CN202178240U - Semiconductor assembly press mounting apparatus - Google Patents

Semiconductor assembly press mounting apparatus Download PDF

Info

Publication number
CN202178240U
CN202178240U CN2011202642387U CN201120264238U CN202178240U CN 202178240 U CN202178240 U CN 202178240U CN 2011202642387 U CN2011202642387 U CN 2011202642387U CN 201120264238 U CN201120264238 U CN 201120264238U CN 202178240 U CN202178240 U CN 202178240U
Authority
CN
China
Prior art keywords
press
guide pillar
pressing plate
semiconductor subassembly
housing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CN2011202642387U
Other languages
Chinese (zh)
Inventor
熊辉
田媛
颜骥
孙文伟
郭金童
任亚东
熊思宇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zhuzhou CRRC Times Electric Co Ltd
CSR Industrial Research Institute Co Ltd
Original Assignee
Zhuzhou CSR Times Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zhuzhou CSR Times Electric Co Ltd filed Critical Zhuzhou CSR Times Electric Co Ltd
Priority to CN2011202642387U priority Critical patent/CN202178240U/en
Application granted granted Critical
Publication of CN202178240U publication Critical patent/CN202178240U/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Landscapes

  • Automatic Assembly (AREA)

Abstract

The utility model provides a semiconductor assembly press mounting apparatus, comprising a press mounting outer framework, an insulating member and a pressing apparatus, wherein the insulating member is arranged between the semiconductor assembly and the press mounting outer framework, the pressing apparatus is arranged on the press mounting outer framework, the pressing apparatus comprises a guide pillar, a disc spring, an adjusting bolt and a snap ring, the guide pillar is arranged on the press mounting outer framework and can move back and forth relative to the press mounting outer framework, the adjusting bolt is arranged inside the guide pillar and connected with the semiconductor assembly, the disc spring is located inside the press mounting outer framework, configured to encircle the guide pillar, and positioned between the guide pillar and the press mounting outer framework, and the snap ring is located outside the press mounting outer framework, movably connected with the guide pillar through clamping and positioned between the guide pillar and the press mounting outer framework. The assembling dimension of the semiconductor assembly press mounting apparatus is controllable, the semiconductor assembly is easy for dismounting, the pressure on the semiconductor assembly can be accurately controlled, and the press mounting apparatus is high in accuracy.

Description

A kind of semiconductor subassembly press-loading apparatus
Technical field
The utility model belongs to electronic devices and components assembling field, relates in particular to a kind of press-loading apparatus of semiconductor subassembly.
Background technology
Plate large power semiconductor device is the device that is assembled by chip, shell, molybdenum sheet, because the characteristic of electronic devices and components, semiconductor device must guarantee certain thrust and radiating condition ability normal use in use; Traditional semiconductor device compresses with annexes such as radiator, pressing plate, bolt, core insulator, dish spring, steel balls when list only uses, but many semiconductor device series connection occasions, single traditional semiconductor press mounting structure can not use, and has some following problems:
1) many semiconductor device series connection, and need and radiator press-fit together, because the volume problem can make the semiconductor subassembly distortion very big, and the difficult assurance of package size;
2) owing to be that many semiconductor device press-fit, press mounting structure also needs dismounting when the dismounting semiconductor device, is unfavorable for changing corresponding components and parts;
3) when semiconductor device is compressed, can't carry out pressure control, be difficult to guarantee the accuracy of element thrust.
The utility model content
Press mounting structure also need be dismantled and is difficult to carry out pressure controlled technical problem when press-fiting components and parts when the utility model had solved in the prior art press mounting structure and can not guarantee package size, dismounting semiconductor device.
The utility model provides a kind of semiconductor subassembly press-loading apparatus, comprises press-fiting housing, insulating part and device for exerting, and said insulating part is located at semiconductor subassembly and is press-fited between the housing, and device for exerting is arranged in and press-fits on the housing;
Said device for exerting comprises guide pillar, dish spring, regulates bolt and snap ring; Said guide pillar is arranged in to press-fit on the housing and also can press-fits the housing reciprocating motion relatively; Regulate bolt and be arranged in the guide pillar, link to each other with semiconductor subassembly;
The dish spring is positioned at and press-fits housing, and is sheathed on the guide pillar, is limited in guide pillar and press-fits between the housing; Snap ring is positioned at and press-fits outside the housing, and active card is connected on the guide pillar, is limited in guide pillar and press-fits between the housing.
In the utility model, said semiconductor subassembly comprises semiconductor device and is arranged at the radiator on the semiconductor device.Said semiconductor subassembly can be the single semiconductor device that is connected with radiator, perhaps a plurality of tandem compounds that are connected with the semiconductor device of radiator respectively.
As the further improvement of the utility model, saidly press-fit housing and comprise first pressing plate, second pressing plate and be used for fixing the set bolt that connects first pressing plate and second pressing plate; Device for exerting is arranged on second pressing plate.The both ends of said set bolt are equipped with platform, are used for limit mounting first pressing plate, second pressing plate.Be arranged with nut on the platform, be used for fixing first pressing plate, second pressing plate forms the said housing that press-fits.Therefore,, can accurately control the size that press-fits housing, thereby guarantee the package size of the press-loading apparatus of the utility model through the setting of set bolt upper mounting plate.
As the further improvement of the utility model, guide pillar comprises first section and second section of integrative-structure, and the external diameter of first section external diameter than second section is big; First section end is provided with first positive stop end, and second section end is provided with second positive stop end; First section is arranged on second pressing plate, and second section is positioned at and press-fits outside the housing.First section outer surface of guide pillar is non-circular, and second pressing plate is provided with the non-circular hole with first section coupling of guide pillar, is used to wear guide pillar and prevents that guide pillar from rotating with respect to second pressing plate.The non-circular setting of first section outer surface through guide pillar can effectively prevent to regulate driving guide pillar when bolt rotates and rotate together.
The dish spring is sheathed on first section of guide pillar, and between first positive stop end and second pressing plate; The snap ring active card is connected on second section of guide pillar, and between second pressing plate and second positive stop end.
As the further improvement of the utility model, said insulating part is two, and wherein first insulating part is between first pressing plate and semiconductor subassembly, and second insulating part is between semiconductor subassembly and device for exerting.
As the further improvement of the utility model, insulating part is bowl-shape; The bowl-shape edge of first insulating part is fixedly connected towards first pressing plate and with first pressing plate, and bowl-shape bottom is fixedly connected with semiconductor subassembly; The bowl-shape edge of second insulating part is towards second pressing plate, and bowl-shape bottom is fixedly connected with semiconductor subassembly, regulates bolt and links to each other with the bowl-shape bottom of second insulating part.The bowl structure of insulating part can increase creepage distance, improves the withstand voltage properties of insulating part simultaneously.
As the further improvement of the utility model, guide pillar is provided with through hole vertically, and through-hole inner surface is provided with screw thread, regulates bolt and is arranged on the guide pillar through this screw thread.The setting of guide pillar through hole internal thread realizes guide pillar and regulates the power conduction between the bolt.
The semiconductor subassembly press-loading apparatus that the utility model provides when single semiconductor device or a plurality of semiconductor device series connection use, can limit its package size through press-fiting housing, improves the assembly withstand voltage properties; Through dish spring deformation principle, semiconductor subassembly is dismantled easily simultaneously, need not to destroy the structure of press-loading apparatus; In addition, the semiconductor subassembly press-loading apparatus that the utility model provides carries out pressure through snap ring and accurately controls, and guarantees the accuracy of thrust.
Description of drawings
Fig. 1 is the structural representation of semiconductor subassembly press-loading apparatus and semiconductor subassembly.
Fig. 2 is the structural representation of first pressing plate and set bolt.
Fig. 3 is the structural representation that press-fits housing.
Fig. 4 is the structural representation of insulating part.
Fig. 5 is first insulating part and the structural representation that press-fits housing.
Fig. 6 is the structural representation of guide pillar.
Fig. 7 is the structural representation of the guide pillar and second pressing plate.
Fig. 8 is the structural representation of snap ring.
Fig. 9 is the structural representation of guide pillar, second pressing plate and snap ring.
Wherein, 1-first pressing plate, 2-second pressing plate, 3-set bolt, 4-insulating part; The 5-semiconductor subassembly, 6-dish spring, 7-regulates bolt, 8-guide pillar, 9-snap ring; The 31-platform, 32-nut, 41-first insulating part, 42-second insulating part, first section of 81-; 810-first positive stop end, second section of 82-, 820-second positive stop end, 83-through hole.
Embodiment
Clearer for technical problem, technical scheme and beneficial effect that the utility model is solved, below in conjunction with accompanying drawing and embodiment, the utility model is further elaborated.Should be appreciated that specific embodiment described herein only in order to explanation the utility model, and be not used in qualification the utility model.
The utility model provides a kind of semiconductor subassembly press-loading apparatus, and is as shown in Figure 1, comprises press-fiting housing, insulating part 4 and device for exerting, and insulating part 4 is located at semiconductor subassembly 5 and is press-fited between the housing, and device for exerting is arranged in and press-fits on the housing.
Device for exerting comprises guide pillar 8, dish spring 6, regulates bolt 7 and snap ring 9.Guide pillar 8 is arranged in to press-fit on the housing and also can press-fits the housing reciprocating motion relatively, regulates bolt 7 and is arranged in the guide pillar 8, links to each other with semiconductor subassembly 5.
Dish spring 6 is positioned at and press-fits housing, and is sheathed on the guide pillar 8, is limited in guide pillar 8 and press-fits between the housing; Snap ring 9 is positioned at and press-fits outside the housing, and active card is connected on the guide pillar 8, is limited in guide pillar 8 and press-fits between the housing.
Snap ring 9 active card are connected on the guide pillar 8, therefore, with snap ring 9 when guide pillar 8 takes off; 6 distortion of dish spring enlarge, and guide pillar 8 press-fits housing relatively and inwardly moves, and drive adjusting bolt 7 and in press-fiting housing, move; Thereby compress semiconductor subassembly 5, semiconductor subassembly is applied certain thrust.And snap ring 9 is connected in 8 last times of guide pillar again; Through 9 pairs of extruding that press-fit housing of snap ring, make dish spring 6 distortion shrink, so guide pillar 8 press-fit housing relatively and outwards move; Driving adjusting bolt 7 moves outside press-fiting housing; Can remove the thrust of device for exerting to semiconductor subassembly 5, can disassemble semiconductor subassembly 5 this moment from press-loading apparatus, need not to destroy the structure of the press-loading apparatus of the utility model.Through the assembling of snap ring 9, can accurately control the thrust of the press-loading apparatus of the utility model to semiconductor subassembly 5, accuracy is very high.
Particularly, press-fiting housing comprises first pressing plate 1, second pressing plate 2 and is used for fixing the set bolt 3 that connects first pressing plate 1 and second pressing plate 2; Device for exerting is arranged on second pressing plate 2.In the utility model, for formation press-fits frame structure, so set bolt 3 can be set to two, thus with first pressing plate 1, second pressing plate, 2 formation surrounding mount structures, as shown in Figure 3.
The both ends of set bolt 3 are equipped with platform 31, are used for limit mounting first pressing plate 1, second pressing plate 2.Be arranged with nut 32 on the platform 31, thereby be used for fixing first pressing plate 1, second pressing plate 2 forms and press-fits housing.Through the setting of set bolt 3 upper mounting plates 31, can accurately control the size that press-fits housing, thereby guarantee the package size of the press-loading apparatus of the utility model.
The structure of guide pillar is as shown in Figure 6, comprises that first section 81 and second sections 82, the first sections 81 the external diameter of external diameter than second section 82 of integrative-structure is big.The end that first section 81 end is provided with 810, the second section 82 of first positive stop end is provided with second positive stop end 820.Said guide pillar 8 is arranged on second pressing plate 2, and is as shown in Figure 7.Particularly, first section 81 of guide pillar 8 is arranged on second pressing plate 2, and second section 82 is positioned at and press-fits outside the housing.
First section 81 outer surface of guide pillar 8 is non-circular, and second pressing plate 2 is provided with the non-circular hole with 8 first section 81 coupling of guide pillar, is used to wear guide pillar 8 and prevents that guide pillar 8 from rotating with respect to second pressing plate 2.The non-circular setting of first section 81 outer surface through guide pillar 8 can effectively prevent to regulate driving guide pillar 8 when bolt 7 rotates and rotate together.
Dish spring 6 is sheathed on first section 81 of guide pillar 8, and between first positive stop end 810 and second pressing plate 2.The structure of snap ring 9 is as shown in Figure 8.As shown in Figure 9, snap ring 9 active card are connected on second section 82 of guide pillar 8, and between second pressing plate 2 and second positive stop end 820.Snap ring 9 active card are connected on second section 82 of guide pillar 8; Therefore when its assembling or when taking off; The corresponding contraction or dilatating and deformable takes place in dish spring 6, thereby drives guide pillar 8 relative second pressing plates 2 to press-fiting housing outside or interior motion, realizes unclamping or compressing of 7 pairs of semiconductor subassemblies 5 of adjusting bolt.Can be through the thickness of snap ring 9 be selected, thus the thrust of semiconductor subassembly 5 is carried out size adjustment.
In the utility model, insulating part 4 is two, and wherein first insulating part 41 is between first pressing plate 1 and semiconductor subassembly 5, and second insulating part 42 is between semiconductor subassembly 5 and device for exerting.
Voltage can use its withstand voltage can existing problem of general insulating part than higher when general many semiconductor subassemblies were connected.In the utility model, insulating part 4 is preferably bowl structure, and is as shown in Figure 4.The bowl-shape edge of first insulating part 41 is fixedly connected towards first pressing plate 1 and with first pressing plate 1, and bowl-shape bottom is fixedly connected with semiconductor subassembly 5.The bowl-shape edge of second insulating part 42 is towards second pressing plate 2, and bowl-shape bottom is fixedly connected with semiconductor subassembly 5, regulates bolt 7 and links to each other with the bowl-shape bottom of second insulating part 42.The bowl structure design of insulating part 4 can increase creepage distance, improves the withstand voltage properties of insulating part 4 simultaneously.
Guide pillar 8 is provided with through hole 83 vertically, and through hole 83 inner surfaces are provided with screw thread, regulates bolt 7 and is arranged on the guide pillar 8 through this screw thread.The setting of guide pillar 8 through holes 83 internal threads realizes guide pillar 8 and regulates the power conduction between the bolt 7.
The semiconductor subassembly press-loading apparatus of the utility model and the assembling process of semiconductor subassembly are following:
Earlier first pressing plate 1 is fixedly connected on through nut 32 on the platform 31 of an end of two set bolts 3, obtains structure shown in Figure 2; Then second pressing plate 2 is fixedly connected on the platform 31 of the other end of set bolt 3, press-fits housing through nut 32 fixing formation, as shown in Figure 3.Bowl-shape edge with first insulating part 41 is fixedly connected on first pressing plate 1 that press-fits housing again, and is as shown in Figure 5.Then semiconductor subassembly 5 is put into and press-fited housing, the bowl-shape bottom of first insulating part 41 is fixedly connected with semiconductor subassembly 5.The bowl structure that is fixedly connected second insulating part, 42, the second insulating parts 42 at the other end of semiconductor subassembly 5 is towards second pressing plate 2, and its bottom is fixedly connected on the semiconductor subassembly 5.
Then dish spring 6 is sheathed on first section 81 of guide pillar 8; And pass second pressing plate 2; Make second section 82 and be positioned at and press-fit outside the housing; Snap ring 9 is connected on second section 82 of guide pillar, will regulates bolt 7 then and be arranged in the guide pillar 8, and rotate and regulate bolt 7 and make it pass guide pillar 8 to link to each other with the bowl-shape bottom of second insulating part 42 through through hole 83.At this moment, promptly accomplish the assembling of the semiconductor subassembly press-loading apparatus of semiconductor subassembly 5 and the utility model.
Then; Take off snap ring 9; Dilatating and deformable takes place in dish spring 6, drives guide pillar 8 relative second pressing plates 2 and in press-fiting housing, moves, and guide pillar 8 drives and regulates bolt 7 motions simultaneously; Thereby the 42 pairs of semiconductor subassemblies 5 of second insulating part through coupled apply thrust, and this moment, semiconductor subassembly 5 can begin normal use.
If when needing dismounting semiconductor subassembly 5, only need snap ring 9 is connected on second section 82 of guide pillar 8, through the extruding of 9 pairs second pressing plates 2 of snap ring; Make dish spring 6 shrink distortion; Guide pillar 8 relative second pressing plates 2 move outside press-fiting housing, and guide pillar 8 drives and regulates bolt 7 motions simultaneously, promptly contacts the thrust to semiconductor subassembly 5 this moment; Can semiconductor subassembly 5 directly be disassembled from the semiconductor subassembly press-loading apparatus of the utility model, and can not destroy the structure of press-loading apparatus.
The above is merely the preferred embodiment of the utility model; Not in order to restriction the utility model; Any modification of being done within all spirit and principles at the utility model, be equal to replacement and improvement etc., all should be included within the protection range of the utility model.

Claims (10)

1. a semiconductor subassembly press-loading apparatus is characterized in that, comprises press-fiting housing, insulating part and device for exerting, and said insulating part is located at semiconductor subassembly and is press-fited between the housing, and device for exerting is arranged in and press-fits on the housing;
Said device for exerting comprises guide pillar, dish spring, regulates bolt and snap ring; Said guide pillar is arranged in to press-fit on the housing and also can press-fits the housing reciprocating motion relatively; Regulate bolt and be arranged in the guide pillar, link to each other with semiconductor subassembly;
The dish spring is positioned at and press-fits housing, and is sheathed on the guide pillar, is limited in guide pillar and press-fits between the housing; Snap ring is positioned at and press-fits outside the housing, and active card is connected on the guide pillar, is limited in guide pillar and press-fits between the housing.
2. semiconductor subassembly press-loading apparatus according to claim 1 is characterized in that, saidly press-fits housing and comprises first pressing plate, second pressing plate and be used for fixing the set bolt that connects first pressing plate and second pressing plate; Device for exerting is arranged on second pressing plate.
3. semiconductor subassembly press-loading apparatus according to claim 2 is characterized in that the both ends of said set bolt are equipped with platform.
4. semiconductor subassembly press-loading apparatus according to claim 3 is characterized in that, is arranged with nut on the platform.
5. semiconductor subassembly press-loading apparatus according to claim 2 is characterized in that, guide pillar comprises first section and second section of integrative-structure, and the external diameter of first section external diameter than second section is big; First section end is provided with first positive stop end, and second section end is provided with second positive stop end; First section is arranged on second pressing plate, and second section is positioned at and press-fits outside the housing.
6. semiconductor subassembly press-loading apparatus according to claim 5 is characterized in that, first section outer surface of guide pillar is non-circular, and second pressing plate is provided with the non-circular hole with first section coupling of guide pillar.
7. semiconductor subassembly press-loading apparatus according to claim 5 is characterized in that, the dish spring is sheathed on first section of guide pillar, and between first positive stop end and second pressing plate; The snap ring active card is connected on second section of guide pillar, and between second pressing plate and second positive stop end.
8. semiconductor subassembly press-loading apparatus according to claim 2 is characterized in that, said insulating part is two, and wherein first insulating part is between first pressing plate and semiconductor subassembly, and second insulating part is between semiconductor subassembly and device for exerting.
9. semiconductor subassembly press-loading apparatus according to claim 8 is characterized in that, insulating part is bowl-shape; The bowl-shape edge of first insulating part is fixedly connected towards first pressing plate and with first pressing plate, and bowl-shape bottom is fixedly connected with semiconductor subassembly; The bowl-shape edge of second insulating part is towards second pressing plate, and bowl-shape bottom is fixedly connected with semiconductor subassembly, regulates bolt and links to each other with the bowl-shape bottom of second insulating part.
10. semiconductor subassembly press-loading apparatus according to claim 1 is characterized in that guide pillar is provided with through hole vertically, and through-hole inner surface is provided with screw thread, regulates bolt and is arranged on the guide pillar through this screw thread.
CN2011202642387U 2011-07-25 2011-07-25 Semiconductor assembly press mounting apparatus Expired - Lifetime CN202178240U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2011202642387U CN202178240U (en) 2011-07-25 2011-07-25 Semiconductor assembly press mounting apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2011202642387U CN202178240U (en) 2011-07-25 2011-07-25 Semiconductor assembly press mounting apparatus

Publications (1)

Publication Number Publication Date
CN202178240U true CN202178240U (en) 2012-03-28

Family

ID=45868108

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2011202642387U Expired - Lifetime CN202178240U (en) 2011-07-25 2011-07-25 Semiconductor assembly press mounting apparatus

Country Status (1)

Country Link
CN (1) CN202178240U (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103633078A (en) * 2013-11-01 2014-03-12 南车株洲电力机车研究所有限公司 Press fitting device for flat power semiconductor devices
CN104392967A (en) * 2014-10-22 2015-03-04 株洲南车时代电气股份有限公司 Semiconductor module pressing structure and pressing method thereof
CN104392987A (en) * 2014-10-22 2015-03-04 中国船舶重工集团公司第七一二研究所 Integrated semiconductor power assembly and pressing gauge thereof
CN104766786A (en) * 2015-04-22 2015-07-08 株洲南车时代电气股份有限公司 Device and method for assisting press fitting assembly in press fitting for semiconductor element
CN110726913A (en) * 2018-06-28 2020-01-24 株洲中车时代电气股份有限公司 Semiconductor device testing device

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103633078A (en) * 2013-11-01 2014-03-12 南车株洲电力机车研究所有限公司 Press fitting device for flat power semiconductor devices
CN103633078B (en) * 2013-11-01 2016-06-08 南车株洲电力机车研究所有限公司 Press-loading apparatus for flat power semiconductor device
CN104392967A (en) * 2014-10-22 2015-03-04 株洲南车时代电气股份有限公司 Semiconductor module pressing structure and pressing method thereof
CN104392987A (en) * 2014-10-22 2015-03-04 中国船舶重工集团公司第七一二研究所 Integrated semiconductor power assembly and pressing gauge thereof
CN104392967B (en) * 2014-10-22 2017-02-01 株洲南车时代电气股份有限公司 Semiconductor module pressing structure and pressing method thereof
CN104766786A (en) * 2015-04-22 2015-07-08 株洲南车时代电气股份有限公司 Device and method for assisting press fitting assembly in press fitting for semiconductor element
CN104766786B (en) * 2015-04-22 2018-01-09 株洲南车时代电气股份有限公司 A kind of device and method for being used to aid in pressing component press pack semiconductor element
CN110726913A (en) * 2018-06-28 2020-01-24 株洲中车时代电气股份有限公司 Semiconductor device testing device

Similar Documents

Publication Publication Date Title
CN202178240U (en) Semiconductor assembly press mounting apparatus
WO2017050189A1 (en) Large-component igbt press fitting unit
CN101211905B (en) Press-loading valve stack for large power all-controlled semiconductor device
CN101596673A (en) Sandwich type piezoelectric transducer automatic assembly machine
CN106298756B (en) A kind of IGBT series connection crimping encapsulation unit and the dc circuit breaker using the encapsulation unit
CN216421584U (en) Shell fragment kludge of charger plug
CN203690282U (en) Novel insulating pulling tape type thyristor device
CN104467532A (en) Double-side driving rotating type traveling wave ultrasonic motor
CN218695800U (en) Motor press-fitting device
CN203456840U (en) Crosslinked cable accessory rubber stress cone compacting device
CN201601559U (en) Heat radiating structure of wind power generator
CN108790242A (en) A kind of mechanical hull class part punching device
CN211059015U (en) Screw compressor box structure convenient to maintenance
CN211208419U (en) Flattening machine table for semiconductor packaging production
CN209792465U (en) Press for manufacturing end socket
CN203542434U (en) Press-fixing device used for machining finned radiator
CN211202383U (en) Low-power electronic water pump for new energy automobile
CN210254072U (en) Cooling device for producing pin roll cold header
CN221549437U (en) Firm compression type heat dissipation module
CN213071100U (en) Clamping type power module packaging structure
CN208342667U (en) A kind of adjustable capping fixture for instrument assembly
CN208123345U (en) The split type electric cabinet tank mounting structure of the die-cutting machine of high shock resistance
CN217617358U (en) Part fixing device for hardware stamping
CN201072705Y (en) Press mounting mold for transformer coil
CN211388452U (en) Transformer bushing clamp plate nut assembly fixture

Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
ASS Succession or assignment of patent right

Owner name: CSR INDUSTRY INSTITUTE CO., LTD.

Effective date: 20150121

C41 Transfer of patent application or patent right or utility model
TR01 Transfer of patent right

Effective date of registration: 20150121

Address after: The age of 412001 in Hunan Province, Zhuzhou Shifeng District Road No. 169

Co-patentee after: CSR INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE CO., LTD.

Patentee after: Zhuzhou CSR Times Electric Co., Ltd.

Address before: 412001 Hunan Province, Zhuzhou Shifeng District North Gate Road Tian Xin Era

Patentee before: Zhuzhou CSR Times Electric Co., Ltd.

CX01 Expiry of patent term
CX01 Expiry of patent term

Granted publication date: 20120328