CN104392967B - Semiconductor module pressing structure and pressing method thereof - Google Patents
Semiconductor module pressing structure and pressing method thereof Download PDFInfo
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- CN104392967B CN104392967B CN201410566054.4A CN201410566054A CN104392967B CN 104392967 B CN104392967 B CN 104392967B CN 201410566054 A CN201410566054 A CN 201410566054A CN 104392967 B CN104392967 B CN 104392967B
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Abstract
The invention discloses a semiconductor module pressing structure, which comprises an upper pressing plate, a lower pressing plate arranged at two ends of the semiconductor module and a plurality of force-bearing positioning pieces, wherein the upper pressing plate and the lower pressing plate are fixedly connected by adopting a screw rod; the force-bearing positioning pieces are arranged at edges of the pressing plates; the edges serve as pressure-applying points to which the pressing force is applied; and the force-bearing positioning pieces position the pressing plates. The invention also provides a semiconductor module pressing method. The method comprises the following steps: a pressing force value of the pressing machine is set; the semiconductor module is placed at the corresponding pressing position on the pressing machine, the edges of the pressing plates are positioned by using the force-bearing positioning pieces, and the pressing force is applied to the edges of the pressing plates; after applying of the pressing force is in place, pressing plate nuts are fastened, and the pressing force is then released. When the structure and the method of the invention are applied, and purposes that operation of pressing operation is simple and convenient, accuracy of the pressing force inside the semiconductor module is improved, and parallelism between the upper pressing plate and the lower pressing plate of the module is improved can be realized.
Description
Technical field
The invention belongs to electric and electronic technical field is and in particular to a kind of press mounting structure of semiconductor module and its side of press-fiting
Method.
Background technology
Semiconductor module press-loading process mode typically has two kinds: a kind of is to enter units by the way of torque spanner fastening
Press-fit fastening.Which is simple to operation, but because of moment and press-fits relation conversion complexity between force value, is subject to not in practical application
Determine that factor impact is big, moment values and press-fit the more difficult conversion of force value accurately；And the fastening that need to manually exert a force, typically how in pressure assembling force
Less applications.Another kind of press-fit approach is to enter units in the form of pressing machine applies pressure assembling force to semiconductor module
Press-fit.The form that it passes through to control pressing machine automatically to apply pressure assembling force is press-fited, and effectively reduces personnel's operation intensity, improves
Working performance.
Its workflow is:
1. pressing machine parameter setting: according to semiconductor module drawing requirement, what setting press-fited machine equipment press-fits force value, such as schemes
It is f (unit kn) that paper requires pressure assembling force, then the force value that press-fits that setting press-fits machine equipment is f；
2. operation pressing machine pressure: semiconductor module is placed on and press-fits in machine equipment correspondence and press-fit position, operation press-fits
Machine equipment, applies pressure assembling force f to semiconductor module；Carry out storage and the release of pressure assembling force by the deformation of internal butterfly spring；
3. tighten the nut on double threaded screw: after pressure assembling force f applies to put in place, fasten semiconductor module top board nut；
4. discharge pressing machine pressure assembling force: after the completion of nut fastening, operation pressing machine rises, and discharges pressure assembling force；
5. press-fit and complete: take out semiconductor module from pressing machine, press-fit and complete.
Close with the present invention based on the press-fit approach of pressing machine is: the element press-fit approach of center single-point pressure up and down.
Concrete mode is: semiconductor module 3 is placed in lower support block 2, then places a briquetting 1 on semiconductor module
Frock, center alignment；Pressing machine passes through the position single-point applying pressure assembling force that frock leans on center to top board 5 and lower platen 6.Press-fit
Structural representation such as Fig. 1,
However, this kind of press-fit approach to there are following two aspects not enough:
1., after semiconductor module press-fits, in it, the pressure assembling force of butterfly spring storage is larger with actual requirement deviation.Concrete point
Analysis is described as follows:
As shown in figure 1, pressing machine applies pressure assembling force f to semiconductor module 3, butterfly spring compression in semiconductor module occurs
Deformation, it stores pressure assembling force f.It is that on semiconductor module, lower platen leans on center that single-point applies to press-fit force, and other positions are not
By pressure assembling force, pressing plate does not deform upon；After the completion of pressure, the nut 4 on double threaded screw 7 at upper and lower pressing plate corner is tightened, this
Place's nut Tightening moment is little, and upper and lower pressing plate does not produce deformation yet, and now daylight opening is set to d up and down；
Thereafter, discharge pressure assembling force, the pressure assembling force of semiconductor module 3 is transferred on double threaded screw 7, i.e. pressure assembling force and butterfly bullet
The interaction force of spring force composition is changed into the fastening force of four double threaded screws and the interaction of butterfly spring elastic force composition
Power.The pressure assembling force f of semiconductor module is progressively transferred on four double threaded screws 7 by middle a briquetting；In transfer process, partly lead
The pressure assembling force f of the internal butterfly spring storage of module 3 acts on upper and lower pressing plate, withdraws with pressing machine pressure assembling force, double end spiral shell
Fastening force on bar 4 is gradually increased.In the process, because upper and lower pressing plate is subject to the position difference (butterfly of active force counteracting force
, in the middle of pressing plate, direction is upward for spring stress；The fastening force of nut, in pressing plate corner, is directed downward), upper lower platen can produce
Raw matrix Bending Deformation, butterfly spring stretches upwards, as shown in Fig. 2 setting after pressing machine pressure assembling force withdraws completely, upper lower platen is each
Deformation δ d, then butterfly spring stretched 2 δ d, then on semiconductor module lower platen middle ware away from for d=d+2 δ d；
If the coefficient of elasticity of butterfly spring is k, then, after pressing machine is withdrawn, transfer to the power on double threaded screw, that is, last
Pressure assembling force is: f=f-2 δ d k.Generally, the coefficient of elasticity of butterfly spring and the deflection of pressing plate are bigger, this press-fit approach
The conversion of the pressure assembling force after press-fiting is bigger.
Test to using the semiconductor module that the press-fit approach that center single-point presses press-fits, it press-fits rear element and partly leads
The force value that press-fits keeping in module differs by more than more than 30% with required value.
2. during semiconductor module press-fits, upper lower platen easily forms dislocation, and the pressing plate side depth of parallelism is poor.
The schematic diagram being upper lower platen dislocation as Fig. 3, the main cause that it occurs is not for adjusting upper lower platen before press-fiting
Whole alignment, the device also upper lower platen not being clamped during press-fiting positioning positions.
Content of the invention
For above-mentioned technical problem, the present invention is intended to provide one kind press-fits, Job Operations are easy, and semiconductor module is internal to press
The accuracy of dress power is higher, the press mounting structure of the more preferable semiconductor module of the depth of parallelism between upper and lower pressing plate and its pressing method.
The technical scheme of solve problem of the present invention is: a kind of press mounting structure of semiconductor module, including being arranged on quasiconductor
The upper and lower pressing plate at module two ends, is fixedly connected using screw rod between upper and lower pressing plate, especially also includes being connected on pressing machine
Some stress keepers, stress keeper is arranged at the edge of pressing plate, and this edge applies applying of pressure assembling force as pressing machine
Pressure point, and pressing plate positions by this stress keeper.
In technique scheme, described pressing plate has corner angle, and described stress keeper is arranged at each edges and corners of pressing plate, should
Edges and corners apply the compression point of pressure assembling force as pressing machine, and each corner angle of pressing plate are positioned by this stress keeper.
Further, press-fit the workbench that machine worktable is with t type groove；Described stress keeper is b briquetting, its top
Being provided with can be with the t type boss of t type groove assembling on pressing machine, and b briquetting bottom is arranged with the locating slot mating with pressing plate corner angle；b
Briquetting is detachably connected with the t type groove of pressing machine.
Meanwhile, provide a kind of pressing method of semiconductor module, comprise the steps:
(1) what setting press-fited machine equipment press-fits force value；
(2) semiconductor module is placed on press-fit to correspond in machine equipment and press-fits position, and the edge of pressing plate is fixed with stress
Position part is positioned, and then applies pressure assembling force to platen edge；
(3) after pressure assembling force applies to put in place, clam member nut, discharge pressure assembling force afterwards.
In above-mentioned pressing method, in step (2), pressing plate used is the pressing plate with corner angle, and stress keeper used is
B briquetting used in claim 3；Its step (2) is to be placed on semiconductor module to press-fit to correspond in machine equipment to press-fit position,
And each corner angle of pressing plate are positioned with b briquetting, then pressure assembling force is applied to each angle point.
The press mounting structure force analysis of the present invention is as follows:
Pressing machine applies pressure assembling force f to semiconductor module, and butterfly spring compression in semiconductor module deforms upon, quasiconductor
Module stores pressure assembling force f.Press-fit the edge that force is upper lower platen, now, upper lower platen is subject to pressing machine pressure assembling force because of edge,
The middle reciprocal resilience force by butterfly spring；There is matrix deformation in upper lower platen.After the completion of pressure, by upper and lower pressing plate side
Nut screwing clamping on screw rod at edge.
Afterwards, discharge pressure assembling force, rise in pressing machine, the pressure during pressure assembling force is withdrawn, on semiconductor module block edge
Dress power is transferred on the nut of screw rod, is converted into the fastening force of nut；When press-fiting, the upper and lower pressing plate of stress deformation has resilience to become
Gesture, but put in place because the nut on screw rod fastens, pressing plate does not have space and the displacement of resilience return；Thus, pressing plate will keep
Press-fit deformation during stress f, in semiconductor module, still keep pressure assembling force to be f.
Be can be seen that by above-mentioned analysis and the press-fit approach of edge multiple spot pressure, pressing machine release pressure are adopted due to the present invention
After dress power, upper lower platen does not almost have deformation resilience, so the accuracy of the internal pressure assembling force of semiconductor module is higher；
And, the position (playing fixture effect) of upper lower platen, pressure during press-fiting, is secured by stress keeper
Plate can only move up and down and deformation is it is impossible to the torsional deformation of left and right.Thus, effectively control and ensure that upper lower platen after press-fiting
The depth of parallelism.
Brief description
The invention will be further described below in conjunction with the accompanying drawings.
Fig. 1 is the press-fit approach structure chart of prior art.
Fig. 2 is the press mounting structure stress deformation figure of prior art.
Fig. 3 is upper lower platen dislocation top view.
Fig. 4 is the schematic diagram of press mounting structure of the present invention.
Fig. 5 is the force diagram of press mounting structure of the present invention.
Fig. 6 is the stress deformation figure of press mounting structure of the present invention.
Fig. 7 is the b briquetting schematic diagram of the present invention.
In figure, 1-a briquetting, support block under 2-, 3- semiconductor module, 4- nut, 5- top board, 6- lower platen, 7- screw rod,
8-b briquetting, 81-t type boss, 82- right angle locating slot.
Specific embodiment
As shown in figure 4, a kind of press mounting structure of semiconductor module, including the machine worktable that press-fits with t type groove, (in figure is not
Illustrate), it is arranged on square top board 5 and the lower platen 6 at semiconductor module 3 two ends, between upper and lower pressing plate, adopt screw rod 7 fixing
Connect, especially also include some b briquettings 8 being connected on pressing machine, as shown in fig. 7, described b briquetting 8 is " work " font, top
Being provided with can be with the t type boss 81 of t type groove assembling on pressing machine, and b briquetting 8 bottom is arranged with right angle locating slot 82；
Described b briquetting 8 is arranged at each edges and corners of pressing plate, and edges and corners apply the compression point of pressure assembling force as pressing machine,
And each corner angle of pressing plate are positioned by b briquetting 8.
Meanwhile, provide a kind of pressing method of semiconductor module, comprise the steps:
(1) what setting press-fited machine equipment press-fits force value；
(2) semiconductor module 3 is placed on press-fit to correspond in machine equipment and press-fits position, and each corner angle b by pressing plate
Briquetting 8 positions, and then applies pressure assembling force to each angle point；
(3) after pressure assembling force applies to put in place, clam member nut 4, discharge pressure assembling force afterwards.
The force analysis of the present embodiment is as follows:
As Fig. 5, to semiconductor module 3 applying pressure assembling force f, shape in butterfly spring compression in semiconductor module 3 to pressing machine there is
Become, semiconductor module stores pressure assembling force f.Press-fit each angle point that force is upper lower platen, then semiconductor module given by each b briquetting 8
The pressure assembling force of block 3 is f/4.Now, upper lower platen is because corner is by pressing machine pressure assembling force, middle reciprocal by butterfly spring
Resilience force；There is matrix deformation in upper lower platen.After the completion of pressure, the nut 4 on double threaded screw 7 at upper and lower pressing plate corner is twisted
Tightly.If the spacing of upper lower platen corresponding angles is d1 after press-fiting, each angle of upper and lower pressing plate is changed into δ with respect to the shape in the middle part of pressing plate
D1, as shown in Figure 6；
Afterwards, discharge pressure assembling force, rise in pressing machine, during pressure assembling force is withdrawn, on each angle of semiconductor module
Pressure assembling force is transferred on the nut 4 of double threaded screw 7, is converted into the fastening force of nut 4；The upper and lower pressing plate of stress deformation when press-fiting
There is trend of rebound, but put in place because the nut 4 on double threaded screw 7 fastens, upper lower platen does not have space and the displacement of resilience return；
Thus, upper lower platen will keep deformation when press-fiting stress f, and spacing d1 of upper and lower pressing plate corresponding angles is basically unchanged, quasiconductor
Pressure assembling force is still kept to be f in module 3.
During press-fiting, secure the position (playing fixture effect) of upper lower platen by b briquetting 8 positioning, pressing plate is only
Can move up and down and deformation is it is impossible to the torsional deformation of left and right.Thus, effectively control and ensure that and after press-fiting, go up the flat of lower platen
Row degree.
Pressure assembling force is applied to semiconductor module 3 by pressing machine, places inside semiconductor module 3 and press-fit force transducer
Detect the pressure assembling force of its storage inside；The semiconductor module of square shaped pressing plate carries out press-fiting test.Two kinds of press-fit approach of measurement
Press-fit force value Service Efficiency.
The pressure assembling force that semiconductor module requires is 45kn, applies the pressure assembling force of 45kn to semiconductor module by pressing machine
Value, press-fit the internal butterfly spring storage of rear semiconductor module press-fits the following table of force value 1:
Table 1 test press-fits force value
| Press-fit approach | Storage press-fits force value | Press-fit force value Service Efficiency |
| The press-fit approach of center single-point pressure | 34.5kn | 76.7% |
| The press-fit approach of each angle multiple spot pressure | 40.6kn | 90.2% |
Show from test result, using the press-fit approach of each angle multiple spot pressure, press-fit rear pressure assembling force storage value and reality
Require closer to substantially increasing the accuracy of pressure assembling force.
Claims (3)
1. a kind of press mounting structure of semiconductor module, including the upper and lower pressing plate being arranged on semiconductor module two ends, upper and lower pressing plate
Between be fixedly connected using screw rod it is characterised in that: also include some stress keepers being connected on pressing machine, stress positions
Part is arranged at the edge of pressing plate, and this edge applies the compression point of pressure assembling force as pressing machine, and this stress keeper will
Pressing plate positions；Described pressing plate has corner angle, and described stress keeper is arranged at each edges and corners of pressing plate, and edges and corners are as pressing machine
Apply the compression point of pressure assembling force, and each corner angle of pressing plate are positioned by this stress keeper.
2. semiconductor module according to claim 1 press mounting structure it is characterised in that: press-fiting machine worktable is with t
The workbench of type groove；Described stress keeper is b briquetting, and its top is provided with can be with the t type boss of t type groove assembling on pressing machine, b
Briquetting bottom is arranged with the locating slot mating with pressing plate corner angle；B briquetting is detachably connected with the t type groove of pressing machine.
3. a kind of pressing method of semiconductor module is it is characterised in that comprise the steps:
(1) what setting press-fited machine equipment press-fits force value；
(2) semiconductor module is placed on and press-fits in machine equipment correspondence and press-fit position, and by the edge of pressing plate stress keeper
Positioned, then pressure assembling force is applied to platen edge；
(3) after pressure assembling force applies to put in place, clam member nut, discharge pressure assembling force afterwards；
In step (2), pressing plate used is the pressing plate with corner angle, and stress keeper used is b used in claim 2
Briquetting；Its step (2) is to be placed on semiconductor module to press-fit to correspond in machine equipment to press-fit position, and each corner angle by pressing plate
With b briquetting positioning, then pressure assembling force is applied to each angle point.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410566054.4A CN104392967B (en) | 2014-10-22 | 2014-10-22 | Semiconductor module pressing structure and pressing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410566054.4A CN104392967B (en) | 2014-10-22 | 2014-10-22 | Semiconductor module pressing structure and pressing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104392967A CN104392967A (en) | 2015-03-04 |
| CN104392967B true CN104392967B (en) | 2017-02-01 |
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| CN201410566054.4A Active CN104392967B (en) | 2014-10-22 | 2014-10-22 | Semiconductor module pressing structure and pressing method thereof |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104766786B (en) * | 2015-04-22 | 2018-01-09 | 株洲南车时代电气股份有限公司 | A kind of device and method for being used to aid in pressing component press pack semiconductor element |
| CN109755140B (en) * | 2019-02-27 | 2023-10-17 | 西安派瑞功率半导体变流技术股份有限公司 | Universal automatic press-fitting mechanism for high-power semiconductor device |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2648605Y (en) * | 2003-08-22 | 2004-10-13 | 北京金自天正智能控制股份有限公司 | Water-cooled plate type electronic power semiconductor device assembly |
| CN201829479U (en) * | 2009-12-30 | 2011-05-11 | 株洲变流技术国家工程研究中心有限公司 | Pressing component of semiconductor element |
| CN202178240U (en) * | 2011-07-25 | 2012-03-28 | 株洲南车时代电气股份有限公司 | Semiconductor assembly press mounting apparatus |
| CN102760729A (en) * | 2012-07-06 | 2012-10-31 | 株洲南车时代电气股份有限公司 | Pulse power switch device |
| CN103633078A (en) * | 2013-11-01 | 2014-03-12 | 南车株洲电力机车研究所有限公司 | Press fitting device for flat power semiconductor devices |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004335777A (en) * | 2003-05-08 | 2004-11-25 | Toshiba Mitsubishi-Electric Industrial System Corp | Stack for flat semiconductor element |
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2014
- 2014-10-22 CN CN201410566054.4A patent/CN104392967B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2648605Y (en) * | 2003-08-22 | 2004-10-13 | 北京金自天正智能控制股份有限公司 | Water-cooled plate type electronic power semiconductor device assembly |
| CN201829479U (en) * | 2009-12-30 | 2011-05-11 | 株洲变流技术国家工程研究中心有限公司 | Pressing component of semiconductor element |
| CN202178240U (en) * | 2011-07-25 | 2012-03-28 | 株洲南车时代电气股份有限公司 | Semiconductor assembly press mounting apparatus |
| CN102760729A (en) * | 2012-07-06 | 2012-10-31 | 株洲南车时代电气股份有限公司 | Pulse power switch device |
| CN103633078A (en) * | 2013-11-01 | 2014-03-12 | 南车株洲电力机车研究所有限公司 | Press fitting device for flat power semiconductor devices |
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| CN104392967A (en) | 2015-03-04 |
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Address after: The age of 412001 in Hunan Province, Zhuzhou Shifeng District Road No. 169 Patentee after: ZHUZHOU CRRC TIMES ELECTRIC Co.,Ltd. Address before: The age of 412001 in Hunan Province, Zhuzhou Shifeng District Road Patentee before: ZHUZH CSR TIMES ELECTRIC Co.,Ltd. |
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