CN218273069U - DMD packaging heat dissipation structure and projection light machine - Google Patents
DMD packaging heat dissipation structure and projection light machine Download PDFInfo
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- CN218273069U CN218273069U CN202222270991.8U CN202222270991U CN218273069U CN 218273069 U CN218273069 U CN 218273069U CN 202222270991 U CN202222270991 U CN 202222270991U CN 218273069 U CN218273069 U CN 218273069U
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Abstract
The utility model discloses a DMD packaging heat dissipation structure and a projection optical machine, wherein the DMD packaging heat dissipation structure comprises an optical machine shell, a DMD, a heat conduction pad, a heat conduction pressing plate and a circuit board; the DMD is embedded in the accommodating groove on the first side part of the optical machine shell; the heat conducting pressure plate at least comprises a first plate part and a second plate part which are connected at a set angle; the first plate part is parallel to and fixedly connected with the first side part, the second plate part extends to a second side part of the optical machine shell, and the second side part is adjacent to the first side part; the heat conducting pad is arranged on the outer side surface of the DMD and is abutted against the inner side surface of the first plate part to conduct heat transfer; the circuit board is positioned on the outer side of the first plate part, is fixedly connected with the optical machine shell and is electrically connected with the DMD; the projection optical machine comprises a DMD packaging heat dissipation structure. The utility model discloses a structure is compacter, occupation space is little, and the equipment of being convenient for, is favorable to the projection ray apparatus to the development of miniaturized direction.
Description
Technical Field
The utility model belongs to the technical field of the optical projection, especially, relate to a DMD encapsulation heat radiation structure and projection ray apparatus.
Background
The micro-projection technology is a novel modern projection display technology, gradually enters the lives of people by virtue of miniaturization and light weight of the micro-projection technology, is more and more favored by people in the current rapidly-developing information era, and becomes an important development trend of projection display. DLP projection display has characteristics such as high brightness, high contrast and high resolution, combines with novel LED light source, can realize miniaturized portable miniature projection, satisfies people to the personal demand of projection display.
A DMD (Digital micromirror Device) is a core Device of Digital light processing technology (DLP), and mainly realizes a projected image by adjusting reflected light. The light irradiates on the DMD to bring the problem of DMD heat dissipation, the existing heat dissipation mode of the DMD is that a heat dissipation fin directly or indirectly contacts with the back of the DMD, the heat on the DMD is conducted to a heat radiator, the heat is dissipated out through the heat radiator, and the heat radiator has a large surface area, so that the space occupied by the heat dissipation fin is large, and the obstruction is generated on the miniaturization of a projection light machine.
SUMMERY OF THE UTILITY MODEL
Aim at overcoming exist among the above-mentioned prior art not enough, the utility model provides a DMD encapsulation heat radiation structure and projection ray apparatus, the encapsulation heat radiation structure of usable self is direct to go out the heat transfer on the DMD, compact structure, and occupation space is little, is favorable to the projection ray apparatus to the miniaturized direction development.
In order to solve the problems existing in the prior art, an embodiment of the present invention provides a DMD package heat dissipation structure, which includes a housing, a DMD, a heat conducting pad, a heat conducting pressing plate, and a circuit board;
the DMD is embedded in a containing groove on the first side part of the optical machine shell; the heat conducting pressure plate at least comprises a first plate part and a second plate part which are connected at a set angle; the first plate part is parallel to and fixedly connected with the first side part, the second plate part extends to a second side part of the optical machine shell, and the second side part is adjacent to the first side part; the heat conducting pad is arranged on the outer side surface of the DMD and is abutted against the inner side surface of the first plate part to conduct heat transfer;
the circuit board is located the outside of first board with ray apparatus casing fixed connection, and with DMD electric connection.
Further, the second side portion includes a first plane and a second plane protruding outward from the first plane, and an inner side surface of the second plate portion is attached to the first plane.
Further, a plurality of heat dissipation fins are arranged on the outer side surface of the second plate portion at intervals, and the height of each heat dissipation fin is smaller than or equal to the height difference between the first plane and the second plane.
Furthermore, a positioning column, a pressing plate installation positioning column and a circuit board installation positioning column are arranged on the first side part;
the first plate part is provided with a positioning hole matched with the positioning column, a first mounting hole matched with the pressing plate mounting positioning column and a second mounting hole for the circuit board mounting positioning column to extend out, and the circuit board is provided with a third mounting hole corresponding to the circuit board mounting positioning column;
the first threaded connecting piece penetrates through the first mounting hole and is in threaded connection with the pressing plate mounting positioning column; and the second threaded connecting piece penetrates through the third mounting hole to be in threaded connection with the circuit board mounting positioning column.
Further, the first mounting hole is a stepped hole, and the head of the first threaded connecting piece is sunk into the first mounting hole; after the fixing connection, the outer end face of the pressing plate installation positioning column is abutted to the first plate part, and the outer end face of the circuit board installation positioning column is abutted to the circuit board.
Furthermore, a first connecting terminal is arranged on the outer side surface of the DMD, and a second connecting terminal is arranged on the inner side surface of the circuit board; the first plate part is provided with a first avoidance port for exposing the first connecting terminal; with the help of first dodge mouthful first connecting terminal with the second connecting terminal is pegged graft.
Furthermore, a first flexible sealing element is clamped between the first plate portion and the first side portion, and an avoiding window for exposing the first connecting terminal and the heat conducting pad is arranged on the first flexible sealing element.
Further, first board with be provided with the flexible sealing member of second between the circuit board, be equipped with on the flexible sealing member of second with the first second of dodging mouthful looks adaptation dodges the mouth.
Further, the two opposite sides of the first connection terminal are respectively provided with one of the heat conduction pads.
The embodiment of the utility model provides a projection ray apparatus is still provided, include DMD encapsulation heat radiation structure.
Since the technical scheme is used, the utility model discloses the beneficial effect who gains as follows:
the utility model discloses a DMD packaging heat dissipation structure, which comprises a light machine shell, a DMD, a heat conducting pad, a heat conducting pressure plate and a circuit board; the DMD is embedded in the accommodating groove on the first side part of the optical machine shell; the heat conducting pressure plate at least comprises a first plate part and a second plate part which are connected at a set angle; the first plate part is parallel to and fixedly connected with the first side part, the second plate part extends to a second side part of the optical machine shell, and the second side part is adjacent to the first side part; the heat conducting pad is arranged on the outer side surface of the DMD and is abutted against the inner side surface of the first plate part to conduct heat transmission; the circuit board is positioned on the outer side of the first plate part, is fixedly connected with the optical machine shell and is electrically connected with the DMD; the projection light machine comprises a DMD packaging heat dissipation structure.
The utility model can directly utilize the heat conducting pad to transfer the heat generated by the DMD to the first plate part of the heat conducting pressure plate and then lead out the heat from the second plate part extending to the second side part of the optical machine shell, thereby realizing high-efficiency heat dissipation; compared with the existing heat dissipation mode by adopting a large-size DMD radiator; the utility model discloses a structure is compacter, occupation space is little, and the equipment of being convenient for is favorable to the projection ray apparatus to the development of miniaturized direction.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required to be used in the embodiments will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic view of a projection apparatus according to the present invention;
FIG. 2 is an exploded view of the heat sink structure of the DMD package of FIG. 1;
FIG. 3 is an enlarged view of the heat sink structure of the DMD package of FIG. 1 without the circuit board;
FIG. 4 is a top view of FIG. 1;
FIG. 5 is a sectional view of the structure at A _ A in FIG. 4;
FIG. 6 is a side view of FIG. 1;
FIG. 7 is a sectional view of the structure at B _ B in FIG. 6;
in the figure: 1-optical engine housing, 11-first side, 111-receiving groove, 112-positioning column, 113-pressing plate mounting positioning column, 114-circuit board mounting positioning column, 12-second side, 121-first plane, 122-second plane, 2-DMD, 21-first connecting terminal, 3-heat conducting pad, 4-heat conducting pressing plate, 41-first plate, 411-first positioning hole, 412-first mounting hole, 413-second mounting hole, 414-first avoiding opening, 42-second plate, 43-heat radiating fin, 5-circuit board, 51-third mounting hole, 52-second connecting terminal, 6-first threaded connector, 7-second threaded connector, 8-first flexible sealing element, 81-avoiding window, 82-avoiding hole, 83-second positioning hole, 84-avoiding notch, 9-second flexible sealing element, 91-second avoiding opening.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention will be further described in detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the invention.
As shown in fig. 1 to 7, the present embodiment discloses a DMD package heat dissipation structure, which includes a light engine housing 1, a DMD 2, a thermal pad 3, a thermal conductive platen 4, and a circuit board 5. Wherein, DMD 2 is embedded in the receiving groove 111 on the first side portion 11 of the optical machine housing 1; the heat-conductive pressure plate 4 includes at least a first plate portion 41 and a second plate portion 42 connected at a set angle (90 degrees as shown in the drawing); the first plate portion 41 is parallel to and fixedly connected with the first side portion 11, the second plate portion 42 extends to the second side portion 12 of the optical housing 1, and the second side portion 12 is adjacent to the first side portion 11 (the second side portion 12 is an upper side portion in the figure); the thermal pad 3 is provided on the outer side surface of the DMD 2 and abuts against the inner side surface of the first plate portion 41 to perform heat transfer; the circuit board 5 is located outside the first board portion 41 and is fixedly connected to the optical machine housing 1, and is electrically connected to the DMD 2.
The heat generated by the DMD 2 is directly conducted to the top of the optical machine shell 1 (the components on the part are loosely mounted, so that heat dissipation is facilitated) by directly utilizing the heat conducting pad 3 and the heat conducting pressing plate 4 without directly or indirectly connecting a traditional radiator on the outer side of the circuit board 5, and the heat dissipation effect is good; the structure can be simplified, the occupied space can be reduced, and the LED lamp can be suitable for light sources with higher lumens.
In this embodiment, the second side portion 12 includes a first plane 121 and a second plane 122 protruding outward from the first plane 121 (i.e., the second plane 122 is higher than the first plane 121), and the inner side surface of the second plate portion 42 is attached to the first plane 121; preferably, a plurality of heat dissipation fins 43 are provided at intervals on the outer side surface of the second plate portion 42, and the height of the heat dissipation fins 43 is smaller than or equal to the height difference between the first plane 121 and the second plane 122. The present embodiment reasonably utilizes the height difference between the first plane 121 and the second plane 122, so that the arrangement of the heat dissipation fins 43 with a certain height will not increase the occupied space and further improve the heat dissipation effect.
In this embodiment, the fixed connection manner of the first plate portion 41, the circuit board 5 and the first side portion 11 of the optical mechanical housing 1 is specifically as follows: a positioning column 112, a pressing plate mounting positioning column 113 and a circuit board mounting positioning column 114 are arranged on the first side portion 11 at the periphery of the accommodating groove 111; the first plate part 41 is provided with a positioning hole (marked as a first positioning hole 411) matched with the positioning column 112, a first mounting hole 412 matched with the pressing plate mounting positioning column 113 and a second mounting hole 413 extending from the circuit board mounting positioning column 114, and the circuit board 5 is provided with a third mounting hole 51 corresponding to the circuit board mounting positioning column 114; the first threaded connector 6 passes through the first mounting hole 412 and is in threaded connection with the pressing plate mounting positioning column 113; the second screw connector 7 passes through the third mounting hole 51 to be in screw connection with the circuit board mounting positioning column 114.
Two positioning columns 112 are arranged at intervals along the horizontal direction and are located on two sides of the accommodating groove 111; the two pressing plate mounting positioning columns 113 are arranged around two corners of the accommodating groove 111 in an opposite angle manner; two circuit board mounting positioning columns 114 are arranged around the other two corners of the accommodating groove 111 in an opposite angle manner; the arrangement can improve the stability and the reliability after packaging. In addition, the positions and the number of the positioning columns 112, the press plate mounting positioning columns 113 and the circuit board mounting positioning columns 114 can be adjusted as required as long as the circuit board 5 and the first plate portion 41 can be fixedly connected with the optical-mechanical housing 1 without interference.
In order to prevent the first threaded connector 6 from interfering with the installation of the circuit board 5, the present embodiment optimizes the above structure, the optimized first mounting hole 412 is a stepped hole, and the head of the first threaded connector 6 sinks into the first mounting hole 412. After the fixed connection, the outer end surfaces of the pressing plate mounting positioning posts 113 abut against the first plate portion 41, and the outer end surfaces of the circuit board mounting positioning posts 114 abut against the circuit board 5.
In this embodiment, the specific implementation manner of electrically connecting the DMD 2 and the circuit board 5 is as follows: a first connection terminal 21 is arranged on the outer side surface of DMD 2, and a second connection terminal 52 is arranged on the inner side surface of circuit board 5; the first plate portion 41 is provided with a first escape opening 414 through which the first connection terminal 21 is exposed; the first connection terminal 21 is plugged into the second connection terminal 52 through the first avoiding opening 414. In some other embodiments, DMD 2 and circuit board 5 are electrically connected by contact; in some embodiments, the DMD 2 and the circuit board 5 are electrically connected through an FPC circuit board; the electrical connection can be achieved in many ways, which are not listed here.
In this embodiment, it is preferable that one heat conduction pad 3 is disposed on each of the upper and lower opposite sides of the first connection terminal 21; the thermal pad 3 is made of silicone grease material or other thermally conductive material.
In this embodiment, the structure is further improved, the first flexible sealing member 8 is interposed between the first plate portion 41 and the first side portion 11, and the escape window 81 through which the first connection terminal 21 and the thermal pad 3 are exposed is provided in the first flexible sealing member 8. First flexible sealing member 8 prevents dust and impurities from entering external surfaces of DMD 2 and first connection terminal 21 to affect usability.
In order to facilitate assembly and prevent interference during assembly, in this embodiment, the first flexible sealing element 8 is provided with a second positioning hole 83, two avoidance holes 82 and an avoidance notch 84, which are adapted to the positioning column 112; the two avoiding holes 82 are respectively used for avoiding one circuit board installation positioning column 114 and one pressing plate installation positioning column 113, the avoiding notch 84 is used for avoiding the other pressing plate installation positioning column 113, and the other circuit board installation positioning column 114 is located outside the coverage range of the first flexible sealing element 8. Preferably, the first flexible sealing member 8 is bonded to the opto-mechanical housing 1 or the first plate portion 41.
In some embodiments, the surface area of the first flexible sealing element 8 is designed to be small, and the first flexible sealing element can just completely or partially avoid the circuit board mounting positioning column 114, the pressing plate mounting positioning column 113 and the positioning column 112, and at this time, whether the second positioning hole 83, the avoiding hole 82 or the avoiding notch 84 is arranged can be flexibly selected according to needs; the first flexible sealing member 8 is not limited to this, as long as the first plate portion 41, the circuit board 5 and the optical housing 1 are not affected by the arrangement of the first flexible sealing member.
In this embodiment, the structure is further improved, a second flexible sealing member 9 is disposed between the first plate portion 41 and the circuit board 5, and a second avoiding opening 91 (avoiding the second connection terminal 52) adapted to the first avoiding opening 414 is disposed on the second flexible sealing member 9. Preferably, the second flexible seal 9 is bonded to the first plate portion 41. The second flexible sealing member 9 can prevent dust and impurities from entering the connection portion between the first connection terminal 21 and the second connection terminal 52 to affect the use performance.
In this embodiment, the first flexible sealing element 8 and the second flexible sealing element 9 are made of a flexible material that is resistant to high temperature and not prone to aging, such as silicone rubber and foam.
The present embodiment further discloses a projection light machine, which includes a light source module, a lens assembly, an imaging module, etc. in addition to the DMD package heat dissipation structure disclosed above, and these components are all known components, which are not listed here. The typical value of the luminous flux of the projection light machine in the present embodiment is not more than 160lm or more.
The utility model can directly utilize the heat conducting pad 3 to transfer the heat generated by the DMD 2 to the first plate part 41 of the heat conducting pressure plate 4 and then lead out the heat from the second plate part 42 extending to the second side part 12 of the optical housing 1, thereby realizing high-efficiency heat dissipation; compared with the existing heat dissipation mode by adopting a large-size DMD radiator; the utility model discloses a structure is compacter, occupation space is little, and the equipment of being convenient for, is favorable to the projection ray apparatus to the development of miniaturized direction.
The above description is only exemplary of the present invention and should not be taken as limiting the scope of the present invention, as any modifications, equivalents, improvements and the like made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.
Claims (10)
1. A DMD packaging heat dissipation structure is characterized by comprising a light machine shell, a DMD, a heat conduction pad, a heat conduction pressing plate and a circuit board;
the DMD is embedded in a containing groove on the first side part of the optical machine shell; the heat-conducting pressure plate at least comprises a first plate part and a second plate part which are connected at a set angle; the first plate part is parallel to and fixedly connected with the first side part, the second plate part extends to a second side part of the optical machine shell, and the second side part is adjacent to the first side part; the heat conducting pad is arranged on the outer side surface of the DMD and is abutted against the inner side surface of the first plate part so as to conduct heat transfer;
the circuit board is located the outside of first board with ray apparatus casing fixed connection, and with DMD electric connection.
2. The DMD package heat sink structure of claim 1, wherein the second side portion comprises a first plane and a second plane protruding outward from the first plane, and an inner side surface of the second plate portion is attached to the first plane.
3. The DMD package heat dissipation structure of claim 2, wherein a plurality of heat dissipation fins are spaced apart from the outer side surface of the second plate, and the height of the heat dissipation fins is less than or equal to the height difference between the first plane and the second plane.
4. The DMD package heat dissipation structure of claim 1, wherein the first side portion has a positioning post, a press plate mounting positioning post and a circuit board mounting positioning post;
the first plate part is provided with a positioning hole matched with the positioning column, a first mounting hole matched with the pressing plate mounting positioning column and a second mounting hole for the circuit board mounting positioning column to extend out, and the circuit board is provided with a third mounting hole corresponding to the circuit board mounting positioning column;
the first threaded connecting piece penetrates through the first mounting hole and is in threaded connection with the pressing plate mounting positioning column; and the second threaded connecting piece penetrates through the third mounting hole to be in threaded connection with the circuit board mounting positioning column.
5. The DMD package heat sink structure of claim 4, wherein the first mounting hole is a stepped hole, and a head of the first threaded connector is sunk into the first mounting hole; after the fixing connection, the outer end face of the pressing plate installation positioning column is abutted to the first plate part, and the outer end face of the circuit board installation positioning column is abutted to the circuit board.
6. The DMD package heat dissipation structure of any of claims 1 to 5, wherein an outer side of the DMD is provided with a first connection terminal, and an inner side of the circuit board is provided with a second connection terminal; the first plate part is provided with a first avoidance port for exposing the first connecting terminal; with the help of first dodge mouthful first connecting terminal with the second connecting terminal is pegged graft.
7. The DMD package heat dissipation structure of claim 6, wherein a first flexible sealing element is interposed between the first plate portion and the first side portion, and an avoiding window for exposing the first connection terminal and the thermal pad is disposed on the first flexible sealing element.
8. The DMD package heat dissipation structure of claim 7, wherein a second flexible sealing element is disposed between the first plate and the circuit board, and a second avoiding opening adapted to the first avoiding opening is disposed on the second flexible sealing element.
9. The DMD package heat sink structure of claim 6, wherein the first connecting terminal has one of the thermal pads on each of two opposite sides.
10. A projection optical machine, comprising the DMD package heat dissipation structure of any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222270991.8U CN218273069U (en) | 2022-08-26 | 2022-08-26 | DMD packaging heat dissipation structure and projection light machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222270991.8U CN218273069U (en) | 2022-08-26 | 2022-08-26 | DMD packaging heat dissipation structure and projection light machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218273069U true CN218273069U (en) | 2023-01-10 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222270991.8U Active CN218273069U (en) | 2022-08-26 | 2022-08-26 | DMD packaging heat dissipation structure and projection light machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218273069U (en) |
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2022
- 2022-08-26 CN CN202222270991.8U patent/CN218273069U/en active Active
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