CN104460909A - Gap self-adaptation adjusting cold plate radiating method - Google Patents
Gap self-adaptation adjusting cold plate radiating method Download PDFInfo
- Publication number
- CN104460909A CN104460909A CN201410786107.3A CN201410786107A CN104460909A CN 104460909 A CN104460909 A CN 104460909A CN 201410786107 A CN201410786107 A CN 201410786107A CN 104460909 A CN104460909 A CN 104460909A
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- CN
- China
- Prior art keywords
- heat sink
- cold drawing
- casing
- circuit board
- flexible member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/203—Heat conductive hinge
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- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a gap self-adaptation adjusting cold plate radiating method. The method is characterized in that one part of the shell of a computer is separated to serve as a radiating plate, and an elastic element is added between the shell and the radiating plate; a circuit board is mounted on a cold plate, and the heating elements on the circuit board attach to the cold plate to transmit heat to the cold plate; the elastic element is free when the circuit board and the cold plate are not inserted into a computer case; when the circuit board and the cold plate are inserted into the computer case, the cold plate is in contact with the radiating plate and presses the radiating plate upwardly, and the elastic element is compressed to generate elastic force so as to automatically eliminate the gap between the radiating plate and the cold plate. By the method, the gap between the radiating plate and the cold plate is adjusted in a self-adaptation manner, and human intervention is not needed.
Description
Technical field
The present invention relates to computer to dissipate heat field, be specifically related to a kind of gap Automatic adjusument cold drawing heat dissipating method.
Technical background
Military computer is applied in rugged surroundings more, the request for utilization under demand fulfillment high temperature, especially full reinforced CPCI framework computing machine, and heat density is large, a heat radiation technical barrier especially.The mode of traditional use cold drawing heat loss through conduction, be limited to the machining precision of cold drawing, casing, its flatness, roughness cannot ensure, use for ease of board plug in addition, certain gap to be reserved between cold drawing and casing, cause thermal contact resistance comparatively large, the reliability that these factors result in heat radiation is lower.
Summary of the invention
The technical problem to be solved in the present invention is: provide a kind of gap Automatic adjusument cold drawing heat dissipating method.
The technical solution adopted in the present invention is:
A kind of gap Automatic adjusument cold drawing heat dissipating method, isolates the heat sink that a part is used for externally heat radiation, and increase flexible member between casing and heat sink by the casing of computing machine; Circuit board is installed on cold drawing, and the heater element on it and cold drawing are fitted, and conduct heat on cold drawing; When circuit board and cold drawing do not insert cabinet, flexible member is in free state, when circuit board and cold drawing insert cabinet, cold drawing contacts with heat sink, and upwards heat sink is pressed on top, and flexible member is compressed, produce elastic force, automatically eliminate the gap between heat sink and cold drawing.
Position near heat sink in cabinet is provided with guide-rail plate, and the space between guide-rail plate and casing is used for mounting circuit boards, and described circuit board and cold drawing insert cabinet by guide-rail plate.
During flexible member free state, heat sink is positioned at the side of deflection guide-rail plate, and when circuit board inserts cabinet, heat sink can be pushed to inclined casing side, this makes flexible member be in compressive state, eliminates the gap between cold drawing and heat sink, realizes fitting tightly.
Described casing outer surface has an opening, the shape of heat sink is suitable with opening shape, and the outer surface edge of casing opening is stretched out, and heat sink just in time snaps in opening from the inside, and the edge be extended blocks, flexible member be arranged at stretch out between edge and heat sink edge.
A kind of gap Automatic adjusument cold drawing heat abstractor, the structure of described heat abstractor comprises casing, casing outer surface has an opening, shape and the opening shape of heat sink are suitable, the outer surface edge of casing opening is stretched out, heat sink just in time snaps in opening from the inside, and the edge be extended blocks, flexible member be arranged at stretch out between edge and heat sink edge; The position of casing and heat sink is provided with guide-rail plate in cabinet, the space between guide-rail plate and casing is used for mounting circuit boards, and the cold drawing having installed circuit board inserts cabinet by guide-rail plate; When circuit board and cold drawing do not insert cabinet, flexible member is in free state, and when circuit board and cold drawing insert cabinet, cold drawing contacts with heat sink, and upwards heat sink is pressed on top, and flexible member is compressed.
Flexible member (as spring etc.) is installed between casing and heat sink, comes the gap between regulating circuit plate and guide-rail plate by the distortion of flexible member.
Beneficial effect of the present invention is: adopt technology of the present invention, and the gap between heat sink and cold drawing is Automatic adjusument, without the need to human intervention.
Accompanying drawing explanation
Fig. 1 is structural representation of the present invention;
Description of reference numerals: 1, circuit board, 2, cold drawing, 3, heat sink, 4, flexible member, 5, casing, 6, guide-rail plate.
Embodiment
With reference to the accompanying drawings, by embodiment, the present invention is further described:
Embodiment 1:
A kind of gap Automatic adjusument cold drawing heat dissipating method, isolates the heat sink 3 that a part is used for externally heat radiation, and increase flexible member 4 between casing 5 and heat sink 3 by the casing 5 of computing machine; Circuit board 1 is installed on cold drawing 2, and the heater element on it and cold drawing are fitted, and conduct heat on cold drawing; When circuit board 1 and cold drawing 2 do not insert cabinet, flexible member is in free state, when circuit board and cold drawing insert cabinet, cold drawing contacts with heat sink, and upwards heat sink is pressed on top, and flexible member 4 is compressed, produce elastic force, automatically eliminate the gap between heat sink and cold drawing.
Embodiment 2:
On the basis of embodiment 1, the position near heat sink in the present embodiment cabinet is provided with guide-rail plate 6, and the space between guide-rail plate 6 and casing 5 is used for mounting circuit boards 1, and described circuit board 1 and cold drawing 2 insert cabinet by guide-rail plate 6.
During flexible member free state, heat sink is positioned at the side of deflection guide-rail plate, and when circuit board inserts cabinet, heat sink can be pushed to inclined casing side, this makes flexible member be in compressive state, eliminates the gap between cold drawing and heat sink, realizes fitting tightly.
Embodiment 3:
On the basis of embodiment 1 or 2, described in the present embodiment, casing 5 outside surface has an opening, shape and the opening shape of heat sink 3 are suitable, the outer surface edge of casing opening is stretched out, heat sink just in time snaps in opening from the inside, and the edge be extended blocks, flexible member 4 be arranged at stretch out between edge and heat sink edge.
Embodiment 4:
On the basis of embodiment 1,2,3, a kind of gap of the present embodiment Automatic adjusument cold drawing heat abstractor, the structure of described heat abstractor comprises casing, casing outer surface has an opening, the shape of heat sink is suitable with opening shape, and the outer surface edge of casing opening is stretched out, and heat sink just in time snaps in opening from the inside, and the edge be extended blocks, flexible member be arranged at stretch out between edge and heat sink edge; The position of casing and heat sink is provided with guide-rail plate in cabinet, the space between guide-rail plate and casing is used for mounting circuit boards, and the cold drawing having installed circuit board inserts cabinet by guide-rail plate; When circuit board and cold drawing do not insert cabinet, flexible member is in free state, and when circuit board and cold drawing insert cabinet, cold drawing contacts with heat sink, and upwards heat sink is pressed on top, and flexible member is compressed.
Flexible member (as spring etc.) is installed between casing and heat sink, comes the gap between regulating circuit plate and guide-rail plate by the distortion of flexible member.
Above embodiment is only for illustration of the present invention; and be not limitation of the present invention; the those of ordinary skill of relevant technical field; without departing from the spirit and scope of the present invention; can also make a variety of changes and modification; therefore all equivalent technical schemes also belong to category of the present invention, and scope of patent protection of the present invention should be defined by the claims.
Claims (4)
1. a gap Automatic adjusument cold drawing heat dissipating method, is characterized in that: the casing of computing machine is isolated the heat sink that a part is used for externally heat radiation, and increase flexible member between casing and heat sink; Circuit board is installed on cold drawing, and the heater element on it and cold drawing are fitted, and conduct heat on cold drawing; When circuit board and cold drawing do not insert cabinet, flexible member is in free state, when circuit board and cold drawing insert cabinet, cold drawing contacts with heat sink, and upwards heat sink is pressed on top, and flexible member is compressed, produce elastic force, automatically eliminate the gap between heat sink and cold drawing.
2. a kind of gap according to claim 1 Automatic adjusument cold drawing heat dissipating method, it is characterized in that: the position near heat sink in cabinet is provided with guide-rail plate, space between guide-rail plate and casing is used for mounting circuit boards, and described circuit board and cold drawing insert cabinet by guide-rail plate; During flexible member free state, heat sink is positioned at the side of deflection guide-rail plate, and when circuit board inserts cabinet, heat sink can be pushed to inclined casing side, this makes flexible member be in compressive state, eliminates the gap between cold drawing and heat sink, realizes fitting tightly.
3. a kind of gap according to claim 1 and 2 Automatic adjusument cold drawing heat dissipating method, it is characterized in that: described casing outer surface has an opening, shape and the opening shape of heat sink are suitable, the outer surface edge of casing opening is stretched out, heat sink just in time snaps in opening from the inside, and the edge be extended blocks, flexible member be arranged at stretch out between edge and heat sink edge.
4. a kind of gap Automatic adjusument cold drawing heat abstractor according to claim 1,2,3, it is characterized in that: the structure of described heat abstractor comprises casing, casing outer surface has an opening, shape and the opening shape of heat sink are suitable, the outer surface edge of casing opening is stretched out, heat sink just in time snaps in opening from the inside, and the edge be extended blocks, flexible member be arranged at stretch out between edge and heat sink edge; The position of casing and heat sink is provided with guide-rail plate in cabinet, the space between guide-rail plate and casing is used for mounting circuit boards, and the cold drawing having installed circuit board inserts cabinet by guide-rail plate; When circuit board and cold drawing do not insert cabinet, flexible member is in free state, and when circuit board and cold drawing insert cabinet, cold drawing contacts with heat sink, and upwards heat sink is pressed on top, and flexible member is compressed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410786107.3A CN104460909B (en) | 2014-12-18 | 2014-12-18 | A kind of gap automatic adjusument cold plate heat dissipating method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410786107.3A CN104460909B (en) | 2014-12-18 | 2014-12-18 | A kind of gap automatic adjusument cold plate heat dissipating method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104460909A true CN104460909A (en) | 2015-03-25 |
| CN104460909B CN104460909B (en) | 2018-05-18 |
Family
ID=52907117
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410786107.3A Active CN104460909B (en) | 2014-12-18 | 2014-12-18 | A kind of gap automatic adjusument cold plate heat dissipating method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104460909B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106020400A (en) * | 2016-07-01 | 2016-10-12 | 山东超越数控电子有限公司 | CPCI module cooling method |
| CN109032310A (en) * | 2018-08-28 | 2018-12-18 | 山东超越数控电子股份有限公司 | A kind of pluggable board heat dissipating method using heat conducting film |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2870410Y (en) * | 2006-01-05 | 2007-02-14 | 英业达股份有限公司 | Radiating structure |
| CN101452327A (en) * | 2007-12-06 | 2009-06-10 | 英业达股份有限公司 | Fixing device |
| CN201435040Y (en) * | 2009-03-31 | 2010-03-31 | 上海研祥智能科技有限公司 | Radiator of industrial computer |
| US20130308271A1 (en) * | 2012-05-17 | 2013-11-21 | Debabrata Pal | Two-phase electronic component cooling arrangement |
| CN103814451A (en) * | 2011-10-05 | 2014-05-21 | 株式会社Kelk | Thermoelectric generator |
-
2014
- 2014-12-18 CN CN201410786107.3A patent/CN104460909B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2870410Y (en) * | 2006-01-05 | 2007-02-14 | 英业达股份有限公司 | Radiating structure |
| CN101452327A (en) * | 2007-12-06 | 2009-06-10 | 英业达股份有限公司 | Fixing device |
| CN201435040Y (en) * | 2009-03-31 | 2010-03-31 | 上海研祥智能科技有限公司 | Radiator of industrial computer |
| CN103814451A (en) * | 2011-10-05 | 2014-05-21 | 株式会社Kelk | Thermoelectric generator |
| US20130308271A1 (en) * | 2012-05-17 | 2013-11-21 | Debabrata Pal | Two-phase electronic component cooling arrangement |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106020400A (en) * | 2016-07-01 | 2016-10-12 | 山东超越数控电子有限公司 | CPCI module cooling method |
| CN106020400B (en) * | 2016-07-01 | 2018-12-14 | 山东超越数控电子有限公司 | A kind of CPCI module heat dissipating method |
| CN109032310A (en) * | 2018-08-28 | 2018-12-18 | 山东超越数控电子股份有限公司 | A kind of pluggable board heat dissipating method using heat conducting film |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104460909B (en) | 2018-05-18 |
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| C06 | Publication | ||
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| C10 | Entry into substantive examination | ||
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 250100 No. 2877 Kehang Road, Sun Village Town, Jinan High-tech District, Shandong Province Patentee after: SHANDONG CHAOYUE DATA CONTROL ELECTRONICS Co.,Ltd. Address before: 250100 No. 2877 Kehang Road, Sun Village Town, Jinan High-tech District, Shandong Province Patentee before: SHANDONG CHAOYUE NUMERICAL CONTROL ELECTRONIC Co.,Ltd. |
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| CP01 | Change in the name or title of a patent holder | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20190425 Address after: 250100 No. 2877 Kehang Road, Sun Village Town, Jinan High-tech District, Shandong Province Co-patentee after: BEIJING MECHANICAL AND ELECTRICAL ENGINEERING GENERAL DESIGN DEPARTMENT Patentee after: SHANDONG CHAOYUE DATA CONTROL ELECTRONICS Co.,Ltd. Address before: 250100 No. 2877 Kehang Road, Sun Village Town, Jinan High-tech District, Shandong Province Patentee before: SHANDONG CHAOYUE DATA CONTROL ELECTRONICS Co.,Ltd. |
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| TR01 | Transfer of patent right |