CN111679396A - Fixing structure of digital micro-mirror element in projector and projector - Google Patents
Fixing structure of digital micro-mirror element in projector and projector Download PDFInfo
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- CN111679396A CN111679396A CN202010510474.6A CN202010510474A CN111679396A CN 111679396 A CN111679396 A CN 111679396A CN 202010510474 A CN202010510474 A CN 202010510474A CN 111679396 A CN111679396 A CN 111679396A
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- digital micromirror
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- 239000000758 substrate Substances 0.000 claims abstract description 65
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- 239000000306 component Substances 0.000 description 18
- 230000008054 signal transmission Effects 0.000 description 9
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- 230000000149 penetrating effect Effects 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 239000002470 thermal conductor Substances 0.000 description 2
- 239000008358 core component Substances 0.000 description 1
- 230000005489 elastic deformation Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
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- 229910001220 stainless steel Inorganic materials 0.000 description 1
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Classifications
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/18—Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors
- G02B7/182—Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors for mirrors
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/18—Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors
- G02B7/181—Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors with means for compensating for changes in temperature or for controlling the temperature; thermal stabilisation
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B21/00—Projectors or projection-type viewers; Accessories therefor
- G03B21/14—Details
- G03B21/142—Adjusting of projection optics
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B21/00—Projectors or projection-type viewers; Accessories therefor
- G03B21/14—Details
- G03B21/16—Cooling; Preventing overheating
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B21/00—Projectors or projection-type viewers; Accessories therefor
- G03B21/14—Details
- G03B21/28—Reflectors in projection beam
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Projection Apparatus (AREA)
Abstract
The invention discloses a fixing structure of a digital micro-mirror element in a projector and the projector, relates to the technical field of projectors, and aims to solve the problem that a connecting component in the prior art cannot meet different stress requirements of a mechanical bearing area and a heat dissipation area. The fixing structure of the digital micromirror element in the projector comprises a mounting substrate, a first through hole is formed in the mounting substrate, a reflecting lens is arranged on the first surface of the digital micromirror element corresponding to the position of the through hole, a mechanical bearing area and a heat dissipation area are arranged on the second surface of the digital micromirror element, and a plurality of first connecting points are distributed in the mechanical bearing area; a plurality of second connecting contacts are arranged at positions of the circuit board assembly corresponding to the plurality of first connecting contacts; the first connecting component enables the second connecting contact point to be in pressing contact with the first connecting contact point; the radiator is contacted with the heat dissipation area of the digital micromirror element; the second connecting member is capable of applying a force to the heat sink that moves the heat sink in a direction closer to the dmd. The invention can be used for projectors.
Description
The application of the invention is based on the application number: 201710687195.5, filing date: 217-8-11, invention name: a fixing structure of a digital micro-mirror element in a projector and a divisional application of the projector are provided.
Technical Field
The invention relates to the technical field of projectors, in particular to a fixing structure of a digital micro-mirror element in a projector and the projector.
Background
Digital Light Processing (DLP) is a technology for displaying visible Digital information based on a Digital Micromirror Device (DMD). The principle is that red, blue and green primary color light beams emitted by a light source are projected onto a digital micro-mirror element, the digital micro-mirror element is composed of a plurality of micro-mirrors, one micro-mirror is equivalent to a pixel unit, each micro-mirror can rotate by a certain angle and is positioned by charges, signal input is processed and then acts on the digital micro-mirror element, so that deflection of the micro-mirror is controlled, along with different deflection angles of the micro-mirror, light can possibly reflect to enter a projection lens or leave the projection lens, the micro-mirror plays a role of an optical switch in a digital light processing projector, and incident light is selectively reflected by the digital micro-mirror element and then is projected and imaged by the projection lens. The digital micro-mirror element is a core component in the digital light processing projector, and whether the connection with other components is stable or not directly relates to the projection quality of the digital light processing projector.
As shown in fig. 1, a conventional fixing structure for a digital micromirror element in a projector includes a mounting substrate 01, where the mounting substrate 01 is provided with a through hole 0111; the fixing frame 02, the digital micro-mirror element assembly 03, the circuit board 04, the supporting plate 05 and the radiator 061 radiator 06 are sequentially arranged in a stacking mode in the direction away from the mounting substrate 01; as shown in fig. 2 and fig. 3, the digital micromirror element assembly 03 includes a base 031 and a digital micromirror element 032, a placement groove 0311 is formed on the base 031, the placement groove 0311 extends along a direction away from the mounting substrate 01, the digital micromirror element 032 is inserted into the placement groove 0311 along a thickness direction thereof, a portion of the digital micromirror element 032, which is located outside the placement groove 0311, extends into the through hole 0111, a reflective lens 0321 is disposed on a first surface (denoted by reference numeral b in fig. 3) of the digital micromirror element 032, a second surface (denoted by reference numeral c in fig. 3) includes a mechanical bearing region and a heat dissipation region (not shown), a plurality of first contact points (not shown) are distributed on the mechanical bearing region, a second surface of the digital micromirror element 032 is attached to the placement groove 0311, a plurality of conductive elastic sheets 0312 are disposed on a surface of the placement groove 0311 corresponding to the mechanical bearing region, and each conductive elastic sheet 0312 extends from the placement groove 0311 to a side surface attached to the circuit board 04, a plurality of second connecting contacts 0313 are distributed on the surface of the circuit board 04, which is attached to the base 031, two ends of a plurality of conductive elastic sheets 0312 are in one-to-one corresponding contact with a plurality of first connecting contacts and a plurality of second connecting contacts 0313, and the support plate 05 is connected with the fixing frame 02 through a first screw 07, so that the circuit board 04 and the digital micromirror element assembly 03 are fixedly clamped between the fixing frame 02 and the support plate 05, and the first connecting contacts and the second connecting contacts 0313 are ensured to be fully contacted with the conductive elastic sheets 0312; the fixing frame 02 is provided with an embedded through hole 021, the edge of an orifice at one side of the embedded through hole 021 is provided with a plurality of elastic hooks 022, and the base 031 is embedded into the embedded through hole 021 from one side of the fixing frame 02 close to the circuit board 04 and enables the elastic hooks to hook the edge of the inner wall of the accommodating groove 0311 and to be in contact with the surface of the digital micromirror element 032; the heat sink 06 includes a heat dissipating body 061 and a heat conductor 062 (as shown in fig. 4), the heat dissipating body 061 is attached to the supporting plate 05, penetrating holes (shown by a symbol a in fig. 1) are formed in regions of the circuit board 04, the supporting plate 05 and the base 031 opposite to the heat dissipating region, the heat conductor 062 sequentially penetrates through the penetrating holes of the circuit board 04, the supporting plate 05 and the base 031 and contacts with the heat dissipating region, the heat dissipating body 061 sequentially penetrates through the supporting plate 05, the circuit board 04 and the fixing frame 02 through a shoulder screw 08 and is connected with the mounting substrate 01, a spring 09 is sleeved on the shoulder screw 08, and the spring 09 is located between a screw head of the shoulder screw 08 and the supporting plate.
In the dmd 032, the heat dissipation region has a smaller structural strength and can bear a smaller force, the mechanical support region contacts with the base 031 and the fixing frame 02 and bears the locking force of the screw, the mechanical support region has a relatively larger structural strength and can bear a larger force (the maximum value of the force that the mechanical support region can bear is about twice as large as that of the heat dissipation region). In the fixing structure of the digital micromirror element 032 in the existing projector, the supporting plate 05, the digital micromirror element 032, the base 031 and the fixing frame 02 are locked and attached to the mounting substrate 01 by the shoulder screw 08, so that the force of the shoulder screw 08 acting on the mechanical bearing region through the heat sink 06, the supporting plate 05 and the base 031 is the same as the force of the shoulder screw 08 acting on the heat sink 06 through the heat conductor 062 of the heat sink 06, and because the mechanical bearing region and the heat dissipation region bear different forces, the locking and attaching force of the shoulder screw 08 cannot simultaneously meet the requirements of the mechanical bearing region and the heat dissipation region on bearing force. If the requirement of the bearing capacity of the heat dissipation area is only satisfied, the locking force of the shoulder screw 08 needs to be reduced, so that the locking force for fixing the support plate 05, the digital micromirror element 032, the base 031 and the fixing frame 02 on the mounting substrate 01 is reduced, the connection between the whole body consisting of the support plate 05, the digital micromirror element 032, the base 031 and the fixing frame 02 and the mounting substrate 01 is loosened, the position of the reflecting lens 0321 on the digital micromirror element 032 is easy to change, the reflection of the reflecting lens 0321 on the digital micromirror element 032 on the light beam is affected, and the image projection quality of the digital light processing projector is affected; if the requirement that the supporting plate 05, the digital micromirror element 032, the base 031 and the fixing frame 02 are fastened on the mounting substrate 01 is met, the locking force of the shoulder screw 08 needs to be increased, because the locking force of the shoulder screw 08 can act on the heat dissipation area of the digital micromirror element 032 through the heat conductor 062 of the heat sink 06, the increased locking force of the shoulder screw 08 can increase the stress of the heat dissipation area of the digital micromirror element 032, thereby increasing the risk that the digital micromirror element 032 is damaged, meanwhile, because the part of the digital micromirror element 032, which is located outside the base 031, extends into the through hole 0111, the through hole 0111 does not limit the digital micromirror element 032, the elastic hook 022 limits the position of the digital micromirror element 032, when the heat conductor 062 exerts a larger acting force on the heat dissipation area of the digital micromirror element 032, the elastic hook 022 is easy to deform greatly, thereby weakening the limiting effect of the digital micromirror element 032, this easily causes the dmd 032 to move toward the mounting substrate 01, which results in loose contact among the circuit board 04, the base 031, and the dmd 032, and thus affects the stability of signal transmission between the circuit board 04 and the dmd 032.
Disclosure of Invention
The embodiment of the invention provides a fixing structure of a digital micromirror element in a projector and the projector, which can meet different stress requirements of a mechanical bearing area and a heat dissipation area on the digital micromirror element, thereby ensuring that the digital micromirror element and a contact of a circuit board component are fully contacted and the digital micromirror element is firmly fixed with a mounting substrate while the digital micromirror element is not damaged.
To achieve the above object, an embodiment of the present invention provides a fixing structure of a digital micromirror element in a projector, including: the digital micromirror device comprises a mounting substrate, a first connecting piece and a second connecting piece, wherein the mounting substrate is provided with a first through hole, a first surface of the digital micromirror element is abutted against the mounting substrate, a reflecting lens is arranged at a position, corresponding to the first through hole, of the first surface, a second surface of the digital micromirror element comprises a mechanical bearing area and a heat dissipation area, the second surface is opposite to the first surface, and a plurality of first connecting points are distributed in the mechanical bearing area; the circuit board assembly is arranged close to the second surface of the digital micromirror element, and a plurality of second connecting contacts are arranged at positions of the circuit board assembly corresponding to the first connecting contacts; a first connection member capable of applying a force to the circuit board assembly to move the circuit board assembly in a direction approaching the mounting substrate, the second connection contact being brought into press contact with the first connection contact; the radiator is contacted with the radiating area of the digital micromirror element and is arranged at intervals with the circuit board assembly; a second connection component capable of applying a force to the heat sink that moves the heat sink in a direction closer to the digital micromirror element.
According to the fixing structure of the digital micromirror element in the projector provided by the embodiment of the invention, as the first through hole is formed on the mounting substrate, the first surface of the digital micromirror element is abutted against the mounting substrate, and the position of the first surface, which corresponds to the first through hole, is provided with the reflecting lens, when a force which enables the digital micromirror element to move towards the direction close to the mounting substrate is applied to the digital micromirror element, the mounting substrate can limit the digital micromirror element, so that the digital micromirror element is prevented from moving along the direction close to the mounting substrate, and the position relation between the reflecting lens and the mounting substrate can be kept fixed, so that the accuracy of the reflecting lens on light reflection is ensured, and the projector can project a stable image; the second surface of the digital micro-mirror element comprises a mechanical bearing area and a heat dissipation area, the second surface is opposite to the first surface, a plurality of first connecting contacts are distributed on the mechanical bearing area, the circuit board assembly is arranged close to the second surface of the digital micro-mirror element, a plurality of second connecting contacts are arranged at positions of the circuit board assembly corresponding to the plurality of first connecting contacts, and the first connecting assembly can apply force to the circuit board assembly to enable the circuit board assembly to move towards the direction close to the mounting substrate, so that the force applied to the circuit board assembly by the first connecting assembly to enable the circuit board assembly to move towards the direction close to the mounting substrate can be adjusted, namely the force applied to the circuit board assembly by the mechanical bearing area is adjusted, so that the second connecting contacts are fully contacted with the first connecting contacts, and stable signal transmission between the circuit board assembly and the digital micro-mirror element is ensured; because the radiator contacts with the heat dissipation area of the digital micromirror element and is arranged at intervals with the circuit board assembly (the force applied by the second connecting assembly to the radiator is only applied to the heat dissipation area is ensured), the second connecting assembly can apply force to the radiator to enable the radiator to move towards the direction close to the digital micromirror element, so that the stress of the heat dissipation area can be adjusted by adjusting the force applied by the second connecting assembly to the radiator, namely, by adjusting the contact tightness between the radiator and the heat dissipation area, the radiator can fully dissipate heat of the heat dissipation area, and the overlarge stress of the heat dissipation area can be avoided. The fixing structure of the digital micro-mirror element in the projector provided by the embodiment of the invention respectively adjusts the stress of the mechanical bearing area and the heat dissipation area through the two groups of connecting components, so that the requirements of the mechanical bearing area and the heat dissipation area on stress can be simultaneously met, namely: the force borne by the mechanical bearing area is adjusted to a proper value through the first connecting component, so that the second connecting contact point can be ensured to be fully contacted with the first connecting contact point, the signal transmission between the circuit board component and the digital micromirror element is ensured to be stable, and the digital micromirror element and the mounting substrate can be well fixed, so that the influence on light reflection when the digital micromirror element and the mounting substrate are loosened can be avoided; the force applied to the heat dissipation area is adjusted to a proper value through the second connecting component, so that the heat dissipation area is prevented from being broken due to overlarge stress, and the heat dissipation area can be fully cooled.
On the other hand, an embodiment of the present invention further provides a projector, including the fixing structure of the digital micromirror element in the projector described in the above embodiment.
Since the projector provided by the embodiment of the invention comprises the fixing structure of the digital micromirror element in the projector in the embodiment, the same technical effect can be generated, and the same technical problem can be solved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is an exploded view of a fixing structure of a digital micromirror device in a projector according to the prior art;
fig. 2 is an exploded view of the fixing frame, the digital micromirror element assembly, the circuit board, and the supporting board of the fixing structure of the digital micromirror element in the conventional projector;
FIG. 3 is an exploded view of a digital micromirror device assembly in a conventional fixed structure of the digital micromirror device in a projector;
FIG. 4 is a schematic structural diagram of a heat sink in a fixing structure of a digital micromirror device in a conventional projector;
FIG. 5 is a schematic view of a fixing structure of a digital micromirror device in a projector according to an embodiment of the invention;
FIG. 6 is an exploded view of a fixing structure of a digital micromirror device in a projector according to an embodiment of the present invention;
FIG. 7 is a schematic diagram of the connection between the digital micromirror element and the circuit board assembly in the fixing structure of the digital micromirror element in the projector according to the embodiment of the invention;
FIG. 8 is a diagram illustrating a second surface of a digital micromirror device according to an embodiment of the invention;
FIG. 9 is a cross-sectional view of section C-C of FIG. 5;
FIG. 10 is a schematic structural diagram illustrating another connection manner of the second connecting member in the fixing structure of the digital micromirror element in the projector according to the embodiment of the invention;
fig. 11 is an exploded view of the mounting structure for the digital micromirror device in the projector of fig. 10.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present invention.
The terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; the specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Referring to fig. 5, 6 and 7, an embodiment of the present invention provides a fixing structure of a digital micromirror element in a projector, including: a mounting substrate 1, wherein a first through hole 111 is formed on the mounting substrate 1; a digital micromirror element 2, wherein a first surface (denoted by reference numeral e) of the digital micromirror element 2 abuts against the mounting substrate 1, a reflective mirror (not shown in the figure) is arranged at a position of the first surface corresponding to the first through hole 111, a second surface (denoted by reference numeral f) of the digital micromirror element 2 comprises a mechanical bearing area 21 and a heat dissipation area 22, the second surface is opposite to the first surface, and a plurality of first connection contact points 211 (shown in fig. 8) are distributed on the mechanical bearing area 21; a circuit board assembly 3, wherein the circuit board assembly 3 is disposed near the second surface of the dmd 2, and a plurality of second connecting contacts 31 (shown in fig. 7) are disposed at positions of the circuit board assembly 3 corresponding to the plurality of first connecting contacts 211; a first connection member 4, the first connection member 4 being capable of applying a force to the circuit board assembly 3 to move the circuit board assembly 3 in a direction approaching the mounting substrate 1, and causing the second connection contact 31 to come into press contact with the first connection contact 211; a heat sink 5, wherein the heat sink 5 is in contact with the heat dissipation region 22 of the digital micromirror device 2 and is spaced from the circuit board assembly 3; and a second connecting member 6, wherein the second connecting member 6 is capable of applying a force to the heat sink 5 to move the heat sink 5 in a direction approaching the dmd 2.
Wherein, the abutting of the first surface of the digital micro-mirror element 2 and the mounting substrate 1 can be realized by the following structure: as shown in fig. 6, the first through hole 111 of the mounting substrate 1 (the mounting substrate 1 refers to a side wall of the projector housing) is a stepped hole, the first surface of the digital micromirror element 2 is provided with a boss 23, the mirror plate is disposed on the boss 23, the boss 23 extends into the first through hole 111, and a stepped surface (denoted by reference numeral a) of the stepped hole abuts against an edge of the first surface. Thus, the dmd 2 can be completely sunk into the first through hole 111, so that the position limiting effect of the dmd 2 can be improved.
Referring to fig. 6, 7 and 8, in the fixing structure of the digital micromirror device in the projector according to the embodiment of the present invention, since the mounting substrate 1 is provided with the first through hole 111, the first surface of the digital micromirror device 2 abuts against the mounting substrate 1, and the position of the first surface corresponding to the first through hole 111 is provided with the reflective mirror, when a force is applied to the digital micromirror device 2 to move the digital micromirror device 2 in a direction close to the mounting substrate 1, the mounting substrate 1 can limit the digital micromirror device 2, so as to prevent the digital micromirror device 2 from moving in the direction close to the mounting substrate 1, so that the reflective mirror and the mounting substrate 1 can be fixed, thereby ensuring the accuracy of the reflective mirror for light reflection, and further enabling the projector to project a stable image; since the second surface of the dmd 2 comprises the mechanical seating area 21 and the heat dissipation area 22, the second surface is opposite to the first surface, the mechanical seating area 21 is distributed with a plurality of first connection points 211, the circuit board assembly 3 is disposed close to the second surface of the dmd 2, and the circuit board assembly 3 is provided with a plurality of second connection contacts 31 at positions corresponding to the plurality of first connection contacts 211, the first connection assembly 4 can apply a force to the circuit board assembly 3 to move the circuit board assembly 3 in a direction approaching the mounting substrate 1, this makes it possible to adjust the amount of force applied by the first connecting members 4 to the circuit board assembly 3 to move the circuit board assembly 3 in the direction approaching the mounting substrate 1, namely, the magnitude of the force borne by the mechanical bearing area 21 is adjusted, so that the second connecting contact 31 is fully contacted with the first connecting contact 211, thereby ensuring the stable signal transmission between the circuit board assembly 3 and the digital micromirror element 2; because the heat sink 5 is in contact with the heat dissipation area 22 of the dmd 2 and is spaced apart from the circuit board assembly 3 (ensuring that the force applied by the second connecting assembly 6 to the heat sink 5 only acts on the heat dissipation area 22), the second connecting assembly 6 can apply a force to the heat sink 5 to move the heat sink 5 in a direction close to the dmd 2, so that the force applied by the second connecting assembly 6 to the heat sink 5 can be adjusted, that is, the force applied to the heat dissipation area 22 can be adjusted by adjusting the contact tightness between the heat sink 5 and the heat dissipation area 22, so that the heat sink 5 can fully dissipate heat from the heat dissipation area 22 and avoid the excessive stress applied to the heat dissipation area 22. The fixing structure of the digital micro-mirror element in the projector provided by the embodiment of the invention respectively adjusts the force borne by the mechanical bearing area 21 and the heat dissipation area 22 through two groups of connecting components, so that the requirements of the mechanical bearing area 21 and the heat dissipation area 22 on the force can be simultaneously met, namely: the force applied to the mechanical bearing area 21 is adjusted to a proper value through the first connecting component 4, so that the second connecting contact 31 is ensured to be fully contacted with the first connecting contact 211, the signal transmission between the circuit board component 3 and the digital micromirror element 2 is ensured to be stable, the digital micromirror element 2 and the mounting substrate 1 can be well fixed, and the influence on light reflection when the digital micromirror element 2 and the mounting substrate 1 are loosened can be avoided; the force applied to the heat dissipation area 22 by the second connecting component 6 is adjusted to a suitable value, so that not only the heat dissipation area 22 is prevented from being broken due to excessive force, but also the heat dissipation area 22 can fully dissipate heat.
The composition of the circuit board assembly 3 is not exclusive, for example, the circuit board assembly 3 may include a circuit board 32, and the second connecting contact 31 is disposed on a surface of the circuit board 32 facing the digital micro-mirror device 2. In addition, as shown in fig. 6, 7 and 8, the circuit board assembly 3 may also include a circuit board 32 and an interposer 33 that are contact-connected, the interposer 33 is located between the circuit board 32 and the digital micromirror element 2, the second connecting contact 31 is disposed on a surface of the interposer 33 facing the digital micromirror element 2, and the second connecting contact 31 is an elastic contact. Compared with the scheme that the circuit board 32 is directly contacted with the digital micro-mirror element 2, in the scheme that the circuit board 32 is contacted with the digital micro-mirror element 2 through the insert 33, because the second connecting contact 31 is an elastic contact, when the second connecting contact 31 is contacted with the first connecting contact 211 on the surface of the digital micro-mirror element 2, the second connecting contact can be ensured to be fully contacted with the first connecting contact 211 through elastic deformation, so that the signal transmission between the circuit board assembly 3 and the digital micro-mirror element 2 can be stable.
It should be noted that: in the circuit board assembly 3, the circuit board 32 and the interposer 33 are stacked, and the circuit board 32 is connected to the interposer 33 through a contact, that is, the interposer 33 is provided with the second connecting contact 31 on both side surfaces in the direction away from the mounting substrate 1 or the second connecting contact 31 penetrates through both side surfaces in the direction away from the mounting substrate 1 of the interposer 33, and the second connecting contact 31 is simultaneously contacted with the first connecting contact 211 and the connecting contact on the circuit board 32. Since the first connecting contact point 211 and the connecting contact point on the circuit board 32 are both generally flat contacts, the two connecting contact points can ensure stable signal transmission between the circuit board 32 and the digital micromirror element 2 through the second connecting contact point 31 having elasticity.
Referring to fig. 6 and 9, a sealing ring (denoted by reference character c) is further disposed between the circuit board 32 and the mounting substrate 1, the sealing ring is sleeved outside the insert 33, and one end of the sealing ring abuts against an outer edge (denoted by reference character x in fig. 6) of the first through hole 111, and the other end abuts against the circuit board 32. The sealing ring can prevent dust from entering the mounting substrate 1 from the first through hole 111, thereby ensuring that the reflecting mirror on the digital micromirror element 2 is not polluted by dust and the like.
The first connecting component 4 is not limited to be composed and arranged in a unique manner, for example, the first connecting component 4 may be composed and arranged as follows: the first connection assembly 4 includes a pressing plate 41 and a first screw 42, and the first screw 42 is screwed with the mounting substrate 1 after passing through a screw through hole of the pressing plate 41.
In addition, the first connecting assembly 4 and the second connecting assembly 6 may also be configured and arranged as shown in fig. 9, the first connecting assembly 4 includes a pressing plate 41, a first screw 42 and a first elastic member 43, the pressing plate 41 covers the surface of the circuit board 32 away from the dmd 2, the first screw 42 passes through a screw through hole of the pressing plate 41 and then is in threaded connection with the mounting substrate 1, and the first elastic member 43 is located between a screw head of the first screw 42 and the pressing plate 41. Compared with the scheme that the first connecting assembly 4 comprises the pressing plate 41 and the screws, in the scheme shown in fig. 9, since the first elastic member 43 is arranged between the screw head of the first screw 42 and the pressing plate 41, after the first screw 42 is fixed with the corresponding threaded hole, the elastic force of the first elastic member 43 to the pressing plate 41 can be adjusted by adjusting the compression amount of the first screw 42 to the first elastic member 43, so that the locking force of the first screw 42 to the pressing plate 41, the circuit board assembly 3 and the digital micro-mirror element 2 can be controllably adjusted. In addition, the first elastic member 43 can make the fit between the first screw 42 and the threaded hole tighter, so that the possibility of loosening and falling off of the first screw 42 is greatly reduced, and the connection reliability of the pressing plate 41, the circuit board 32, the insert 33, the digital micro-mirror element 2 and the mounting substrate 1 can be improved.
In the fixing structure of the digital micromirror device in the projector according to the embodiment of the invention, the digital micromirror device 2 is located between the mounting substrate 1 and the insert 33, in this configuration, the heat sink 5 is brought into contact with the heat dissipation area 22 of the dmd 2, in order to perform good heat dissipation on the digital micromirror element 2, as shown in fig. 6, the heat sink 5 is located on a side of the pressing plate 41 away from the digital micromirror element 2, the heat sink 5 includes a heat conductor 51 and a heat sink 52 that are connected to each other, the heat sink 52 and the pressing plate 41 are arranged at an interval (it is ensured that the force applied to the heat sink 5 by the second connecting assembly 6 only acts on the heat dissipation area 22 through the heat conductor 51), second through holes (denoted by reference numeral b) are respectively formed in the pressing plate 41, the circuit board 32 and the inserting piece 33 corresponding to the heat dissipation area 22 of the digital micromirror element 2, and the heat conductor 51 sequentially passes through the second through holes of the pressing plate 41, the circuit board 32 and the inserting piece 33. The second through holes are respectively formed in the pressing plate 41, the circuit board 32 and the insert 33 corresponding to the heat dissipation area 22 of the digital micro-mirror element 2, and the heat conductor 51 sequentially penetrates through the second through holes of the pressing plate 41, the circuit board 32 and the insert 33 to realize that the heat radiator 5 is contacted with the heat dissipation area 22, so that the problem that other parts are inconvenient to contact between the heat radiator 5 and the digital micro-mirror element 2 is solved, the good heat dissipation of the digital micro-mirror element 2 is ensured, and the heat conductor 51 penetrates through the second through holes in the pressing plate 41, the circuit board 32 and the insert 33, so that the structure of the assembly is more compact, and the occupied space is favorably reduced.
It should be noted that: the thermal conductor 51 of the heat sink 5 may be in indirect contact with the heat dissipation area 22 through the thermal paste, i.e. a gap of about 0.1mm needs to be reserved between the heat sink 5 and the heat dissipation area 22 for filling the thermal paste. The size of the gap between the heat conductor 51 and the heat dissipation area 22 directly determines the heat dissipation of the dmd 2, and if the gap is too large, the heat conductive paste cannot transfer the heat of the dmd 2 to the heat sink 5 to the maximum extent; if the gap is too small, the thermal conductor 51 may exert too much force on the heat dissipation region 22, which may easily cause damage to the dmd 2.
As shown in fig. 8, the heat dissipation area 22 of the dmd 2 may be located in the middle of the dmd 2, and the mechanical support area 21 of the dmd 2 is located at the periphery of the heat dissipation area 22. By this arrangement, when the mechanical bearing region 21 is subjected to a large locking force of the first connecting component 4, the digital micromirror device 2 can be uniformly stressed.
In the fixing structure of the digital micromirror element in the projector according to the embodiment of the present invention, the fixing manner of the heat sink 5 is not exclusive, for example, the heat sink 5 may be fixed to the screw head of the first screw 42 through the second connecting assembly 6, or may be fixed to the mounting substrate 1 through the second connecting assembly 6. Fig. 6 and 9 show an embodiment in which the heat sink 5 is fixed to the screw head of the first screw 42 through the second connection assembly 6, specifically, the second connection assembly 6 includes a second screw 61 and a second elastic member 62, the first screw 42 and the second screw 61 are located on the same axis, a screw hole (denoted by reference numeral d) is formed in the screw head of the first screw 42, the second screw 61 passes through the screw hole of the heat sink 52 and then is connected to the screw hole in the screw head of the first screw 42, and the second elastic member 62 is located between the screw head of the second screw 61 and the heat sink 5. Since the heat sink 5 is adjacent to the pressure plate 41, the screw head of the first screw 42 disposed on the pressure plate 41 is closest to the heat sink 5, and the heat sink 5 is fixed to the screw head of the first screw 42 by the second screw 61, so that the length of the second screw 61 can be reduced, and the connection between the heat sink 5 and the fixing component is more stable. In addition, similar to the first connection assembly 4, the second connection assembly 6 also includes a second elastic member 62, so that after the second screw 61 is fixed with the threaded hole formed in the screw head of the first screw 42, by adjusting the amount of compression of the second screw 61 on the second elastic member 62, the elastic force of the second elastic member 62 on the heat sink 52 can be adjusted, so that the locking force of the second screw 61 on the heat sink 5 can be controllably adjusted, and further the magnitude of the stress on the heat dissipation area 22 on the digital micromirror element 2 can be controllably adjusted; the second elastic element 62 can also make the second screw 61 and the corresponding threaded hole more tightly fit, so as to greatly reduce the possibility of loosening and falling of the second screw 61, thereby ensuring that the heat conductor 51 is fully contacted with the heat dissipation area 22 of the digital micromirror element 2, and further being beneficial to improving the heat dissipation effect of the heat sink 5 on the digital micromirror element 2.
The head of the screw is typically provided with a structure to facilitate the tightening or loosening of a tool, such as a slotted channel, into which a tool, such as a screwdriver, may be inserted for convenient tightening or loosening of the screw. In the embodiment where the heat sink 5 is fixed to the screw head of the first screw 42 by the second connection assembly 6, since the middle region of the screw head of the first screw 42 is occupied by the screw hole, it is not easy to screw and unscrew the screw head by a tool such as a screwdriver, and the first screw 42 is a hexagon socket head cap screw as shown in fig. 6 in order to facilitate the screwing and unscrewing operation of the first screw 42 by the tool. Since the head of the first screw 42 is of a hexagonal configuration, a tool such as a wrench can be easily engaged with the hexagonal configuration to tighten and loosen the first screw 42.
In the embodiment where the heat sink 5 is fixed to the head of the first screw 42 by the second connection assembly 6, the second screw 61 may be a straight shoulder screw, so that it is convenient for a tool such as a screwdriver to tighten and loosen the screw.
Fig. 10 and 11 show an embodiment in which the heat sink 5 is fixed on the mounting substrate 1 through the second connection assembly 6, specifically, the second connection assembly 6 includes a second screw 61 and a second elastic member 62, the first screw 42 and the second screw 61 are arranged in a staggered manner, the second screw 61 is threaded with the mounting substrate 1 after passing through a screw through hole of the heat dissipation body 52, and the second elastic member 62 is located between a screw head of the second screw 61 and the heat sink 5. The heat sink 5 is directly fixed on the mounting substrate 1 by the second screw 61, so that the mounting error of the heat sink 5 can be reduced, and the fixing precision of the heat sink 5 can be improved (namely, the size of the gap between the heat conductor 51 of the heat sink 5 and the heat dissipation area 22 can be accurately controlled), thereby being beneficial to ensuring the sufficient contact between the heat conduction portion and the heat dissipation area 22, and further being beneficial to improving the heat dissipation effect of the heat sink 5.
In the embodiment where the heat sink 5 is fixed to the mounting substrate 1 by the second connection assembly 6, as shown in fig. 11, the first screw 42 and the second screw 61 may be both straight shoulder screws, so that the first screw 42 and the second screw 61 can be tightened and loosened by using a tool such as a screwdriver.
In order to enable the pressing plate 41 to uniformly press the circuit board 32, the interposer 33, and the dmd 2, so as to ensure that the contacts between the circuit board 32, the interposer 33, and the dmd 2 are fully contacted, as shown in fig. 6, a plurality of first screws 42 are uniformly distributed on the pressing plate 41, each of the plurality of first screws 42 is a shoulder screw, the first elastic member 43 is sleeved between a shoulder of the first screw 42 and a screw head, and distances from the shoulder of the plurality of first screws 42 to the screw head are equal. By arranging the plurality of first screws 42 on the pressing plate 41, and the distances from the shaft shoulders of the plurality of first screws 42 to the screw heads are equal, when the first screws 42 are screwed, the shaft shoulders of the first screws 42 are abutted against the pressing plate 41, so that the compression amount of the first elastic members 43 sleeved on the shaft shoulders of each first screw 4 can be ensured to be equal, the elastic force exerted by each first elastic member 43 on the pressing plate 41 is easy to keep equal, and the pressing force exerted by the pressing plate 41 on the circuit board 32, the inserting member 33 and the digital micro-mirror element 2 is more uniform, so that the circuit board 32, the inserting member 33 and the digital micro-mirror element 2 can be ensured to be fully contacted, and further, the signal transmission between the circuit board 32 and the digital micro-mirror element 2 can be more stable.
The number of the first screws 42 may be two, four, six, etc., and is not limited in particular. As shown in fig. 6, when the number of the first screws 42 is four, that is, two pairs, two first screws 42 in each pair may be symmetrically disposed on both sides of a central plane (e.g., a plane a in fig. 6) of the pressure plate 41 in the length direction or the width direction.
In order to make the stress of the heat dissipation body 52 uniform and ensure that the heat conductor 51 is in uniform contact with the heat dissipation area 22, as shown in fig. 6, the second screws 61 are multiple and uniformly distributed on the heat dissipation body 52, the multiple second screws 61 are all shoulder screws, the second elastic member 62 is sleeved between the shoulders of the second screws 61 and the screw heads, and the distances between the shoulders of the multiple second screws 61 and the screw heads are equal. Through set up a plurality of second screws 61 on heat dissipation body 52, and the distance between the shaft shoulder of a plurality of second screws 61 to the screw head equals, when screwing second screw 61, the shaft shoulder of second screw 61 leans on with heat dissipation body 52, thereby just can guarantee that the compression volume of the second elastic component 62 of establishing on every second screw 61 shaft shoulder overlaps equals, every second elastic component 62 just keeps equaling to the elasticity that heat dissipation body 52 applyed easily, can make the atress more even on heat dissipation body 52 like this, can avoid the slope of heat dissipation body 52 because of the uneven emergence of atress, thereby can make the contact of heat conductor 51 and digital micromirror element 2's radiating area 22 more even, and then can further improve the radiating effect of radiator 5.
The number of the second screws 61 may be two, four, six, etc., and is not limited herein. As shown in fig. 6, when the number of the second screws 61 is four, that is, two pairs, two second screws 61 in each pair may be symmetrically disposed on both sides of a central plane (e.g., a plane B in fig. 6) of the heating body 52 in the length direction or the width direction; the head of the second screw 61 may be sunk into the heat sink 52 (as shown in fig. 9), or may be attached to a surface of the heat sink 52, which is not limited herein.
In the fixing structure of the digital micromirror element in the projector according to the embodiment of the present invention, the material of the pressing plate 41 is not exclusive, for example, the pressing plate 41 may be a plastic plate, and as shown in fig. 6, the pressing plate 41 may also be a metal plate, for example, a stainless steel plate, and an insulating pad 7 is disposed between the pressing plate 41 and the circuit board 32. Wherein, the insulating pad 7 is also provided with a second through hole (denoted by reference sign b) at a position corresponding to the heat dissipation region 22. The insulating pad 7 can prevent the pressing plate 41, which may be metal, from being in direct contact with the circuit board 32 to short-circuit the circuit board 32. Compared with a plastic plate, the rigidity and the flatness of the metal plate are better, and the metal plate is less deformed under the action of the first connecting component 4, so that the pressing plate 41 can smoothly compress the insert 33, the circuit board 32 and the digital micro-mirror element 2, the contact points among the insert 33, the circuit board 32 and the digital micro-mirror element 2 are fully contacted, and the signal transmission between the circuit board 32 and the digital micro-mirror element 2 is stable.
In the fixing structure of the digital micromirror element in the projector according to the embodiment of the present invention, the types of the first elastic member 43 and the second elastic member 62 are not exclusive, for example, the first elastic member 43 and the second elastic member 62 may be both a rubber ring and an elastic washer, and as shown in fig. 6, the first elastic member 43 and the second elastic member 62 may also be both springs. Compared with a rubber ring and an elastic washer, the elasticity of the spring is better, the elasticity provided for the screw heads of the first screw 42 and the second screw 61 is larger, and the anti-loosening effect of the first screw 42 and the second screw 61 is improved.
In order to prevent the circuit board 32 from interfering with the arrangement of the first screw 42 and the second screw 61, as shown in fig. 11, an avoiding hole 34 for avoiding the first screw 42 and the second screw 61 is formed on the circuit board 32, so that the first screw 42 and the second screw 61 can pass through the avoiding hole 34 of the circuit board 32, thereby fixing the circuit board assembly 3, the digital micromirror element 2 and the mounting substrate 1 and fixing the heat sink 5 and the mounting substrate 1.
It should be noted that: in the embodiment where the second screw 61 is fixed to the head of the first screw 42, as shown in fig. 6, the avoidance hole 34 is formed in the circuit board 32 only to avoid the first screw 42.
On the other hand, an embodiment of the present invention further provides a projector, including the fixing structure of the digital micromirror element in the projector in any of the above embodiments.
Since the projector provided by the embodiment of the invention comprises the fixing structure of the digital micromirror element in the projector in any one of the embodiments, the same technical effect can be produced, and the same technical problem can be solved. Other structures of the projector are well known to those skilled in the art and will not be described herein.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention, and the changes or substitutions should be covered within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (10)
1. A fixing structure of a digital micromirror device in a projector, comprising:
the digital micromirror device comprises a mounting substrate, a first through hole is formed in the mounting substrate, a first surface of a digital micromirror element is abutted against the mounting substrate, a reflecting lens is arranged at a position, corresponding to the first through hole, of the first surface, a second surface of the digital micromirror element comprises a mechanical bearing area and a heat dissipation area, the second surface is opposite to the first surface, a plurality of first connecting points are distributed in the mechanical bearing area, the heat dissipation area is located in the middle of the digital micromirror element, and the mechanical bearing area is located in the periphery of the heat dissipation area;
the circuit board assembly is arranged close to the second surface of the digital micromirror element, and a plurality of second connecting contacts are arranged at positions of the circuit board assembly corresponding to the first connecting contacts;
the first connecting assembly can apply a force to the circuit board assembly to enable the circuit board assembly to move towards the direction close to the mounting substrate, and enable the second connecting contact to be in pressing contact with the first connecting contact, wherein the first connecting assembly comprises a pressing plate and a first screw, the pressing plate covers the surface of the circuit board far away from the digital micro-mirror element, and the first screw penetrates through a screw through hole of the pressing plate and then is in threaded connection with the mounting substrate;
the radiator comprises a heat conductor and a heat radiator which are connected with each other, the heat conductor is contacted with the heat dissipation area of the digital micromirror element, and the heat radiator and the circuit board assembly are arranged at intervals;
a second connection component capable of applying a force to the heat sink that moves the heat sink in a direction closer to the digital micromirror element; the second connecting assembly comprises a second screw, the first screw and the second screw are arranged in a staggered mode, and the second screw penetrates through a screw through hole of the heat radiation body and then is in threaded connection with the mounting substrate.
2. The fixing structure of a digital micromirror element in a projector according to claim 1, wherein the circuit board assembly comprises a contact-connected circuit board and an interposer between the circuit board and the digital micromirror element, the second connecting contact is disposed on a surface of the interposer facing the digital micromirror element, and the second connecting contact is an elastic contact.
3. The fixing structure of a digital micromirror element in a projector according to claim 2, wherein the first connecting assembly further comprises a first elastic member between a screw head of the first screw and the pressure plate.
4. The fixing structure of a digital micromirror device in a projector as claimed in claim 3, wherein the heat sink is located at a side of the pressing plate away from the digital micromirror device, the pressing plate, the circuit board and the insert are respectively provided with a second through hole corresponding to the heat dissipation area of the digital micromirror device, and the heat conductor sequentially passes through the second through holes of the pressing plate, the circuit board and the insert and then contacts with the heat dissipation area of the digital micromirror device.
5. The fixing structure of a digital micromirror element in a projector according to claim 1, wherein the second connecting assembly further comprises a second elastic member between a screw head of the second screw and the heat sink.
6. The fixing structure of a digital micromirror element in a projector according to any of claims 3-5, wherein the first screws are uniformly distributed on the pressing plate, the first screws are all shoulder screws, the first elastic member is sleeved between the shoulder screws and the screw heads of the first screws, and the distance between the shoulder screws and the screw heads of the first screws is equal.
7. The fixing structure of a digital micromirror element in a projector according to any of claims 1-5, wherein the second screws are uniformly distributed on the heat sink, the second screws are all shoulder screws, the second elastic member is sleeved between the shoulder screws and the screw heads of the second screws, and the distances between the shoulder screws and the screw heads of the second screws are equal.
8. The fixing structure of digital micromirror element in projector as claimed in any of claims 3-5, wherein the pressing plate is a metal plate and an insulating pad is disposed between the pressing plate and the circuit board.
9. The fixing structure of digital micromirror element in projector as claimed in any of claims 1-5, wherein the first and second elastic members are both springs.
10. A projector comprising the fixing structure of the digital micromirror device in a projector according to any of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010510474.6A CN111679396A (en) | 2017-08-11 | 2017-08-11 | Fixing structure of digital micro-mirror element in projector and projector |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010510474.6A CN111679396A (en) | 2017-08-11 | 2017-08-11 | Fixing structure of digital micro-mirror element in projector and projector |
| CN201710687195.5A CN107329232A (en) | 2017-08-11 | 2017-08-11 | The fixed structure of digital micromirror elements and projector in a kind of projector |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201710687195.5A Division CN107329232A (en) | 2017-08-11 | 2017-08-11 | The fixed structure of digital micromirror elements and projector in a kind of projector |
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| CN111679396A true CN111679396A (en) | 2020-09-18 |
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| CN202010510474.6A Pending CN111679396A (en) | 2017-08-11 | 2017-08-11 | Fixing structure of digital micro-mirror element in projector and projector |
| CN201710687195.5A Pending CN107329232A (en) | 2017-08-11 | 2017-08-11 | The fixed structure of digital micromirror elements and projector in a kind of projector |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110286552A (en) * | 2018-03-19 | 2019-09-27 | 青岛海信激光显示股份有限公司 | A kind of projector |
| JP7075299B2 (en) * | 2018-07-12 | 2022-05-25 | 株式会社小糸製作所 | Vehicle lighting |
| WO2019194276A1 (en) | 2018-04-06 | 2019-10-10 | 株式会社小糸製作所 | Lighting appliance for vehicle, spatial light modulation unit, and lighting appliance unit |
| US11265521B2 (en) | 2019-04-18 | 2022-03-01 | Hisense Laser Display Co., Ltd. | Digital light processing projector |
| CN110099265B (en) * | 2019-04-18 | 2020-10-23 | 青岛海信激光显示股份有限公司 | Digital light processing projector |
| CN113589633A (en) * | 2020-04-30 | 2021-11-02 | 青岛海信激光显示股份有限公司 | Optical engine |
| CN113075841B (en) * | 2020-12-23 | 2022-08-23 | 深圳市安华光电技术有限公司 | Optical machine and projector |
| CN214278597U (en) * | 2021-02-09 | 2021-09-24 | 海信视像科技股份有限公司 | Display device and optical-mechanical assembly thereof |
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| CN107329232A (en) | 2017-11-07 |
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