TWI709810B - Projection device - Google Patents

Abstract

The present invention provides a projection device. The projection device includes a prism set, a digital micro-mirror device, a reflective component and a heat dissipation module. The prism set includes a light-incident side, a mirror-corresponding side, a first light-emitting side and a second light-emitting side. The first light-emitting side and the second light-emitting side are adjacent to each other. The digital micro-mirror device spatially corresponds to the mirror corresponding side. An incident light is transmitted through the light-incident side of the prism set to irradiate the digital micro-mirror device. When the digital micro-mirror device is configured to generate an on-state light, the on-state light is outputted through the first light-emitting side. The reflective component spatially corresponds to the first light-emitting side. When the digital micro-mirror device is configured to generate an off-state light, the off-state light is transmitted toward the reflective component to be reflected and further outputted through the second light-emitting side. The heat dissipation module spatially corresponding to the second light-emitting side is configured to receive the off-state light and convert the off-state light into heat for dissipation.

Description

Projection device

This case relates to a projection device, especially a projection device that can provide a heat dissipation module under dark conditions.

In response to market demand, current projection devices continue to pursue brightness enhancement, which means the provision of power and the generation of heat. However, when the projection device is actually used, it does not continuously provide on-state light to produce a projected bright image. When the projection device is manipulated to provide off-state light, the projected bright picture disappears and presents a dark picture, and most of the light energy of the projection device will remain inside the light engine. Since the optical machine of the traditional projection device adopts a closed housing design, it is not easy to dissipate the heat inside, and the continuous accumulation of heat will cause the temperature of the key internal optical components to become too high, which will damage or malfunction.

Take the optical machine of a traditional one-chip laser projector as an example. When the optical machine is manipulated to provide dark state light, the optical machine uses a barrier to block between the lens and the prism to prevent the projection light source from directly irradiating the edge of the lens, which may cause the lens to heat up and be damaged. However, due to the limitation of relative space, the thickness of the barrier sheet is small, the heat diffusion resistance is large, and the heat conduction effect is not good. Furthermore, due to factors such as focal length between the lens and the lens, it is not easy to install a heat dissipation module to connect to the blocking plate for heat dissipation. Therefore, when the traditional optical machine is in a dark state, it cannot provide an effective heat dissipation module, so that the heat is accumulated on the barrier and cannot be dissipated. As the temperature of the barrier sheet increases, the optical components inside the optical engine or the lens and the lens adjacent to the barrier sheet are easily affected and increased, increasing the risk of failure and damage.

In view of this, it is really necessary to provide a projection device that can provide a heat dissipation module under dark conditions, to achieve the heat dissipation effect in a closed optical machine, improve the temperature of key optical components, and make the projection device have higher luminous efficiency and Reliability to solve the lack of conventional technology.

The purpose of this case is to provide a projection device that can provide a heat dissipation module under dark conditions. By arranging the at least one reflective element and the heat dissipation module respectively opposite to the first light-emitting surface and the second light-emitting surface of the set, the problem that it is difficult to directly dissipate the energy of the dark state light due to space constraints can be solved, and The heat dissipation effect in the airtight machine improves the temperature of key optical components, so that the projection device has higher luminous efficiency and reliability.

Another objective of this case is to provide a projection device that can provide a heat dissipation module under dark conditions. Through the arrangement of at least one reflective element, the dark state light is guided to a space that is conducive to heat dissipation, and then the heat dissipation module is used for heat dissipation. There is an anti-reflection film on the second light-emitting surface of the dark state light passing through, so as to increase the penetration rate of the dark-state light on the second light-emitting surface and reduce the retention of the light in the shadow. On the other hand, the receiving part of the heat-dissipating module is arranged adjacent to the second light-emitting surface of the faucet and is accommodated in the airtight machine, and the conduction part conducts heat to the external heat-dissipating part for heat dissipation. Since the receiving part is located inside the optical engine, it has a geometric surface that is conducive to the retention of light in the dark state. The geometric surface is more blackened and roughened to increase the absorption rate of light in the dark state. The receiving part absorbs the light energy of the dark state light and converts it into heat energy, which is transferred to the heat dissipation part located outside the optical machine through the conduction part for heat dissipation, which can solve the problem of dissipating the heat dissipation module and achieve the internal dark state of the escaped optical machine The heat dissipation effect of light energy improves the temperature of key optical components, so that the projection device has higher luminous efficiency and reliability.

In order to achieve the foregoing objective, this project provides a projection device, which includes a lens set, a digital micro-mirror element, a lens, a reflective element, and a heat dissipation module. The ridge group has a light-incident surface, a micro-mirror corresponding surface, a first light-emitting surface, and a second light-emitting surface. The corresponding surface of the micromirror and the first light-emitting surface are opposite to each other, the first light-emitting surface is arranged adjacent to the second light-emitting surface, and an anti-reflection film is provided on the second light-emitting surface. The digital micro-mirror element is spatially opposed to the corresponding surface of the micro-mirror of the group. When a light source passes through the light-incident surface of the light beam assembly and the digital micro-mirror element is introduced, the digital micro-mirror element assembly provides one of a bright state light and a dark state light. The lens is spatially opposite to the first light-emitting surface of the lens group. When the digital micro-mirror element provides bright state light, the bright state light is guided to the lens through the first light-emitting surface. The reflecting element is arranged between the lens set and the lens, and the reflecting element at least partially overlaps the first light-emitting surface when viewed from the direction of the lens set facing the lens, wherein the dark state light guides when the digital micro-mirror element provides dark state light The reflective element reflects the dark state light so that the dark state light passes through the anti-reflection film on the second light-emitting surface. The heat dissipation module is spatially opposed to the second light-emitting surface of the sill group, receives and emits the dark-state light passing through the anti-reflection film on the second light-emitting surface, and converts the dark-state light into a heat energy for dissipation.

In one embodiment, the heat dissipation module includes a receiving part, wherein the receiving part is adjacent to the second light-emitting surface of the stalk group, and is configured to receive the dark state light that penetrates and emits the anti-reflection film on the second light-emitting surface.

In one embodiment, the receiving part has a geometric surface, and the geometric surface is blackened and roughened to facilitate the retention of light in the dark state and increase the absorption rate of light in the dark state.

In one embodiment, the projection device includes a housing with an accommodating space, wherein the radiator assembly and the receiving part of the heat dissipation module are accommodated in the accommodating space, the light source faces the light incident surface, and the micro mirror element faces the micro mirror The corresponding surface, and the lens faces the first light-emitting surface.

In one embodiment, the heat dissipation module further includes a conduction part and a heat dissipation part, the conduction part is connected between the receiving part and the heat dissipation part, and the heat dissipation part is disposed outside the casing.

In one embodiment, the conductive portion is selected from one of a heat pipe and a copper tube, and the heat dissipation portion is selected from one of a heat dissipation fin and a semiconductor refrigerator.

In one embodiment, the first light-emitting surface and the second light-emitting surface form an included angle, and the included angle is less than 90 degrees.

In one embodiment, the set of light beams further has an auxiliary reflecting surface, wherein the first light emitting surface and the auxiliary reflecting surface face each other, and the second light emitting surface is connected between the first light emitting surface and the auxiliary reflecting surface.

In one embodiment, the auxiliary reflecting surface and the second light emitting surface form an included angle, and the included angle is less than 90 degrees.

In one embodiment, the set of ridges includes at least one first ridge and at least one second ridge, at least one first ridge and at least one second ridge has an interface between them, and the reflective light source is assembled to a digital position. Micro-mirror element, and make the light in the bright state and the light in the dark state pass through the interface, wherein the light-incident surface and the micro-mirror corresponding surface are located at at least one first beam, and the first light-emitting surface and the second light-emitting surface are located at the at least one Two 稜鏡.

In one embodiment, the reflective element is adjacent to the intersection of the first light-emitting surface and the second light-emitting surface.

In one embodiment, the reflective element is a reflective coating formed on the first light-emitting surface, and the reflective coating at least partially covers the first light-emitting surface.

In one embodiment, the reflective element is a metal sheet with a reflective surface, and the reflective surface at least partially covers the first light-emitting surface when viewed from the direction of the lens assembly facing the lens.

In one embodiment, the projection device is a single-chip laser projector.

In order to achieve the foregoing objective, this project also provides a projection device, which includes a mirror group, a digital micro-mirror element, a reflective element, and a heat dissipation module. The ridge group has a light-incident surface, a micro-mirror corresponding surface, a first light-emitting surface, and a second light-emitting surface. The micro-mirror corresponding surface and the first light-emitting surface are opposite to each other, and the first light-emitting surface and the second light-emitting surface are arranged adjacent to each other. The digital micro-mirror element is spatially opposed to the corresponding surface of the micro-mirror of the group. When a light source passes through the light-incident surface of the mirror assembly and the digital micro-mirror element is introduced, the digital micro-mirror element assembly provides one of a bright state light and a dark state light, among which the digital micro-mirror element When the bright state light is provided, the bright state light passes through the first light-emitting surface. The reflective element is spatially opposed to the first light-emitting surface of the mirror group, and the reflective element at least partially covers the first light-emitting surface when viewed from the direction of the mirror group facing the lens. When the digital micro-mirror device provides dark state light, The dark state light is guided to the reflective element, and the reflective element reflects the dark state light so that the dark state light passes through the second light-emitting surface. The heat dissipation module is spatially opposed to the second light-emitting surface of the group, receives and emits the dark state light on the second light-emitting surface, and converts the dark state light into a heat energy for dissipation.

In one embodiment, the projection device further includes a lens, which is spatially opposed to the first light-emitting surface of the group, wherein when the digital micro-mirror element provides bright state light, the bright state light is guided to the lens through the first light-emitting surface.

In one embodiment, an anti-reflection film is provided on the second light-emitting surface.

In one embodiment, the heat dissipation module includes a receiving part, a conducting part and a heat dissipating part, wherein the receiving part is adjacent to the second light-emitting surface of the group, and is configured to receive and emit the anti-reflection on the second light-emitting surface. In the dark state of the film, the conductive part is connected between the receiving part and the heat dissipation part, and the heat dissipation part is arranged outside the casing.

In one embodiment, the receiving part has a geometric surface, and the geometric surface is blackened and roughened to facilitate the retention of light in the dark state and increase the absorption rate of light in the dark state.

In one embodiment, the projection device includes a housing with an accommodating space, wherein the radiator assembly and the receiving part of the heat dissipation module are accommodated in the accommodating space, the light source faces the light incident surface, and the micro mirror element faces the micro mirror The corresponding surface, and the lens faces the first light-emitting surface.

In one embodiment, the first light-emitting surface and the second light-emitting surface form an included angle, and the included angle is less than 90 degrees.

In one embodiment, the set of light beams further has an auxiliary reflecting surface, wherein the first light emitting surface and the auxiliary reflecting surface face each other, and the second light emitting surface is connected between the first light emitting surface and the auxiliary reflecting surface.

In one embodiment, the auxiliary reflecting surface and the second light emitting surface form an included angle, and the included angle is less than 90 degrees.

In one embodiment, the set of ridges includes at least one first ridge and at least one second ridge, at least one first ridge and at least one second ridge has an interface between them, and the reflective light source is assembled to a digital position. Micro-mirror element, and make the light in the bright state and the light in the dark state pass through the interface, wherein the light-incident surface and the micro-mirror corresponding surface are located at at least one first beam, and the first light-emitting surface and the second light-emitting surface are located at the at least one Two 稜鏡.

In one embodiment, the reflective element is a reflective coating formed on the first light-emitting surface, and the reflective coating at least partially covers the first light-emitting surface.

In one embodiment, the reflective element is a metal sheet with a reflective surface, and the reflective surface at least partially covers the first light-emitting surface when viewed from the direction of the lens assembly facing the lens.

In one embodiment, the projection device is a single-chip laser projector.

Some typical embodiments embodying the features and advantages of this case will be described in detail in the following description. It should be understood that this case can have various changes in different aspects, all of which do not depart from the scope of the case, and the descriptions and drawings therein are essentially for illustrative purposes, not for limiting the case.

FIG. 1 is a schematic diagram showing the structure of the projection device of the first preferred embodiment of the present invention. Fig. 2 is an exploded view showing the partial structure of the projection device of the first preferred embodiment of the present invention. FIG. 3 is a schematic diagram showing the light path of the incident light source of the projection device according to the first preferred embodiment of the present invention. FIG. 4 is a schematic diagram showing the light path of the bright state light of the projection device of the first preferred embodiment of the present invention. FIG. 5 is a schematic diagram showing the light path of the dark state light of the projection device of the first preferred embodiment of the present invention. In this embodiment, the projection device 1 is applied to a single-chip laser projector, for example. The projection device 1 includes a lens group 10, a digital micro-mirror device (DMD) 20, a lens 30, a reflective element 40, a heat dissipation module 50, and a housing 60. The housing 60, for example, but not limited to, is formed by assembling a front cover 60a and a rear cover 60b, and has an accommodating space 61. The ridge group 10 is accommodated in the accommodating space 61 of the housing 60, and the ridge group 10 has a light-incident surface 11, a micro-mirror corresponding surface 12, a first light-emitting surface 13 and a second light-emitting surface 14. The micro-mirror corresponding surface 12 and the first light-emitting surface 13 are opposite to each other, the first light-emitting surface 13 and the second light-emitting surface 14 are arranged adjacent to each other, and an anti-reflection film 16 is provided on the second light-emitting surface 14, for example. In addition, when the lens assembly 10 is accommodated in the accommodating space 61 of the casing 60, a light source λ0 faces the light incident surface 11, the micro-mirror element 20 faces the micro-mirror corresponding surface 12, and the lens 30 faces the first light-emitting surface 13. In this embodiment, the digital micro-mirror element 20 is spatially opposed to the micro-mirror corresponding surface 12 of the group 10. When the light source λ0 passes through the light-incident surface 11 of the group 10 and the digital micro-mirror element 20 is introduced (as shown in Figure 3), the digital micro-mirror element 20 is combined to provide an on-state light (on-state light). ) One of λ1 (as shown in Figure 4) and an off-state light λ2 (as shown in Figure 5). It should be noted that, in this embodiment, the digital micro-mirror element 20 is a matrix composed of micro-lens (not shown) arranged on a semiconductor chip, and each micro-lens controls a pixel in the projection image. The micro lens can quickly change the angle under the control of the digital drive signal. Once the corresponding signal is received, the micro lens will change the inclination angle, so that the reflection direction of the incident light source λ0 is changed. The micro lens in the projection state is shown as "on-state" and provides bright state light λ1, as shown in Figure 4. In this embodiment, the lens 30 is spatially opposed to the first light-emitting surface 13 of the lens group 10. When the digital micro-mirror element 20 provides the bright state light λ1, the bright state light λ1 is guided to the lens 30 through the first light-emitting surface 13. On the other hand, if the micro-lens is in the non-projection state, it is shown as "off-state", and the dark state light λ2 is provided instead, as shown in Figure 5. In this embodiment, the reflective element 40 is, for example, a metal sheet, which is disposed between the lens assembly 10 and the lens 30 and adjacent to the intersection of the first light-emitting surface 13 and the second light-emitting surface 14. The reflective element 40 further has a reflective surface 41. When the reflective element 40 is viewed from the direction of the lens assembly 10 facing the lens 30, the reflective surface 41 at least partially overlaps the first light-emitting surface 13 of the lens assembly 10. When the digital micro-mirror element 20 provides the dark state light λ2, the dark state light λ2 is guided to the reflective element 40, and the reflective element 40 reflects the dark state light λ2, so that the dark state light λ2 passes through the anti-reflection film 16 on the second light-emitting surface 14 . In this embodiment, the heat dissipation module 50 is connected to the housing 60, and is spatially opposed to the second light-emitting surface 14 of the group 10, and receives and emits the dark-state light that penetrates and emits the anti-reflection film 16 on the second light-emitting surface 14 λ2, and the dark state light λ2 is converted into a heat energy to escape.

In the present embodiment, the set of scallops 10 includes at least one first scallop 10a and at least one second scallop 10b. There is an interface 15 between at least one first scallop 10a and at least one second scallop 10b. Combine the reflective light source λ0 to the digital micro-mirror element 20. And the bright state light λ1 reflected by the digital micro-mirror element 20 under control can penetrate the interface 15 and be guided to the lens 30 by the first light-emitting surface 13, or the dark state light reflected by the digital micro-mirror element 20 under control λ2 can penetrate the interface 15 to guide the reflective element 40 and guide the heat dissipation module 50 through the second light-emitting surface 14. In this embodiment, the light-incident surface 11 and the micro-mirror corresponding surface 12 are located on at least one first beam 10a, and the first light-emitting surface 13 and the second light-emitting surface 14 are located on at least one second beam 10b. Of course, this case is not limited to this. It is worth noting that there is an anti-reflective film 16 on the second light-emitting surface 14 where the dark-state light λ2 travels, which can further increase the penetration rate of the dark-state light λ2 on the second light-emitting surface 14 and reduce the retention of the light λ2. In 10, the dark state light λ2 can be completely absorbed by the heat dissipation module 50, and converted into a heat energy for dissipation. Of course, the present case is not limited to this. In other embodiments, the anti-reflection film 16 can also be omitted, and the dark-state light λ2 is absorbed by the heat dissipation module 50 after passing through the second light-emitting surface 14. In addition, the number and size of the first ridge 10a and the second ridge 10b, and the way of constructing the ridge group 10 can be adjusted according to actual application requirements. This case is not limited to this and will not be repeated here.

On the other hand, in this embodiment, the heat dissipation module 50 includes a receiving portion 51, a conductive portion 52, and a heat dissipation portion 53, wherein the receiving portion 51 is accommodated in the accommodating space 61 of the housing 60 and is adjacently disposed The second light-emitting surface 14 and the anti-reflection film 16 of the group 10 are assembled to receive and emit the dark state light λ2 passing through the anti-reflection film 16 on the second light-emitting surface 14 and convert the dark state light λ2 into a heat energy. In this embodiment, the receiving portion 51 further has a geometric surface 51a. The geometric surface 51a can be blackened and roughened, for example, to facilitate the retention of the dark state light λ2 and increase the absorption rate of the dark state light λ2. In this embodiment, the conductive portion 52 may be, for example, but not limited to, a heat pipe or a copper pipe, penetrates the housing 60 and is connected between the receiving portion 51 and the heat dissipation portion 53. The heat dissipation portion 53 may be, for example, but not limited to, a heat dissipation fin or a semiconductor refrigerator, and is disposed outside the housing 60. In this embodiment, the accommodating space 61 of the housing 60 accommodates the faucet assembly 10 and the receiving portion 51 of the heat dissipation module 50, the light source λ0 faces the light incident surface 11, and the digital micro-mirror element 20 faces the corresponding surface of the micromirror 12, and the lens 30 faces the first light-emitting surface 13. It is worth noting that in the limited accommodating space 61 of the housing 60, in addition to the faucet assembly 10, the receiving portion 51 of the heat dissipation module 50 is also accommodated. In this embodiment, an included angle θ is formed between the first light-emitting surface 13 and the second light-emitting surface 14 of the ridge group 10, and the included angle θ is less than 90 degrees, so the ridge group 10 is accommodated in the accommodating space of the housing 60 At 61 o'clock, there is still enough accommodating space 61 between the housing 60 and the second light-emitting surface 14 of the set 10 to accommodate the receiving portion 51 of the heat dissipation module 50. In other words, in the projection device 1 of the present invention, by arranging the receiving part 51 of the heat dissipation module 50 adjacent to the second light-emitting surface 14 of the set 10, in addition to enabling the receiving part 51 of the heat dissipation module 50 to effectively absorb the light of the dark state λ2 It can be converted into heat energy, and transferred to the heat dissipation part 53 located outside the casing 60 through the conducting part 52 for heat dissipation. It can also solve the installation problem of the heat dissipating module 50, and at the same time achieve the dissipation of the dark state light in the casing 60. The heat dissipation effect of λ2 energy improves the temperature of key optical components, so that the projection device 1 has higher luminous efficiency and reliability.

FIG. 6 is a schematic diagram showing the structure of the projection device of the second preferred embodiment of the present invention. FIG. 7 is a schematic diagram showing the light path of the dark state light of the projection device of the second preferred embodiment of the present invention. In this embodiment, the projection device 1a is similar to the projection device 1 shown in FIGS. 1 to 5, and the same component numbers represent the same components, structures, and functions, which will not be repeated here. In this embodiment, the reflective element 40a is a reflective coating formed on the first light-emitting surface 13, and the reflective coating at least partially covers the first light-emitting surface 13. The reflective element 40a is viewed from the direction facing the lens 30. 40a, the reflective surface 41a of the reflective element 40a at least partially overlaps the first light-emitting surface 13. In other words, the covered portion of the first light emitting surface 13 can be constructed as a reflective surface 41a. When the digital micro-mirror element 20 provides the dark state light λ2, the dark state light λ2 is guided to the reflective element 40a, and the reflective surface 41a of the reflective element 40a reflects the dark state light λ2, so that the dark state light λ2 passes through the second light exit surface 14 The anti-reflection film 16 is emitted, and the dark state light λ2 is absorbed by the receiving portion 51 of the heat dissipation module 50 in the casing 60 to convert the dark state light λ2 into heat energy. After the dark state light λ2 is converted into heat energy, it is transferred to the heat dissipation portion 53 outside the casing 60 through the conductive portion 52 and escapes. By arranging the reflective element 40a and the receiving portion 51 of the heat dissipation module 50 respectively opposite to the first light-emitting surface 13 and the second light-emitting surface 14 of the group 10, it can solve the problem that it is difficult to directly escape the dark state light due to space constraints. The problem of λ2 energy can achieve, for example, the heat dissipation effect in the sealed optical machine in the housing 60, improve the temperature of key optical components, and make the projection device 1a have higher luminous efficiency and reliability. It should be further explained that through the coating of the reflective film and the anti-reflection film, the reflective surface 41a and the first light-emitting surface 13 can be constructed on the same side surface of the group 10 at the same time, and the ratio of the reflective surface 41a to the first light-emitting surface 13 It can be adjusted according to actual application requirements. However, this case is not limited to this.

FIG. 8 is a schematic diagram showing the structure of the projection device of the third preferred embodiment of the present invention. FIG. 9 is a schematic diagram showing the light path of the dark state light of the projection device of the third preferred embodiment of the present invention. In this embodiment, the projection device 1b is similar to the projection device 1 shown in FIGS. 1 to 5, and the same component numbers represent the same components, structures, and functions, and will not be repeated here. In this embodiment, the projection device 1b includes a reflective element 40a and an auxiliary reflective element 40b. The set 10 includes a first set 10a and a second set 10c. There is an interface 15 between the first ridge 10a and the second ridge 10c, and a reflective light source λ0 to a digital micro-mirror element 20 is assembled. The first beam 10a further has a light incident surface 11 and a micro-mirror corresponding surface 12. The second light-emitting surface 10c further has a first light-emitting surface 13, a second light-emitting surface 14 and an auxiliary reflective surface 17. The first light emitting surface 13 and the auxiliary reflecting surface 17 face each other, the second light emitting surface 14 is connected between the first light emitting surface 13 and the auxiliary reflecting surface 17, and an included angle θ is formed between the auxiliary reflecting surface 17 and the second light emitting surface 14 , The included angle θ is less than 90 degrees. In this embodiment, the reflective element 40a and the auxiliary reflective element 40c may be, for example, a reflective coating film formed on the first light-emitting surface 13 and the auxiliary reflective surface 17 respectively. In other implementations, the reflective element 40a and the auxiliary reflective element 40c may be, for example, a metal sheet, which is disposed facing the first light emitting surface 13 and the auxiliary reflective surface 17 respectively. This case is not limited to this. When the digital micro-mirror element 20 provides the dark state light λ2, the dark state light λ2 passes through the interface 15 and is guided to the reflecting element 40a. The reflecting surface 41a of the reflecting element 40a reflects the dark state light λ2 to the auxiliary reflecting surface 17, and then passes through the auxiliary reflecting surface 41a. The reflective surface 41b of the reflective element 40b reflects the dark state light λ2 to the second light exit surface 14, so that the dark state light λ2 passes through the anti-reflection film 16 on the second light exit surface 14 and is emitted, and is emitted from the heat dissipation module in the housing 60 The receiving part 51 of 50 absorbs the dark state light λ2 to convert the dark state light λ2 into heat energy. After the dark state light λ2 is converted into heat energy, it is transferred to the heat dissipation portion 53 outside the casing 60 through the conductive portion 52 and escapes. In this embodiment, by respectively arranging the reflective element 40a and the auxiliary reflective element 40c on the first light-emitting surface 13 of the first beam 10a and the auxiliary reflective surface 17 of the second beam 10c, the heat dissipation module 50 The receiving part 51 can be arranged relative to the second light-emitting surface 14 of the group 10 and accommodated in the accommodating space 61 to solve the problem that it is difficult to directly dissipate the energy of the dark state light λ2 due to space constraints, and achieve For example, the heat dissipation effect in the optical engine is sealed in the casing 60 to improve the temperature of key optical elements, so that the projection device 1b has higher luminous efficiency and reliability. It should be noted that the design of the heat sink assembly 10 can be adjusted according to actual applications. With the arrangement of the auxiliary reflecting element 40c, the receiving part 51 of the heat dissipation module 50 and the heat sink assembly 10 can be optimally accommodated in the housing 60 In the accommodation space 61, the accommodation space 61 of the housing 60 is effectively used. Of course, the types of the first ridge 10a and the second ridge 10c, the number of auxiliary reflection elements 40c, and the placement position can be adjusted according to actual applications. This case is not covered by this, and will not be repeated here.

In summary, this project provides a projection device that can provide a heat dissipation module under dark conditions. By arranging the at least one reflective element and the heat dissipation module respectively opposite to the first light-emitting surface and the second light-emitting surface of the set, the problem that it is difficult to directly dissipate the energy of the dark state light due to space constraints can be solved, and The heat dissipation effect in the airtight machine improves the temperature of key optical components, so that the projection device has higher luminous efficiency and reliability. In addition, through the arrangement of at least one reflective element, the dark state light is guided to a space conducive to heat dissipation, and then the heat dissipation module is used for heat dissipation. There is an anti-reflection film on the second light-emitting surface of the dark state light passing through, so as to increase the penetration rate of the dark-state light on the second light-emitting surface and reduce the retention of the light in the shadow. On the other hand, the receiving part of the heat-dissipating module is arranged adjacent to the second light-emitting surface of the faucet and is accommodated in the airtight machine, and the conduction part conducts heat to the external heat-dissipating part for heat dissipation. Since the receiving part is located inside the optical engine, it has a geometric surface that is conducive to the retention of light in the dark state. The geometric surface is more blackened and roughened to increase the absorption rate of light in the dark state. The receiving part absorbs the light energy of the dark state light and converts it into heat energy, which is transferred to the heat dissipation part located outside the optical machine through the conduction part for heat dissipation, which can solve the problem of dissipating the heat dissipation module and achieve the internal dark state of the escaped optical machine The heat dissipation effect of light energy improves the temperature of key optical components, so that the projection device has higher luminous efficiency and reliability.

This case can be modified in many ways by those who are familiar with this technology, but it is not deviated from the protection of the patent application.

1, 1a, 1b: projection device 10: 稜鏡 group 10a: The first tang 10b, 10c: the second tang 11: Glossy surface 12: Micro mirror corresponding surface 13: The first glossy surface 14: The second glossy surface 15: Interface 16: Anti-reflective film 17: Auxiliary reflective surface 20: Digital micro mirror element 30: lens 40, 40a: reflective element 41, 41a, 41b: reflective surface 40b: auxiliary reflective element 50: cooling module 51: receiving department 51a: Geometric surface 52: Conduction part 53: heat sink 60: shell 60a: front cover 60b: back cover 61: accommodation space λ0: light source λ1: bright state light λ2: dark state light

FIG. 1 is a schematic diagram showing the structure of the projection device of the first preferred embodiment of the present invention. Fig. 2 is an exploded view showing the partial structure of the projection device of the first preferred embodiment of the present invention. FIG. 3 is a schematic diagram showing the light path of the incident light source of the projection device according to the first preferred embodiment of the present invention. FIG. 4 is a schematic diagram showing the light path of the bright state light of the projection device of the first preferred embodiment of the present invention. FIG. 5 is a schematic diagram showing the light path of the dark state light of the projection device of the first preferred embodiment of the present invention. FIG. 6 is a schematic diagram showing the structure of the projection device of the second preferred embodiment of the present invention. FIG. 7 is a schematic diagram showing the light path of the dark state light of the projection device of the second preferred embodiment of the present invention. FIG. 8 is a schematic diagram showing the structure of the projection device of the third preferred embodiment of the present invention. FIG. 9 is a schematic diagram showing the light path of the dark state light of the projection device of the third preferred embodiment of the present invention.

1: Projection device

10: 稜鏡 group

10a: The first tang

10b: The second tang

11: Glossy surface

12: Micro mirror corresponding surface

13: The first glossy surface

14: The second glossy surface

15: Interface

16: Anti-reflective film

20: Digital micro mirror element

30: lens

40: reflective element

41: reflective surface

50: cooling module

51: receiving department

52: Conduction part

53: heat sink

60: shell

61: accommodation space

λ0: light source

λ1: bright state light

λ2: dark state light

Claims (12)

A projection device includes: a light-incident group with a light-incident surface, a micro-mirror corresponding surface, a first light-emitting surface, and a second light-emitting surface, wherein the micro-mirror corresponding surface and the first light-emitting surface are opposite to each other, The first light-emitting surface is arranged adjacent to the second light-emitting surface, and an anti-reflective film is disposed on the second light-emitting surface; a digital micro-mirror element is spatially opposed to the micro-mirror corresponding surface of the group of light beams, wherein When a light source passes through the light-incident surface of the light beam assembly and the digital micro-mirror element is introduced, the digital micro-mirror element assembly provides one of a bright state light and a dark state light; a lens, Spatially opposing the first light-emitting surface of the light-emitting group, wherein when the digital micro-mirror element provides the bright state light, the bright state light is guided to the lens through the first light-emitting surface; a reflective element is disposed on The reflective element is at least partially overlapped with the first light-emitting surface when viewed from the direction of the lens set and the lens, and the reflective element at least partially overlaps the first light-emitting surface, wherein when the digital micro-mirror element provides the dark state light , The dark state light is guided to the reflective element, the reflective element reflects the dark state light so that the dark state light passes through the anti-reflection film on the second light-emitting surface; and a heat dissipation module, which is spatially opposed to the The second light-emitting surface of the ridge group receives and emits the dark-state light passing through the anti-reflection film on the second light-emitting surface, and converts the dark-state light into a heat energy to escape. The projection device according to claim 1, wherein the heat dissipation module includes a receiving part, wherein the receiving part is adjacent to the second light-emitting surface of the beam group. The projection device according to claim 2, wherein the receiving part has a geometric surface, and the geometric surface is blackened and roughened to facilitate the retention of light in the dark state and increase the absorption rate of light in the dark state. The projection device according to claim 2, comprising a housing with an accommodating space, wherein the receiving part of the radiating module and the radiating module are accommodated in the accommodating space, and the light source faces the light incident surface , The micro mirror element faces the corresponding surface of the micro mirror, and the lens faces the first light-emitting surface. The projection device according to claim 4, wherein the heat dissipation module further includes a conduction part and a heat dissipation part, the conduction part is connected between the receiving part and the heat dissipation part, and the heat dissipation part is disposed outside the casing. The projection device according to claim 1, wherein the first light-emitting surface and the second light-emitting surface form an included angle, and the included angle is less than 90 degrees. The projection device according to claim 1, wherein the faucet group further has an auxiliary reflective surface, wherein the first light-emitting surface and the auxiliary reflective surface face each other, and the second light-emitting surface is connected to the first light-emitting surface and the Between auxiliary reflective surfaces. The projection device according to claim 7, wherein the auxiliary reflecting surface and the second light emitting surface form an included angle, and the included angle is less than 90 degrees. The projection device according to claim 1, wherein the set of ridges includes at least one first ridge and at least one second ridge, and there is an interaction between the at least one first ridge and the at least one second ridge Interface, the light source is assembled to reflect the light source to the digital micro-mirror element, and the bright state light and the dark state light can penetrate the interface, wherein the light incident surface and the corresponding surface of the micro mirror are located on the at least one first For the ridge, the first light-emitting surface and the second light-emitting surface are located on the at least one second ridge. The projection device according to claim 1, wherein the reflective element is a reflective coating formed on the first light-emitting surface, and the reflective coating at least partially covers the first light-emitting surface. The projection device according to claim 1, wherein the reflective element is a metal sheet with a reflective surface, and the reflective surface at least partially covers the first light-emitting surface when viewed from the direction of the lens assembly facing the lens. The projection device according to claim 1, wherein the projection device is a single-chip laser projector.

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