CN110286552A - A kind of projector - Google Patents
A kind of projector Download PDFInfo
- Publication number
- CN110286552A CN110286552A CN201810224792.9A CN201810224792A CN110286552A CN 110286552 A CN110286552 A CN 110286552A CN 201810224792 A CN201810224792 A CN 201810224792A CN 110286552 A CN110286552 A CN 110286552A
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- CN
- China
- Prior art keywords
- seal
- cavity
- dmd
- radiator
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B21/00—Projectors or projection-type viewers; Accessories therefor
- G03B21/14—Details
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B21/00—Projectors or projection-type viewers; Accessories therefor
- G03B21/14—Details
- G03B21/16—Cooling; Preventing overheating
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Projection Apparatus (AREA)
Abstract
The present invention relates to projection device technical fields, disclose a kind of projector, including cavity, DMD component and radiator, it further include first seal and second seal, the bearing surface for bearing against dmd chip of cavity is equipped with groove, first seal is arranged in groove, and it is coated on the outside of the dmd chip of DMD component, for sealing dmd chip when DMD component is fixed on cavity, second seal is set on the heat dissipation head of radiator, and it is set between radiator and the support plate of DMD component, for the sealed heat-dissipating head when radiator is fixed on cavity, heat dissipation head and cavity are filled after second seal compressive deformation, gap between DMD component, it is entered in cavity from heat dissipation head to avoid dust；The outside of dmd chip is filled in groove and be coated on after first seal compressive deformation, is entered in cavity to avoid dust from the contact position of dmd chip and cavity bearing surface；Therefore the projector has dmd chip and heat dissipation region two parts dustproof construction, good dustproof effect.
Description
Technical field
The present invention relates to projection device technical field more particularly to a kind of projectors.
Background technique
In projection device technical field, Digital Micromirror Device (Digital Micromirror Device, DMD) chip is
Core component in projector is issued by laser in projector and reaches DMD core by a series of light beam of optical mirror slips
Piece, dmd chip handle optical signal, ultimately form image.Therefore the performance of dmd chip extremely closes the display effect of projector
It is important, and since susceptibility of the dmd chip to dust is higher, therefore for projector, it is dust-proof be one it is extremely important because
Element.
Currently, dust-proof main use of existing projector is used to bear against DMD in projector's cavity after dmd chip assembly
The dust-proof mode with rubber pad is set on the bearing surface of chip, which is difficult to prevent completely from for dissipating dmd chip
The dust entered at the radiator of heat cannot ensure that the realization of projector's cavity is dust-proof completely, and the dust-tight manner is for size
Biggish projector dustproof effect is preferable, but for minitype projection machine, since its is small in size, structure size is more compact, right
It answers the ground intracorporal bearing surface area of projector's chamber too small, above-mentioned dust-tight manner can not be used, and minitype projection machine uses at present
The mode of the surrounding setting sealing ring of dmd chip, although can prevent dust from entering throwing from dmd chip position to a certain extent
Shadow machine cavity body, but sealing and dustproof effect is bad, while can not prevent dust and enter from spreader region.
Therefore, designing a kind of can prevent dust and enter the projector of projector's cavity to be just particularly important.
Summary of the invention
The present invention provides a kind of projector, which has dmd chip and heat dissipation region two parts dustproof construction, energy
Enough prevent dust and enters projector's cavity, good dustproof effect.
A kind of projector, including cavity, DMD component and radiator further include first seal and second seal, institute
The bearing surface for bearing against dmd chip for stating cavity is equipped with groove, and the first seal is arranged in the groove and wraps
The outside for overlaying on the dmd chip of the DMD component, for sealing the DMD core when the DMD component is fixed on the cavity
Piece, the second seal are set on the heat dissipation head of the radiator, and are set to the support of the radiator and DMD component
Between plate, for sealing the heat dissipation head when the radiator is fixed on the cavity.
In above-mentioned projector, due to dust from the position that spreader region enters at heat dissipation head, therefore it is solid in radiator
When on cavity, heat dissipation head and cavity, DMD are filled after the second seal compressive deformation between radiator and support plate
Gap between component, and then sealed heat-dissipating head, enter in cavity from heat dissipation head to avoid dust；And in dmd chip position
Place is set, when DMD component is fixed on cavity, is filled after the first seal compressive deformation being arranged in the groove of cavity bearing surface
In groove and it is coated on the outside of dmd chip, and then dmd chip can be sealed, to avoid dust from dmd chip and cavity branch
The contact position of bearing surface enters in cavity；Therefore the projector has dmd chip and heat dissipation region two parts dustproof construction, and two
Part dustproof construction is mutually indepedent, and cooperates, and then can prevent dust and enter projector's cavity, good dustproof effect.
Preferably, projector further includes the first positioning component and the second positioning component, and first positioning component is in lock
The DMD component and the cavity are locked when tight state and press the first seal component in the groove, it is described
Second positioning component locks the radiator and the cavity and the second seal pressure is attached to institute when being in locking state
It states in support plate.
Preferably, first positioning component includes along circumferentially equally distributed four group of first locating piece of the cavity, often
One first locating piece include the first screw and the first spring, first spring be set on the screw rod of first screw and
Between the cavity and the screw head of first screw.
Preferably, second positioning component includes along circumferentially equally distributed four group of second locating piece of the cavity, often
One second locating piece include the second screw and second spring, the second spring be set on the screw rod of second screw and
Between the radiator and the screw head of first screw.
Preferably, the second seal is prepared using rubber material resistant to high temperature.
Preferably, the second seal is equipped with the through slot through its thickness direction, and the area of the through slot is not more than
The area of section of the most big end of the heat dissipation head.
Preferably, the maximum compressibility of the second seal is not less than 0.3mm.
Preferably, the shore hardness A of the second seal is not more than 40 degree.
Preferably, the first seal is the closed-loop shaped structure prepared using silastic material.
Preferably, the maximum compressibility of the first seal is not less than 0.3mm.
Detailed description of the invention
Fig. 1 is a kind of structural schematic diagram for projector that an embodiment of the present invention provides；
Fig. 2 is a kind of perspective view of the explosion for projector that an embodiment of the present invention provides；
The structural representation of cavity and DMD component junction in a kind of projector that Fig. 3 provides for an embodiment of the present invention
Figure.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
As shown in Figure 1, Figure 2 and shown in Fig. 3, a kind of projector, including cavity 1, DMD component 2 and radiator 3, further include
First seal 4 and second seal 5, cavity 1 for bear against dmd chip 21 bearing surface 11 be equipped with groove 111, first
Sealing element 4 is arranged in groove 111 and is coated on the outside of the dmd chip 21 of DMD component 2, for being fixed in DMD component 2
Dmd chip 21 is sealed when cavity 1, second seal 5 is set on the heat dissipation head 31 of radiator 3, and is set to 3 He of radiator
Between the support plate 25 of DMD component 2, for the sealed heat-dissipating head 31 when radiator 3 is fixed on cavity 1.
In above-mentioned projector, the position entered from 3 region of radiator due to dust is at heat dissipation head 31, therefore in radiator
3 when being fixed on cavity 1, and heat dissipation head 31 is filled after 5 compressive deformation of second seal between radiator 3 and support plate 25
With the gap between cavity 1, DMD component 2, and then sealed heat-dissipating head 31 enters cavity 1 to avoid dust from heat dissipation head 31
It is interior；And at 21 position of dmd chip, when DMD component 2 is fixed on cavity 1, it is arranged in the groove 111 of 1 bearing surface 11 of cavity
4 compressive deformation of first seal after be filled in groove 111 and be coated on the outside of dmd chip 21, and then DMD can be sealed
Chip 21 enters in cavity 1 to avoid dust from the contact position of dmd chip 21 and 1 bearing surface 11 of cavity；Therefore the projector
With dmd chip 21 and heat dissipation region two parts dustproof construction, and two parts dustproof construction is mutually indepedent, and cooperates, into
And dust can be prevented and enter projector's cavity 1, good dustproof effect.
On the basis of above-mentioned projector, in order to guarantee preferable sealing and dustproof effect, as shown in Fig. 2, a kind of preferred reality
It applies in mode, projector further includes the first positioning component 6 and the second positioning component 7, when the first positioning component 6 is in locking state
It locks DMD component 2 and cavity 1 and 4 component of first seal is pressed together in groove 111, the second positioning component 7 is in locking
Radiator 3 and cavity 1 are locked when state and the pressure of second seal 5 is attached in support plate 25.
In above-mentioned projector, the first positioning component 6 is used to fix DMD component 2 and cavity 1, and at which in locking shape
DMD component 2 and cavity 1 are locked when state, at this point, the first seal 4 being arranged in the groove 111 of 1 bearing surface 11 of cavity is the
One positioning component 6 is filled in groove 111 and is coated on to pressing after compressive deformation under the active force of DMD component 2 and cavity 1
The outside of dmd chip 21, and then dmd chip 21 can be sealed, so that there is no dust to enter between dmd chip 21 and cavity 1
Gap enters in cavity 1 to avoid dust from the contact position of dmd chip 21 and 1 bearing surface 11 of cavity, the first positioning component
The active force of 6 pairs of DMD components 2 and cavity 1 is pressed together on the first positioning component 6 in groove 111, improves sealing and dustproof effect
Fruit；Equally, the second positioning component 7 is used for fixed heat sink 3 and cavity 1, and locks 3 He of radiator when locking state at which
Cavity 1, at this point, being set to the second sealing between radiator 3 and the support plate 25 of DMD component 2 and being set on heat dissipation head 31
In the case where the second positioning component 7 is to the active force of radiator 3 and cavity 1, pressure is attached in support plate 25 to fill part 5 after compressive deformation
Gap between heat dissipation head 31 and cavity 1, DMD component 2, and then sealed heat-dissipating head 31, so that not having between heat dissipation head 31 and cavity 1
The gap for having dust to enter, enters in cavity 1 from heat dissipation head 31, the second positioning component 7 is to 3 He of radiator to avoid dust
The active force of cavity 1 is attached to the pressure of second seal 5 in support plate 25, improves sealing and dustproof effect；Therefore, pass through first
The effect of positioning component 6 and the second positioning component 7 can guarantee preferable sealing and dustproof effect.
On the basis of above-mentioned projector, in order to realize that the first positioning component 6 can guarantee preferable sealing and dustproof effect,
As shown in Fig. 2, specifically, the first positioning component 6 includes along circumferential equally distributed four group of first locating piece of cavity 1 every 1 the
Positioning piece includes the first screw 61 and the first spring 62, and the first spring 62 is set on the screw rod of the first screw 61 and is located at
Between cavity 1 and the screw head of the first screw 61.
In above-mentioned projector, dmd chip 21 is realized that DMD determines by 1 location structure of projector's cavity first when installation
Position is installed on the bearing surface 11 of projector's cavity 1, and the converter in DMD component 2 is then successively placed above dmd chip 21
22, first seal 4, pcb board 23, the insulation spacer 24 for making DMD component 2 insulate, DMD support plate 25, then by equal
Four piece of first screw 61 of cloth and the first spring 62 (the first screw 61 is placed in the first spring 62) are locked, by it is above-mentioned successively
Each component piled up locks together, and first seal 4 is pressed under the pressure effect of pcb board 23 when the first screw 61 locks
Tightly, the possibility for preventing dust from entering cavity 1 from the surrounding of dmd chip 21 is realized.
It can guarantee 4 uniform force of first seal along 1 equally distributed four group of first locating piece of circumferential direction of cavity, can incite somebody to action
It is pressed in groove 111, guarantees sealing and dustproof effect, and can guarantee 2 uniform force of DMD component simultaneously, avoids to DMD core
Piece 21 impacts.While first screw 61 and 62 mating reaction of the first spring make DMD 2 uniform force of component, first
It can guarantee sealing and dustproof effect under 62 buffer function of spring.In addition, the first positioning component 6 may include four group of first positioning
Part, also may include equally distributed first locating piece of other multiple groups, and the first locating piece can be the first screw 61 and the first bullet
Spring 62, or other can be realized the structural member for locking function and the component that can be realized buffer function, not limit to
It is selected in the specific structure of screw and spring, the first positioning component 6 according to the actual conditions of projector.
On the basis of above-mentioned projector, in order to realize that the second positioning component 7 can guarantee preferable sealing and dustproof effect,
As shown in Fig. 2, specifically, the second positioning component 7 includes along circumferential equally distributed four group of second locating piece of cavity 1 every 1 the
Two locating pieces include the second screw 71 and second spring 72, and second spring 72 is set on the screw rod of the second screw 71 and is located at
Between radiator 3 and the screw head of the first screw 61.
In above-mentioned projector, second seal 5 is placed on heat dissipation head 31 after completing the assembling of DMD component 2, then will
Second seal 5 and radiator 3, by four piece of second uniformly distributed screw 71 and second spring 72, (the second screw 71 is placed on together
In second spring 72) projector's cavity 1 is locked, second seal 5 between heat dissipation head 31 and DMD support plate 25 due to being squeezed
Pressure realizes sealing of the sealing to heat dissipation head 31, so that preventing dust enters possibility inside cavity 1 from heat dissipation region.
It can guarantee 5 uniform force of second seal along 1 equally distributed four group of second locating piece of circumferential direction of cavity, can incite somebody to action
It is pressed in DMD support plate 25, guarantees sealing and dustproof effect, and can guarantee 3 uniform force of radiator simultaneously, avoids to scattered
Hot device 3 impacts.While second screw 71 and 72 mating reaction of second spring make 3 uniform force of radiator, second
It can guarantee sealing and dustproof effect under 72 buffer function of spring.In addition, the second positioning component 7 may include four group of second positioning
Part, also may include equally distributed second locating piece of other multiple groups, and the second locating piece can be the second screw 71 and the second bullet
Spring 72, or other can be realized the structural member for locking function and the component that can be realized buffer function, not limit to
It is selected in the specific structure of screw and spring, the second positioning component 7 according to the actual conditions of projector.
In order to guarantee the sealing performance of second seal 5, in a kind of preferred embodiment, second seal 5 can be used
Rubber material preparation resistant to high temperature.
In above-mentioned projector, since second seal 5 is set on heat dissipation head 31 and held against heat sink 3, and radiate
The temperature of device 3 is up to 80 degree or more, therefore in order to guarantee the sealing performance of second seal 5, second seal 5 uses high temperature resistant
Rubber material preparation, rubber material needs the material using at least resistance to 80 degree or more of high temperature, in addition, second seal 5 and also
The material preparation of high temperature resistant demand can be can satisfy using other, second seal 5 prepares material according to the tool of projector
Body actual conditions are selected.
On the basis of above-mentioned second seal 5 can guarantee sealing performance, in order to further ensure sealing effect, specifically
Ground, second seal 5 are equipped with the through slot through its thickness direction, and the area of through slot is not more than cutting for the most big end of heat dissipation head 31
Face area.
In above-mentioned projector, match in second seal 5 with the shape of heat dissipation head 31 through its thickness direction
Through slot, and the area of through slot no more than heat dissipation head 31 most big end area of section so that second seal 5 be set in it is scattered
It can be tightly attached on heat dissipation head 31 when hot head 31, gap of the dust between second seal 5 and heat dissipation head 31 is avoided to enter, with
Optimal seal effect can be reached.
On the basis of above-mentioned projector, in order to reach optimal seal effect, more specifically, second seal 5
Maximum compressibility is not less than 0.3mm.
In above-mentioned projector, to reach optimal seal effect, second seal 5 need to be made into and 31 profiling knot of heat dissipation head
Structure, and after ensuring assembling, second seal 5 has the decrement of 0.3mm or more between DMD support plate 25 and radiator 3.Second
The specific value of the maximum compressibility of sealing element 5 can be selected according to the actual conditions of projector.
On the basis of above-mentioned projector, in order to guarantee the balance of radiator 3, more specifically, the shore of second seal 5
Hardness A is not more than 40 degree.
In above-mentioned projector, the shore hardness A of second seal 5 need to meet the requirement no more than 40 degree, the second sealing
If 5 hardness of part is excessive to will lead to larger stress, the balance after radiator 3 assembles, the shore hardness A of second seal 5 are influenced
Specific value can be selected according to the actual conditions of projector.
In order to guarantee the sealing performance of first seal 4, in a kind of preferred embodiment, first seal 4 can be to adopt
The closed-loop shaped structure prepared with silastic material.
In above-mentioned projector, first seal 4 uses closed-loop shaped structure, also dmd chip 21 can be coated on inside,
Guarantee the sealing performance of first seal 4；And since first seal 4 is close to dmd chip 21, to ensure that first seal 4 exists
It is non-volatile under high temperature, it can be prepared using silastic material, it is prepared by the material that can also be can satisfy needs using other, and first
The material for preparing of sealing element 4 is selected according to the specific actual conditions of projector.
Wherein seal rubber 2 is silicone rubber material, due to close to DMD, therefore, to assure that rubber is non-volatile at high temperature, is true
Confidential letter effect, it is ensured that seal rubber 2 has the decrement of 0.3mm or more after assembling,
On the basis of above-mentioned projector, in order to reach optimal seal effect, specifically, first seal 4 is most
Big decrement is not less than 0.3mm.
In above-mentioned projector, to reach optimal seal effect, the maximum compressibility of first seal 4 after assembling is not small
In 0.3mm.The specific value of the maximum compressibility of first seal 4 can be selected according to the actual conditions of projector.
Obviously, those skilled in the art can carry out various modification and variations without departing from this hair to the embodiment of the present invention
Bright spirit and scope.In this way, if these modifications and changes of the present invention belongs to the claims in the present invention and its equivalent technologies
Within the scope of, then the present invention is also intended to include these modifications and variations.
Claims (10)
1. a kind of projector, including cavity, DMD component and radiator, which is characterized in that further include first seal and second
The bearing surface for bearing against dmd chip of sealing element, the cavity is equipped with groove, and the first seal is arranged described recessed
Slot is interior and is coated on the outside of the dmd chip of the DMD component, for the sealing when the DMD component is fixed on the cavity
The dmd chip, the second seal are set on the heat dissipation head of the radiator, and are set to the radiator and DMD
Between the support plate of component, for sealing the heat dissipation head when the radiator is fixed on the cavity.
2. projector according to claim 1, which is characterized in that it further include the first positioning component and the second positioning component,
First positioning component locks the DMD component and the cavity and by the first seal group when being in locking state
Part press in the groove, second positioning component locked when being in locking state the radiator and the cavity and
The second seal pressure is attached in the support plate.
3. projector according to claim 2, which is characterized in that first positioning component includes circumferential along the cavity
Equally distributed four group of first locating piece, every one first locating piece include the first screw and the first spring, first spring pocket
It is located on the screw rod of first screw and between the cavity and the screw head of first screw.
4. projector according to claim 2, which is characterized in that second positioning component includes circumferential along the cavity
Equally distributed four group of second locating piece, every one second locating piece include the second screw and second spring, the second spring set
It is located on the screw rod of second screw and between the radiator and the screw head of first screw.
5. projector according to claim 1, which is characterized in that the second seal uses rubber material resistant to high temperature
Preparation.
6. projector according to claim 5, which is characterized in that the second seal, which is equipped with, runs through its thickness direction
Through slot, the area of section of the area of the through slot no more than the most big end of the heat dissipation head.
7. projector according to claim 6, which is characterized in that the maximum compressibility of the second seal is not less than
0.3mm。
8. projector according to claim 7, which is characterized in that the shore hardness A of the second seal is not more than 40
Degree.
9. projector according to claim 1, which is characterized in that the first seal is to be prepared using silastic material
Closed-loop shaped structure.
10. projector according to claim 9, which is characterized in that the maximum compressibility of the first seal is not less than
0.3mm。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810224792.9A CN110286552A (en) | 2018-03-19 | 2018-03-19 | A kind of projector |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810224792.9A CN110286552A (en) | 2018-03-19 | 2018-03-19 | A kind of projector |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110286552A true CN110286552A (en) | 2019-09-27 |
Family
ID=68000862
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810224792.9A Pending CN110286552A (en) | 2018-03-19 | 2018-03-19 | A kind of projector |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110286552A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112433423A (en) * | 2020-08-18 | 2021-03-02 | 深圳市安华光电技术有限公司 | DMD assembly and projection optical machine |
| CN114077123A (en) * | 2021-07-30 | 2022-02-22 | 深圳市安华光电技术有限公司 | DMD packaging and heat dissipation structure for optical machine, small projection optical machine and portable projector |
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2018
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| JPH11305674A (en) * | 1998-04-24 | 1999-11-05 | Victor Co Of Japan Ltd | Liquid crystal projector device |
| US6185047B1 (en) * | 1999-05-17 | 2001-02-06 | Infocus Corporation | Image projection system packaged to operate lying flat with a very low profile |
| JP2003195254A (en) * | 2001-12-26 | 2003-07-09 | Seiko Epson Corp | Optical device and projector provided with the same |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112433423A (en) * | 2020-08-18 | 2021-03-02 | 深圳市安华光电技术有限公司 | DMD assembly and projection optical machine |
| CN112433423B (en) * | 2020-08-18 | 2021-10-08 | 深圳市安华光电技术有限公司 | DMD assembly and projection optical machine |
| CN114077123A (en) * | 2021-07-30 | 2022-02-22 | 深圳市安华光电技术有限公司 | DMD packaging and heat dissipation structure for optical machine, small projection optical machine and portable projector |
| CN114077123B (en) * | 2021-07-30 | 2023-11-28 | 深圳市安华光电技术股份有限公司 | DMD (digital micromirror device) package for optical machine, heat dissipation structure, small-sized projector and portable projector |
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| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190927 |