WO2017050189A1 - Large-component igbt press fitting unit - Google Patents

Large-component igbt press fitting unit Download PDF

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WO2017050189A1
WO2017050189A1 PCT/CN2016/099253 CN2016099253W WO2017050189A1 WO 2017050189 A1 WO2017050189 A1 WO 2017050189A1 CN 2016099253 W CN2016099253 W CN 2016099253W WO 2017050189 A1 WO2017050189 A1 WO 2017050189A1
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igbt
press
fit
heat sink
pressure
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PCT/CN2016/099253
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French (fr)
Chinese (zh)
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魏晓光
贺之渊
张升
王成昊
刘远
周万迪
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全球能源互联网研究院
国家电网公司
国网湖北省电力公司
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Publication of WO2017050189A1 publication Critical patent/WO2017050189A1/en

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/11Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/115Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/32Holders for supporting the complete device in operation, i.e. detachable fixtures
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367Cooling facilitated by shape of device
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367Cooling facilitated by shape of device
    • H01L23/3675Cooling facilitated by shape of device characterised by the shape of the housing
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/564Details not otherwise provided for, e.g. protection against moisture

Definitions

  • the invention relates to the field of high voltage transmission, in particular to a large component IGBT press-fit unit.
  • IGBT devices With the development of high-power power electronics technology, especially the development of high-voltage flexible DC transmission and flexible AC transmission, IGBT devices have become more and more widely used in power systems with their flexible and controllable shutdown characteristics. With the continuous increase of transmission capacity, IGBT devices with high withstand voltage, high flow capacity and large cross-section size are widely used. Early IGBT devices were mainly soldered. The device was designed with bolts fixed on the heat sink. The flow capacity and withstand voltage were limited, and the break mode was broken under the breakdown condition. The circuit device makes the design of this type of IGBT complex, limiting its extended application in the engineering field.
  • the IGBT press-fit mechanism must have higher mechanical strength, better electrical insulation performance, and the compact structure is safe and reliable, and the performance is stable.
  • the IGBT press-fit mechanism should also facilitate press-fit and disassembly at the engineering site.
  • the design of the large component IGBT press-fit mechanism is similar to the thyristor press-fit. Basically, the method of applying pressure through the thyristor and the heat sink center line is adopted, but the implementation is various, and the press-fit frame structure of the IGBT press-fit mechanism is adopted. Diverse, pressure loading methods also have their own characteristics.
  • the more common reference thyristor press-fit frame is made of insulating laminated sheets and metal structural parts. A rigid frame composed of fastening bolts, although the structure is stable and strong, but the weight is large, relatively bulky, and the structure lacks elasticity, and the ability to adapt to the dimensional change of the IGBT press-fit mechanism is poor.
  • the frequency converter on some electric power transfer locomotive equipment adopts the crimping type IGBT, and the press-fit mechanism adopts the press-fit frame with the metal structural member and the insulating tie rod, which is limited by the transverse shear strength limit of the insulating tie rod, and basically adopts the hoisting design. Very poor flexibility and low reliability.
  • the pressure loading type of the IGBT press-fit mechanism also has various designs, and has a structure that is pressed by a single bolt center. This structure is inconvenient to install and repair, and the pressure control is inaccurate; there is also a structure by multi-screw pressing, this type The operation is complicated, the pressure loading is inconvenient, and it is difficult to ensure uniform pressure dispersion.
  • the embodiment of the present invention provides a large component IGBT press-fit unit, which has the advantages of simple structure, uniform pressure dispersion, accurate press-fit, easy operation, and easy maintenance; and can solve the above problems in the prior art.
  • a large component IGBT press-fit unit provided by the embodiment of the invention includes a support frame and a press-fit unit for fixing the IGBT valve string in the support frame;
  • the press-fit unit includes: a press-fit stress cone, a pressure adaptive adjustment mechanism, and an insulation isolation structure at both ends of the IGBT valve string;
  • the press-fit stress cone and the pressure adaptive adjustment mechanism are respectively fixed to the metal end plates at both ends of the support frame, and the insulation isolation structure is used for electrically isolating between the press-fit structure and the electrical component.
  • the present invention is mainly directed to a DC power electronic device with a fully-controlled IGBT device as a core component of a flexible direct current transmission system, and is also applicable to an AC power transmission device with an IGBT device as a core component; the application range is wide and the applicability is strong;
  • the design of the press-fit stress cone and the pressure adaptive mechanism proposed by the invention patent can ensure uniform dispersion and reliable press-fitting of the pressing force on the IGBT surface, and satisfy the reliable heat dissipation and uniform current carrying of the IGBT operation;
  • the large components of multi-stage IGBT devices and heat sinks are pressed to ensure reliable electrical connection and effective heat dissipation of IGBT devices, ensuring reliable operation of IGBT devices under rated current or overload current;
  • the structure design of the IGBT heat sink proposed by the invention patent can realize the expansion of the function of the heat sink, and in addition to realizing the heat dissipation function of the IGBT, it also has the functions of fixed support IGBT drive and busbar connection;
  • the design of the insulating spacer of the IGBT press-fit unit proposed by the invention patent can realize the potential isolation between the press-fit assembly of the IGBT and the heat sink and the support frame, and meet the requirements of air insulation and creepage distance.
  • the crimping IGBT has been fabricated in series with not less than 16 stages, and can be expanded to a maximum of 20 stages and above.
  • FIG. 1 is a schematic structural view of a large component IGBT press-fit unit
  • FIG. 2 is a cross-sectional structural view of a large component IGBT press-fit unit
  • Figure 3 is a schematic view showing the structure of a press-fit stress cone
  • Figure 4 is a schematic view of the pressure dispersion principle of the press-fit stress cone
  • Figure 5 is a IGBT press-fit unit support frame
  • FIG. 6 is a schematic view of the IGBT heat sink structure 1;
  • FIG. 7 is a schematic view of the IGBT heat sink structure 2;
  • Figure 8 is a schematic view showing the structure of an insulating spacer.
  • the invention relates to a large component IGBT press-fit unit design, which adopts a support fixed structure composed of a metal tie rod and a metal end plate as a carrier, and achieves pressure loading and uniform pressure dispersion by using a press-fit stress cone and a pressure adaptive adjustment mechanism;
  • the combined disc spring mechanism realizes long-term pressure maintenance and deformation adaptive adjustment, and achieves high-potential isolation between the support structure and the IGBT through the insulating spacer disk.
  • the press-fit unit is designed with an accurate centering mechanism to effectively protect the IGBT and meet its various operations. Working condition requirements.
  • a large component IGBT press-fit unit provided by this embodiment includes a support frame 14 and a press-fit unit for fixing the IGBT valve string in the support frame;
  • the press-fit unit comprises a press-fit stress cone 11 and a pressure adaptive adjustment mechanism at both ends of the IGBT valve string, and the press-fit stress cone and the pressure adaptive adjustment mechanism are respectively solidified with the metal end plate 01 at both ends of the support frame Pick up.
  • the press-fit stress cone has a solid funnel shape with a 90 degree angle between the tapered surfaces; a tapered head having an end face that is in close contact with one end of the IGBT valve string, and a cylindrical tail portion and a support frame
  • the metal end plates 01 at one end are connected by a pressure adapter 13, and an adjusting spacer 12 sleeved on the cylindrical tail portion is mounted between the press-fit stress cone and the metal end plate.
  • the adjusting gasket is used to realize the compression deformation and the displacement gap filling during the IGBT press-fit process; the pressure loading terminal is used to cooperate with the external pressure loading mechanism to realize the transmission of the external pressure to the IGBT press-fit unit.
  • the principle is:
  • the external pressure loading mechanism applies a pulling force to the pressure loading terminal, and the external pressure loading mechanism presses the pressure stress cone, and the external pressing force uniformly applies pressure to the IGBT and the heat sink through the press-fit stress cone, and gradually reaches the IGBT.
  • the required rated press force During the pressure loading process, the disc spring is gradually compressed and deformed, and a deformation gap is formed between the press-fit stress cone and the metal end plate, and the adjusting gasket matched with the gap is filled in between before the external pressing force is cancelled. Then, after the external pressing force is removed, the pressing force is maintained inside the IGBT press-fit unit by the disc spring deformation.
  • the pressure adaptive adjustment mechanism includes a pressure adaptive cone 05, a pressure adaptive cone 06 and a disc spring 07 disposed between the pressure adaptive cone and the metal end plate cone;
  • the disc spring 07 is used for realizing the pressure maintenance of the IGBT after the pressure loading and the deformation adjustment of the expansion and contraction of the IGBT and the heat sink assembly during the application process.
  • the support frame includes two metal end plates 01 and four gold fixed by nuts.
  • the utility model belongs to the pull rod 02; the bottom end of the two metal end plates is provided with an insulating support beam 15 for supporting the IGBT valve string, and the four corners of each metal end plate are respectively provided with through holes for the metal rods to pass through, and between the four metal rods A space for accommodating the IGBT valve string is left, and the metal tie rod is externally sheathed with an insulating sleeve 04.
  • the insulating support beam is used for the fixed support of the IGBT valve string and the device before the IGBT press-fit unit is pressed, and also serves as the IGBT valve string support after the IGBT is disassembled and the press-fit force is cancelled.
  • an insulating spacer disk is arranged between the end surface of the tapered head and the IGBT valve string.
  • the insulating spacer disk is made of high-strength insulating material, and is designed as an umbrella structure from the open end to the middle part of the disc, and the disc structure is adopted as a whole, and is connected with the press-fit stress cone.
  • the insulating spacer disk is made of high-strength insulating material as shown in Fig. 8.
  • the crawler umbrella group is distributed from the lower end to the middle of the disc; the disc structure is connected with the press-fit stress cone. With this design, single-potential isolation of the support frame can be achieved.
  • the outermost ends of the IGBT valve string are heat sinks, which simplifies the structural integration design of the IGBT press-fit unit application equipment, and is advantageous for the compact design of the application equipment.
  • the IGBT valve string is composed of a heat sink and an IGBT 10 which are connected in series, and the IGBT has the same structure of the 08 heat sink 1 or the same structure of the 09 heat sink 2, or one side of the IGBT is the heat sink 1, and the other The side is the heat sink 2.
  • the IGBT heat sink and the IGBT are alternately distributed, and the two conductive contact faces of each IGBT are bonded to the heat sink to realize bidirectional heat dissipation of the IGBT.
  • the heat sink 1 includes: a first IGBT busbar fixed terminal 16, a driving fixed terminal 17, and a first IGBT detachment pressing auxiliary terminal 18; the first IGBT busbar fixed terminal and The driving fixed terminals are respectively disposed on the left and right sides of the heat sink 1; the IGBT detaching pressing auxiliary terminal is located at the top of the heat sink 1;
  • the 09 heat sink 2 includes: a second IGBT busbar fixed terminal 19, and a second IGBT disassembly The top auxiliary terminal 20 and the heat sink limit terminal 21; the second IGBT busbar fixed terminal and the second IGBT dismounting auxiliary terminal are respectively disposed on the left and right sides of the heat sink 2, and the heat sink limit The terminal is located at the top of the heat sink 2.

Abstract

A large-component IGBT press fitting unit, comprising a support frame (14) and a press fitting unit that is located in the support frame (14) and is used for fixing an IGBT valve series. The press fitting unit comprises: press fitting stress cones (11) located at the two ends of the IGBT valve series, a pressure adaptive adjusting mechanism and an insulated isolation structure; and the press fitting stress cones (11) and the pressure adaptive adjusting mechanism are respectively and fixedly connected to metal end plates (01) arranged at the two ends of the support frame (14), and the insulated isolation structure is used for realizing electric isolation of the press fitting structure from electrical components.

Description

一种大组件IGBT压装单元Large component IGBT press-fit unit 技术领域Technical field
本发明涉及高压输电领域,具体涉及一种大组件IGBT压装单元。The invention relates to the field of high voltage transmission, in particular to a large component IGBT press-fit unit.
背景技术Background technique
随着大功率电力电子技术的发展,尤其是高压柔性直流输电和灵活交流输电的发展,IGBT器件以其灵活可控的关断特性在电力系统的应用越来越广泛。随着输电容量的不断提高,高耐压、高通流能力、大截面尺寸的IGBT器件不断普及应用。早期IGBT器件主要以焊接式为主,这种器件采用螺栓固定在散热板上应用的设计结构,通流能力和耐压有限,且在击穿工况下为断路失效模式,需要配置相应的旁路装置,使得该类型IGBT应用设计复杂,限制其在工程领域的扩展应用。针对此问题,最近几年出现了新型压接式IGBT,在电气特性上与焊接式IGBT一致,但是结构完全不同,该IGBT需要通过一定的压力压装在散热结构上使用,且该器件在发生击穿时,为短路失效模式,类似于晶闸管,应用时不需要设计相应的旁路装置,应用方便,可靠性高,且由于采用压装设计,散热效率更高,结温控制精确,具有更高耐压和更高通流能力。With the development of high-power power electronics technology, especially the development of high-voltage flexible DC transmission and flexible AC transmission, IGBT devices have become more and more widely used in power systems with their flexible and controllable shutdown characteristics. With the continuous increase of transmission capacity, IGBT devices with high withstand voltage, high flow capacity and large cross-section size are widely used. Early IGBT devices were mainly soldered. The device was designed with bolts fixed on the heat sink. The flow capacity and withstand voltage were limited, and the break mode was broken under the breakdown condition. The circuit device makes the design of this type of IGBT complex, limiting its extended application in the engineering field. In response to this problem, a new type of crimping IGBT has appeared in recent years, which is identical in electrical characteristics to the soldered IGBT, but the structure is completely different. The IGBT needs to be mounted on the heat dissipation structure by a certain pressure, and the device is in occur. In the case of breakdown, it is a short-circuit failure mode, similar to a thyristor. It does not need to be designed with a corresponding bypass device. It is easy to apply, has high reliability, and because of the press-fit design, the heat dissipation efficiency is higher, the junction temperature control is accurate, and there is more High withstand voltage and higher flow capacity.
这种高性能的压接式IGBT对压装要求更为苛刻,因此要求IGBT压装机构必须具有更高的机械强度、更好的电气绝缘性能,而且压紧结构安全可靠,性能稳定,考虑到工程应用,IGBT压装机构还应便于工程现场的压装和拆卸。This high-performance crimp IGBT is more demanding for press-fit. Therefore, the IGBT press-fit mechanism must have higher mechanical strength, better electrical insulation performance, and the compact structure is safe and reliable, and the performance is stable. For engineering applications, the IGBT press-fit mechanism should also facilitate press-fit and disassembly at the engineering site.
大组件IGBT压装机构设计从原理角度考虑,类似于晶闸管的压装,基本都采用了通过晶闸管、散热器中心线施加压力的方式,但实现的方式多样,IGBT压装机构的压装框架结构多样,压力加载的方法也各有特点。目前比较常见的可参考的晶闸管压装框架是用绝缘层压板材和金属结构件通 过紧固螺栓组成的刚性框架,这种框架虽然结构稳定,强度大,但是重量大、比较笨重,结构缺乏弹性,适应于IGBT压装机构尺寸弹性变化方面的能力较差。部分电力迁移机车设备上的变频器采用压接式IGBT,其压装机构采用金属结构件与绝缘拉杆配合的压装框架,受限于绝缘拉杆的横向剪切强度限制,基本都采用吊装设计,灵活性很差,可靠性很低。IGBT压装机构的压力加载型式也有多种设计,有通过单个螺栓中心顶压的结构,这种结构安装和检修都不方便,压力控制不精确;也有通过多螺杆顶压的结构,这种型式操作复杂,压力加载不方便,且很难保证压力均匀分散。针对压接式IGBT,由于单个器件在压装时,IGBT的厚度尺寸有很大的形变位移,压装和拆卸都很不方便,截止目前为止,从可查到的文献还没有相关大组件IGBT压装压力自适应设计方面的参考技术路线。The design of the large component IGBT press-fit mechanism is similar to the thyristor press-fit. Basically, the method of applying pressure through the thyristor and the heat sink center line is adopted, but the implementation is various, and the press-fit frame structure of the IGBT press-fit mechanism is adopted. Diverse, pressure loading methods also have their own characteristics. At present, the more common reference thyristor press-fit frame is made of insulating laminated sheets and metal structural parts. A rigid frame composed of fastening bolts, although the structure is stable and strong, but the weight is large, relatively bulky, and the structure lacks elasticity, and the ability to adapt to the dimensional change of the IGBT press-fit mechanism is poor. The frequency converter on some electric power transfer locomotive equipment adopts the crimping type IGBT, and the press-fit mechanism adopts the press-fit frame with the metal structural member and the insulating tie rod, which is limited by the transverse shear strength limit of the insulating tie rod, and basically adopts the hoisting design. Very poor flexibility and low reliability. The pressure loading type of the IGBT press-fit mechanism also has various designs, and has a structure that is pressed by a single bolt center. This structure is inconvenient to install and repair, and the pressure control is inaccurate; there is also a structure by multi-screw pressing, this type The operation is complicated, the pressure loading is inconvenient, and it is difficult to ensure uniform pressure dispersion. For the crimp IGBT, since the thickness of the IGBT has a large deformation displacement due to the single device during press-fitting, it is inconvenient to press and disassemble. Up to now, there is no relevant large-component IGBT from the available literature. Reference technology route for adaptive design of press-fit pressure.
需要重点说明的是,国内应用的IGBT压装技术,还没有在高电压等级实现10级以上IGBT压装的设计专利。It is important to note that the domestically applied IGBT press-fit technology has not yet achieved a design patent for IGBT press-fit of 10 or higher levels at high voltage levels.
发明内容Summary of the invention
为了弥补上述缺陷,本发明实施例提出一种大组件IGBT压装单元,具有结构简洁、压力分散均匀、压装精确、易于操作、便于维护等优点;能够解决现有技术中存在的上述问题。In order to remedy the above defects, the embodiment of the present invention provides a large component IGBT press-fit unit, which has the advantages of simple structure, uniform pressure dispersion, accurate press-fit, easy operation, and easy maintenance; and can solve the above problems in the prior art.
本发明的目标是采用下述技术方案实现的:The object of the present invention is achieved by the following technical solutions:
本发明实施例提供的一种大组件IGBT压装单元,包括支撑框架和位于支撑框架中用于固定IGBT阀串的压装单元;其中,A large component IGBT press-fit unit provided by the embodiment of the invention includes a support frame and a press-fit unit for fixing the IGBT valve string in the support frame;
所述压装单元包括:位于IGBT阀串两端的压装应力锥、压力自适应调整机构和绝缘隔离结构;The press-fit unit includes: a press-fit stress cone, a pressure adaptive adjustment mechanism, and an insulation isolation structure at both ends of the IGBT valve string;
所述压装应力锥和压力自适应调整机构分别与支撑框架两端的金属端板相固接,绝缘隔离结构用于实现压装结构与电气元部件之间电气隔离。The press-fit stress cone and the pressure adaptive adjustment mechanism are respectively fixed to the metal end plates at both ends of the support frame, and the insulation isolation structure is used for electrically isolating between the press-fit structure and the electrical component.
本发明达到的有益效果是: The beneficial effects achieved by the present invention are:
(1)本发明主要针对柔性直流输电系统的以全控IGBT器件为核心部件的直流电力电子设备,同时也适用于以IGBT器件为核心部件的交流输电设备;应用范围广泛,适用性强;(1) The present invention is mainly directed to a DC power electronic device with a fully-controlled IGBT device as a core component of a flexible direct current transmission system, and is also applicable to an AC power transmission device with an IGBT device as a core component; the application range is wide and the applicability is strong;
(2)通过本发明专利提出的压装应力锥与压力自适应机构配合的设计,可以保证压装力在IGBT表面的均匀分散和可靠压装,满足IGBT运行的可靠散热和均匀载流;适用于多级IGBT器件及散热器的大组件压装,确保IGBT器件的可靠电气连接和有效散热,确保IGBT器件在额定通流或者过负荷电流下的可靠运行;(2) The design of the press-fit stress cone and the pressure adaptive mechanism proposed by the invention patent can ensure uniform dispersion and reliable press-fitting of the pressing force on the IGBT surface, and satisfy the reliable heat dissipation and uniform current carrying of the IGBT operation; The large components of multi-stage IGBT devices and heat sinks are pressed to ensure reliable electrical connection and effective heat dissipation of IGBT devices, ensuring reliable operation of IGBT devices under rated current or overload current;
(3)本发明专利提出的金属端板、金属拉杆和绝缘套管组合的支撑框架设计,可以满足IGBT压装单元的结构稳定性和强度要求,为压装单元提供可靠支撑,同时有在高电位差下实现了紧凑化绝缘设计;(3) The support frame design of the metal end plate, the metal tie rod and the insulating sleeve combined by the invention patent can meet the structural stability and strength requirements of the IGBT press-fit unit, provide reliable support for the press-fit unit, and have high A compact insulation design is achieved with a potential difference;
(4)本发明专利提出的压装应力锥、IGBT、散热器、压力自调整机构、碟簧等零部件和器件组合的布置形式,可实现IGBT压装单元的多级IGBT大组件压装,可实现最大20级及以上IGBT的压接;(4) The arrangement form of the press-fit stress cone, the IGBT, the heat sink, the pressure self-adjusting mechanism, the disc spring and the like and the device combination proposed by the invention patent can realize the multi-stage IGBT large component press-fit of the IGBT press-fit unit, It can realize the crimping of IGBTs of up to 20 grades and above;
(5)本发明专利提出的IGBT散热器结构设计,可以实现散热器功能的扩展,在除了实现IGBT散热功能外,还兼具固定支撑IGBT驱动、母排连接等作用;(5) The structure design of the IGBT heat sink proposed by the invention patent can realize the expansion of the function of the heat sink, and in addition to realizing the heat dissipation function of the IGBT, it also has the functions of fixed support IGBT drive and busbar connection;
(6)本发明专利提出的IGBT压装单元绝缘隔离盘设计,可以实现IGBT和散热器等压装组件与支撑框架之间的电位隔离,满足空气绝缘和爬电距离的要求。首次实现了压接式IGBT不少于16级的串联压装,且最大可扩展至20级及以上压装。(6) The design of the insulating spacer of the IGBT press-fit unit proposed by the invention patent can realize the potential isolation between the press-fit assembly of the IGBT and the heat sink and the support frame, and meet the requirements of air insulation and creepage distance. For the first time, the crimping IGBT has been fabricated in series with not less than 16 stages, and can be expanded to a maximum of 20 stages and above.
附图说明DRAWINGS
图1为一种大组件IGBT压装单元结构示意图;1 is a schematic structural view of a large component IGBT press-fit unit;
图2为一种大组件IGBT压装单元剖视结构示意图;2 is a cross-sectional structural view of a large component IGBT press-fit unit;
图3为压装应力锥结构示意图; Figure 3 is a schematic view showing the structure of a press-fit stress cone;
图4为压装应力锥压力分散原理示意图;Figure 4 is a schematic view of the pressure dispersion principle of the press-fit stress cone;
图5为IGBT压装单元支撑框架;Figure 5 is a IGBT press-fit unit support frame;
图6为IGBT散热器结构1示意图;Figure 6 is a schematic view of the IGBT heat sink structure 1;
图7为IGBT散热器结构2示意图;Figure 7 is a schematic view of the IGBT heat sink structure 2;
图8为绝缘隔离盘结构示意图。Figure 8 is a schematic view showing the structure of an insulating spacer.
其中,01-金属端板,02-金属拉杆,03-绝缘隔离盘,04-绝缘套管,05-压力自适应锥头,06-压力自适应锥窝,07-碟簧,08-散热器1,09-散热器2,10-IGBT,11-压装应力锥,12-调整垫片,13-压力适配器,14-支撑框架,15-绝缘支撑横梁,16-第一IGBT母排固定端子,17-驱动固定端子,18-第一IGBT拆卸顶压辅助端子;19-第二IGBT母排固定端子,20-第二IGBT拆卸顶压辅助端子,21-散热器限位端子。Among them, 01-metal end plate, 02-metal tie rod, 03-insulation isolation disc, 04-insulation sleeve, 05-pressure adaptive cone head, 06-pressure adaptive cone, 07-dised spring, 08-heat sink 1,09-heat sink 2,10-IGBT,11-pressed stress cone,12-adjusting washer,13-pressure adapter,14-support frame,15-insulated support beam,16-first IGBT busbar fixed terminal , 17-drive fixed terminal, 18-first IGBT removal top pressure auxiliary terminal; 19-second IGBT busbar fixed terminal, 20-second IGBT removal top pressure auxiliary terminal, 21-heatsink limit terminal.
具体实施方式detailed description
下面结合附图对本发明的具体实施方式做进一步的详细说明。The specific embodiments of the present invention will be further described in detail below with reference to the accompanying drawings.
本发明提出的一种大组件IGBT压装单元设计,以金属拉杆和金属端板组成的支撑固定结构为载体,通过配合压装应力锥和压力自适应调整机构实现压力加载和压力均匀分散;通过组合式碟簧机构实现压力的长期保持和形变自适应调整,通过绝缘隔离盘实现支撑结构与IGBT之间的高电位隔离。为了确保IGBT运行在运行时长期保持结构稳定性,避免外部施加的各种冲击负荷对IGBT性能产生不利影响,该压装单元设计了精确的对中机构,有效的保护IGBT,满足其各种运行工况要求。The invention relates to a large component IGBT press-fit unit design, which adopts a support fixed structure composed of a metal tie rod and a metal end plate as a carrier, and achieves pressure loading and uniform pressure dispersion by using a press-fit stress cone and a pressure adaptive adjustment mechanism; The combined disc spring mechanism realizes long-term pressure maintenance and deformation adaptive adjustment, and achieves high-potential isolation between the support structure and the IGBT through the insulating spacer disk. In order to ensure the long-term structural stability of the IGBT during operation and to avoid adverse effects on the IGBT performance caused by externally applied various impact loads, the press-fit unit is designed with an accurate centering mechanism to effectively protect the IGBT and meet its various operations. Working condition requirements.
如图1和图2所示,本实施例提供的一种大组件IGBT压装单元,包括支撑框架14和位于支撑框架中用于固定IGBT阀串的压装单元;As shown in FIG. 1 and FIG. 2, a large component IGBT press-fit unit provided by this embodiment includes a support frame 14 and a press-fit unit for fixing the IGBT valve string in the support frame;
其中,所述压装单元包括位于IGBT阀串两端的压装应力锥11和压力自适应调整机构,所述压装应力锥和压力自适应调整机构分别与支撑框架两端的金属端板01相固接。 Wherein, the press-fit unit comprises a press-fit stress cone 11 and a pressure adaptive adjustment mechanism at both ends of the IGBT valve string, and the press-fit stress cone and the pressure adaptive adjustment mechanism are respectively solidified with the metal end plate 01 at both ends of the support frame Pick up.
为了保证压力在IGBT压装面均匀分散,采用“90度应力锥”理论,设计了特殊的压装应力锥结构,如图3所示,实现了压力在IGBT表面的均匀分散,其分散原理如图4所示。In order to ensure that the pressure is evenly dispersed on the IGBT press-fit surface, a special press-fit stress cone structure is designed using the "90-degree stress cone" theory. As shown in Fig. 3, the pressure is uniformly dispersed on the IGBT surface, and the dispersion principle is as follows. Figure 4 shows.
所述压装应力锥,呈实心漏斗状,锥面之间呈90度;具备锥形头部,所述锥形头部的端面与IGBT阀串的一端贴紧、其圆柱形尾部与支撑框架一端的金属端板01通过压力适配器13相连接,所述压装应力锥与金属端板之间安装有套设于圆柱形尾部上的调整垫片12。The press-fit stress cone has a solid funnel shape with a 90 degree angle between the tapered surfaces; a tapered head having an end face that is in close contact with one end of the IGBT valve string, and a cylindrical tail portion and a support frame The metal end plates 01 at one end are connected by a pressure adapter 13, and an adjusting spacer 12 sleeved on the cylindrical tail portion is mounted between the press-fit stress cone and the metal end plate.
调整垫片用于实现IGBT压装过程中压缩形变及位移间隙的填充;压力加载端子用于和外部压力加载机构配合,实现外部压力向IGBT压装单元的传递。其原理为:The adjusting gasket is used to realize the compression deformation and the displacement gap filling during the IGBT press-fit process; the pressure loading terminal is used to cooperate with the external pressure loading mechanism to realize the transmission of the external pressure to the IGBT press-fit unit. The principle is:
借助外部的压力加载机构,对压力加载端子施加拉力,同时外部压力加载机构顶压压装应力锥,则外部压装力通过压装应力锥均匀的向IGBT和散热器施加压力,并逐渐达到IGBT所需的额定压装力。在压力加载过程中,碟簧逐渐被压缩而变形,在压装应力锥与金属端板之间了一个形变间隙,在外部压装力撤销之前,将与该间隙大小配合的调整垫片填充其间,则在外部压装力撤销后,通过碟簧形变,将压装力保持在IGBT压装单元内部。The external pressure loading mechanism applies a pulling force to the pressure loading terminal, and the external pressure loading mechanism presses the pressure stress cone, and the external pressing force uniformly applies pressure to the IGBT and the heat sink through the press-fit stress cone, and gradually reaches the IGBT. The required rated press force. During the pressure loading process, the disc spring is gradually compressed and deformed, and a deformation gap is formed between the press-fit stress cone and the metal end plate, and the adjusting gasket matched with the gap is filled in between before the external pressing force is cancelled. Then, after the external pressing force is removed, the pressing force is maintained inside the IGBT press-fit unit by the disc spring deformation.
所述压力自适应调整机构包括压力自适应锥头05、压力自适应锥窝06和设置于所述压力自适应锥头和金属端板锥窝之间的碟簧07;The pressure adaptive adjustment mechanism includes a pressure adaptive cone 05, a pressure adaptive cone 06 and a disc spring 07 disposed between the pressure adaptive cone and the metal end plate cone;
其中,所述碟簧07,用于实现压力加载后的IGBT的压力保持和应用过程的IGBT和散热器组件的膨胀收缩的形变调整。The disc spring 07 is used for realizing the pressure maintenance of the IGBT after the pressure loading and the deformation adjustment of the expansion and contraction of the IGBT and the heat sink assembly during the application process.
通过压力自适应锥头05和压力自适应锥窝06的锥面配合,实现压力加载过程的由IGBT、散热器及辅助结构尺寸公差导致的形位偏差的自适应调整,保证IGBT压装力的均匀分布,从而满足IGBT散热和通流要求。Through the cone matching of the pressure adaptive cone 05 and the pressure adaptive cone 06, the adaptive adjustment of the shape and position deviation caused by the dimensional tolerance of the IGBT, the heat sink and the auxiliary structure during the pressure loading process is realized, and the pressing force of the IGBT is ensured. Uniform distribution to meet IGBT heat dissipation and flow requirements.
如图5所示,支撑框架包括通过螺母固定的2个金属端板01和4根金 属拉杆02;2个金属端板的底端设有用于支撑IGBT阀串的绝缘支撑横梁15且每个金属端板的四角分别设有供金属拉杆穿过的通孔,4根金属拉杆之间留有容纳IGBT阀串的空间,所述金属拉杆外部套有绝缘套管04。绝缘支撑横梁,用于IGBT压装单元压装前IGBT阀串和器件的固定支撑,同时还起到IGBT拆卸时,压装力撤销后的IGBT阀串支撑。As shown in Figure 5, the support frame includes two metal end plates 01 and four gold fixed by nuts. The utility model belongs to the pull rod 02; the bottom end of the two metal end plates is provided with an insulating support beam 15 for supporting the IGBT valve string, and the four corners of each metal end plate are respectively provided with through holes for the metal rods to pass through, and between the four metal rods A space for accommodating the IGBT valve string is left, and the metal tie rod is externally sheathed with an insulating sleeve 04. The insulating support beam is used for the fixed support of the IGBT valve string and the device before the IGBT press-fit unit is pressed, and also serves as the IGBT valve string support after the IGBT is disassembled and the press-fit force is cancelled.
为了保持支撑框架与IGBT压装单元内部的IGBT、散热器及其他金属结构件在高电位差下的空气绝缘距离需求,所述锥形头部的端面与IGBT阀串之间设有绝缘隔离盘03。In order to maintain the air insulation distance requirement between the support frame and the IGBT, the heat sink and other metal structural parts inside the IGBT press-fit unit under a high potential difference, an insulating spacer disk is arranged between the end surface of the tapered head and the IGBT valve string. 03.
所述绝缘隔离盘采用高强度绝缘材料制成,由盘沿下端敞口至中部分布设计为伞状结构,整体采用盘式结构,与压装应力锥相互连接。The insulating spacer disk is made of high-strength insulating material, and is designed as an umbrella structure from the open end to the middle part of the disc, and the disc structure is adopted as a whole, and is connected with the press-fit stress cone.
其中,绝缘隔离盘如图8所示,采用高强度绝缘材料制成,由盘沿下端敞口至中部分布有爬电伞群;采用盘式结构与压装应力锥相互连接。通过该设计,可实现支撑框架的单电位隔离。Among them, the insulating spacer disk is made of high-strength insulating material as shown in Fig. 8. The crawler umbrella group is distributed from the lower end to the middle of the disc; the disc structure is connected with the press-fit stress cone. With this design, single-potential isolation of the support frame can be achieved.
为了具有良好的散热性能,IGBT阀串两端的最外侧均为散热器,简化IGBT压装单元应用设备的结构集成设计,有利于应用设备的结构紧凑化设计。In order to have good heat dissipation performance, the outermost ends of the IGBT valve string are heat sinks, which simplifies the structural integration design of the IGBT press-fit unit application equipment, and is advantageous for the compact design of the application equipment.
所述IGBT阀串由散热器和IGBT10间隔串联组成,所述IGBT两端采用结构相同的08散热器1,或者采用结构相同的09散热器2,或者IGBT的一侧为散热器1、另一侧为散热器2。所述IGBT散热器与IGBT交错分布,每个IGBT的两个导电接触面皆与散热器贴合,实现IGBT的双向散热。The IGBT valve string is composed of a heat sink and an IGBT 10 which are connected in series, and the IGBT has the same structure of the 08 heat sink 1 or the same structure of the 09 heat sink 2, or one side of the IGBT is the heat sink 1, and the other The side is the heat sink 2. The IGBT heat sink and the IGBT are alternately distributed, and the two conductive contact faces of each IGBT are bonded to the heat sink to realize bidirectional heat dissipation of the IGBT.
如图6和图7所示,所述散热器1包括:第一IGBT母排固定端子16、驱动固定端子17和第一IGBT拆卸顶压辅助端子18;所述第一IGBT母排固定端子和驱动固定端子分别设置于所述散热器1的左右两侧;所述IGBT拆卸顶压辅助端子位于所述散热器1顶部;As shown in FIG. 6 and FIG. 7, the heat sink 1 includes: a first IGBT busbar fixed terminal 16, a driving fixed terminal 17, and a first IGBT detachment pressing auxiliary terminal 18; the first IGBT busbar fixed terminal and The driving fixed terminals are respectively disposed on the left and right sides of the heat sink 1; the IGBT detaching pressing auxiliary terminal is located at the top of the heat sink 1;
所述09散热器2包括:第二IGBT母排固定端子19、第二IGBT拆卸 顶压辅助端子20和散热器限位端子21;所述第二IGBT母排固定端子和第二IGBT拆卸顶压辅助端子分别设置于所述散热器2的左右两侧,所述散热器限位端子位于所述散热器2顶部。The 09 heat sink 2 includes: a second IGBT busbar fixed terminal 19, and a second IGBT disassembly The top auxiliary terminal 20 and the heat sink limit terminal 21; the second IGBT busbar fixed terminal and the second IGBT dismounting auxiliary terminal are respectively disposed on the left and right sides of the heat sink 2, and the heat sink limit The terminal is located at the top of the heat sink 2.
最后应当说明的是:以上实施例仅用以说明本申请的技术方案而非对其保护范围的限制,尽管参照上述实施例对本申请进行了详细的说明,所属领域的普通技术人员应当理解:本领域技术人员阅读本申请后依然可对申请的具体实施方式进行种种变更、修改或者等同替换,这些变更、修改或者等同替换,其均在其申请待批的权利要求范围之内。 It should be noted that the above embodiments are only used to explain the technical solutions of the present application and not to limit the scope of the protection thereof. Although the present application is described in detail with reference to the above embodiments, those skilled in the art should understand that: A person skilled in the art can still make various changes, modifications, or equivalents to the specific embodiments of the application after reading the present application. These changes, modifications, or equivalents are all within the scope of the claims to be approved.

Claims (9)

  1. 一种大组件IGBT压装单元,包括支撑框架和位于支撑框架中用于固定IGBT阀串的压装单元;其中,A large component IGBT press-fit unit includes a support frame and a press-fit unit for fixing the IGBT valve string in the support frame;
    所述压装单元包括:位于IGBT阀串两端的压装应力锥、压力自适应调整机构和绝缘隔离结构;The press-fit unit includes: a press-fit stress cone, a pressure adaptive adjustment mechanism, and an insulation isolation structure at both ends of the IGBT valve string;
    所述压装应力锥和压力自适应调整机构分别与支撑框架两端的金属端板相固接,绝缘隔离结构用于实现压装结构与电气元部件之间电气隔离。The press-fit stress cone and the pressure adaptive adjustment mechanism are respectively fixed to the metal end plates at both ends of the support frame, and the insulation isolation structure is used for electrically isolating between the press-fit structure and the electrical component.
  2. 如权利要求1所述的压装单元,其中,所述压装应力锥,呈实心漏斗状,锥面之间呈90度,且具备锥形头部以及圆柱形尾部;其中,The press-fit unit according to claim 1, wherein the press-fit stress cone has a solid funnel shape with a 90 degree angle between the tapered surfaces, and has a tapered head portion and a cylindrical tail portion;
    所述压装应力锥的锥形头部的端面与IGBT阀串的一端贴紧;并且所述锥形头部的端面与IGBT阀串之间设有绝缘隔离盘;An end surface of the tapered head of the press-fit stress cone is in close contact with one end of the IGBT valve string; and an insulating spacer disk is disposed between the end surface of the tapered head and the IGBT valve string;
    所述压装应力锥的所述圆柱形尾部,套设有调整垫片;所述圆柱形尾部与支撑框架一端的金属端板通过压力适配器相连接。The cylindrical tail portion of the press-fit stress cone is sleeved with an adjustment pad; the cylindrical tail portion is connected to the metal end plate at one end of the support frame through a pressure adapter.
  3. 如权利要求2所述的压装单元,其中,所述绝缘隔离盘,由高强度绝缘材料制成,由盘沿下端敞口至中部分布有爬电伞群,采用盘式结构与压装应力锥相互连接。The press-fit unit according to claim 2, wherein said insulating spacer is made of a high-strength insulating material, and a crawler umbrella group is distributed from the lower end to the middle of the disc, and the disc structure and the press-fit stress are used. The cones are connected to each other.
  4. 如权利要求1所述的压装单元,其中,所述压力自适应调整机构,包括:碟簧,设置于所述压力自适应锥头和金属端板之间,用于实现压力加载后的压力保持和应用过程的形变调整。The press-fit unit of claim 1, wherein the pressure adaptive adjustment mechanism comprises: a disc spring disposed between the pressure adaptive cone and the metal end plate for achieving pressure after pressure loading Maintain and adjust the deformation of the application process.
  5. 如权利要求4所述的压装单元,其中,所述压力自适应调整机构,还包括:压力自适应锥头和压力自适应锥窝;通过所述压力自适应锥头和所述压力自适应锥窝的锥面配合,实现压力加载过程的由IGBT、散热器及辅助结构尺寸公差导致的形位偏差的自适应调整。The press-fit unit of claim 4, wherein the pressure adaptive adjustment mechanism further comprises: a pressure adaptive cone and a pressure adaptive cone; the pressure adaptive cone and the pressure adaptation The tapered surface of the cone is matched to realize the adaptive adjustment of the shape and position deviation caused by the dimensional tolerance of the IGBT, the heat sink and the auxiliary structure during the pressure loading process.
  6. 如权利要求1所述的压装单元,其中:所述支撑框架包括通过螺母固定的两个金属端板和四根金属拉杆; The press-fit unit according to claim 1, wherein: said support frame comprises two metal end plates and four metal tie rods fixed by nuts;
    所以金属端板的底端,设有用于支撑IGBT阀串的绝缘支撑横梁,且每个金属端板的四角分别设有供金属拉杆穿过的通孔;Therefore, the bottom end of the metal end plate is provided with an insulating support beam for supporting the IGBT valve string, and the four corners of each metal end plate are respectively provided with through holes for the metal rod to pass through;
    相邻的两个金属拉杆之间留有容纳IGBT阀串的空间,且所述金属拉杆外部套有绝缘套管。A space for accommodating the IGBT valve string is left between the adjacent two metal tie rods, and the metal tie rod is externally sheathed with an insulating sleeve.
  7. 如权利要求1所述的压装单元,其中,所述IGBT阀串由散热器和IGBT间隔串联组成;The press-fit unit according to claim 1, wherein said IGBT valve string is composed of a heat sink and an IGBT spaced apart in series;
    所述IGBT两侧采用结构相同的散热器一,或者采用结构相同的散热器二,或者IGBT的一侧为散热器一、另一侧为散热器二。A heat sink 1 having the same structure is used on both sides of the IGBT, or a heat sink 2 having the same structure is used, or one side of the IGBT is a heat sink 1 and the other side is a heat sink 2 .
  8. 如权利要求7所述的压装单元,其中,所述散热器一包括:第一IGBT母排固定端子、驱动固定端子和第一IGBT拆卸顶压辅助端子;The press-fit unit according to claim 7, wherein the heat sink 1 comprises: a first IGBT busbar fixed terminal, a drive fixed terminal, and a first IGBT detachment pressing auxiliary terminal;
    所述第一IGBT母排固定端子和驱动固定端子分别设置于所述散热器一的左右两侧;所述IGBT拆卸顶压辅助端子位于所述散热器一的顶部。The first IGBT busbar fixed terminal and the driving fixed terminal are respectively disposed on the left and right sides of the heat sink 1. The IGBT detachment pressing auxiliary terminal is located at the top of the heat sink 1.
  9. 如权利要求7所述的压装单元,其中,所述散热器二包括:第二IGBT母排固定端子、第二IGBT拆卸顶压辅助端子和散热器限位端子;The press-fit unit according to claim 7, wherein the heat sink 2 comprises: a second IGBT busbar fixed terminal, a second IGBT detachment pressing auxiliary terminal, and a heat sink limit terminal;
    所述第二IGBT母排固定端子和第二IGBT拆卸顶压辅助端子分别设置于所述散热器二的左右两侧,所述散热器限位端子位于所述散热器二的顶部。 The second IGBT busbar fixed terminal and the second IGBT detachment pressing auxiliary terminal are respectively disposed on the left and right sides of the heat sink 2. The heat sink limit terminal is located at the top of the heat sink 2.
PCT/CN2016/099253 2015-09-25 2016-09-18 Large-component igbt press fitting unit WO2017050189A1 (en)

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