CN103140121A - Heat dissipation device and adapter with same - Google Patents
Heat dissipation device and adapter with same Download PDFInfo
- Publication number
- CN103140121A CN103140121A CN 201210063710 CN201210063710A CN103140121A CN 103140121 A CN103140121 A CN 103140121A CN 201210063710 CN201210063710 CN 201210063710 CN 201210063710 A CN201210063710 A CN 201210063710A CN 103140121 A CN103140121 A CN 103140121A
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- Prior art keywords
- radiating fin
- heat
- storage tank
- fin modules
- radiating
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- 230000017525 heat dissipation Effects 0.000 title abstract description 10
- 238000003860 storage Methods 0.000 claims description 57
- 230000005855 radiation Effects 0.000 abstract description 8
- 230000002035 prolonged effect Effects 0.000 abstract 1
- 238000009434 installation Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 5
- 238000010276 construction Methods 0.000 description 4
- 230000000007 visual effect Effects 0.000 description 4
- 238000012545 processing Methods 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 238000010420 art technique Methods 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- NHDHVHZZCFYRSB-UHFFFAOYSA-N pyriproxyfen Chemical compound C=1C=CC=NC=1OC(C)COC(C=C1)=CC=C1OC1=CC=CC=C1 NHDHVHZZCFYRSB-UHFFFAOYSA-N 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
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Abstract
The invention relates to a heat dissipation device and an adapter with the heat dissipation device. The circuit board is provided with a chip, and the heat dissipation device is attached to the chip. The heat dissipation device comprises a first heat dissipation fin module, a heat conduction plate, a plurality of heat conduction pipes and a second heat dissipation fin module, wherein the heat conduction plate is fixedly arranged on the first heat dissipation fin module, the plurality of heat conduction pipes are respectively provided with a first end and a second end, the first ends are attached to the first heat dissipation fin module and the chip, and the second ends are attached to the heat conduction plate. The second heat radiation fin module is attached to the second end of the heat conduction pipe. The first radiating fin module and the second radiating fin module are respectively arranged on the two sides of the heat conducting plate to increase the radiating area of the radiating device, so that the radiating efficiency of the radiating device can be improved, and the service life of the adapter is prolonged.
Description
[technical field]
The present invention relates to the adapter of a kind of heat abstractor and tool heat abstractor, referred to especially a kind of heat abstractor of radiating efficiency and adapter of tool heat abstractor of increasing.
[background technology]
Along with the progress in epoch and the development of science and technology, electronic installation is more taken a favourable turn thin short and small, and the data processing speed of electronic installation increases day by day.Therefore, the chip on the circuit board of electronic installation is as central processing unit (Central Processing Unit; CPU) etc., its transistor density must increase thereupon, can speed the speed that data are processed, therefore increased electrical energy demands and the chip heat production of chip.The volume of adding chip and electronic installation is also more and more less, that is heat-dissipating space is more and more less, causes the heat energy that chip produces to be difficult for leaving.If heat energy continues to be deposited in chip, can affect the normal operation of chip, chip is burnt.So, the useful life of electronic installation thereby reduction even may damage.
Electronic installation is stable to be operated in order to allow, and extends the useful life of electronic installation, therefore must use heat abstractor to guide out rear dispersing with the heat energy of chip, therefore heat abstractor just becomes the very important design of electronic installation.At present common heat abstractor uses the radiating fin of making as the material of the tool high thermal conductivity coefficients such as aluminium mostly, by the area of dissipation of a plurality of radiating fins with the raising heat abstractor.In addition, heat abstractor is contacted with chip surface, help the thermal energy conduction of chip is dispersed to heat abstractor.Some heat abstractor even further comprises a fan, accelerates cross-ventilation between radiating fin by fan, to accelerate rate of heat dispation.
Even so, but along with the power of chip is more and more higher, the heat energy that chip produces is also more and more, and therefore the necessary heat dissipation that improves heat abstractor, just can allow a large amount of heat energy disperse.The method of present common improving heat radiation efficiency is mostly for adopting larger radiating fin, to increase area of dissipation and then improving heat radiation efficiency; Or the fan of use relatively high power, increase heat dispersion by accelerating convection current.Yet oversize radiating fin or fan can affect storing and the running of other assemblies, therefore adopt radiating fin or the fan of large-size, are not the Perfected process that solves the chip cooling problem.
[summary of the invention]
In view of above problem, the invention provides the adapter of a kind of heat abstractor and tool heat abstractor, the present invention need not strengthen the size of radiating fin, gets final product the radiating efficiency of heat radiation device and adapter, to solve the known problem that is derived.
Heat abstractor of the present invention comprises one first radiating fin modules, a thermal conduction plate, a plurality of heat pipe and one second radiating fin modules, thermal conduction plate is fixedly arranged on the first radiating fin modules, a plurality of heat pipes have respectively a first end and one second end, first end is attached at the first radiating fin modules, the second end is attached at thermal conduction plate, and the second radiating fin modules is fixedly arranged on thermal conduction plate and is attached at the second end of heat pipe.
Above-mentioned heat abstractor, wherein, the first radiating fin modules comprises a plurality of the first radiating fins, and the first radiating fin is formed with one first storage tank, and its first end is located in the first storage tank.
Above-mentioned heat abstractor, wherein the first radiating fin modules further comprises one first base plate, is attached at a side of the first radiating fin and extends to be attached in the first storage tank.
Above-mentioned heat abstractor, wherein the first radiating fin modules further comprises a bearing part, and bearing part is located at the first radiating fin and is positioned at the phase heteropleural with the first storage tank.
Above-mentioned heat abstractor, wherein the second radiating fin modules comprises a plurality of the second radiating fins, and the second radiating fin is formed with one second storage tank, and its second end is located in the second storage tank.
Above-mentioned heat abstractor, wherein the second radiating fin modules further comprises one second base plate, and the second base plate attaches a side of the second radiating fin and extends and is attached in the second storage tank.
Above-mentioned heat abstractor, wherein the second radiating fin modules further comprises a fixture, and fixture is located at the second radiating fin and is positioned at the phase heteropleural with the second storage tank.
Adapter of the present invention comprises a circuit board and a heat abstractor, circuit board has a chip, heat abstractor is attached at chip, heat abstractor comprises one first radiating fin modules, a thermal conduction plate, a plurality of heat pipe and one second radiating fin modules, thermal conduction plate is fixedly arranged on the first radiating fin modules, a plurality of heat pipes have respectively a first end and one second end, first end is attached at the first radiating fin modules, the second end is attached at thermal conduction plate and chip, and the second radiating fin modules is fixedly arranged on thermal conduction plate and is attached at the second end of heat pipe.
Above-mentioned adapter, wherein the first radiating fin modules comprises a plurality of the first radiating fins, and the first radiating fin is formed with one first storage tank, and its first end is positioned at the first storage tank.
Above-mentioned adapter, wherein the first radiating fin modules further comprises one first base plate, is attached at a side of the first radiating fin and extends to be attached in the first storage tank.
Above-mentioned adapter, wherein the first radiating fin modules further comprises a bearing part, and bearing part is located at the first radiating fin and is positioned at the phase heteropleural with the first storage tank.
Above-mentioned adapter, wherein the second radiating fin modules comprises a plurality of the second radiating fins, and the second radiating fin is formed with one second storage tank, and its second end is located in the second storage tank.
Above-mentioned adapter, wherein the second radiating fin modules further comprises one second base plate, and the second base plate attaches a side of the second radiating fin and extends and is attached in the second storage tank.
Above-mentioned adapter, wherein the second radiating fin modules further comprises a fixture, and fixture is located at the second radiating fin and is positioned at the phase heteropleural with the second storage tank.
Effect of the present invention is, by the both sides at thermal conduction plate, the first radiating fin modules and the second radiating fin modules is set respectively, with the area of dissipation of increase heat abstractor, but the radiating efficiency of heat radiation device like this, and then the useful life of increase adapter.
About feature of the present invention, implementation and effect, hereby coordinate graphicly to be described in detail as follows as most preferred embodiment.
[description of drawings]
Figure 1A is the stereogram of the heat abstractor of preferred embodiment of the present invention.
Figure 1B is the exploded view of the heat abstractor of preferred embodiment of the present invention.
Fig. 2 A is the vertical view of the first radiating fin modules of preferred embodiment of the present invention.
Fig. 2 B is the end view of the first radiating fin modules of preferred embodiment of the present invention.
Fig. 2 C is the stereogram of different visual angles of the first radiating fin modules of preferred embodiment of the present invention.
Fig. 3 A is the vertical view of the heat pipe of preferred embodiment of the present invention.
Fig. 3 B is the rearview of the heat pipe of preferred embodiment of the present invention.
Fig. 3 C is the stereogram of different visual angles of the heat pipe of preferred embodiment of the present invention.
Fig. 4 A is the upward view of the second radiating fin modules of preferred embodiment of the present invention.
Fig. 4 B is the stereogram of the second radiating fin modules of preferred embodiment of the present invention.
Fig. 4 C is the end view of the second radiating fin modules of preferred embodiment of the present invention.
Fig. 5 A is that the group of the heat abstractor of preferred embodiment of the present invention is established schematic diagram.
Fig. 5 B is that the group of the heat abstractor of preferred embodiment of the present invention is established schematic diagram.
Fig. 6 A is the stereogram of the adapter of preferred embodiment of the present invention.
Fig. 6 B is the exploded view of the adapter of preferred embodiment of the present invention.
Fig. 6 C is that the group of the adapter of preferred embodiment of the present invention is established schematic diagram.
The primary clustering symbol description:
100 heat abstractor 110 first radiating fin modules
112 first radiating fin 1,122 first storage tanks
114 first base plate 116 bearing parts
120 thermal conduction plate 130 heat pipes
132 first end 134 second ends
140 second radiating fin modules 142 second radiating fins
1,422 second storage tank 144 second base plates
146 fixture 200 adapters
210 circuit board 212 chips
[embodiment]
Figure 1A and Figure 1B are stereogram and the exploded view of the heat abstractor of preferred embodiment of the present invention.As shown in the figure, heat abstractor 100 of the present invention comprises one first radiating fin modules 110, a thermal conduction plate 120, a plurality of heat pipe 130 and one second radiating fin modules 140, thermal conduction plate 120 is fixedly arranged on the first radiating fin modules 110, a plurality of heat pipes 130 have respectively a first end 132 and one second end 134, first end 132 is attached at the first radiating fin modules 110, the second end 134 is attached at the second end 134 that thermal conduction plate 120, the second radiating fin modules 140 are fixedly arranged on thermal conduction plate 120 and are attached at heat pipe 130.
When wish is used heat abstractor 100 of the present invention, the first end 132 of heat pipe 130 is attached at thermal source, the heat energy of thermal source is absorbed by the first end 132 of heat pipe 130.The heat energy of a part conducts to the first radiating fin modules 110 by first end 132, leaves with the heat energy with its part by the first radiating fin modules 110.The heat energy of another part conducts to the second end 134 by first end 132, conduct to thermal conduction plate 120 by the second end 134 again, thermal conduction plate 120 is then with thermal energy conduction to the first radiating fin modules 110 and the second radiating fin modules 140, leaves by the first radiating fin modules 110 and the second radiating fin modules 140 heat energy with its another part.The present invention arranges respectively the first radiating fin modules 110 and the second radiating fin modules 140 in the both sides of thermal conduction plate 120, with the area of dissipation of increase heat abstractor 100, but the radiating efficiency of heat radiation device 100 like this.
Fig. 2 A, Fig. 2 B and Fig. 2 C are the stereogram of vertical view, end view and different visual angles of the first radiating fin modules of preferred embodiment of the present invention.As shown in the figure, first radiating fin modules 110 of the present embodiment comprises a plurality of the first radiating fins 112, the first radiating fin 112 is formed with one first storage tank 1122, and the first end 132 of heat pipe 130 is located in the first storage tank 1122, a plurality of the first radiating fins 112 is fixed in the first end 132 of heat pipe 130 in the mode of welding.Like this can allow the heat energy of heat pipe 130 conduct to the first radiating fin 112 by first end 132.In addition, heat pipe 130 is circular body, in order further to increase the heat conduction efficiency between heat pipe 130 and the first radiating fin 112, therefore allow the section shape of the first storage tank 1122 be semicircle, so can allow the first end 132 of heat pipe 130 be close to the sidewall of the first storage tank 1122, not only increase the contact area of first end 132 and first radiating fin 112 of heat pipe 130, and further increase the convenience when heat pipe 130 and the first radiating fin 112 are installed.Will be appreciated that, the present embodiment be section shape take the first storage tank 1122 as semicircle as example, yet the section shape of the first storage tank 1122 can determine according to actual demand, also can coordinate heat pipe 130 and is arbitrary polygon.
In addition, first radiating fin modules 110 of the present embodiment further comprises one first base plate 114, the first base plates 114 and is attached at a side of each the first radiating fin 112 and extends and be attached in the first storage tank 1122.Intensity when the first base plate 114 not only helps to increase by the first radiating fin 112 with heat pipe 130 combination, and then increase the overall construction intensity of the first radiating fin modules 110, and can increase the area of dissipation of the first radiating fin modules 110, therefore increase the radiating efficiency of the first radiating fin modules 110.
Again, first radiating fin modules 110 of the present embodiment further comprises a bearing part 116, and bearing part 116 is used for arranging thermal conduction plate 120.Bearing part 116 is located at each first radiating fin 112 and is positioned at the phase heteropleural with the first storage tank 1122.Bearing part 116 also helps to increase overall construction intensity and the area of dissipation of the first radiating fin modules 110, and then increases the radiating efficiency of the first radiating fin modules 110.
Fig. 3 A, Fig. 3 B and Fig. 3 C are the stereogram of vertical view, rearview and the different visual angles of the heat pipe of preferred embodiment of the present invention.As shown in the figure, the present embodiment is take 6 heat pipes 130 as example, and we also can increase and decrease according to actual demand the quantity of heat pipe 130.The heat pipe 130 of the present embodiment presents the ㄈ font, and each heat pipe 130 has first end 132 and the second end 134, and when using a plurality of heat pipe 130, the spacing of adjacent first end 132 is less than the spacing of the second adjacent end 134.The first end 132 of heat pipe 130 is arranged in thermal source, and most thermals source are all less than heat abstractor 100, and the therefore necessary intensive arrangement of first end 132 of adjacent heat pipe 130 is to absorb more heat energy.And after the first end 132 of heat pipe 130 absorbs heat energy, will conduct to the second end 134 of heat pipe 130.In order further to allow heat energy distribution get evenly, the distance of the second adjacent end 134 can be strengthened, the spacing by making the second adjacent end 134 is greater than the spacing of adjacent first end 132, and heat pipe 130 just is arranged in radial.So, heat energy scatters in radial mode by heat pipe 130, can increase the radiating efficiency of heat abstractor 100.
In addition, the present embodiment makes first end 132 flattenings of heat pipe 130, that is the section shape of the first end 132 of heat pipe 130 is semicircle.Therefore, when first end 132 is connected in thermal source, can make the semicircular tabular surface of first end 132 prop up thermal source, steadiness during with increase heat abstractor 100 and combinations of sources of heat, first end 132 and the contact area of thermal source are promoted, so can increase the heat transfer efficiency of heat pipe 130, and further increase the radiating efficiency of heat abstractor 100.In like manner, also can make the second end 134 flattenings of heat pipe 130, the section shape of the second end 134 of heat pipe 130 becomes semicircle, semicircular tabular surface with the second end 134 is butted on thermal conduction plate 120 again, so can increase the contact area of the second end 134 with the thermal conduction plate 120 of heat pipe 130, and then the heat transfer efficiency of lifting heat pipe 130, to increase the radiating efficiency of heat abstractor 100.
Fig. 4 A, Fig. 4 B and Fig. 4 C are upward view, stereogram and the end view of the second radiating fin modules of preferred embodiment of the present invention.As shown in the figure, second radiating fin modules 140 of the present embodiment comprises a plurality of the second radiating fin 142, the second radiating fins 142 and is formed with one second storage tank 1422, and the second end 134 of heat pipe 130 is located in each second storage tank 1422.The section shape of the second storage tank 1422 is semicircle, so is located at the second storage tank 1422 when interior, 134 sidewalls that can be close to the second storage tank 1422 of the second end of heat pipe 130 when the second end 134 of heat pipe 130.So, the convenience when making up except increasing heat pipe 130 and the second radiating fin 142, also can further increase the contact area of heat pipe 130 and the second radiating fin 142 simultaneously, and then increase the heat transfer efficiency of heat pipe 130.In addition, though the present embodiment take the section shape of the second storage tank 1422 as semicircle as example, the section shape of the second storage tank 1422 can be decided according to real demand, maybe can coordinate heat pipe 130 and is arbitrary polygon.
Second radiating fin modules 140 of the present embodiment further comprises one second base plate 144, the second base plates 144 and is attached at a side of each the second radiating fin 142 and extends and be attached in the second storage tank 1422.Intensity when the second base plate 144 not only can increase by the second radiating fin 142 with heat pipe 130 combination, and then increase the overall construction intensity of the second radiating fin modules 140, and can increase the area of dissipation of the second radiating fin modules 140, therefore increase the radiating efficiency of the second radiating fin modules 140.
In addition, the second radiating fin modules 140 further comprises a fixture 146, and each second radiating fin 142 all is provided with fixture 146, and it is positioned at the phase heteropleural with the second storage tank 1422.Fixture 146 can further increase the overall construction intensity of the second radiating fin modules 140, and increases the area of dissipation of the second radiating fin modules 140, and then improves the radiating efficiency of the second radiating fin modules 140.
Fig. 5 A and Fig. 5 B are that the group of the heat abstractor of preferred embodiment of the present invention is established schematic diagram.As shown in the figure, when the wish group is established heat abstractor 100 of the present invention, at first with welding manner, thermal conduction plate 120 is arranged at the first radiating fin modules 110, as shown in Fig. 5 A, first end 132 with a plurality of heat pipes 130 is arranged in the first storage tank 1122 of the first radiating fin modules 110 again, and is welded and fixed.After this, the second radiating fin modules 140 is fixedly arranged on thermal conduction plate 120, and allows the second end 134 of heat pipe 130 be arranged in the second storage tank 1422 of the second radiating fin 142, as shown in Fig. 5 B, so complete heat abstractor 100.
In addition, also can adopt another way combination heat abstractor 100 of the present invention.First thermal conduction plate 120 is fixedly arranged on the first radiating fin modules 110, again with the first storage tank 1122 and the interior coating welding of the second storage tank 1422 tin cream, then the second radiating fin modules 140 is positioned over the second radiating fin modules 140 tops, and first end 132 and second end 134 of heat pipe 130 are worn respectively the first storage tank 1122 and the second storage tank 1422, then heat heat abstractor 100, make heat pipe 130 fluid-tight engagement in the first radiating fin modules 110 and the second radiating fin modules 140.
Fig. 6 A, Fig. 6 B and Fig. 6 C are that stereogram, exploded view and the group of the adapter with heat abstractor of preferred embodiment of the present invention established schematic diagram.As shown in the figure, adapter 200 comprises a circuit board 210 and a heat abstractor 100, circuit board 210 is the circuit board of common display card, circuit board of sound card etc., the adapter 200 of the present embodiment is to explain take display card as example, therefore circuit board 210 is the circuit board of display card, and the present embodiment is not as limit.Circuit board 210 has a chip 212, and 100 of heat abstractors are mounted on chip 212.When heat abstractor 100 is mounted on chip 212, can make the first end 132 of heat pipe 130 aim at chip 212, as shown in Fig. 6 B, then the first end 132 with heat pipe 130 is attached at chip 212.Can be in chip 212 or the first end of heat pipe 130 132 coating thermal greases when being sticked, the heat energy of chip 212 can conduct to the first end 132 of heat pipe 130 comparatively rapidly.When chip 212 adstante febres, heat pipe 130 is with thermal energy conduction to the first radiating fin modules 110 of chip 212 parts, and the heat energy of another part conducts to thermal conduction plate 120, and thermal conduction plate 120 is again with 140 heat radiations of thermal energy conduction to the second radiating fin modules.The mode of the first radiating fin modules 110 and the second radiating fin modules 140 is set by the both sides at thermal conduction plate 120, can increase the area of dissipation of heat abstractor 100, but the useful life of so radiating efficiency of heat radiation device 100, and then increase adapter 200.
Although embodiments of the invention disclose as mentioned above; be not so to limit the present invention; anyly have the knack of related art techniques person; without departing from the spirit and scope of the present invention; such as according to the described shape of claim of the present invention, structure, feature and quantity when can do a little change, therefore right protection scope of the present invention must be looked the appended claim scope person of defining of this specification and is as the criterion.
Claims (14)
1. a heat abstractor, is characterized in that, described heat abstractor comprises:
One first radiating fin modules;
One thermal conduction plate is fixedly arranged on described the first radiating fin modules;
A plurality of heat pipes respectively have a first end and one second end, and described first end is attached at described the first radiating fin modules, and described the second end is attached at described thermal conduction plate; And
One second radiating fin modules is fixedly arranged on described thermal conduction plate and is attached at described second end of described heat pipe.
2. according to 1 described heat abstractor of claim the, it is characterized in that, described the first radiating fin modules comprises a plurality of the first radiating fins, and described the first radiating fin is formed with one first storage tank, and described first end is located in described the first storage tank.
3. according to 2 described heat abstractors of claim the, it is characterized in that, described the first radiating fin modules further comprises one first base plate, and described the first base plate attaches a side of described the first radiating fin and extends and is attached in described the first storage tank.
4. according to 2 described heat abstractors of claim the, it is characterized in that, described the first radiating fin modules further comprises a bearing part, and described bearing part is located at described the first radiating fin and is positioned at the phase heteropleural with described the first storage tank.
5. according to 1 described heat abstractor of claim the, it is characterized in that, described the second radiating fin modules comprises a plurality of the second radiating fins, and described the second radiating fin is formed with one second storage tank, and described the second end is located in described the second storage tank.
6. according to 5 described heat abstractors of claim the, it is characterized in that, described the second radiating fin modules further comprises one second base plate, and described the second base plate attaches a side of described the second radiating fin and extends and is attached in described the second storage tank.
7. according to 5 described heat abstractors of claim the, it is characterized in that, described the second radiating fin modules further comprises a fixture, and described fixture is located at described the second radiating fin and is positioned at the phase heteropleural with described the second storage tank.
8. the adapter with heat abstractor, is characterized in that, described adapter comprises:
One circuit board has a chip;
One heat abstractor is attached at described chip, and described heat abstractor comprises;
One first radiating fin modules;
One thermal conduction plate is fixedly arranged on described the first radiating fin modules;
A plurality of heat pipes have respectively a first end and one second end, and described first end is attached at described the first radiating fin modules and described chip, and described the second end is attached at described thermal conduction plate; And
One second radiating fin modules is fixedly arranged on described thermal conduction plate and is attached at described second end of described heat pipe.
9. according to 8 described adapters of claim the, it is characterized in that, described the first radiating fin modules comprises a plurality of the first radiating fins, and described the first radiating fin is formed with one first storage tank, and described first end is located in described the first storage tank.
10. according to 9 described adapters of claim the, it is characterized in that, described the first radiating fin modules further comprises one first base plate, and described the first base plate attaches a side of described the first radiating fin and extends and is attached in described the first storage tank.
11. according to 9 described adapters of claim the, it is characterized in that, described the first radiating fin modules further comprises a bearing part, described bearing part is located at described the first radiating fin and is positioned at the phase heteropleural with described the first storage tank.
12. according to 8 described adapters of claim the, it is characterized in that, described the second radiating fin modules comprises a plurality of the second radiating fins, described the second radiating fin is formed with one second storage tank, and described the second end is located in described the second storage tank.
13. according to 12 described adapters of claim the, it is characterized in that, described the second radiating fin modules further comprises one second base plate, described the second base plate attaches a side of described the second radiating fin and extends and is attached in described the second storage tank.
14. according to 12 described adapters of claim the, it is characterized in that, described the second radiating fin modules further comprises a fixture, described fixture is located at described the second radiating fin and is positioned at the phase heteropleural with described the second storage tank.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW100144539A TW201324095A (en) | 2011-12-02 | 2011-12-02 | Heat dissipation device and interface card with the same |
| TW100144539 | 2011-12-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103140121A true CN103140121A (en) | 2013-06-05 |
Family
ID=48499239
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201210063710 Pending CN103140121A (en) | 2011-12-02 | 2012-03-12 | Heat dissipation device and adapter with same |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN103140121A (en) |
| TW (1) | TW201324095A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105722371A (en) * | 2014-12-05 | 2016-06-29 | 技嘉科技股份有限公司 | Heat conduction assembly and heat radiation device |
| CN115940616B (en) * | 2023-03-10 | 2023-05-09 | 深圳市澳博森科技有限公司 | Automatic overheat protection method and device for power adapter and intelligent power adapter |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11867467B2 (en) | 2015-07-14 | 2024-01-09 | Furukawa Electric Co., Ltd. | Cooling device with superimposed fin groups |
| JP6117288B2 (en) | 2015-07-14 | 2017-04-19 | 古河電気工業株式会社 | Cooling system |
-
2011
- 2011-12-02 TW TW100144539A patent/TW201324095A/en unknown
-
2012
- 2012-03-12 CN CN 201210063710 patent/CN103140121A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105722371A (en) * | 2014-12-05 | 2016-06-29 | 技嘉科技股份有限公司 | Heat conduction assembly and heat radiation device |
| CN105722371B (en) * | 2014-12-05 | 2018-03-09 | 技嘉科技股份有限公司 | Heat transfer assembly and heat abstractor |
| CN115940616B (en) * | 2023-03-10 | 2023-05-09 | 深圳市澳博森科技有限公司 | Automatic overheat protection method and device for power adapter and intelligent power adapter |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201324095A (en) | 2013-06-16 |
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