JPH06177293A - Semiconductor stack - Google Patents

Abstract

PURPOSE:To provide a horizontal semiconductor stack in which flat elements can be easily replaced. CONSTITUTION:A semiconductor stack includes flat elements 2, each of which has its edge engaged with a recess 14 formed in a cooling fin 3. When a screw 6 is loosened to replace elements in this stack, the element will not fall off and it can be removed through a narrow gap. Since the loosening of the screw does not cause the element to fall, there is no need for removing conductors, and thus replacing is facilitated.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor stack used in a power conversion device.

[0002]

2. Description of the Related Art FIG. 4 shows a conventional semiconductor stack disclosed in, for example, Japanese Utility Model Laid-Open No. 52360/1990.
In the figure, 1 is a semiconductor stack, 2 is a flat element for controlling current, 3 is a cooling fin for cooling the flat element, 4 is a lead terminal for energizing the flat element 2, 5 is an insulating spacer, and 6 is an insulating spacer. A tightening screw screwed to one mounting leg 7a, 8 is a movable pin which is inserted into the other mounting leg 7b and receives the pressure contact force of the flat element 2 and the like, and 9 is fitted into this movable pin 8 to retain the pressure contact force Springs 10 for mounting feet 7
stack holding rods for holding a and 7b, 11 is a flat element 2
Movable cradle to be used when replacing
An adjustment screw for moving 1 up and down, and 13 is a mount for the movable pedestal 11.

Next, the operation will be described. Flat element 2,
The cooling fin 3, the lead-out terminal 4, and the insulating spacer 5 are pressed against each other at a predetermined pressure and held by tightening the tightening screw 6. At this time, the spring 9 is compressed and the movable pin 8
Are pressing. The mounting feet 7a and 7b on both sides of the stack 1 are held at a constant interval by a holding rod 10 so that they will not bend or bend even if pressure contact force is applied from the movable pin 8 and the tightening screw 6. Has strength. The movable pedestal 11 and the cooling fins 3 are sufficiently separated during normal use. Here, when the flat element 2 fails, the tightening screw 6 is loosened and the flat element 2 is taken out from the stack 1. However, when the stack 1 is horizontally mounted as shown in the figure, if the tightening bolt 6 is loosened, the cooling is performed. Since the fins 3 and the flat element 2 fall down, the adjusting screw 12 is adjusted to lift the movable table 11 until it contacts the cooling fin 3, and then the tightening screw 6 is loosened to press the flat element 2 or the like. Is set to zero, but the amount of loosening of the tightening screw 6 at this time is very delicate. Then, by manually expanding the gap between the cooling fins 3 on both sides of the flat element 2 to be replaced, the element 2 in between falls, so a new flat element 2 to be replaced is inserted, and the flat element 2 on both sides that has been expanded is replaced. While holding the cooling fin 3, tighten the tightening screw 6 to the specified pressure contact force, then adjust screw 1
The movable table 11 is lowered by 2 so as to be separated from the cooling fin 3. This completes the replacement of the flat element 2.

[0004]

Since the conventional stack is constructed as described above, it is difficult to loosen the tightening screw when replacing a defective flat element when the stack is mounted laterally. If you fail to do this, all flat elements will fall, and it will take time and labor to reassemble the entire stack from the beginning.Therefore, there is a problem that only a skilled worker can replace flat elements. there were.

The present invention has been made to solve the above problems, and an object thereof is to make it possible to easily replace a flat element of a semiconductor stack mounted in a lateral direction.

[0006]

According to another aspect of the present invention, there is provided a semiconductor stack having a recess in which an end face portion of a flat element fits and engages with an end face of the cooling fin on a surface where the flat element and the cooling fin are in contact with each other. is there.

[0007]

In the semiconductor stack according to the present invention, the flat element is fitted with a recess on the cooling fin side of the surface where the flat element and the cooling fin are in contact with each other. Since the flat element is supported by the concave portion of the cooling fin, it does not fall unless it is extremely loosened, and it can be taken out by simply loosening the tightening screw when taking out the flat element.

[0008]

EXAMPLES Example 1. Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is an exploded perspective view showing the first embodiment,
A wide and shallow recessed slide groove 14 into which the end face portion 2a of the flat element 2 is fitted and locked is provided on the end face of the cooling fin 3. The rest of the configuration is similar to that of the conventional example.

Next, the operation will be described. When the tightening screw 6 for replacing the flat element 2 is loosened, the pressure contact force between the flat element 2 and the cooling fin 3 which are in contact with each other becomes small, and a gap is generated in the contact portion. In this case, in the case of the conventional stack, the flat element 2 slides down, but as shown in FIG. 1, since the end of the flat element 2 has entered the concave slide groove 14 formed in the cooling fin 3, it does not slide down. Absent. Then, in order to take out the flat element 2 to be exchanged, the cooling fins 3 on both sides of the flat element 2 to be exchanged are spread by using an appropriate tool to extract the flat element 2. in this case,
Since the concave slide groove 14 is formed in the cooling fin 3, the flat element 2 can be easily taken out upward with a slight gap.

Embodiment 2. FIG. 2 is an exploded perspective view a showing Embodiment 2 and a sectional view b showing an engagement state of a flat element and a cooling fin. In the figure, 15 is a screw pin screwed to the center of the end face of the flat element 2, Reference numeral 16 denotes a recess slide groove formed on the end surface of the cooling fin 3, and its size is set to a size with which the screw pin 15 can slide. When the stack is assembled and pressure-welded, the contact surface between the flat element 2 and the cooling fin 3 is provided with the screw pin 1 by the concave slide groove 16.
It is designed to make perfect contact without being disturbed by 5.

Embodiment 3. FIG. 3 is an exploded perspective view showing the third embodiment, and the same effect can be obtained by processing the circular recess 17 in the cooling fin 3. In this case, compared with the first embodiment, there is an advantage that the center of the flat element can be easily aligned during assembly.

[0012]

As described above, according to the present invention, by inserting the end portion of the flat element into the recess formed in the cooling fin, the flat element can be removed even if the tightening screw is loosened when the flat element is replaced. Since it does not slip off, the flat element can be easily replaced,
In addition, when removing the flat element, it is sufficient to slightly loosen the contact pressure between the cooling fin and the flat element, and it is not necessary to remove the lead conductor that is drawn to energize the cooling fin to shorten the element replacement time. There is an effect that can be done.

[Brief description of drawings]

FIG. 1 is an exploded perspective view showing a first embodiment of a semiconductor stack according to the present invention.

FIG. 2 is an exploded perspective view a showing a second embodiment of the present invention and a partial sectional view b in an assembled state.

FIG. 3 is an exploded perspective view showing a third embodiment of the present invention.

FIG. 4 is an assembled sectional view showing a conventional semiconductor stack.

[Explanation of symbols]

 1 Stack 2 Flat Element 3 Cooling Fin 6 Tightening Bolt 9 Spring 14, 16 Recessed Slide Groove 15 Screw Pin 17 Circular Recessed

Claims (1)

[Claims] 1. A semiconductor stack in which a plurality of semiconductor elements and cooling fins are alternately arranged side by side in a lateral direction and clamped from both sides by spring pressure to be closely attached to each other to be assembled, A semiconductor stack, characterized in that a concave portion is provided on a surface in contact with the flat element so that an end surface portion of the flat element enters and is locked.