CN218158693U

CN218158693U - Small-size projection optical machine

Info

Publication number: CN218158693U
Application number: CN202121778513.7U
Authority: CN
Inventors: 朱青; 杨浩; 孙峰
Original assignee: Shenzhen Anhua Optoelectronics Technology Co Ltd
Current assignee: Shenzhen Anhua Photoelectric Technology Co ltd
Priority date: 2021-07-30
Filing date: 2021-07-30
Publication date: 2022-12-27
Anticipated expiration: 2031-07-30

Abstract

The utility model relates to a small-size projection light machine, including the ray apparatus shell, the light source subassembly, prism subassembly and radiator unit, the light source subassembly inlays and locates on the ray apparatus shell, the prism subassembly is located in the ray apparatus shell, be equipped with first mounting groove on the ray apparatus shell, the embedded DMD that is equipped with of first mounting groove, radiator unit installs on the ray apparatus shell, and radiator unit includes from inside to outside interior heat conduction pad that the connection of laminating in proper order, heat conduction clamp plate, outer heat conduction pad and radiator circuit board, the medial surface of interior heat conduction pad is laminated with the lateral surface of DMD to dispel the heat through radiator unit with the heat on the DMD. The utility model relates to a radiator unit and DMD laminating among the small-size projection optical machine, therefore on the heat conductibility to radiator unit on the DMD to dispel the heat through the radiating circuit board. Therefore, structures such as radiating fins are not required to be arranged on the outer side of the radiating circuit board, the size of the final projection optical machine can be greatly reduced, and the problem of miniaturization of the projection optical machine is solved.

Description

Small-size projection optical machine

Technical Field

The utility model relates to an ray apparatus technical field, in particular to small-size projection optical machine.

Background

A DMD (Digital micromirror Device) is a core Device of Digital light processing technology (DLP), and mainly realizes a projected image by adjusting reflected light. The light irradiates on the DMD to bring the heat dissipation problem of the DMD, the heat dissipation mode of the existing DMD is that the heat dissipation sheet is directly or indirectly contacted with the back of the DMD, the heat on the DMD is conducted to the heat dissipation sheet, and the heat is dissipated out through the heat dissipation sheet, and the heat dissipation sheet has a large surface area, so that the space occupied by the heat dissipation sheet is large, and the projection light machine is hindered from being miniaturized.

SUMMERY OF THE UTILITY MODEL

In view of this, the main objective of the present invention is to provide a small-sized projection optical machine, which can dissipate heat through the heat dissipation circuit board on the DMD, so that it is not necessary to additionally dissipate heat for the DMD through the heat dissipation fins, thereby reducing the size of the projection optical machine.

The utility model discloses the concrete embodiment who adopts:

the utility model provides a small-size projection optical machine, includes light casing, light source subassembly, prism subassembly and radiator unit, the light source subassembly inlays to be located on the light casing, the prism subassembly is located in the light casing, be equipped with first mounting groove on the light casing, the embedded DMD that is equipped with of first mounting groove, radiator unit install in on the light casing, just radiator unit includes interior heat conduction pad, heat conduction clamp plate, outer heat conduction pad and the radiating circuit board of laminating connection from inside to outside in proper order, the medial surface of interior heat conduction pad with the lateral surface laminating of DMD, with will heat on the DMD passes through radiator unit dispels the heat.

Preferably, still be equipped with the second mounting groove on the optical chassis, link up of first mounting groove the tank bottom of second mounting groove, interior heat conduction pad set up in second mounting groove department DMD inlays to be located first mounting groove department interior heat conduction pad set up in when second mounting groove department, the lateral surface protrusion of interior heat conduction pad in the notch of second mounting groove, the outline of heat conduction clamp plate is greater than the outline of interior heat conduction pad, the heat conduction clamp plate will from the extroversion inwards interior heat conduction pad is whole to be impressed in the second mounting groove to make the lateral surface of interior heat conduction pad with the plane at the notch place of second mounting groove flushes.

Preferably, four corners of the inner heat conducting pad are respectively provided with a first mounting hole, and a first screw penetrates through the first mounting hole to fix the heat conducting pressing plate on the optical chassis.

Preferably, the heat dissipation circuit board is provided with a second mounting hole, the outer heat conduction pad is provided with a first via hole, the heat conduction pressing plate is provided with a second via hole, the optical chassis is provided with an installation positioning column, the installation positioning column penetrates through the second via hole and the first via hole, the end face of the installation positioning column is abutted to the inner side face of the heat dissipation circuit board, and a second screw penetrates through the second mounting hole and is connected with the installation positioning column, so that the heat dissipation circuit board is fixedly connected to the optical chassis.

Preferably, the number of the mounting positioning columns is two, and the cross sections of the two mounting positioning columns are different.

Preferably, a first through groove is formed in the middle of the inner heat conducting pad, a second through groove is formed in the middle of the heat conducting pressing plate, a third through groove is formed in the middle of the outer heat conducting pad, the first through groove, the second through groove and the third through groove are partially overlapped in the inner direction and the outer direction, the overlapped part forms a connecting channel, a first connecting terminal is arranged on the outer side face of the DMD, a second connecting terminal is arranged on the inner side face of the heat radiating circuit board, and the first connecting terminal and the second connecting terminal are connected in an inserting mode through the connecting channel.

Preferably, the light source assembly includes a first light source and a second light source, the first light source can emit a first color light and a second color light of three color lights, the second light source can emit a third color light of the three color lights, the colors of the first color light, the second color light and the third color light are different from each other, the prism assembly includes a first light splitter, a second light splitter and a fly eye lens, the second light source is disposed opposite to the fly eye lens, the first light splitter and the second light splitter are disposed between the second light source and the fly eye lens, the third color light passes through the first light splitter and the second light splitter to the fly eye lens, the first light source is disposed on one side of the third color light between the second light source and the fly eye lens, the first light splitter and the second light splitter are disposed obliquely with respect to a mirror surface of the fly eye lens, the first color light is obliquely emitted to the first light splitter and is reflected to the fly eye lens by the first light splitter, and the second color light is obliquely emitted to the fly eye lens.

Preferably, the first light source includes a light emitting chip, a first light emitting area and a second light emitting area are arranged on the light emitting chip side by side, the first light emitting area can emit light of a first color, the second light emitting area can emit light of a second color, the first light emitting area is far away from the fly eye lens than the second light emitting area, and an included angle between the light of the third color and the first light splitter is smaller than an included angle between the light of the third color and the second light splitter.

Preferably, the first light splitter is closer to the first light source than the second light splitter.

Preferably, the power rating of the light source assembly is no greater than 5W.

The utility model has the advantages that:

the utility model relates to a radiator unit and DMD laminating in the small-size projection optical machine, therefore on heat conductible to radiator unit on the DMD, because the radiating circuit board among the radiator unit is in the outside, the heat on the DMD can conduct to radiating circuit board on to dispel the heat through radiating circuit board. Therefore, structures such as radiating fins are not required to be arranged on the outer side of the radiating circuit board, the size of the final projection optical machine can be greatly reduced, and the problem of miniaturization of the projection optical machine is solved.

Drawings

The above and other objects, features and advantages of the present invention will become more apparent from the following description of the embodiments of the present invention with reference to the accompanying drawings, in which:

fig. 1 is a schematic structural diagram of a preferred embodiment of a compact projector according to the present invention;

FIG. 2 is an exploded view of the heat dissipation assembly and the optical chassis of FIG. 1;

FIG. 3 is an exploded view of the DMD and heat sink assembly of FIG. 1;

FIG. 4 is a schematic structural view of the first mounting groove and the second mounting groove;

FIG. 5 is a schematic view of a DMD and internal thermal pad mounted on a light housing;

FIG. 6 isbase:Sub>A cross-sectional view taken in the direction of FIG. 5A-A;

fig. 7 is an enlarged view of portion B of fig. 6;

FIG. 8 is an exploded view of the thermal platen, external thermal pad, heat sink circuit board and optical chassis;

FIG. 9 is a schematic view of the light source assembly, the prism assembly mounted to the light housing;

fig. 10 is a schematic diagram of the first light-emitting region and the second light-emitting region in the first light source.

In the figure: 1. an optical chassis; 2. DMD; 3. a heat dissipating component; 4. a connecting channel; 5. a light source assembly; 6. a prism assembly;

11. an outer surface of one side of the light housing; 12. installing a positioning column; 13. a first mounting groove; 14. a second mounting groove;

21. a first connection terminal;

31. an inner thermally conductive pad; 32. a heat conducting pressure plate; 33. an outer thermally conductive pad; 34. a heat dissipating circuit board;

51. a first light source; 52. a second light source;

61. a first light splitting sheet; 62. a second dichroic sheet; 63. a fly-eye lens;

121. a second via hole; 122. a first via hole;

141. the bottom of the second mounting groove;

311. a first through groove; 321. a second through groove; 322. a first mounting hole; 323. a first screw; 331. a third through groove;

341. a second mounting hole; 342. a second screw;

511. a first light-emitting region; 512. a second light emitting region; 513. and (3) a light-emitting chip.

Detailed Description

The present invention will be described below based on examples, but the present invention is not limited to only these examples. In the following detailed description of the present invention, certain specific details are set forth in order to avoid obscuring the spirit of the present invention, well-known methods, procedures, flows, and components have not been described in detail.

Further, those of ordinary skill in the art will appreciate that the drawings provided herein are for illustrative purposes and are not necessarily drawn to scale.

Unless the context clearly requires otherwise, throughout the description and the claims, the words "comprise", "comprising", and the like are to be construed in an inclusive sense as opposed to an exclusive or exhaustive sense; that is, what is meant is "including, but not limited to".

In the description of the present invention, it is to be understood that the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. In addition, in the description of the present invention, "a plurality" means two or more unless otherwise specified.

In the present invention, as shown in fig. 3, the side close to the optical housing is "inside" and the side far away from the optical housing is "outside".

Referring to fig. 1-4 and fig. 9, the utility model relates to a small-size projection optical machine, including light casing 1, light source subassembly 5, prism subassembly 6 and radiator unit 3, light source subassembly 5 inlays to be located on the light casing 1, prism subassembly 6 is located in the light casing 1, be equipped with first mounting groove 13 on the light casing 1, the embedded DMD2 that is equipped with of first mounting groove 13. The light source assembly 5 can emit red, green and blue light, and the three-color light irradiates on the DMD2 through the prism assembly 6, so that the DMD2 needs to dissipate heat. Radiator unit 3 install in on the light casing 1, just radiator unit 3 includes interior heat conduction pad 31, heat conduction clamp plate 32, outer heat conduction pad 33 and the radiating circuit board 34 of laminating the connection in proper order from inside to outside, interior heat conduction pad 31 the medial surface with DMD 2's lateral surface laminating, with will heat on the DMD2 passes through radiator unit 3 dispels the heat. DMD2 directly contacts heat sink 3, so that the heat of DMD2 can be directly conducted to heat sink 3 and dissipated through heat sink 3.

Specifically, as shown in fig. 3, the inner side surface of the inner heat conducting pad 31 is attached to the outer side surface of the DMD2, so that heat on the DMD2 can be conducted to the inner heat conducting pad 31, the outer side surface of the inner heat conducting pad 31 is attached to the inner side surface of the heat conducting pressing plate 32, so that the heat is conducted to the heat conducting pressing plate 32, the outer side surface of the heat conducting pressing plate 32 is attached to the inner side surface of the outer heat conducting pad 33, so that the heat can be conducted to the outer heat conducting pad 33, the outer side surface of the outer heat conducting pad 33 is attached to the inner side surface of the heat dissipating circuit board 34, and the heat can be conducted to the heat dissipating circuit board 34, because the outer side surface of the heat dissipating circuit board 34 is directly contacted with air, the heat dissipating circuit board 34 can be used for dissipating heat for the DMD2.

Because the heat dissipation circuit board 34 is used for heat dissipation, no heat dissipation fins are needed, and because the inner heat conduction pad 31, the heat conduction pressing plate 32, the outer heat conduction pad 33 and the heat dissipation circuit board 34 are of thin plate structures, the space occupied by the formed heat dissipation assembly 3 is smaller, and compared with a heat dissipation mode through heat dissipation fins, the size of the projection optical machine can be effectively reduced.

It should be noted that, the outer side surface of the DMD2 is attached to the inner side surface of the inner heat conducting pad 31, the inner side surface of the heat conducting pressing plate 32 is attached to the outer side surface of the inner heat conducting pad 31, the inner side surface of the outer heat conducting pad 33 is attached to the outer side surface of the heat conducting pressing plate 32, and the inner side surface of the heat dissipating circuit board 34 is attached to the outer side surface of the outer heat conducting pad 33, which only describes the relationship between the surfaces of the DMD2, the inner heat conducting pad 31, the heat conducting pressing plate 32, the outer heat conducting pad 33, and the heat dissipating circuit board 34, and can be understood as follows: the outer side face of part of the DMD2 is entirely or partially bonded to the inner side face of the inner heat conducting pad 31, the entire or partial inner side face of the heat conducting pressure plate 32 is entirely or partially bonded to the outer side face of the inner heat conducting pad 31, the entire or partial inner side face of the outer heat conducting pad 33 is entirely or partially bonded to the outer side face of the heat conducting pressure plate 32, and the partial inner side face of the heat dissipating circuit board 34 is partially bonded to the entire or partial outer side face of the outer heat conducting pad 33. It is only necessary to ensure that an effective heat dissipation channel is formed between DMD2, inner thermal pad 31, thermal pressure plate 32, outer thermal pad 33 and heat dissipation circuit board 34.

In a preferred embodiment, referring to fig. 4 to 7, the optical housing 1 further includes a second mounting groove 14, the bottom 141 of the first mounting groove 13 penetrating the second mounting groove, the inner thermal pad 31 is disposed at the second mounting groove 14, when the DMD2 is mounted at the first mounting groove 13 and the inner thermal pad 31 is disposed at the second mounting groove 14, the outer side surface of the inner thermal pad 31 protrudes from the notch (shown in fig. 7) of the second mounting groove 14, the outer contour of the thermal pressing plate 32 is larger than the outer contour of the inner thermal pad 31, and the thermal pressing plate 32 presses the inner thermal pad 31 into the second mounting groove 14 from the outside to the inside, so that the outer side surface of the inner thermal pad 31 is flush with the plane where the notch of the second mounting groove 14 is located.

A second mounting groove 14 is arranged on the outer surface 11 of one side of the optical chassis, a first mounting groove 13 is arranged at the groove bottom 141 of the second mounting groove, the dmd2 is arranged at the first mounting groove 13, the inner heat conducting pad 31 is arranged in the groove of the second mounting groove 14, and the outer side surface of the inner heat conducting pad 31 protrudes out of the groove opening of the second mounting groove 14, namely the outer side surface of the inner heat conducting pad 31 protrudes out of the corresponding outer surface of the optical chassis 1; at this moment, the heat conduction pressing plate 32 is fixed with the optical chassis 1 from the outside to the inside, the inner side surface of the heat conduction pressing plate 32 is attached to the outer side surface of the inner heat conduction pad 31, the heat conduction pressing plate 32 continues to move towards one side of the optical chassis 1, therefore, the heat conduction pressing plate 32 can extrude the inner heat conduction pad 31, the inner heat conduction pad 31 deforms in the inside and outside direction, until the inner side surface of the heat conduction pressing plate 32 is attached to the outer surface corresponding to the optical chassis 1, correspondingly, the outer side surface of the inner heat conduction pad 31 is flush with the outer surface corresponding to the optical chassis 1, and the inner heat conduction pad 31 is completely located in the first installation groove 13 at this moment. Because interior heat conduction pad 31 takes place to warp in the inside and outside direction, therefore the medial surface of interior heat conduction pad 31 can extrude the lateral surface of DMD2, the medial surface of interior heat conduction pad 31 can extrude the medial surface of heat conduction clamp plate 32 to ensure the inseparable degree of interior heat conduction pad 31 and the laminating of DMD2 and the inseparable degree of interior heat conduction pad 31 and heat conduction clamp plate 32, guarantee that the heat on DMD2 can be smoothly, high-efficiently conduct to heat conduction clamp plate 32 on through interior heat conduction pad 31. Of course, the heat dissipating circuit board 34 may also press the outer thermal pad 33 from the outside to the inside, so that the outer thermal pad 33 is also deformed to some extent in the inside and outside directions, thereby finally ensuring that the heat on the DMD2 can be efficiently conducted to the heat dissipating circuit board 34, and the heat is dissipated through the heat dissipating circuit board 34.

It can be understood that, the heat-conducting pressure plate 32 is usually made of metal (such as 5052 aluminum plate, copper plate, etc.), the heat conductivity of the heat-conducting pressure plate 32 should be higher than 100W/(m · K), so as to ensure the heat-conducting performance of the heat-conducting pressure plate 32 and ensure that it has sufficient rigidity; in contrast, the outer thermal pad 33 is an insulating thermal pad, which prevents short circuit between solder joints of components on the inner side of the heat-dissipating circuit board 34.

The outer contour of the heat conducting pressing plate 32 is larger than the outer contour of the inner heat conducting pad 31, so that the heat conducting pressing plate 32 at the peripheral part of the inner heat conducting pad 31 can only be attached to the outer surface of the optical chassis 1 at most in the process of connecting the heat conducting pressing plate 32 with the optical chassis 1, thereby determining the maximum deformation of the inner heat conducting pad 31.

In a preferred embodiment, referring to fig. 8, four corners of the inner thermal pad 31 are respectively provided with a first mounting hole 322, and a first screw 323 passes through the first mounting hole 322 to fix the thermal pressure plate 32 to the optical housing 1. The heat-conducting pressure plate 32 is pressed on the outer side surface of the inner heat-conducting pad 31 more uniformly, and the stress at each position between the heat-conducting pressure plate 32 and the inner heat-conducting pad 31 is ensured to be more uniform; in addition, the four corners of the heat conduction pressure plate 32 are connected with the optical machine casing 1, so that the warping phenomenon at the later stage of the edge of the heat conduction pressure plate 32 can be prevented, and the long-term effectiveness of the bonding between the heat conduction pressure plate 32 and the inner heat conduction pad 31 is ensured.

In a preferred embodiment, referring to fig. 3 and 8, a second mounting hole 341 is disposed on the heat dissipation circuit board 34, a first via hole 122 is disposed on the outer heat conduction pad 33, a second via hole 121 is disposed on the heat conduction pressing plate 32, an installation positioning column 12 is disposed on the optical chassis 1, the installation positioning column 12 passes through the second via hole 121 and the first via hole 122, an end surface of the installation positioning column 12 abuts against an inner side surface of the heat dissipation circuit board 34, and a second screw 342 passes through the second mounting hole 341 and is connected to the installation positioning column 12, so that the heat dissipation circuit board 34 is fixedly connected to the optical chassis 1.

The heat-conducting pressing plate 32 is sleeved on the mounting positioning column 12 through the second through hole 121, the outer heat-conducting pad 33 is sleeved on the mounting positioning column 12 through the first through hole 122, so that the heat-conducting pressing plate 32 and the outer heat-conducting pad 33 can be relatively accurately positioned and mounted on the optical housing 1, the second screw 342 can be connected with the internal thread on the mounting positioning column 12, and the head of the second screw 342 presses the heat-dissipating circuit board 34 inwards, so that the heat-dissipating circuit board 34 presses the outer heat-conducting pad 33 inwards, thereby ensuring that the inner side surface of the outer heat-conducting pad 33 is attached to the outer side surface of the heat-conducting pressing plate 32, the outer side surface of the outer heat-conducting pad 33 is attached to the inner side surface of the heat-dissipating circuit board 34, further ensuring that the heat on the heat-conducting pressing plate 32 can be smoothly conducted to the heat-dissipating circuit board 34, and the heat can be dissipated through the heat-dissipating circuit board 34.

It can be understood that, in order to ensure that the outer thermal pad 33 is deformed by the heat dissipating circuit board 34 in the inward and outward directions, the sum of the thickness of the outer thermal pad 33 and the thickness of the thermal conductive pressing plate 32 should be larger than the length (in the inward and outward directions) of the mounting positioning post 12 in a natural state (when the heat dissipating circuit board 34 is not mounted).

In a preferred embodiment, the number of the mounting location pillars 12 is two, and the cross sections of the two mounting location pillars 12 are different. Because the number of the installation positioning columns 12 is two, correspondingly, the number of the first through holes 122 and the number of the second through holes 121 are two, the shapes of the two first through holes 122 correspond to the shapes of the cross sections of the two installation positioning columns 12 respectively, and the shapes of the two second through holes 121 also correspond to the shapes of the cross sections of the two installation positioning columns 12 respectively, the two first through holes 122 can only be respectively matched with the corresponding installation positioning columns 12, so that the heat conduction pressing plate 32 can only be matched with the installation positioning columns 12 in a unique mode, and similarly, the outer heat conduction pad 33 can only be matched with the installation positioning columns 12 in a unique mode, and the situation that the heat conduction pressing plate 32 and the outer heat conduction pad 33 are assembled wrongly when matched with the installation positioning columns 12 is prevented.

In a preferred embodiment, referring to fig. 3, a first through groove 311 is formed in a middle portion of the inner heat conducting pad 31, a second through groove 321 is formed in a middle portion of the heat conducting pressing plate 32, a third through groove 331 is formed in a middle portion of the outer heat conducting pad 33, the first through groove 311, the second through groove 321, and the third through groove 331 are partially overlapped in an inner and outer direction, the overlapped portion forms a connecting channel 4, a first connecting terminal 21 is disposed on an outer side surface of the DMD2, a second connecting terminal (not shown) is disposed on an inner side surface of the heat dissipating circuit board 34, and the first connecting terminal 21 and the second connecting terminal are inserted through the connecting channel 4.

The connection channel 4 is reserved among the inner heat conduction pad 31, the heat conduction pressing plate 32 and the outer heat conduction pad 33, so that when the heat dissipation circuit board 34 is connected with the optical machine shell 1, the second connection terminal on the inner side surface of the heat dissipation circuit board 34 extends into the connection channel 4 and is connected with the first connection terminal 21 on the outer side surface of the DMD2 in the connection channel 4 in an inserting mode. The connection of the first connection terminal 21 and the second connection terminal can be simultaneously achieved during the process of assembling the heat dissipation circuit board 34.

In a preferred embodiment, referring to fig. 9, the light source assembly 5 includes a first light source 51 and a second light source 52, the first light source 51 can emit light of a first color and a second color of light of three colors, the second light source 52 can emit light of a third color of light of the three colors, the colors of the light of the first color, the light of the second color and the light of the third color are different from each other, the prism assembly 6 includes a first light splitter 61, a second light splitter 62 and a fly eye lens 63, the second light source 52 is disposed opposite to the fly eye lens 63, the first light splitter 61 and the second light splitter 62 are disposed between the second light source 52 and the fly eye lens 63, the light of the third color passes through the first light splitter 61 and the second light splitter 62 to the fly eye lens 63, the first light source 51 is disposed at a side of the light of the third color between the second light source 52 and the fly eye lens 63, the first light splitter 61 and the second light splitter 62 are disposed opposite to the fly eye lens 63, the first light splitter 61 and the light of the second light splitter 62 is obliquely reflected toward the fly eye lens 63 through the first light splitter 62, and the fly eye lens 62.

The light source assembly 5 typically comprises three separate light sources, each having a respective light emitting chip, such as: the red light source emits red light, the green light source emits green light, and the blue light source emits blue light.

The utility model discloses only have two independent light sources, compare current three independent light source, the utility model discloses the quantity of light source is still less, therefore the size of projection ray apparatus also can be littleer.

To form a projection image, three color lights (red light, green light, and blue light) are irradiated onto the inner surface of the DMD2, and the projection image is formed by reflection by the DMD2. As can be seen from the above process, to form a projection image, the light source assembly 5 needs to be able to project three colors of light, and the light source assembly 5 of the present invention only includes the first light source 51 and the second light source 52, and thus three colors of light need to be emitted by the first light source 51 and the second light source 52. Specifically, the first light source 51 can emit light of a first color and light of a second color, and the second light source 52 can emit light of a third color, thereby achieving the purpose of emitting light of three colors only by the first light source 51 and the second light source 52. Due to the position difference between the first light source 51 and the second light source 52, the first light splitter 61 and the second light splitter 62 are disposed, so that the light beam formed by the light of the first color, the light beam formed by the light of the second color, and the light beam formed by the light of the third color can all irradiate substantially the same region of the fly eye lens 63. Specifically, the second light source 52 and the fly eye lens 63 are arranged oppositely, and the third color light emitted by the second light source 52 can directly pass through the first light splitter 61 and the second light splitter 62 to the fly eye lens 63; the first color light emitted from the first light source 51 is emitted to the first light splitter 61, the first light splitter 61 can reflect the first color light and emit the first color light to the fly eye lens 63, the second color light is emitted to the second light splitter 62 and emitted to the fly eye lens 63 by being reflected by the second light splitter 62, and thus the first color light, the second color light and the third color light can be emitted to a designated area of the fly eye lens 63. Specifically, the placing angles of the first light splitter 61 and the second light splitter 62 can be adjusted, so that the light beam formed by the light ray of the first color, the light beam formed by the light ray of the second color, and the light beam formed by the light ray of the third color can all irradiate to the same area of the fly eye lens 63.

Referring to fig. 10, each of the first light source 51 and the second light source 52 includes a light emitting chip, the light emitting chip 513 of the first light source 51 is capable of emitting light of a first color and light of a second color, the light emitting chip 513 of the second light source 52 is capable of emitting light of a third color, the light emitting chip 513 of the first light source 51 includes a first light emitting region 511 and a second light emitting region 512 arranged side by side, when the first light emitting region 511 is lit, the first light emitting region 511 emits light of the first color, and similarly, when the second light emitting region 512 is lit, the second light emitting region 512 emits light of the second color, the first light emitting region 511 is farther away from the fly eye lens 63 than the second light emitting region 512, so that an angle between the first light splitter 61 and the second light splitter 62 is different, and an angle between the first light splitter 61 and the reference direction is set to be a reference direction (i.e., a direction in which the second light source 52 is opposite to the fly eye lens 63), and an angle between the first light splitter 61 and the reference direction is smaller than an angle between the second light splitter 62 and the reference direction, so that light beams formed by the light beams of the first color and the second light beams 63 are substantially the same as the light beams irradiated in the fly eye lens.

In a preferred embodiment, the first light splitter 61 is closer to the first light source 51 than the second light splitter 62. The second light emitting region 512 emits a second color light, and the second color light passes through the first light splitting sheet 61 to the second light splitting sheet 62, is reflected by the second light splitting sheet 62, and then passes through the first wind-light sheet again to the fly eye lens 63.

It is understood that the first color light, the second color light and the third color light are all one of red light, green light or blue light, and the colors of the first color light, the second color light and the third color light are different. For example: the first color light is red light, the second color light is green light, and the third color light is blue light; or, the first color light is red light, the second color light is blue light, the third color light is green light, and the like.

In other alternative embodiments, the fly-eye lens 63 may be replaced with an integrator rod.

In a preferred embodiment, the power rating of the light source assembly 5 is not more than 5W. Therefore, the light source module 5 of the small projection light machine has a low light emission amount, and the light flux of the actual projection picture of the small projection light machine does not exceed 80lm, so that the heat dissipation module 3 on the small projection light machine can completely meet the heat dissipation requirement of the DMD2.

It will be understood that the above-described embodiments are illustrative only and not restrictive, and that various obvious and equivalent modifications and substitutions may be made in the details described herein by those skilled in the art without departing from the basic principles of the invention.

Claims

1. The utility model provides a small-size projection optical machine, its characterized in that includes light casing (1), light source subassembly (5), prism subassembly (6) and radiator unit (3), light source subassembly (5) inlay and locate on light casing (1), prism subassembly (6) are located in the light casing (1), be equipped with first mounting groove (13) on light casing (1), the embedded DMD (2) that is equipped with in first mounting groove (13), radiator unit (3) install in on light casing (1), just radiator unit (3) are including interior heat conduction pad (31), heat-conducting pressure plate (32), outer heat conduction pad (33) and radiating circuit board (34) that laminate the connection from inside to outside in proper order, the medial surface of interior heat conduction pad (31) with the lateral surface laminating of DMD (2), with will heat on DMD (2) passes through radiator unit (3) dispel the heat.

2. The compact optical projector as claimed in claim 1, wherein a second mounting groove (14) is further formed on the optical housing (1), the bottom (141) of the first mounting groove (13) penetrating the second mounting groove, the inner thermal pad (31) is disposed at the second mounting groove (14), when the DMD (2) is embedded at the first mounting groove (13) and the inner thermal pad (31) is disposed at the second mounting groove (14), the outer side of the inner thermal pad (31) protrudes from the notch of the second mounting groove (14), the outer profile of the thermal pad (32) is larger than the outer profile of the inner thermal pad (31), and the thermal pad (32) presses the inner thermal pad (31) into the second mounting groove (14) from the outside to the inside, so that the outer side of the inner thermal pad (31) is flush with the plane of the notch of the second mounting groove (14).

3. The compact projection engine according to claim 2, wherein the inner thermal pad (31) has a first mounting hole (322) at each of four corners, and a first screw (323) passes through the first mounting hole (322) to fix the thermal platen (32) to the optical housing (1).

4. The small-sized projection optical engine according to claim 1, wherein a second mounting hole (341) is formed in the heat dissipation circuit board (34), a first via hole (122) is formed in the outer heat conduction pad (33), a second via hole (121) is formed in the heat conduction pressure plate (32), a mounting positioning post (12) is formed in the optical chassis (1), the mounting positioning post (12) passes through the second via hole (121) and the first via hole (122), an end surface of the mounting positioning post (12) abuts against an inner side surface of the heat dissipation circuit board (34), and a second screw (342) passes through the second mounting hole (341) and is connected to the mounting positioning post (12), so that the heat dissipation circuit board (34) is fixedly connected to the optical chassis (1).

5. The compact projector as defined in claim 4, wherein the number of the mounting posts (12) is two, and the cross-sections of the two mounting posts (12) are different.

6. The compact optical projector as claimed in any one of claims 1 to 5, wherein a first through groove (311) is formed in the middle of the inner heat conducting pad (31), a second through groove (321) is formed in the middle of the heat conducting pressing plate (32), a third through groove (331) is formed in the middle of the outer heat conducting pad (33), the first through groove (311), the second through groove (321) and the third through groove (331) are partially overlapped in the inner and outer directions, the overlapped portion forms a connecting channel (4), a first connecting terminal (21) is disposed on the outer side surface of the DMD (2), a second connecting terminal is disposed on the inner side surface of the heat dissipating circuit board (34), and the first connecting terminal (21) and the second connecting terminal are plugged through the connecting channel (4).

7. The compact light projector as claimed in any one of claims 1 to 5, wherein the light source assembly (5) comprises a first light source (51) and a second light source (52), the first light source (51) is capable of emitting light of a first color and a second color of three colors, the second light source (52) is capable of emitting light of a third color of three colors, the colors of the light of the first color, the light of the second color and the light of the third color are different from each other, the prism assembly (6) comprises a first light splitter (61), a second light splitter (62) and a fly eye lens (63), the second light source (52) is disposed opposite to the fly eye lens (63), the first light splitter (61) and the second light splitter (62) are disposed between the second light source (52) and the fly eye lens (63), the light of the third color passes through the first light splitter (61) and the second light splitter (62) to the fly eye lens (63), the first light source (51) is disposed between the second light source (52) and the fly eye lens (63), the light of the first light splitter (63) is inclined toward the fly eye lens (63), the light of the first light source (61) is inclined toward the side of the first light splitter (63), the second color light is obliquely emitted to the second light splitter (62) and is reflected to the fly eye lens (63) through the second light splitter (62).

8. The compact projector as claimed in claim 7, wherein the first light source (51) comprises a light emitting chip (513), the light emitting chip (513) is disposed with a first light emitting area (511) and a second light emitting area (512) side by side, the first light emitting area (511) can emit light of a first color, the second light emitting area (512) can emit light of a second color, the first light emitting area (511) is farther from the fly-eye lens (63) than the second light emitting area (512), and an angle between the light of the third color and the first light splitting sheet (61) is smaller than an angle between the light of the third color and the second light splitting sheet (62).

9. The compact projection light machine of claim 8, wherein the first light splitter (61) is closer to the first light source (51) than the second light splitter (62).

10. The compact projector as defined in any of claims 1-5 wherein the power rating of said light source module (5) is no greater than 5W.