TWI537567B - Electronic load testing device - Google Patents

Description

Electronic load test device

The invention relates to an electronic load testing device, in particular to an electronic load testing device for improving heat dissipation efficiency.

The electronic load test device includes a single channel model and a multi-channel model. The single channel model allows testing of the object under test in a single channel. Multi-channel models can be tested in multiple single-channel test objects or in multi-channel test objects. Therefore, for users with multi-channel testing requirements, the cost of testing with multi-channel models is actually less than the cost of testing with single-channel models.

The dual-channel model includes at least two load circuit modules and a heat sink, and the two load circuit modules conduct heat to the heat sink to reduce the operating temperature of the two-load circuit module. However, in order to prevent the two load circuit modules from contacting the heat sink together, the circuit of the two negative circuit modules interferes with each other, and a layer of heat conductive insulation material is generally sandwiched between the load circuit module and the heat sink. However, no matter how good the thermal conductivity of the thermal insulation material is, the heat dissipation effect of the insulating circuit between the load circuit and the heat sink is that the heat dissipation effect of the direct contact between the load circuit and the heat sink cannot be exceeded.

Therefore, how to improve the heat conduction performance between the load circuit module and the heat sink, and thus reduce the operating temperature of the load circuit module will be one of the problems that the researcher should start.

The present invention provides an electronic load testing device for improving thermal conduction between a load circuit module and a heat sink by separating a conventional load circuit module from a heat sink through an insulating sheet. Poor problem.

The electronic load testing device disclosed in the present invention comprises a casing, a connection interface component, a first load circuit component, a first heat dissipation component and an insulation component. The connection interface component is disposed on the outer casing and electrically insulated from the outer casing. The first load circuit component includes a first circuit board and a plurality of first load wafers. The first circuit board is electrically connected to the connection interface component. The first load wafer is electrically connected to the first circuit board. The first heat dissipating component is located within the outer casing, and the first load wafers are in direct thermal contact with the first heat dissipating component. The first heat dissipating component is coupled to the outer casing through the insulating component to electrically insulate the first heat dissipating component from the outer casing.

According to the electronic load testing device disclosed in the above invention, for the single-channel model, since the heat dissipating component is electrically insulated from the outer casing, the insulating wafer is not required to be separated between the supporting wafer and the heat dissipating component, so that the load wafer can be directly thermally contacted. The heat sink component further enhances the heat transfer performance between the load circuit component and the heat sink component, and reduces the operating temperature of the load circuit module.

Moreover, since the load component can directly contact the heat dissipating component, the load component can be directly locked to the heat dissipating component. In this way, in addition to the cost of reducing the insulation sheet, it is not necessary to additionally provide a complicated clamping member to fix the load wafer to the heat dissipation assembly.

The above description of the present invention and the following description of the embodiments are intended to illustrate and explain the principles of the invention, and to provide a further explanation of the scope of the invention.

10‧‧‧Electronic load test device

100‧‧‧ Shell

110‧‧‧First housing

120‧‧‧second housing

200‧‧‧Connecting interface components

210‧‧‧First electrical connection group

220‧‧‧Second electrical connection group

300‧‧‧First load circuit assembly

310‧‧‧First board

311‧‧‧First electrical contact group

320‧‧‧First load wafer

400‧‧‧Second load circuit assembly

410‧‧‧Second circuit board

411‧‧‧Second electrical contact group

420‧‧‧Second load wafer

500‧‧‧First heat sink assembly

510‧‧‧ first board

520‧‧‧Second board

521‧‧‧ surface

530‧‧‧First fin

500’‧‧‧First heat sink

510’‧‧‧ first board

520’‧‧‧Second board

530’‧‧‧ third board

540’‧‧‧First Fin

600‧‧‧Second heat sink

610‧‧‧ third board

620‧‧‧Fourth plate

621‧‧‧ surface

630‧‧‧second fin

600’‧‧‧Second heat sink

610'‧‧‧ fourth board

620'‧‧‧ fifth board

630'‧‧‧ sixth board

640'‧‧‧second fin

710‧‧‧First control circuit assembly

720‧‧‧Second control circuit assembly

800‧‧‧Insulation components

810‧‧‧First insulation mat

820‧‧‧Second insulation mat

830‧‧‧First insulation frame

840‧‧‧Second insulation frame

900‧‧‧fan

1 is a perspective view of an electronic load testing device according to a first embodiment of the present invention.

Figure 2 is a partial schematic diagram of the outside of Figure 1.

Figure 3 is a schematic diagram of the internal decomposition of Figure 1.

Figure 4 is a schematic cross-sectional view of Figure 1.

Fig. 5 is a schematic cross-sectional view showing an electronic load testing device according to a second embodiment of the present invention.

Figure 6 is a cross-sectional view showing an electronic load testing device according to a third embodiment of the present invention.

Please refer to Figures 1 to 3. 1 is a perspective view of an electronic load testing device according to a first embodiment of the present invention. Figure 2 is a partial schematic diagram of the outside of Figure 1. Figure 3 is a schematic diagram of the internal decomposition of Figure 1.

The electronic load testing device 10 of this embodiment is a two-channel model, and can be used for electronic load testing by up to two power supplies (not shown). The electronic load testing device 10 includes a housing 100, a connection interface assembly 200, a first load circuit assembly 300, a second load circuit assembly 400, a first heat dissipation assembly 500, a second heat dissipation assembly 600, and a first control. The circuit component 710, a second control circuit component 720, a fan 900, and an insulation component 800.

The outer casing 100 is made of, for example, metal. The outer casing 100 includes a first housing 110 and a second housing 120 that are grouped with each other. The two-piece design of the outer casing 100 of the present embodiment is only for improving the assembly convenience, but is not limited thereto. In other embodiments, the outer casing 100 may also be a one-piece design.

The connection interface assembly 200 is disposed on the housing 100 and electrically insulated from the housing 100. The connection interface assembly 200 has a first electrical connection set 210 and a second electrical connection set 220. The first electrical connection group 210 and the second electrical connection group 220 are respectively electrically connected to the different power supply. In addition, the connection interface assembly 200 is provided with, for example, an operation button and a display screen. The operation button is used to switch the detection mode, and the display is used for the user to view the detection result.

The first load circuit assembly 300 includes a first circuit board 310 and a plurality of first load wafers 320. The first circuit board 310 has a first electrical contact group 311. First of the first circuit board 310 The electrical contact group 311 is electrically connected to the first electrical connection group 210 of the connection interface assembly 200. The first load wafers 320 are electrically connected to the first circuit board 310. The first load wafer 320 is, for example, a power transistor.

The second load circuit assembly 400 includes a second circuit board 410 and a plurality of second load wafers 420. The second circuit board 410 is electrically connected to the connection interface component 200, and the second circuit board 410 has a second electrical contact group 411. The second electrical contact group 411 of the second circuit board 410 is electrically connected to the second electrical connection group 220 of the connection interface assembly 200. The second load wafers 420 are electrically connected to the second circuit board 410. The second load wafer 420 is, for example, a power transistor.

The first heat dissipation assembly 500 is located within the outer casing 100. The first heat dissipation component 500 includes a first plate member 510 , a second plate member 520 , and a plurality of first fins 530 . The second plate member 520 is coupled to the first plate member 510 such that the first plate member 510 and the second plate member 520 form an L shape. The first fins 530 are connected to the second plate 520 and extend along one of the extending directions of the first plate member 510, that is, the first fins 530 are parallel to the first plate member 510. In addition, the wall surface of the first plate member 510 may have a concave-convex structure to increase the heat dissipation effect of the first heat dissipation assembly 500. In this embodiment, the first circuit board 310 is parallel to the first board member 510 and is disposed on a side of the first board member 510 away from the first fins 530. The first load wafers 320 are directly in thermal contact and are electrically connected to the surface 521 of the second plate 520 facing away from the first fins 530 .

The second heat dissipation assembly 600 includes a third plate member 610 , a fourth plate member 620 , and a plurality of second fins 630 . The fourth plate member 620 is coupled to the third plate member 610 such that the third plate member 610 and the fourth plate member 620 form an L shape. The second fins 630 are connected to the fourth plate member 620 and extend along one of the extending directions of the third plate member 610, that is, the second fins 630 are parallel to the third plate member 610. In addition, the wall surface of the third plate member 610 may have a concave-convex structure to increase the heat dissipation effect of the first heat dissipation assembly 500.

The second heat dissipation component 600 is located beside the first heat dissipation component 500, and the first plate component 510 Parallel to the third plate member 610, the second plate member 520 is parallel to the fourth plate member 620, and the first plate member 510, the second plate member 520, the third plate member 610, and the fourth plate member 620 collectively surround the first Fin 530 and these second fins 630.

In addition, please refer to Figure 4. Figure 4 is a schematic cross-sectional view of Figure 1. The first plate 510 and the fourth plate 620 maintain a first spacing D1. The second plate 520 and the third plate 610 maintain a second spacing D2. The first fins 530 maintain a third spacing D3 with the second fins 630. The first pitch D1, the second pitch D2, and the third pitch D3 are each greater than or equal to 3 millimeters (mm). That is, the distance between the first heat dissipation component 500 and the second heat dissipation component 600 is at least 3 millimeters (mm) or more to comply with safety regulations.

In the present embodiment, the third plate member 610 is parallel to the second circuit board 410, and the third plate member 610 is located between the second circuit board 410 and the second fins 630. The second load wafers 420 are directly in thermal contact and electrically connected to the surface 621 of the fourth plate 620 facing away from the second fins 630.

The first control circuit component 710 is mounted to the first load circuit component 300. The second control circuit component 720 is disposed in the first control circuit component 710, and the first control circuit component 710 is located between the first load circuit component 300 and the second control circuit component 720. In addition, the first control circuit component 710 and the second control circuit component 720 are respectively electrically connected to the first load circuit component 300 and the second load circuit component 400 through a transmission line (not shown).

The insulating component 800 includes a plurality of first insulating pads 810, a plurality of second insulating pads 820, a first insulating frame 830, and a second insulating frame 840. Each of the first insulating pads 810 is coupled between the second plate member 520 and the outer casing 100, and each of the second insulating pads 820 is coupled between the fourth plate member 620 and the outer casing 100 to dissipate the first heat dissipating component 500 and the second heat dissipating component. The assembly 600 is assembled on the outer casing 100, and the first heat dissipation assembly 500 and the second heat dissipation assembly 600 are electrically insulated from the outer casing 100.

The first insulating frame 830 is disposed on one side of the first heat dissipating component 500 and the second heat dissipating component 600, and the second insulating frame 840 is assembled on the other side of the first heat dissipating component 500 and the second heat dissipating component 600 for further fixing. The relative position of the first heat dissipation component 500 and the second heat dissipation component 600.

It should be noted that the number of the first insulating pad 810 and the second insulating pad 820 of the embodiment is multiple, but not limited thereto. In other embodiments, the first insulating pad 810 is insulated from the second. The number of pads 820 may also be one each. In addition, in other embodiments, the first insulating frame 830 and the second insulating frame 840 may be omitted, or only one device may be installed.

The fan 900 is located in the outer casing 100 and is configured to generate an airflow to the first heat dissipation component 500 and the second heat dissipation component 600 for forced heat dissipation.

It should be noted that, in this embodiment, since the first heat dissipation component 500 and the second heat dissipation component 600 are insulated from the outer casing 100, and the first heat dissipation component 500 and the second heat dissipation component 600 are insulated from each other, the load wafer can be directly heated. Contact and lock on the heat sink assembly. That is to say, there is no need for additional separation between the load wafer and the heat dissipating component through the insulating sheet and additional assembly to fix the load wafer to the heat dissipating component. Therefore, in addition to reducing the cost of the insulating sheet and the load wafer holder, the electronic load testing device 10 of the present embodiment can increase the heat conduction performance between the heat dissipation component and the load wafer because the load wafer is directly in thermal contact with the heat dissipation component. In turn, the first heat dissipating component 500 and the second heat dissipating component 600 can dissipate as much heat as possible from the load wafer during the electronic load test.

The above-mentioned electronic load testing device 10 is a two-channel model, but is not limited thereto. In other embodiments, the electronic load testing device 10 may also be a single-channel model. Please refer to Figure 5. Fig. 5 is a schematic cross-sectional view showing an electronic load testing device according to a second embodiment of the present invention. This embodiment is similar to the embodiment of Fig. 1 described above, and therefore only the differences will be described.

The electronic load testing device 10 of the present embodiment is a single-channel model, so compared to the first In the embodiment of the figure, the electronic load testing device 10 of the embodiment does not need to provide the second load circuit component 400 and the second control circuit component 720. In detail, the first load circuit assembly 300 of the present embodiment includes a first circuit board 310 and a plurality of first load chips 320. The first load chips 320 are respectively disposed on opposite sides of the first circuit board 310, and The first heat dissipation component 500 and the second heat dissipation component 600 are directly in thermal contact with each other. Since the electronic load testing device 10 has only a single load circuit component, the first heat dissipation component 500 and the second heat dissipation component 600 can be in contact with each other without a problem of circuit interference. That is to say, in the single-channel embodiment, the portion of the second plate member 520 and the portion of the fourth plate member 620 are not milled to keep the first heat dissipating component 500 and the second heat dissipating component 600 at a distance.

It should be noted that the first heat dissipating component 500 of the embodiment is also insulatively mounted on the outer casing 100 through the first insulating pad 810. Therefore, the insulating chip is not required to be separated between the load wafer and the heat dissipating component, so that the load wafer can also be directly The thermal contact with the heat dissipating component can increase the heat transfer performance between the heat dissipating component and the load cell, thereby allowing the first heat dissipating component 500 and the second heat dissipating component 600 to dissipate as much heat as possible from the load wafer during the electronic load test.

In addition, the first heat dissipating component 500 of the present embodiment has an outer shape of an "L shape" for ease of assembly. In detail, since the length of the first plate member 510 is long enough, the first circuit board 310 can be directly locked to the first plate member 510.

The outer shape of the heat dissipating component is slightly similar to the "L shape", but is not limited thereto. In other embodiments, the outer shape of the heat dissipating component may be other geometric shapes. For example, see Figure 6. Figure 6 is a cross-sectional view showing an electronic load testing device according to a third embodiment of the present invention. This embodiment is similar to the embodiment of Fig. 1 described above, and therefore only the differences will be described.

In this embodiment, the first heat dissipating component 500' includes a first plate member 510', a second plate member 520', a third plate member 530', and a plurality of first fins 540'. First plate 510' and third plate 530' are respectively connected to opposite sides of the second plate member 520' to constitute an n-shape. These first fins 540 are coupled to the second panel 520' and extend in a direction in which one of the first panels 510' extends. The first plate 510' is located between the first circuit board 310 and the first fins 540'. The first load wafers 320 are in thermal contact and electrically connected to the surface 521' of the second plate 520' facing away from the first fins 540'.

The second heat dissipating component 600' includes a fourth plate member 610', a fifth plate member 620', a sixth plate member 630', and a plurality of second fins 640'. The fourth plate member 610' and the sixth plate member 630' are respectively coupled to opposite sides of the fifth plate member 620' to constitute an n-shape. These second fins 640' are coupled to the fifth panel 620' and extend in a direction in which one of the fourth panels 610' extends. The second heat dissipation component 600 ′ is located beside the first heat dissipation component 500 ′, and the first panel 510 ′, the second panel 520 ′, the third panel 530 ′, the fourth panel 610 ′, and the fifth panel 620 ′′ And the sixth plate 630' collectively surrounds the first fins 540' and the second fins 640'. The first plate 510 ′ and the fourth plate 610 ′, the second plate 520 ′ and the fifth plate 620 ′, and the first fin 540 ′ and the second fin 640 ′ are all kept at a distance greater than or equal to 3 mm (mm) to comply with the safety specifications of the electronic load test device 10.

According to the electronic load testing device disclosed in the above invention, for the single-channel model, since the heat dissipating component is electrically insulated from the outer casing, the insulating wafer is not required to be separated between the supporting wafer and the heat dissipating component, so that the load wafer can be directly thermally contacted. The heat sink component further enhances the heat transfer performance between the load circuit component and the heat sink component, and reduces the operating temperature of the load circuit module.

In addition, for the dual-channel model, in addition to being electrically insulated from the heat-dissipating component and the outer casing, the heat-dissipating components are electrically insulated from each other at a distance, so that the load wafer can also directly contact the heat-dissipating component, thereby lifting the load. The heat transfer performance between the circuit components and the heat sink components, as well as the operating temperature of the load circuit module.

Furthermore, since the load component can directly contact the heat dissipating component, the load component can be straight The lock is attached to the heat sink assembly. In this way, in addition to the cost of reducing the insulation sheet, it is not necessary to additionally provide a complicated clamping member to fix the load wafer to the heat dissipation assembly.

Although the embodiments of the present invention are disclosed above, it is not intended to limit the present invention, and those skilled in the art, regardless of the spirit and scope of the present invention, the shapes, configurations, and features described in the scope of the present application. And the number of modifications may be made, and the scope of patent protection of the present invention shall be determined by the scope of the patent application attached to the specification.

110‧‧‧First housing

120‧‧‧second housing

300‧‧‧First load circuit assembly

310‧‧‧First board

320‧‧‧First load wafer

400‧‧‧Second load circuit assembly

410‧‧‧Second circuit board

420‧‧‧Second load wafer

500‧‧‧First heat sink assembly

510‧‧‧ first board

520‧‧‧Second board

521‧‧‧ surface

530‧‧‧First fin

600‧‧‧Second heat sink

610‧‧‧ third board

620‧‧‧Fourth plate

621‧‧‧ surface

630‧‧‧second fin

710‧‧‧First control circuit assembly

720‧‧‧Second control circuit assembly

810‧‧‧First insulation mat

820‧‧‧Second insulation mat

Claims (10)

An electronic load testing device includes: a housing; a connection interface component disposed on the housing and electrically insulated from the housing; a first load circuit assembly including a first circuit board and a plurality of first load wafers, The first circuit board is electrically connected to the connection interface component, the first load chips are electrically connected to the first circuit board; a first heat dissipation component is located in the outer casing, and the first load wafers are directly in thermal contact And the first heat dissipating component is coupled to the outer casing through the insulating component to electrically insulate the first heat dissipating component from the outer casing. The electronic load testing device of claim 1, further comprising a second load circuit component and a second heat dissipation component, the second load circuit component comprising a second circuit board and a plurality of second load wafers, the second The circuit board is electrically connected to the connection interface component, the second load chips are electrically connected to the second circuit board, the second heat dissipation component is spaced apart from the first heat dissipation component, and the second load wafers are hot Contacting and electrically connecting to the second heat dissipating component, the second heat dissipating component is coupled to the outer casing through the insulating component to electrically insulate the second heat dissipating component from the outer casing. The electronic load testing device of claim 2, wherein the first heat dissipating component comprises a first plate member, a second plate member and a plurality of first fins, the second plate member being connected to the first plate member The first fin is connected to the second board and extends along one of the extending directions of the first board. The first board is located on the first circuit board and the first fins. The first load wafers are in thermal contact and are electrically connected to the second surface of the second plate facing away from the first surface of the first fins. The electronic load testing device of claim 3, wherein the second heat dissipating component comprises a third plate member, a fourth plate member and a plurality of second fins, the fourth plate member being connected to the third plate member The second fin is connected to the fourth plate and extends along one of the extending directions of the third plate. The second heat dissipating component is located beside the first heat dissipating component, and the first plate is formed. The first plate member, the third plate member and the fourth plate member jointly surround the first fins and the second fins, and the first plate member and the fourth plate member maintain a first a second spacing between the second panel and the third panel, the first fins and the second fins maintaining a third spacing, the third panel being located on the second circuit board The second load pads are in thermal contact with the second fins and are electrically connected to the second surface of the fourth plate facing away from the second fins. The electronic load testing device of claim 4, wherein the insulating component further comprises at least one first insulating pad and at least one second insulating pad, the first insulating pad being sandwiched between the second plate and the outer casing The second insulating pad is sandwiched between the fourth plate and the outer casing. The electronic load testing device of claim 5, wherein the insulating component further comprises at least one first insulating frame, the first insulating frame being assembled on one side of the first heat dissipating component and the second heat dissipating component. The electronic load testing device of claim 5, wherein the insulating component further comprises at least one second insulating frame, the second insulating frame being assembled on the other side of the first heat dissipating component and the second heat dissipating component. The electronic load testing device of claim 2, wherein the first heat dissipating component comprises a first plate member, a second plate member, a third plate member and a plurality of first fins, the first plate member and the first plate member The third plate member is respectively connected to opposite sides of the second plate member to form an n-shape, and the first fins are connected to the second plate member and extend along one extending direction of the first plate member. The first board is located between the first board and the first fins, and the first load pads are in thermal contact and are electrically connected to the second board facing away from the first fins. a second heat dissipating component comprising a fourth plate member and a fifth plate member a sixth plate member and a plurality of second fins, wherein the fourth plate member and the sixth plate member are respectively connected to opposite sides of the fifth plate member to form an n-shape, and the second fins are connected to the second plate member a fifth plate member extending along the extending direction of the fourth plate member, the second heat dissipation component being located beside the first heat dissipation component, and the first plate member, the second plate member, the third plate member, The fourth plate member, the fifth plate member and the sixth plate member jointly surround the first fins and the second fins, and the first plate member and the fourth plate member maintain a first spacing. The second plate and the fifth plate maintain a second spacing, and the first fins and the second fins maintain a third distance. The electronic load testing device of claim 2, further comprising a first control circuit component and a second control circuit board, the first control circuit component being mounted on the first load circuit component, and the first control The circuit component is electrically connected to the first load circuit component, the first control circuit component is located between the first load circuit component and the second control circuit component, and the second control circuit component is electrically connected to the second Load circuit components. The electronic load testing device of claim 1, further comprising a fan, the fan being located in the casing and configured to generate an airflow to the first heat dissipating component.