.
Background technology
On circuit substrate, various forms of radiator is generally set, to reach the effect that particular electronic component or system entirety are dispelled the heat.And circuit substrate generally also can arrange different fixed structures, fixing post, for follow-up, various additional structures are installed on circuit substrate.
The hardware unit of assembling in general main frame, for instance display card or central processing unit etc., above-mentioned hardware unit also can produce certain heat energy while running.And heat energy produced by the hardware unit in computer must flow through the heat abstractor electronic building brick to higher calorific power and dispels the heat.
Traditional heat abstractor is generally radiating fin group, by the mode that free convection, forced convertion or even water-cooled are assisted, removes the heat absorbed.When radiating fin group heat dissipation is not enough, the Main Means solving demand is exactly the mode strengthening forced convertion or water-cooled usefulness.
But, in part system, due to quiet or other demand, radiating fin group can only adopt the mode of free convection to remove the heat absorbed.If so, the heat dissipation of radiating fin group is not enough, and the radiating fin group that more renew and size is bigger solves.Aforementioned manner, can make the stock of manufacturer complicate, since it is desired that prepare different radiator stocks according to different radiating requirements.And for terminal user, if finding the problem that heat dissipation is not enough, then can only directly change radiating fin group.
Summary of the invention
In view of this, it is an object of the invention to provide a kind of conduction of heat assembly and heat abstractor, and make manufacturer or user expand, strengthen the heat dissipation of existing radiator on existing basis.
In order to reach above-mentioned purpose, the present invention provides a kind of conduction of heat assembly, and it sets up between one first radiator and one second radiator a heat conduction path；This conduction of heat assembly includes:
One first heat-conducting piece, it is connected to this first radiator, and this first heat-conducting piece has one first contact surface；And
One second heat-conducting piece, it is connected to this second radiator, and this second heat-conducting piece has one second contact surface, and this second contact surface is contacted with this first contact surface.
As the preferred version of above-mentioned a kind of conduction of heat assembly, wherein this first heat-conducting piece is arranged at the one first of this first radiator and arranges face, and this second heat-conducting piece is arranged at the one second of this second radiator and arranges face.
As the preferred version of above-mentioned a kind of conduction of heat assembly, wherein said conduction of heat assembly more comprises a fixing device, and in order to fix this first heat-conducting piece in this second heat-conducting piece, and this first contact surface is in close contact with this second contact surface.
As the preferred version of above-mentioned a kind of conduction of heat assembly, wherein said conduction of heat assembly more comprises one the 3rd heat-conducting piece, and this second heat-conducting piece is connected with this second radiator by the 3rd heat-conducting piece.
As the preferred version of above-mentioned a kind of conduction of heat assembly, wherein the 3rd heat-conducting piece is a stock body, and its one end connects this second radiator, and the other end connects this second heat-conducting piece.
As the preferred version of above-mentioned a kind of conduction of heat assembly, wherein the 3rd heat-conducting piece extends for bending.
Preferred version as above-mentioned a kind of conduction of heat assembly, wherein form a grasping part between this second heat-conducting piece and this second radiator, and this first radiator is positioned at this grasping part, and the first contact surface of this first heat-conducting piece contacts the second contact surface of this second heat-conducting piece.
As the preferred version of above-mentioned a kind of conduction of heat assembly, the 3rd heat-conducting piece is a metallic rod or a heat pipe.
In order to reach above-mentioned purpose, the present invention also provides for a kind of heat abstractor, comprises:
One first radiator, it has one first and arranges face；
One first heat-conducting piece, it is arranged at this and first arranges face and be connected to this first radiator, and this first heat-conducting piece has one first contact surface；
One second radiator, it has one second and arranges face；And
One second heat-conducting piece, it is connected to the second of this second radiator and arranges face, and this second heat-conducting piece has one second contact surface, and this second contact surface is contacted with this first contact surface.
As the preferred version of above-mentioned a kind of heat abstractor, wherein this second heat-conducting piece is arranged at this and second arranges face, and this first arranges face and second arrange face with this and face one another.
As the preferred version of above-mentioned a kind of heat abstractor, wherein said heat abstractor more comprises a fixing device, and in order to fix this first heat-conducting piece in this second heat-conducting piece, and this first contact surface is in close contact with this second contact surface.
As the preferred version of above-mentioned a kind of heat abstractor, wherein said heat abstractor more comprises one the 3rd heat-conducting piece, extends this and second arranges face, and connects this second heat-conducting piece and arrange face with the second of this second radiator.
As the preferred version of above-mentioned a kind of heat abstractor, wherein the 3rd heat-conducting piece is a stock body, and its one end connects the second of this second heat-conducting piece and arranges face, and the other end connects the 3rd heat-conducting piece.
As the preferred version of above-mentioned a kind of heat abstractor, wherein the 3rd heat-conducting piece extends for bending.
Preferred version as above-mentioned a kind of heat abstractor, wherein this first arrange face with this second arrange facing to same direction, a grasping part is formed between this second heat-conducting piece and this second radiator, and this first radiator is positioned at this grasping part, and the first contact surface of this first heat-conducting piece contacts the second contact surface of this second heat-conducting piece.
As the preferred version of above-mentioned a kind of heat abstractor, wherein this second radiator is arranged corresponding to this first side arranging face.
As the preferred version of above-mentioned a kind of heat abstractor, wherein the 3rd heat-conducting piece is a metallic rod or a heat pipe.
Conduction of heat assembly provided by the present invention and heat abstractor, by contacting with each other of the first contact surface and the second contact surface, first heat-conducting piece and the second heat-conducting piece set up a heat conduction path, and connecting the first radiator and the second radiator so that the second radiator can expand, strengthen the cooling usefulness of the first radiator；And the second radiator can be close to the first heat sink arrangements, therefore there is compactification overall structure and be not take up the feature in space.
Accompanying drawing explanation
Fig. 1 is one of exploded perspective view of first embodiment of the invention；
Fig. 2 is the two of the exploded perspective view of first embodiment of the invention；
Fig. 3 is the axonometric chart of first embodiment of the invention；
Fig. 4 is one of exploded perspective view of second embodiment of the invention；
Fig. 5 is the two of the exploded perspective view of second embodiment of the invention；
Fig. 6 is the axonometric chart of second embodiment of the invention；
Fig. 7 is one of exploded perspective view of third embodiment of the invention；
Fig. 8 is the two of the exploded perspective view of third embodiment of the invention；
Fig. 9 is the axonometric chart of third embodiment of the invention；
Figure 10 is the axonometric chart that the present invention first, second, third embodiment is implemented simultaneously.
Critical piece title:
100-the first radiator；1000-heat abstractor；101-first arranges face；
200-the second radiator；202-second arranges face；
310-the first heat-conducting piece；311-the first contact surface；320-the second heat-conducting piece；322-the second contact surface；330-the 3rd heat-conducting piece；
400-fixes device.
Detailed description of the invention
In order to above and other objects of the present invention, feature and advantage can be become apparent from, hereafter will coordinate accompanying drawing, be described in detail below.
Refer to shown in Fig. 1, Fig. 2 and Fig. 3, for a kind of heat abstractor 1000 that first embodiment of the invention is disclosed, comprise a conduction of heat assembly, one first radiator 100 and one second radiator 200.Conduction of heat assembly in order to set up a heat conduction path between the first radiator 100 and the second radiator 200, to be supplemented the deficiency of the heat dissipation of the first radiator 100 by the second radiator 200.
As shown in Figure 1, Figure 2 with shown in Fig. 3, the first radiator 100 has one first and arranges face 101, and the second radiator 200 has one second and arranges face 202.In embodiments of the invention, the first radiator 100 or the second radiator 200 are for fin slices radiator, but are not limited, and radiator also can be fin and the combination of heat pipe, the heat sink combination with heat pipe, or simple heat sink.
As shown in Figure 1, Figure 2 with shown in Fig. 3, conduction of heat assembly includes at least one first heat-conducting piece 310 and at least one second heat-conducting piece 320.
As shown in Figure 1, Figure 2 with shown in Fig. 3, the first heat-conducting piece 310 is arranged at first and arranges face 101, and is connected to the first radiator 100, and the first heat-conducting piece 310 has one first contact surface 311.
First radiator 100 is usually used as electronic component, for instance the main heat sink unit of the display chip of a display card, and is arranged on the one side of circuit board, to contact display chip.First heat-conducting piece 310 is then away from aforesaid circuit board side, in order to connect the second radiator 200 further, to be expanded the cooling usefulness of the first radiator 100 by the second radiator 200.
As shown in Figure 1, Figure 2 with shown in Fig. 3, the second heat-conducting piece 320 is connected to the second radiator 200, is particularly connected to second and arranges face 202.Second heat-conducting piece 320 has one second contact surface 322, is used for being contacted with the first contact surface 311.By contacting with each other of the first contact surface 311 and the second contact surface 322, first heat-conducting piece 310 and the second heat-conducting piece 320 set up a heat conduction path, and connecting the first radiator 100 and the second radiator 200 so that the second radiator 200 can expand, strengthen the cooling usefulness of the first radiator 100.
In first embodiment, what the first heat-conducting piece 310 was arranged at the first radiator 100 first arranges face 101, and the second heat-conducting piece 320 is directly arranged at the second of the second radiator 200 and arranges face 202, and first arranges face 101 and second and arrange face 202 and face one another.
First heat-conducting piece 310 is incorporated into the first means arranging face 101, or the second heat-conducting piece 320 is arranged at the second mode arranging face 202, it is possible to is bonding, inlay card, welding or in the way of other fixture auxiliary is fixing, but is not limited with foregoing approach.The present embodiment is disclosed be the first heat-conducting piece 310 be embedded in first the groove in face 101 is set, to be embedded in the second groove arranging face 202 be example explanation to the second heat-conducting piece 320.
As shown in Figures 1 and 2, conduction of heat assembly more comprises a fixing device 400, in order to fix the first heat-conducting piece 310 in the second heat-conducting piece 320, so that the first contact surface 311 and the second contact surface 322 are in close contact.In the present embodiment, the illustration using screw as fixing device 400, but be not limited, fixing device 400 can also be the combination of other draw-in groove and fixture block, or the heat-conducting glue that adhesion is higher.
By the configuration of first embodiment, the first radiator 100 is arranged side by side for parallel with the second radiator 200, and forms the arrangement of compactification, without additionally taking up room, and is combined as a whole, simplifies the framework expanding heat dissipation.
Refer to shown in Fig. 4, Fig. 5 and Fig. 6, for a kind of heat abstractor 1000 shown in second embodiment of the invention, comprise a conduction of heat assembly, one first radiator 100 and one second radiator 200.
As shown in Fig. 4, Fig. 5 and Fig. 6, the first radiator 100 has one first and arranges face 101, and the second radiator 200 has one second and arranges face 202.
As shown in Fig. 4, Fig. 5 and Fig. 6, conduction of heat assembly includes at least one first heat-conducting piece 310, at least one second heat-conducting piece 320 and at least one the 3rd heat-conducting piece 330.
As shown in Fig. 4, Fig. 5 and Fig. 6, the first heat-conducting piece 310 is arranged at first and arranges face 101, and is connected to the first radiator 100, and the first heat-conducting piece 310 has one first contact surface 311.3rd heat-conducting piece 330 extends second and arranges face 202, and connects the second of the second heat-conducting piece 320 and the second radiator 200 and arrange face 202 so that the second heat-conducting piece 320 is connected to the second radiator 200 indirectly by the 3rd heat-conducting piece 330.Second heat-conducting piece 320 has one second contact surface 322, is used for being contacted with the first contact surface 311.By contacting with each other of the first contact surface 311 and the second contact surface 322, the first heat-conducting piece 310 and the second heat-conducting piece 320 set up a heat conduction path.
In the second embodiment, the 3rd heat-conducting piece 330 is a stock body, can be a metallic rod or a heat pipe.One end of 3rd heat-conducting piece 330 connects the second of the second radiator 200 and arranges face 202, and the other end of the 3rd heat-conducting piece 330 connects the second heat-conducting piece 320.Meanwhile, the 3rd heat-conducting piece 330 extends for bending, and first arranges face 101 is arranged with second between face 202 as vertical so that form a grasping part between the second heat-conducting piece 320 and the second radiator 200.First radiator 100 is positioned in grasping part with display, and makes the first contact surface 311 of the first heat-conducting piece 310 contact the second contact surface 322 of the second heat-conducting piece 320.
By the configuration of the second embodiment, the first radiator 100 is arranged side by side for parallel with the second radiator 200, and forms the arrangement of compactification, without additionally taking up room, and is combined as a whole, simplifies the framework expanding heat dissipation.
Refer to shown in Fig. 7, Fig. 8 and Fig. 9, for a kind of heat abstractor 1000 shown in third embodiment of the invention, comprise a conduction of heat assembly, one first radiator 100 and one second radiator 200.
As shown in Fig. 7, Fig. 8 and Fig. 9, conduction of heat assembly includes one first heat-conducting piece 310,1 second heat-conducting piece 320 and one the 3rd heat-conducting piece 330.
3rd embodiment is roughly the same with the second embodiment, and its difference is in that, in the 3rd embodiment, and the second radiator 200 is arranged corresponding to the first side arranging face 101, and forms the first radiator 100 and the form of the second radiator 200 extension arrangement.
As shown in Figure 10, first embodiment, the second embodiment and the 3rd embodiment, it is possible to individually implement, it is also possible to combination in any is implemented, even implement three embodiments such as Figure 10 simultaneously, and form one first radiator 100 and expanded the structure of heat dissipation by second radiator 200 of more than two.And the second radiator 200 to be all next-door neighbour's the first radiator 100 configure, therefore there is compactification overall structure and be not take up the feature in space.
The above, be only presently preferred embodiments of the present invention, not thereby limits the scope of patent protection of the present invention, therefore such as uses the equalization that description of the present invention and accompanying drawing are made to change and modify, is all protection scope of the present invention and is contained.
Claims (17)
1. a conduction of heat assembly, it sets up between one first radiator and one second radiator a heat conduction path；It is characterized in that, this conduction of heat assembly includes:
One first heat-conducting piece, it is connected to this first radiator, and this first heat-conducting piece has one first contact surface；And
One second heat-conducting piece, it is connected to this second radiator, and this second heat-conducting piece has one second contact surface, and this second contact surface is contacted with this first contact surface.
2. conduction of heat assembly as claimed in claim 1, it is characterised in that this first heat-conducting piece is arranged at the one first of this first radiator and arranges face, and this second heat-conducting piece is arranged at the one second of this second radiator and arranges face.
3. conduction of heat assembly as claimed in claim 1, it is characterised in that more comprise a fixing device, in order to fix this first heat-conducting piece in this second heat-conducting piece, and this first contact surface is in close contact with this second contact surface.
4. conduction of heat assembly as claimed in claim 1, it is characterised in that more comprising one the 3rd heat-conducting piece, this second heat-conducting piece is connected with this second radiator by the 3rd heat-conducting piece.
5. conduction of heat assembly as claimed in claim 4, it is characterised in that the 3rd heat-conducting piece is a stock body, and its one end connects this second radiator, and the other end connects this second heat-conducting piece.
6. conduction of heat assembly as claimed in claim 5, it is characterised in that the 3rd heat-conducting piece extends for bending.
7. conduction of heat assembly as claimed in claim 6, it is characterized in that, form a grasping part between this second heat-conducting piece and this second radiator, and this first radiator is positioned at this grasping part, and the first contact surface of this first heat-conducting piece contacts the second contact surface of this second heat-conducting piece.
8. conduction of heat assembly as claimed in claim 5, it is characterised in that the 3rd heat-conducting piece is a metallic rod or a heat pipe.
9. a heat abstractor, it is characterised in that comprise:
One first radiator, it has one first and arranges face；
One first heat-conducting piece, it is arranged at this and first arranges face and be connected to this first radiator, and this first heat-conducting piece has one first contact surface；
One second radiator, it has one second and arranges face；And
One second heat-conducting piece, it is connected to the second of this second radiator and arranges face, and this second heat-conducting piece has one second contact surface, and this second contact surface is contacted with this first contact surface.
10. heat abstractor as claimed in claim 9, it is characterised in that this second heat-conducting piece is arranged at this and second arranges face, and this first arranges face and second arranges face with this and face one another.
11. heat abstractor as claimed in claim 9, it is characterised in that more comprise a fixing device, in order to fix this first heat-conducting piece in this second heat-conducting piece, and this first contact surface is in close contact with this second contact surface.
12. heat abstractor as claimed in claim 9, it is characterised in that more comprise one the 3rd heat-conducting piece, extend this and second face is set, and connect this second heat-conducting piece face is set with the second of this second radiator.
13. heat abstractor as claimed in claim 12, it is characterised in that the 3rd heat-conducting piece is a stock body, and its one end connects the second of this second heat-conducting piece and arranges face, and the other end connects the 3rd heat-conducting piece.
14. heat abstractor as claimed in claim 13, it is characterised in that the 3rd heat-conducting piece extends for bending.
15. heat abstractor as claimed in claim 14, it is characterized in that, this first arrange face with this second arrange facing to same direction, a grasping part is formed between this second heat-conducting piece and this second radiator, and this first radiator is positioned at this grasping part, and the first contact surface of this first heat-conducting piece contacts the second contact surface of this second heat-conducting piece.
16. heat abstractor as claimed in claim 14, it is characterised in that this second radiator is arranged corresponding to this first side arranging face.
17. heat abstractor as claimed in claim 13, it is characterised in that the 3rd heat-conducting piece is a metallic rod or a heat pipe.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410738217.2A CN105722371B (en) | 2014-12-05 | 2014-12-05 | Heat transfer assembly and heat abstractor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410738217.2A CN105722371B (en) | 2014-12-05 | 2014-12-05 | Heat transfer assembly and heat abstractor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105722371A true CN105722371A (en) | 2016-06-29 |
| CN105722371B CN105722371B (en) | 2018-03-09 |
Family
ID=56144334
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410738217.2A Active CN105722371B (en) | 2014-12-05 | 2014-12-05 | Heat transfer assembly and heat abstractor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105722371B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110278682A (en) * | 2018-03-15 | 2019-09-24 | 英研智能移动股份有限公司 | The radiating module of variable bridge joint and its electronic device of application |
| WO2022017312A1 (en) * | 2020-07-24 | 2022-01-27 | 华为数字能源技术有限公司 | Heat dissipation apparatus, inverter and electronic device |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2773902Y (en) * | 2005-03-07 | 2006-04-19 | 达隆科技股份有限公司 | Symmetric radiating module structure with heat collecting tube |
| CN101222836A (en) * | 2007-01-11 | 2008-07-16 | 杨伍民 | Direct conduction-Peltier effect refrigeration mixed cooling method and device |
| CN101316495A (en) * | 2007-06-01 | 2008-12-03 | 富准精密工业(深圳)有限公司 | Heat sink assembly |
| CN202931731U (en) * | 2012-11-07 | 2013-05-08 | 广西嵘光珈程科技发展有限公司 | Composite pipe type heat radiation apparatus |
| CN103140121A (en) * | 2011-12-02 | 2013-06-05 | 技嘉科技股份有限公司 | Heat dissipation device and adapter with same |
| CN202998766U (en) * | 2012-12-03 | 2013-06-12 | 深圳市万景华科技有限公司 | A heat dissipater |
| CN104066301A (en) * | 2013-03-22 | 2014-09-24 | 技嘉科技股份有限公司 | Heat pipe type radiator |
-
2014
- 2014-12-05 CN CN201410738217.2A patent/CN105722371B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2773902Y (en) * | 2005-03-07 | 2006-04-19 | 达隆科技股份有限公司 | Symmetric radiating module structure with heat collecting tube |
| CN101222836A (en) * | 2007-01-11 | 2008-07-16 | 杨伍民 | Direct conduction-Peltier effect refrigeration mixed cooling method and device |
| CN101316495A (en) * | 2007-06-01 | 2008-12-03 | 富准精密工业(深圳)有限公司 | Heat sink assembly |
| CN103140121A (en) * | 2011-12-02 | 2013-06-05 | 技嘉科技股份有限公司 | Heat dissipation device and adapter with same |
| CN202931731U (en) * | 2012-11-07 | 2013-05-08 | 广西嵘光珈程科技发展有限公司 | Composite pipe type heat radiation apparatus |
| CN202998766U (en) * | 2012-12-03 | 2013-06-12 | 深圳市万景华科技有限公司 | A heat dissipater |
| CN104066301A (en) * | 2013-03-22 | 2014-09-24 | 技嘉科技股份有限公司 | Heat pipe type radiator |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110278682A (en) * | 2018-03-15 | 2019-09-24 | 英研智能移动股份有限公司 | The radiating module of variable bridge joint and its electronic device of application |
| WO2022017312A1 (en) * | 2020-07-24 | 2022-01-27 | 华为数字能源技术有限公司 | Heat dissipation apparatus, inverter and electronic device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105722371B (en) | 2018-03-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US20130206367A1 (en) | Heat dissipating module | |
| KR20130111035A (en) | A heat sink bonded with pulsating heat pipe typed fins | |
| TW201304089A (en) | Bi-directional heat sink for package element and a method of fabricating the same | |
| JP2016066639A (en) | Heat sink having fins connected in different methods | |
| CN104010474A (en) | Servo amplifier having cooling structure including heat sink | |
| US20130107547A1 (en) | Heat pipe, heat dissipating module and illumination device | |
| CN105722371A (en) | Heat conduction assembly and heat radiation device | |
| CN201726633U (en) | Hollow laminar type cooling plate unit structure | |
| CN103879087A (en) | Heat-conducting copper foil | |
| CN104144591A (en) | Cooling device and server cabinet with the same | |
| CN203708743U (en) | Heating and heat dissipation apparatus of integrated camera core | |
| CN100518473C (en) | Heat radiator | |
| CN103813693A (en) | Heat dissipating device combination | |
| CN108304048B (en) | Server and solid-state storage device thereof | |
| JP6471417B2 (en) | Cooling jacket | |
| WO2016197789A1 (en) | Liquid-cooled heat sink, and processing and assembly method therefor | |
| CN103732038A (en) | Heat dissipating structure | |
| US20150159966A1 (en) | Manufacturing Method of Thermal Module | |
| CN104460909A (en) | Gap self-adaptation adjusting cold plate radiating method | |
| CN208210530U (en) | intelligent service terminal | |
| CN101661314B (en) | Radiating structure for expanding laminated plate framework | |
| TW201410127A (en) | Electronic device | |
| CN203151929U (en) | Heat radiation module | |
| CN209964221U (en) | 5G router fin | |
| CN209659703U (en) | A kind of circuit board with radiator |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |