CN114578640A

CN114578640A - Laser projection device

Info

Publication number: CN114578640A
Application number: CN202210346829.1A
Authority: CN
Inventors: 逄相来; 石龙飞; 刘亚立
Original assignee: Qingdao Hisense Laser Display Co Ltd
Current assignee: Qingdao Hisense Laser Display Co Ltd
Priority date: 2022-03-31
Filing date: 2022-03-31
Publication date: 2022-06-03
Also published as: CN116107145A

Abstract

The invention discloses laser projection equipment which is used for solving the problem that the packaging volume of a laser in the existing laser light source is large. The laser projection equipment comprises a laser light source and a main board; the laser light source comprises a shell and at least one laser, and the at least one laser is arranged on the shell; wherein, the laser instrument includes: a first circuit board having a first surface; the plurality of light-emitting chips are arranged on the first surface and are electrically connected with the first circuit board; the conductive part is at least partially arranged on the first surface and is electrically connected with the first circuit board; the conductive part is used for electrically connecting the first circuit board with the mainboard. According to the laser projection equipment provided by the invention, the conductive part is not required to be fixed by arranging the side plate surrounding the whole periphery of the first circuit board, so that the whole volume of the laser is smaller, the volume of the whole laser light source is smaller, and the volume of the whole laser projection equipment is smaller.

Description

Laser projection device

Technical Field

The invention relates to the technical field of projection equipment, in particular to laser projection equipment.

Background

The laser projection display technology is an optical display technology which adopts a semiconductor laser to convert electric energy into light energy and projects the laser onto a screen through a light path system, a circuit system and a lens system.

Fig. 1 is an assembly diagram of a laser light source of the prior art, and fig. 4a and 4b are structural diagrams of a laser of the prior art. As shown in fig. 4a and 4b, the MCL laser 2a used in the laser light source 100a is a full-volume package, and as shown in fig. 4a and 4b, the MCL laser 2a includes a substrate 201a and a side plate 202a disposed circumferentially around the substrate 201 a. The substrate 201a may be provided with light emitting chips 203a as light sources, for example, four rows of light emitting chips 203a are provided on the substrate 201a of the MCL laser 2a, two ends of each row of light emitting chips 203a respectively extend out of a pin 204a for transmitting signals to make the light emitting chips 203a emit light, the pins 204a are fixed on the side plate 202a of the MCL laser 2a, one end of the pin 204a is located in a space enclosed by the side plate 202a and the substrate 201a and electrically connected to a lead of the light emitting chip 203a, and the other end extends out of the side plate 204 a. The pin 204a is used for connecting with the adapting circuit board 1a to conduct the MCL laser 2a and the adapting circuit board 1a, so that the light emitting chip 203a of the MCL laser 2a emits light. When the laser light source 100a is assembled, as shown in fig. 1, one through circuit board 1a is disposed on each of the left and right sides of the MCL laser 2a, and two through circuit boards 1a are vertically connected to both sides of the MCL laser 2a in a package manner. By such a packaging manner, the volume of the laser light source 100a is larger, and further the volume of the entire laser projection apparatus 200 is larger.

Disclosure of Invention

The invention aims to provide laser projection equipment which is used for solving the problem that the packaging volume of a laser in the existing laser light source is large.

In order to achieve the purpose, the invention provides the following technical scheme:

some embodiments of the present invention provide a laser projection apparatus, including a laser light source and a main board; the laser light source comprises a shell and at least one laser, and the at least one laser is arranged on the shell; the laser comprises a first circuit board, a plurality of light emitting chips and a conductive part. The first circuit board has a first surface. The plurality of light emitting chips are arranged on the first surface and electrically connected with the first circuit board. At least a portion of a conductive portion is disposed on the first surface, the conductive portion being electrically connected to the first circuit board; the conductive part is used for electrically connecting the first circuit board with the mainboard.

In some embodiments, the laser light source further comprises: the second circuit board is provided with a first mounting hole, and the at least one laser is positioned in the first mounting hole; the second circuit board has a second surface; the second surface is flush with the first surface of the first circuit board; the second circuit board is used for being electrically connected with the mainboard. The conductive part includes: one end of each metal elastic sheet is arranged on the first surface of the first circuit board and electrically connected with the first circuit board, and the other end of each metal elastic sheet is arranged on the second surface and electrically connected with the second circuit board.

In some embodiments, the first circuit board has a plurality of first pads on a first surface thereof and the second circuit board has a plurality of second pads on a second surface thereof; the second circuit board is provided with a plurality of second mounting holes, and one second mounting hole penetrates one second bonding pad. The metal elastic sheet comprises a main body part, a first connecting part and a second connecting part. The body portion has opposite first and second ends. One end of the first connecting portion is connected with the first end, and the other end of the first connecting portion is welded with the first bonding pad. One end of the second connecting part is connected with the second end, and the other end of the second connecting part is matched with one second mounting hole and welded with the second bonding pad.

In some embodiments, the second mounting hole is a through hole penetrating the second circuit board. The metal shrapnel further comprises: and the limiting bulge is arranged on the second connecting part and is abutted against the second surface.

In some embodiments, the first circuit board has a plurality of first pads on a first surface thereof and the second circuit board has a plurality of second pads on a second surface thereof. The metal elastic sheet comprises a main body part and two third connecting parts. The main body part is connected with the shell. The two third connecting parts are respectively connected with two ends of the main body part and are positioned on the same side of the main body part; the two third connecting parts are respectively abutted against one first bonding pad and one second bonding pad.

In some embodiments, the conductive portion comprises: the conductive socket is arranged on the first surface and is electrically connected with the first circuit board; the conductive socket is used for being electrically connected with the mainboard through a wire.

In some embodiments, the plurality of first pads on the first circuit board are located on the same side of the plurality of light emitting chips. The at least one laser includes a first laser and a second laser. The first circuit board of the first laser is abutted against the first circuit board of the second laser, and the first surface of the first laser is coplanar with the first surface of the second laser.

In some embodiments, the housing is provided with a third mounting hole and a fourth mounting hole, and an inner side wall of the third mounting hole is arranged around the plurality of light emitting chips of the first laser; the inner side wall of the fourth mounting hole is arranged around the plurality of light emitting chips of the second laser in a circle. The laser light source further includes: the sealing element is provided with a first through hole and a second through hole, the inner side wall of the first through hole is arranged around the plurality of light emitting chips of the first laser in a circle, and the inner side wall of the second through hole is arranged around the plurality of light emitting chips of the second laser in a circle; the sealing element is positioned between the shell and the first circuit board and is abutted against the shell and the first circuit board.

In some embodiments, the housing has a first carrier portion and a second carrier portion, the at least one laser being mounted on the first carrier portion by a fastener; the second bearing part is arranged along the peripheral side of the first bearing part, and the second circuit board is installed on the second bearing part through a fastener.

In some embodiments, the first bearing portion has a plurality of first threaded holes formed therein. And the first circuit board is provided with a plurality of fifth mounting holes and a plurality of positioning holes. The laser light source further comprises a plurality of connecting pieces and a plurality of positioning columns. And the connecting piece penetrates through a fifth mounting hole and is screwed with the first threaded hole. The positioning columns are arranged on the shell, and one positioning column is matched with one positioning hole.

In some embodiments, the laser light source further comprises: the radiator is connected with the shell, the radiator is attached to the third surface of the first circuit board, and the third surface and the first surface are arranged oppositely.

In some embodiments, the laser light source further comprises: and the sound absorbing pieces are stacked on two sides of the second circuit board.

The laser projection equipment provided by the invention has the following beneficial effects:

according to the laser projection device provided by the invention, the plurality of light-emitting chips are arranged on the first surface of the first circuit board and are electrically connected with the first circuit board, and at least one part of the conductive part is arranged on the first surface of the first circuit board and is electrically connected with the first circuit board, so that the light-emitting chips and the conductive part can be electrically connected through the circuit layer on the first circuit board, the light-emitting chips can be electrically connected with the main board of the laser projection device through the conductive part, and therefore, the light-emitting chips can receive the control signal of the main board to emit light beams. Therefore, it is not necessary to provide a side plate around the entire circumference of the first circuit board to fix the conductive portion, so that the entire volume of the laser is small. The at least one laser is arranged on the shell of the laser light source, so that the volume of the whole laser light source is smaller, the volume of the whole laser projection equipment is smaller, and the portability of the whole laser projection equipment is improved.

In addition, the conductive part can be connected to the first circuit board through a patch welding mode and the like, so that the laser can be assembled on the shell easily and disassembled from the shell easily, and maintenance and replacement are facilitated.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

FIG. 1 is an assembled view of a laser light source according to the prior art;

FIG. 2 is a schematic diagram of a laser projection device according to some embodiments of the present invention in use;

FIG. 3 is a schematic external view of a laser projection device according to some embodiments of the present invention;

FIG. 4a is a schematic diagram of a laser according to the prior art;

FIG. 4b is a schematic diagram of another prior art laser configuration;

FIG. 5 is a schematic diagram of a portion of a laser light source according to some embodiments of the present invention;

FIG. 6 is an exploded view of a laser light source according to some embodiments of the present invention;

FIG. 7 is a schematic structural view of a housing according to some embodiments of the present invention;

FIG. 8 is a schematic diagram of a laser according to some embodiments of the present invention;

FIG. 9 is a schematic diagram of a second circuit board according to some embodiments of the invention;

FIG. 10 is a schematic illustration of a portion of a laser light source according to further embodiments of the present invention;

FIG. 11 is a cross-sectional view of a portion of a laser light source according to some embodiments of the present invention;

fig. 12 is a schematic structural view of a metal dome according to some embodiments of the present invention;

FIG. 13 is a cross-sectional view of a portion of a laser light source according to further embodiments of the present invention;

FIG. 14 is a schematic diagram of a laser according to further embodiments of the present invention;

FIG. 15 is a cross-sectional view of a laser light source according to some embodiments of the invention.

Reference numerals: 100 a-a laser light source; 1 a-a transfer circuit board; 2 a-an MCL laser; 201 a-a substrate; 202 a-side plate; 203 a-light emitting chip; 204 a-pin; 100-a laser light source; 1-a shell; 101-a top wall; 102-a bottom wall; 103-side walls; 104-a light outlet; 105-a third mounting hole; 106-fourth mounting hole; 107-a first carrier part; 1071 — a first threaded hole; 108-a second carrier part; 2-a laser; 2A-a first laser; 2B-a second laser; 201-a first circuit board; 2011-first surface; 2011 a-first engagement area; 2011 b-second engagement area; 2012-a third surface; 2013-a first pad; 202-a light emitting chip; 203-a conductive portion; 2031-metal dome; 20311-a main body portion; 20311 a-first end; 20311 b-a second end; 20312 — a first connection; 20313-a second connecting part; 20314-a stop protrusion; 20315-a third junction; 2032-a conductive socket; 204-a fifth mounting hole; 205-positioning holes; 3-a second circuit board; 301-a first mounting hole; 302-a second surface; 303-a second mounting hole; 304-a second pad; 4-a seal; 401 — a first via; 402-a second via; 5-a connecting piece; 6-positioning columns; a heat sink 7; 701-a heat pipe; 702-heat dissipating fins; 8-sound absorbing member; 200-a laser projection device; 300-projection screen.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

In the description of the present invention, it is to be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present invention.

The terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified.

In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; the specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

In the embodiments of the present application, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element identified by the phrase "comprising an … …" does not exclude the presence of other identical elements in the process, method, article, or apparatus that comprises the element.

In the embodiments of the present application, words such as "exemplary" or "for example" are used to mean serving as an example, instance, or illustration. Any embodiment or design described herein as "exemplary" or "e.g.," is not necessarily to be construed as preferred or advantageous over other embodiments or designs. Rather, use of the word "exemplary" or "such as" is intended to present concepts related in a concrete fashion.

The laser projection display technology is an optical display technology which adopts a semiconductor laser to convert electric energy into light energy and projects the laser onto a screen through a light path system, a circuit system and a lens system. The laser projection device 200 is usually required to be used with the projection screen 300, as shown in fig. 2, the laser projection device 200 can emit a laser beam to the projection screen 300, and the projection screen 300 reflects the laser beam to realize the display of the picture.

The projection screen 300 may be an optical screen, for example, the projection screen may be composed of a support plate and a membrane located on the support plate, and the membrane may be an optical membrane mainly including a fresnel lens layer, for example, the membrane may include a diffusion layer, a substrate layer, and a fresnel lens layer (or may also include a substrate layer, a diffusion layer, and a fresnel lens layer) stacked in sequence in a direction away from the laser projection apparatus 200; the substrate layer is a transparent film layer, when images are displayed, light beams are emitted from the laser projection device 200, when the light beams pass through the diffusion layer, the light beams are dispersed by the diffusion layer, and then the light beams are reflected on the surface of the Fresnel lens layer, so that a user can view the images. As another example, the supporting plate may be bonded to the membrane through an adhesive layer to fix and flatten the membrane, and the adhesive layer may be a double-sided adhesive layer or a glue layer.

In order to implement the emission of the laser beam and display the image on the projection screen 300, as shown in fig. 3, some embodiments of the present invention provide a laser projection apparatus 200, where the laser projection apparatus 200 may include a laser light source 100, an optical engine 110, and a lens 120, which are sequentially connected along a beam transmission direction, when the laser projection apparatus 200 is in operation, the laser light source 100 may provide the laser beam to the optical engine 110, and the optical engine 110 may modulate the laser beam provided by the light source 110 and project the modulated laser beam onto the lens 120, so that the laser beam is emitted from the lens 120 to the projection screen 300 and is reflected on the projection screen 300, so that the user views the image.

The optical engine 110 may include a plurality of lens groups, such as a Total Internal Reflection (TIR) prism and a Reverse Total Internal Reflection (RTIR) mirror, for forming an illumination light path, so that an illumination light beam may be incident on a core device in the optical engine 110, that is, a light valve, which is used to modulate the light beam and make the modulated light beam incident on a lens group of the lens 120 for imaging. Based on this, the light valve may be a Digital Micromirror chip (DMD), which is also exemplary.

The lens 120 may be an ultra-short-focus projection lens, which generally includes a refractive lens group and a reflective lens group, and is configured to receive the light beam reflected by the DMD for imaging. The ultra-short-focus projection lens corrects and amplifies the imaging light beam, and the imaging light beam is reflected and then enters the projection screen 300 to be imaged, and the ultra-short-focus projection device can realize a smaller projection ratio (the projection ratio is a ratio of a vertical distance from a central point of a light emitting surface of the lens 120 to a plane where the projection screen 300 is located to a width of a display area on the projection screen 300, wherein the width of the display area is a size of the display area along a horizontal direction), for example, the width is less than or equal to 0.3, so that the laser projection device 200 can be closer to the projection screen 300 when projecting an image, so as to reduce a space occupied by the whole laser television.

To implement a laser projection display, the laser projection apparatus 200 may further include a plurality of circuit boards (not shown in the drawings). A plurality of circuit boards may be collectively disposed within the laser projection device 200.

The laser light source 100 may be various, and the laser light source 100 may include at least one laser, and the laser light source 100 is configured to emit laser light of at least one color. For example, the laser light source 100 may be a monochromatic laser light source, i.e., the laser in the laser light source 100 emits laser light of one color, a bicolor laser light source, i.e., the laser in the laser light source 100 emits laser light of two colors, or a tricolor laser light source, i.e., the laser in the laser light source 100 emits laser light of three colors.

In the prior art, the MCL laser 2a used in the laser light source 100a is a full-volume package, and as shown in fig. 4a and 4b (the laser structure shown in fig. 4b is different from that shown in fig. 4a in that the number of light emitting chips 203a in each row is different, and the rest of the structure and principle are the same), the MCL laser 2a includes a substrate 201a and a side plate 202a disposed around the substrate 201 a. The substrate 201a may be provided with light emitting chips 203a as light sources, for example, four rows of light emitting chips 203a are provided on the substrate 201a of the MCL laser 2a, two ends of each row of light emitting chips 203a respectively extend out of a pin 204a for transmitting signals to make the light emitting chips 203a emit light, the pins 204a are fixed on the side plate 202a of the MCL laser 2a, one end of the pin 204a is located in a space enclosed by the side plate 202a and the substrate 201a and electrically connected to a lead of the light emitting chip 203a, and the other end extends out of the side plate 204 a. The pin 204a is used for connecting with the adapting circuit board 1a to conduct the MCL laser 2a and the adapting circuit board 1a, so that the light emitting chip 203a of the MCL laser 2a emits light. When the laser light source 100a is assembled, as shown in fig. 1, one through circuit board 1a is disposed on each of the left and right sides of the MCL laser 2a, and two through circuit boards 1a are vertically connected to both sides of the MCL laser 2a in a package manner. By such a packaging manner, the volume of the laser light source 100a is larger, and further the volume of the entire laser projection apparatus 200 is larger.

Based on this, some embodiments of the present invention provide a laser light source 100 applied to a laser projection apparatus 200, where the laser projection apparatus 200 includes a main board (not shown in the figure). The main board is one of the aforementioned circuit boards, and its main function is to transmit various electronic signals for controlling the entire laser projection apparatus 200.

Referring to fig. 5, the laser light source 100 includes a housing 1 and at least one laser 2, and the at least one laser 2 is disposed on the housing 1.

Illustratively, as shown in fig. 6, the housing 1 may include a top wall 101 (shown in fig. 3) and a bottom wall 102 disposed opposite to each other, and a plurality of side walls 103 connected between the top wall 101 and the bottom wall 102, and the at least one laser 2 may be disposed on one of the side walls 103. In another exemplary embodiment, the other side wall 103 of the housing 1 may further have a light outlet 104, and the light outlet 104 is used for being connected to a light inlet of the optical engine 110, so that a light beam emitted from the laser light source 100 can enter the optical engine 110. Based on this, for example, the sidewall 103 where the light outlet 104 is located may be opposite to the sidewall 103 where the laser 2 is located, or, as shown in fig. 7, the sidewall 103 where the light outlet 104 is located may also be perpendicular to the sidewall 103 where the laser 2 is located. As another example, a lens group (not shown) and a reflector group (not shown) are generally disposed in the inner cavity enclosed by the housing 1, the lens group is used for converging and diverging the light beam emitted from the laser 2, and the reflector group is used for reflecting the light beam emitted from the laser 2 to change the transmission path of the light beam.

Based on this, the number of the lasers 2 may be one, and one laser 2 may emit monochromatic light, and may also emit bichromatic light or tricolor light; alternatively, the number of the lasers 2 may be plural (as shown in fig. 5), and when the number of the lasers 2 is plural, one laser 2 may emit light of one color, a plurality of the lasers 2 may all emit light of the same single color, or a plurality of the lasers 2 may emit light of different colors. It should be noted that, when the colors of the light emitted by the plurality of lasers 2 are one or two, a fluorescent wheel (not shown in the figure) may be further included in the inner cavity enclosed by the housing 1, and under the effect of the light emitted by the lasers 2, light of other colors is generated, so as to meet the requirement of projecting a display picture.

As shown in fig. 8, the laser 2 includes a first circuit board 201, a plurality of light emitting chips 202, and a conductive portion 203 (shown in fig. 10). The first circuit board 201 has a first surface 2011. The light emitting chips 202 are disposed on the first surface 2011 and electrically connected to the first circuit board 201. At least a portion of the conductive portion 203 is disposed on the first surface 2011, and the conductive portion 203 is electrically connected to the first circuit board 201. The conductive portion 203 is used to electrically connect the first circuit board 201 with the motherboard.

For example, the first circuit board 201 may include a substrate, a circuit layer and an insulating layer, which are stacked, the substrate may be made of an insulating material with good thermal conductivity, the circuit layer may be made of copper, and a circuit is formed through an etching process to electrically connect the conductive portion 203 and the light emitting chip 202. The insulating layer exposes a portion (e.g., a pad) of the circuit layer for electrically connecting the light emitting chip 202 and the conductive portion 203 and covers the remaining portion to protect the circuit layer. The first circuit board 201 has a first surface 2011 and a third surface 2012 opposite to the first surface 2011, and the first bonding region 2011a and the second bonding region 2011b are spaced apart from each other. The light emitting chips 203 may be disposed on the first bonding region 2011a, for example, a pad may be exposed at the first bonding region 2011a, and the light emitting chips 202 may be soldered to the first bonding region 2011 a; at least a portion of the conductive portion 203 may be disposed in the second bonding area 2011b, for example, a pad may be exposed at the second bonding area 2011b, and the conductive portion 203 may be soldered to the second bonding area 2011b, or the conductive portion 203 may also be abutted against the second bonding area 2011b under an external force, and the first bonding area 2011a and the second bonding area 2011b may be electrically connected through a line in a line layer, so that the light emitting chip 202 may be electrically connected to the conductive portion 203 through the line layer on the first circuit board 201, and the connection reliability is good.

As another example, a plurality of light emitting chips 202 may form a light emitting unit, as shown in fig. 8, every four light emitting chips 202 may be packaged into one light emitting unit, and after the four light emitting chips 202 in one light emitting unit are connected in series, the four light emitting chips 202 are soldered to the exposed pads on the first surface 2011 of the first circuit board 201. As another example, the number of light emitting cells on one laser 2 may be one; alternatively, as shown in fig. 8, the number of the light emitting units on one laser 2 may be two, and two light emitting units may be connected in series, or two light emitting units may be connected in parallel.

On this basis, the conductive part 203 may be a conductive socket, which may be directly electrically connected to the motherboard through a wire; alternatively, the conductive part 203 may be a conductive connector, and may be electrically connected to the motherboard through the relay circuit board.

In summary, in the laser light source 100 provided by the present invention, the plurality of light emitting chips 202 are disposed on the first surface 2011 of the first circuit board 201 and electrically connected to the first circuit board 201, and at least a portion of the conductive portion 203 is disposed on the first surface 2011 of the first circuit board 201 and electrically connected to the first circuit board 201, so that the light emitting chips 202 and the conductive portion 203 can be electrically connected through the circuit layer on the first circuit board 201, and the light emitting chips 202 can be electrically connected to the motherboard of the laser projection apparatus 100 through the conductive portion 203, so that the light emitting chips 202 can receive the control signal of the motherboard to emit light beams. Therefore, it is not necessary to provide a side plate around the entire circumference of the first circuit board 201 to fix the conductive portion 203, so that the entire volume of the laser 2 is small. By arranging at least one laser 2 on the shell 1 of the laser light source 100, the volume of the whole laser light source 100 is smaller, the volume of the whole laser projection device 200 is smaller, and the portability of the whole laser projection device 200 is improved.

In addition, the conductive portion 203 can be connected to the first circuit board 201 by means of a die bonding process or the like, thereby making it easier to assemble and disassemble the laser 2 to and from the housing, and facilitating maintenance and replacement.

As a possible implementation, referring to fig. 5, in some embodiments, the laser light source 100 further includes a second circuit board 3. The structure of the second circuit board 3 may be approximately the same as that of the first circuit board 201, and is not described in detail. The second circuit board 3 is formed with a first mounting hole 301 (as shown in fig. 9), and at least one laser 2 is located in the first mounting hole 301. For example, as shown in fig. 10, the inner side wall of the first mounting hole 301 may be attached to the outer side wall of the laser 2, so that the connection structure between the first circuit board 201 and the second circuit board 3 is more compact, and the reliability of the connection is ensured. The second circuit board 3 has a second surface 302, and the second surface 302 is flush with the first surface 2011 of the first circuit board 201. It should be noted that, the term "flush" herein may be understood as that the first surface 2011 and the second surface 302 are approximately coplanar, and on this basis, for example, the first circuit board 201 and the second circuit board 3 may be coplanar, that is, the thicknesses of the first circuit board 201 and the second circuit board 3 may be the same. Thus, the laser 2 and the second circuit board 3 are small in mounting dimension in the thickness direction, and the mounting flatness is good. The second circuit board 3 is used for electrical connection with the motherboard. For example, a connection socket may be disposed on the second circuit board 3, and the connection socket is electrically connected to the main board of the laser projection apparatus 100 through a wire.

On this basis, as shown in fig. 10, the conductive portion 203 includes a plurality of metal elastic pieces 2031, one end of each metal elastic piece 2031 is disposed on the first surface 2011 of the first circuit board 201 and electrically connected to the first circuit board 201, and the other end of each metal elastic piece 2031 is disposed on the second surface 302 and electrically connected to the second circuit board 3. For example, two ends of the metal elastic sheet 2031 may be rigidly connected to the first circuit board 201 and the second circuit board 3, that is, two ends of the metal elastic sheet 2031 may be electrically connected to the first circuit board 201 and the second circuit board 3 by welding, and may also be structurally connected to the first circuit board 201 and the second circuit board 3; alternatively, the two ends of the metal elastic sheet 2031 may be electrically connected to the first circuit board 201 and the second circuit board 3 in other manners, and the same may also be applied. In this way, when the second circuit board 3 is electrically connected to the motherboard, the light emitting chip 202 of the laser 2 can be electrically connected to the motherboard to receive the control signal of the motherboard to emit the light beam.

For example, the number of the metal elastic pieces 2031 of one laser 2 may be two, and at this time, all the light emitting chips 202 in the laser 2 are connected in series; alternatively, the number of the metal elastic pieces 2031 of one laser 2 may be two or more, and in this case, the light emitting chips 202 in the laser 2 may be connected in parallel, and may be used.

One possible connection way of the metal elastic sheet 2031 to the first circuit board 201 and the second circuit board 3 is as follows: referring to fig. 8, in some embodiments, the first circuit board 201 has a plurality of first pads 2013 on the first surface 2011 and the second circuit board 3 has a plurality of second pads 304 on the second surface 302 (as shown in fig. 9). Illustratively, the number of the first pads 2013 may be two, and accordingly, the number of the second pads 304 on the second circuit board 3 for electrically connecting to one laser 2 is two, and the number of the metal elastic pieces 2031 of one laser 2 is also two (as shown in fig. 10), so that the electrical connection between the light emitting chip 202 and the motherboard can be realized with the minimum number of the metal elastic pieces 2031, and the connection is simple and easy to realize.

On this basis, the second circuit board 3 is provided with a plurality of second mounting holes 303 (as shown in fig. 9), and one second mounting hole 303 passes through one second pad 304. For example, the second mounting hole 303 may be a through hole; alternatively, the second mounting hole 303 may be a blind hole, and may be applied. Accordingly, as shown in fig. 12, the metal spring 2031 includes a main body 20311, a first connection portion 20312, and a second connection portion 20313. The body portion 20311 has opposing first and

second ends

20311a, 20311 b. The first connection portion 20312 has one end connected to the first end 20311a and the other end soldered to one first pad 2013. The second connecting portion 20313 has one end connected to the second end 20311b, and the other end fitted into one of the second mounting holes 303 (shown in fig. 11), and is soldered to the second pad 304. For example, the first connection portion 20312 may be L-shaped, and one side of the L-shape is attached to the first pad 2013 and fixed by welding; the second connection portion 20313 may be formed in a straight line shape, inserted into the second mounting hole 303, and fixed thereto by welding. In this way, the metal elastic strip 2031 can have a certain elastic deformation, so that two ends of the metal elastic strip 2031 can be connected with the first circuit board 201 and the second circuit board 3 respectively.

In order to make the connection between the metal spring 2031 and the second circuit board 3 more stable, referring to fig. 12, in some embodiments, the second mounting hole 303 is a through hole penetrating through the second circuit board 3. The metal spring 2031 further comprises a limiting protrusion 20314. The limiting protrusion 20314 is disposed on the second connecting portion 20313, and the limiting protrusion 20314 abuts against the second surface 302. For example, the number of the limiting portions 20314 may be two, and the two limiting portions are symmetrically disposed on two sides of the second connecting portion 20313. In this way, the connection between the metal spring 2031 and the second circuit board 2 is more stable.

Another possible connection manner of the metal elastic pieces 2031 to the first circuit board 201 and the second circuit board 3 is as follows: in some embodiments, the first circuit board 201 has a plurality of first pads 2013 on the first surface 2011 (shown in fig. 8), and the second circuit board 3 has a plurality of second pads 304 on the second surface 302 (shown in fig. 9). The corresponding relationship among the numbers of the first pads 2013, the second pads 304 and the metal domes 2013 may be the same as above, and is not described in detail. Referring to fig. 13, the metal spring 2031 includes a main portion 20311 and two third connecting portions 20315. The body portion 20311 is connected to the housing 1. The two third connecting portions 20315 are connected to two ends of the main body portion 20311, and are located on the same side of the main body portion 20311. The two third connecting portions 20315 abut against one first pad 2013 and one second pad 304, respectively. For example, the third connecting portion 20315 may have an L shape, a joint between two sides of the L shape may have a rounded corner, and openings of two third connecting portions 20315 may be disposed opposite to each other. Therefore, the metal elastic sheet 2031 can have a certain elastic deformation, and is electrically connected with the first circuit board 201 and the second circuit board 3 under the action of the elastic restoring force, so that the connection is simple and convenient, and the detachment is convenient.

As one possible implementation, referring to fig. 14, in some embodiments, the conductive portion 203 includes a conductive socket 2032. The conductive socket 2032 is disposed on the first surface 2011 and electrically connected to the first circuit board 201. The conductive socket 2032 is used for electrical connection to a motherboard via a wire. Illustratively, the conductive socket 2032 may also be soldered to the first surface 2011 in a patch mount configuration. Therefore, a switching circuit board can be omitted, and the laser 2 is directly electrically connected with the mainboard.

In order to increase the power of the outgoing beam of the laser light source 100, referring to fig. 10, in some embodiments, the plurality of first bonding pads 2013 are located on the same side of the plurality of light emitting chips 202. For example, the first circuit board 201 may have a rectangular shape, the light emitting chip 202 may be located at one end of the first circuit board 201 in the width direction, the plurality of first pads 2013 may be located at the other end of the first circuit board 201 in the width direction, and correspondingly, the second pads 304 on the second circuit board 3 for electrically connecting to the same laser 2 are located on the same side of the second mounting hole 304.

On this basis, the at least one laser 2 includes a first laser 2A and a second laser 2B. The first circuit board 201 of the first laser 2A abuts against the first circuit board 201 of the second laser 2B, and the first surface 2011 of the first laser 2A is coplanar with the first surface 2011 of the second laser 2B. Illustratively, a side of the first circuit board 201 of the first laser 2A, which is far from the first pad 2013, abuts against a side of the first circuit board 201 of the second laser 2B, which is far from the first pad 2013, that is, a side of the first circuit board 201 of the first laser 2A, which is close to the first pad 2013, and a side of the first circuit board 201 of the second laser 2B, which is close to the first pad 2013, abuts against corresponding inner side walls of the first mounting holes 303, so that the power of the outgoing beam of the laser light source 100 can be increased by splicing the two lasers 2 into one first mounting hole 303. It should be noted that in other embodiments, the number of the lasers 2 may be three or more, and the same applies.

In order to seal the laser light source 100 and achieve airtightness of the inner cavity surrounded by the housing 1, referring to fig. 7, in some embodiments, the housing 1 is provided with a third mounting hole 105 and a fourth mounting hole 106, and an inner side wall of the third mounting hole 105 is disposed around the plurality of light emitting chips 202 of the first laser 2A; the inner side wall of the fourth mounting hole 106 is provided around the plurality of light emitting chips 202 of the second laser 2B (as shown in fig. 15). As described above, the third mounting hole 105 and the fourth mounting hole 106 may be opened on one side wall of the housing 1, for example. The laser light source 100 further comprises a seal 4. Illustratively, the material of the sealing element 4 may be silicone, which has good heat resistance and strong sealing performance. The sealing member 4 is provided with a first through hole 401 and a second through hole 402 (as shown in fig. 10), an inner side wall of the first through hole 401 is disposed around a plurality of light emitting chips 202 of the first laser 2A, and an inner side wall of the second through hole 402 is disposed around a plurality of light emitting chips 202 of the second laser 2B. Exemplarily, the sealing element can be integrally formed in a shape like a Chinese character ri, so that the sealing effect can be ensured, and the occupied space is small. Therefore, through the structural design of the sealing element 4, each laser 2 is independently sealed, so that the sealing performance is better, and the reliability is higher. The sealing member 4 is located between the housing 1 and the first circuit board 201, and abuts against the housing 1 and the first circuit board 201. Therefore, the sealing element is extruded by the shell 1 and the first circuit board 201 of the laser 2, so that sealing is realized, and the sealing form has good reliability and is convenient to assemble.

For mounting the lasers 2 and the second circuit board 3, see fig. 7, in some embodiments the housing 1 has a first carrier part 107 and a second carrier part 108, the first carrier part 107 being used for mounting at least one first laser 2. Illustratively, the first bearing part 107 may be a boss structure disposed on one side wall 103 of the housing 1, and the first bearing part 107 may be two bosses disposed oppositely, top surfaces of the two bosses are located in the same plane, and top surfaces of the bosses are used for bearing against the first surface 2011 of the first circuit board 201 of the laser 2. Further illustratively, the two bosses have a through hole therebetween for transmitting the light beam of the laser 2, and as described above, when the number of the lasers 2 is two, the above-described third mounting hole 105 and fourth mounting hole 106 are provided therebetween. On this basis, for another example, the distance between the side walls of the bosses close to the third mounting hole 105 and the fourth mounting hole 106 and the side walls corresponding to the third mounting hole 105 and the fourth mounting hole 106 may be the single-side thickness of the sealing element 4 shaped like a Chinese character ri, so that the sealing element 4 can be limited between the two bosses, and the sealing reliability is ensured.

Based on this, the second bearing part 108 is provided along the peripheral side of the first bearing part 107 for mounting the second circuit board 201. Illustratively, the second bearing portion 108 may be composed of a plurality of threaded posts disposed on the side wall 103 of the housing 1, top surfaces of the plurality of threaded posts are located in the same plane, the top surfaces of the threaded posts are used for bearing against the second surface 302 of the second circuit board 3, and the second circuit board 3 may be mounted and fixed by a threaded connector.

In order to mount and fix the laser 2 to the housing 1, referring to fig. 7, in some embodiments, the first bearing portion 107 has a plurality of first threaded holes 1071. The first circuit board 201 is provided with a plurality of fifth mounting holes 204 (as shown in fig. 8). As shown in fig. 5, the laser light source 100 further includes a plurality of connectors 5, and one connector 5 is screwed into one first threaded hole 1071 through one fifth mounting hole 204. In this way, the laser 2 can be mounted and fixed to the housing 1. For example, the number of the fifth mounting holes 204 on the first circuit board 201 may be two, and the fifth mounting holes are symmetrically disposed at two ends of the first circuit board 201 along the length direction, and when the number of the lasers 2 is two, the number of the first threaded holes 1071 and the number of the connectors 5 are four. As another example, the connecting member 5 may be a screw, a screw shaft of the screw is screwed into the first threaded hole 1071 through the fifth mounting hole 204, and a screw cap abuts against the third surface 2012 of the first circuit board 201.

Referring to fig. 8, in some embodiments, the first circuit board 201 further has a plurality of positioning holes 205 formed thereon. The laser light source 100 further includes a plurality of positioning posts 6 (shown in fig. 7). The positioning posts 6 are disposed on the housing 1, and one positioning post 6 is matched with one positioning hole 205 (as shown in fig. 5). In this way, when the laser 2 is mounted and fixed on the housing 1, the positioning post 6 is first engaged with the positioning hole 205 to position the laser 2, and the connector 5 is used to fix the laser 2, thereby improving the efficiency of assembling the laser 2 on the housing 1. For example, the number of the positioning holes 205 on the first circuit board 201 may be two, and the positioning holes are symmetrically disposed at two ends of the first circuit board 201 along the length direction, and when the number of the lasers 2 is two, the number of the positioning posts 6 is four.

To cool the laser 2, see fig. 15, in some embodiments the laser light source 100 further comprises a heat sink 7. The heat sink 7 is connected to the housing 1, the heat sink 7 is attached to the third surface 2012 of the first circuit board 201, and the third surface 2012 is opposite to the first surface 2011. Therefore, the laser 2 can be cooled, and the normal work of the laser 2 is ensured. For example, the heat sink 7 may include a heat pipe 701 and a heat dissipating fin 702 connected to each other, wherein the heat pipe 701 is attached to the third surface 2012 of the first circuit board 201; alternatively, the heat sink 7 may also include a liquid cooling head and a cold drain that are communicated with each other, and the liquid cooling head is attached to the third surface 2012 of the first circuit board 201, and can also cool the laser 2.

Referring to fig. 6, in some embodiments, the laser light source 100 further includes a plurality of sound absorbers 8 stacked on both sides of the second circuit board 201. In this way, the noise generated by the laser light source 100 can be reduced, and the user experience can be improved. For example, the sound absorbing member 8 may be a sound absorbing foam. As another example, the sound absorbing members 8 may be two, and disposed on both sides of the second circuit board 3.

The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention, and the changes or substitutions should be covered within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims

1. The laser projection equipment is characterized by comprising a laser light source and a main board; the laser light source comprises a shell and at least one laser, and the at least one laser is arranged on the shell; wherein the laser comprises:

a first circuit board having a first surface;

the plurality of light-emitting chips are arranged on the first surface and are electrically connected with the first circuit board; and

a conductive portion, at least a portion of which is disposed on the first surface, the conductive portion being electrically connected to the first circuit board; the conductive part is used for electrically connecting the first circuit board with the mainboard.

2. A laser projection device as claimed in claim 1,

the laser light source further includes: the second circuit board is provided with a first mounting hole, and the at least one laser is positioned in the first mounting hole; the second circuit board has a second surface; the second surface is flush with the first surface of the first circuit board; the second circuit board is used for being electrically connected with the mainboard;

the conductive part includes: one end of each metal elastic sheet is arranged on the first surface of the first circuit board and electrically connected with the first circuit board, and the other end of each metal elastic sheet is arranged on the second surface and electrically connected with the second circuit board.

3. A laser projection device as claimed in claim 2,

the first circuit board has a plurality of first pads on a first surface thereof and the second circuit board has a plurality of second pads on a second surface thereof; the second circuit board is provided with a plurality of second mounting holes, and one second mounting hole penetrates through one second bonding pad;

the metal shrapnel comprises:

a body portion having opposing first and second ends;

one end of the first connecting part is connected with the first end, and the other end of the first connecting part is welded with one first bonding pad; and

and one end of the second connecting part is connected with the second end, and the other end of the second connecting part is matched with one second mounting hole and welded with the second bonding pad.

4. A laser projection device as claimed in claim 3,

the second mounting hole is a through hole penetrating through the second circuit board;

the metal shrapnel further comprises: and the limiting bulge is arranged on the second connecting part and is abutted against the second surface.

5. A laser projection device as claimed in claim 2,

the first circuit board has a plurality of first pads on a first surface thereof and the second circuit board has a plurality of second pads on a second surface thereof;

the metal shrapnel comprises:

a main body part connected with the housing; and

the two third connecting parts are respectively connected with two ends of the main body part and are positioned on the same side of the main body part; the two third connecting parts are respectively abutted with one first bonding pad and one second bonding pad.

6. A laser projection device as claimed in claim 1,

the conductive part includes: the conductive socket is arranged on the first surface and is electrically connected with the first circuit board; the conductive socket is used for being electrically connected with the mainboard through a wire.

7. A laser projection device as claimed in any one of claims 3 to 5,

the plurality of first bonding pads on the first circuit board are positioned on the same side of the plurality of light-emitting chips;

the at least one laser comprises:

a first laser; and

the first circuit board of the first laser is abutted against the first circuit board of the second laser, and the first surface of the first laser is coplanar with the first surface of the second laser.

8. A laser projection device as claimed in claim 7,

the shell is provided with a third mounting hole and a fourth mounting hole, and the inner side wall of the third mounting hole is arranged around the plurality of light emitting chips of the first laser in a circle; the inner side wall of the fourth mounting hole is arranged around the plurality of light emitting chips of the second laser in a circle;

the laser light source further includes: the sealing element is provided with a first through hole and a second through hole, the inner side wall of the first through hole is arranged around the plurality of light emitting chips of the first laser in a circle, and the inner side wall of the second through hole is arranged around the plurality of light emitting chips of the second laser in a circle; the sealing element is positioned between the shell and the first circuit board and is abutted against the shell and the first circuit board.

9. The laser projection device of any one of claims 3 to 5, wherein the housing has a first bearing portion and a second bearing portion, the at least one laser being mounted on the first bearing portion by a fastener; the second bearing part is arranged along the peripheral side of the first bearing part, and the second circuit board is installed on the second bearing part through a fastener.

10. A laser projection device as claimed in any one of claims 3 to 5, wherein the laser light source further comprises:

and the sound absorbing pieces are stacked on two sides of the second circuit board.