TWI612361B - Surface light source device and liquid crystal display device - Google Patents
Surface light source device and liquid crystal display device Download PDFInfo
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- TWI612361B TWI612361B TW102127045A TW102127045A TWI612361B TW I612361 B TWI612361 B TW I612361B TW 102127045 A TW102127045 A TW 102127045A TW 102127045 A TW102127045 A TW 102127045A TW I612361 B TWI612361 B TW I612361B
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133621—Illuminating devices providing coloured light
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133603—Direct backlight with LEDs
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133615—Edge-illuminating devices, i.e. illuminating from the side
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133628—Illuminating devices with cooling means
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- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Liquid Crystal (AREA)
- Planar Illumination Modules (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
液晶顯示裝置100,包括:雷射光源5、LED光源4及散熱器2。雷射光源5射出雷射光51。LED光源4射出LED光41。散熱器2保持雷射光源5並且將雷射光源5產生的熱傳遞至空氣中。雷射光源5配置在比LED光源4更下側的位置。液晶顯示裝置100抑制不容易受熱影響的LED光源4的熱往容易受熱影響的雷射光源5傳遞。 The liquid crystal display device 100 includes a laser light source 5, an LED light source 4, and a heat sink 2. The laser light source 5 emits laser light 51. The LED light source 4 emits LED light 41. The heat sink 2 holds the laser light source 5 and transfers heat generated by the laser light source 5 to the air. The laser light source 5 is disposed at a position lower than the LED light source 4. The liquid crystal display device 100 suppresses heat of the LED light source 4 that is not easily affected by heat from being transmitted to the laser light source 5 that is easily affected by heat.
Description
本發明係有關於一種具有2種光源的液晶顯示裝置的冷卻構造。 The present invention relates to a cooling structure of a liquid crystal display device having two types of light sources.
液晶顯示裝置所具備的液晶顯示元件本身不發光。因此,液晶顯示裝置會在液晶顯示元件的背面配置背光裝置,做為照明液晶顯示元件的光源。背光裝置發出的光入射液晶顯示元件後射出影像光。近年來,隨著藍色的發光二極體(以下稱LED(Light Emitting Diode))的性能飛躍性地提昇,使用藍色LED做為光源的背光裝置也因而廣泛地被採用。 The liquid crystal display element included in the liquid crystal display device itself does not emit light. Therefore, the liquid crystal display device is provided with a backlight device on the back of the liquid crystal display element as a light source for illuminating the liquid crystal display element. The light emitted from the backlight device enters the liquid crystal display element and then emits image light. In recent years, as the performance of blue light emitting diodes (hereinafter referred to as LEDs (Light Emitting Diodes)) has improved dramatically, backlight devices using blue LEDs as light sources have been widely used.
使用藍色LED的光源的構成要素包括藍色LED元件以及螢光體,螢光體吸收藍色LED元件發出的光後發出藍色的補色光。這種LED稱為白色LED,藍色的補色也就是包含綠色與紅色的黃色。 The constituent elements of a light source using a blue LED include a blue LED element and a phosphor. The phosphor absorbs light emitted by the blue LED element and emits blue complementary color light. This kind of LED is called white LED, and the complementary color of blue is yellow including green and red.
白色LED的電光轉換效率高,能有效地降低耗電。「電光轉換」是指將電轉換為光。然而,白色LED卻有波長帶域寬,色彩重現範圍狹窄的問題。液晶顯示裝置在其液晶顯示元件的內部具備彩色濾光片。液晶顯示裝置透過彩色濾光片取出紅色、綠色、及藍色的頻譜範圍的光,呈現出色彩。像白色LED這種具有波長帶域寬的連續頻譜的光源,為了擴大色彩重 現範圍,需要提高彩色濾光片的顯示顏色的色純度。也就是說,必須將透過彩色濾光片的波長帶域設定狹窄。然而,若將透過彩色濾光片的波長帶域設定狹窄,光的利用效率會下降。這是因為不用於液晶顯示元件顯示影像的光的光量增加。另外,也會產生液晶顯示元件的顯示面亮度下降,導致液晶顯示裝置的耗電增大的問題。 The white LED has high electro-optical conversion efficiency and can effectively reduce power consumption. "Electro-optical conversion" refers to the conversion of electricity into light. However, white LEDs have problems with a wide wavelength band and a narrow color reproduction range. The liquid crystal display device includes a color filter inside the liquid crystal display element. The liquid crystal display device extracts light in the red, green, and blue spectral ranges through a color filter, and presents colors. Light sources such as white LEDs have a continuous spectrum with a wide wavelength band. It is necessary to improve the color purity of the display color of the color filter. In other words, it is necessary to narrow the wavelength band of the color filter. However, if the wavelength band of the color filter is set to be narrow, the use efficiency of light is reduced. This is because the amount of light that is not used for liquid crystal display elements to display images increases. In addition, there is a problem that the brightness of the display surface of the liquid crystal display element is reduced, and the power consumption of the liquid crystal display device is increased.
為了改善這些問題,有一種背光裝置採用色純度更高的單色LED來取代白色LED。單色LED是紅色、綠色、及藍色。另外,也有一種背光裝置使用比單色LED色純度更高的雷射。雷射的顏色為紅色、綠色、及藍色。「色純度高」是指波長帶域窄、單色性佳。藉由採用這些光源做為背光裝置,能夠擴大液晶顯示裝置的色彩重現範圍。 In order to improve these problems, there is a backlight device that replaces white LEDs with monochromatic LEDs with higher color purity. Monochrome LEDs are red, green, and blue. In addition, there is also a backlight device using a laser having a higher color purity than a monochromatic LED. Laser colors are red, green, and blue. "High color purity" refers to a narrow wavelength band and good monochromaticity. By using these light sources as the backlight device, the color reproduction range of the liquid crystal display device can be expanded.
然而,以3原色的LED或3原色的雷射構成的光源當中有些元件隨著溫度上升電光變換效率會顯著地下降。特別是,紅色雷射在高溫狀態持續射出高亮度的光會使劣化加速,縮短元件的壽命。因此,為了在環境溫度高溫時也能獲得希望的光量,一般需要散熱機構。「環境溫度」包含液晶顯示裝置擺放的環境溫度、液晶顯示裝置中的背光裝置的周圍溫度。 However, some elements in light sources composed of LEDs of three primary colors or lasers of three primary colors will have a significant decrease in the electro-optical conversion efficiency with increasing temperature. In particular, red lasers continue to emit high-intensity light at high temperatures, which accelerates degradation and shortens the life of the device. Therefore, in order to obtain a desired amount of light even at high ambient temperature, a heat dissipation mechanism is generally required. "Ambient temperature" includes the ambient temperature at which the liquid crystal display device is placed, and the ambient temperature of the backlight device in the liquid crystal display device.
專利文獻1顯示沿著液晶顯示面板3的二個長邊配置LED模組9做為光源的液晶顯示裝置1。二個長邊是指液晶顯示面板3的上側與下側的長邊。LED模組9安裝在背面框架7的立起部位8(段落0009、第2圖)。散熱片27以熱接觸背面框架7的幾乎整個背面的方式下安裝(第1圖)。另外,散熱片27並不安裝至LED驅動電源31與控制基板29的部分。在此,液晶顯示 面板是液晶顯示元件。 Patent Document 1 shows a liquid crystal display device 1 in which LED modules 9 are arranged as light sources along two long sides of a liquid crystal display panel 3. The two long sides are the long sides of the upper side and the lower side of the liquid crystal display panel 3. The LED module 9 is mounted on a rising portion 8 of the back frame 7 (paragraph 0009, FIG. 2). The heat sink 27 is attached so as to thermally contact almost the entire back surface of the back frame 7 (FIG. 1). The heat sink 27 is not attached to the LED driving power source 31 and the control board 29. Here, the liquid crystal display The panel is a liquid crystal display element.
先行技術文獻 Advance technical literature
專利文獻1:特開2006-267936(段落0009、0012、第1、2圖)。 Patent Document 1: Japanese Patent Application Laid-Open No. 2006-267936 (paragraphs 0009, 0012, Figs. 1, 2).
然而,背光裝置採用例如直下型與側光型並用的2種光源時,必須考慮到兩種光源的熱各自往彼此的光源傳遞。「直下型」是指光源排列在液晶面板的背面的背光裝置。「側光型」是指光源在液晶面板的端面排成一列,再利用導光板將光擴散到面板的整個背面的背光裝置。因此,採用容易受熱影響的光源時,依據2種光源的配置方式,反而有可能會造成易受熱影響的光源的溫度上升的問題。 However, when the backlight device uses two types of light sources such as a direct type and an edge type, it is necessary to consider that the heat of the two light sources is transmitted to each other's light sources. The "direct type" refers to a backlight device in which light sources are arranged on the back of a liquid crystal panel. "Side-light type" refers to a backlight device in which light sources are lined up on the end face of a liquid crystal panel, and then the light guide plate is used to diffuse the light to the entire back of the panel. Therefore, when using a light source that is easily affected by heat, depending on the arrangement of the two light sources, there may be a problem that the temperature of the light source that is easily affected by heat rises.
本發明有鑑於此,提出一種液晶顯示裝置,其構造能夠抑制不易受熱影響的光源的熱往易受熱影響的光源傳遞。 In view of this, the present invention proposes a liquid crystal display device having a structure capable of suppressing the transfer of heat from a light source that is not easily affected to heat to a light source that is easily affected by heat.
有鑑於上述問題,本發明提出一種液晶顯示裝置,包括:雷射光源,射出雷射光;LED光源,射出LED光;以及散熱器,保持該雷射光源並且將該雷射光源產生的熱傳遞至空氣中,其中該雷射光源配置在比該LED光源更下側的位置。 In view of the above problems, the present invention provides a liquid crystal display device including: a laser light source that emits laser light; an LED light source that emits LED light; and a radiator that holds the laser light source and transfers heat generated by the laser light source to In the air, the laser light source is disposed at a position lower than the LED light source.
根據上述發明,能夠抑制不易受熱影響的光源的熱往易受熱影響的光源傳遞。 According to the invention described above, it is possible to suppress heat from being transmitted from a light source that is not easily affected by heat to a light source that is easily affected by heat.
1‧‧‧背面部 1‧‧‧ back
2、2a、2b、2c、2d、2e‧‧‧散熱器 2, 2a, 2b, 2c, 2d, 2e‧‧‧ radiator
3、3a、3b、3c、3d、3e、3f‧‧‧LED光源陣列 3, 3a, 3b, 3c, 3d, 3e, 3f‧‧‧LED light source array
4‧‧‧LED光源 4‧‧‧LED light source
41‧‧‧LED光 41‧‧‧LED light
5‧‧‧雷射光源 5‧‧‧laser light source
51‧‧‧雷射光 51‧‧‧laser light
8‧‧‧反射部 8‧‧‧Reflection
81a、81b、81c、81d‧‧‧側板部 81a, 81b, 81c, 81d
82‧‧‧底板部 82‧‧‧ floor
83‧‧‧開口部 83‧‧‧ opening
9‧‧‧反射片 9‧‧‧Reflector
10‧‧‧導光棒 10‧‧‧light guide
11‧‧‧擴散板 11‧‧‧ diffuser
12‧‧‧光學片 12‧‧‧ Optical Sheet
13‧‧‧液晶顯示元件 13‧‧‧LCD display element
14‧‧‧安裝孔 14‧‧‧Mounting holes
15‧‧‧斷熱部 15‧‧‧Insulation
16‧‧‧空氣 16‧‧‧ air
17、18‧‧‧熱 17, 18‧‧‧ heat
19‧‧‧週邊元件配置位置 19‧‧‧ Peripheral component placement
20‧‧‧空氣氣流的亂流 20‧‧‧ air turbulence
21‧‧‧散熱鰭片 21‧‧‧Cooling Fin
22‧‧‧安裝部 22‧‧‧Mounting Department
23‧‧‧孔 23‧‧‧hole
24‧‧‧基底板部 24‧‧‧ base plate
25‧‧‧下端面 25‧‧‧ bottom face
30‧‧‧導光部 30‧‧‧light guide
100、102‧‧‧液晶顯示裝置 100, 102‧‧‧ LCD display device
101‧‧‧入射面 101‧‧‧ incident surface
200‧‧‧面光源裝置 200‧‧‧area light source device
第1圖係顯示實施例1的液晶顯示裝置的構造的立體圖。 FIG. 1 is a perspective view showing the structure of the liquid crystal display device of the first embodiment.
第2圖係顯示實施例1的液晶顯示裝置的構造的部分立體圖。 FIG. 2 is a partial perspective view showing the structure of the liquid crystal display device of Example 1. FIG.
第3圖係顯示實施例1的散熱器的構造的立體圖。 FIG. 3 is a perspective view showing the structure of the heat sink of the first embodiment.
第4圖係顯示實施例1的液晶顯示裝置的構造的架構圖。 FIG. 4 is a block diagram showing the structure of the liquid crystal display device of the first embodiment.
第5圖係顯示實施例1的面光源裝置的立體圖。 Fig. 5 is a perspective view showing the surface light source device of the first embodiment.
第6圖係顯示實施例1的液晶顯示裝置的構造的架構圖。 Fig. 6 is a block diagram showing the structure of the liquid crystal display device of the first embodiment.
第7圖係顯示實施例2的液晶顯示裝置的構造的架構圖。 FIG. 7 is a block diagram showing a structure of a liquid crystal display device of Example 2. FIG.
第8圖係顯示實施例2的液晶顯示裝置的構造的架構圖。 FIG. 8 is a block diagram showing a structure of a liquid crystal display device of Example 2. FIG.
實施例1 Example 1
以下,為了容易說明圖式,在各圖中顯示XYZ的直角座標系的座標軸。假設液晶顯示裝置100的短邊方向為Y軸方向,長邊方向為X軸方向,垂直X-Y平面的方向為Z軸方向。假設液晶顯示裝置100的顯示面側為+Z軸方向,液晶顯示裝置的上方向為+Y軸方向,觀看液晶顯示裝置100的顯示面時左側為+X軸方向。「觀看顯示面」是指面向顯示面。 In the following, for easy explanation of the drawings, the coordinate axes of the rectangular coordinate system of XYZ are shown in each drawing. It is assumed that the short-side direction of the liquid crystal display device 100 is the Y-axis direction, the long-side direction is the X-axis direction, and the direction perpendicular to the X-Y plane is the Z-axis direction. It is assumed that the display surface side of the liquid crystal display device 100 is the + Z axis direction, the upper direction of the liquid crystal display device is the + Y axis direction, and the left side when viewing the display surface of the liquid crystal display device 100 is the + X axis direction. "Viewing display surface" means facing the display surface.
第1圖係實施例1的液晶顯示裝置100的背面立體圖。背面部1為配置在液晶顯示裝置100背面的保持構件。例如,背面部1為板材。背面部1例如對鐵進行施壓加工後成形。實施例1中,背面部也記述為背面板金。因此,背面部是具有散熱效果的構件。散熱器2a、2b、2c、2d、2e配置於背面部1的背面(-Z軸方向側)。散熱器2a、2b、2c、2d、2e配置在背面部1的Y軸方向的下端。散熱器2a、2e左右對稱地配置在背面 部1的背面。散熱器2a、2e配置在背面部1的背面的X軸方向兩端。散熱器2b、2d左右對稱地配置在背面部1的背面。散熱器2c配置在背面部1的背面的X軸方向的中心。散熱器2b配置在散熱器2a與散熱器2c之間。散熱器2d配置在散熱器2e與散熱器2c之間。散熱器2a、2b、2c、2d、2e的風路設置在鉛直方向(+Y軸方向)。「風路」是指製作風流通的通路,使熱散失。 FIG. 1 is a rear perspective view of the liquid crystal display device 100 according to the first embodiment. The back surface portion 1 is a holding member arranged on the back surface of the liquid crystal display device 100. For example, the back surface portion 1 is a plate material. The back surface portion 1 is formed by, for example, applying pressure to iron. In Example 1, the back part is also described as a back sheet metal. Therefore, the back surface portion is a member having a heat radiation effect. The heat sinks 2a, 2b, 2c, 2d, and 2e are arranged on the back surface (-Z axis direction side) of the back surface portion 1. The heat sinks 2a, 2b, 2c, 2d, and 2e are arranged at the lower ends in the Y-axis direction of the back surface portion 1. The radiators 2a and 2e are arranged symmetrically on the back side The back of the part 1. The heat sinks 2 a and 2 e are arranged at both ends in the X-axis direction of the back surface of the back surface portion 1. The heat sinks 2 b and 2 d are arranged symmetrically on the back surface of the back surface portion 1. The heat sink 2 c is arranged at the center in the X-axis direction of the back surface of the back surface portion 1. The heat sink 2b is disposed between the heat sink 2a and the heat sink 2c. The heat sink 2d is disposed between the heat sink 2e and the heat sink 2c. The air paths of the radiators 2a, 2b, 2c, 2d, and 2e are provided in a vertical direction (+ Y-axis direction). "Wind path" refers to the path through which the wind circulates to allow heat to escape.
第2圖係從液晶顯示面側觀看液晶顯示裝置100的內部構造的立體圖。第2圖中,顯示卸下液晶顯示元件13、光學片12、擴散板11、導光棒10及反射部8的狀態。第2圖中,以虛線表示配置於背面部1的背面(-Z軸方向側)的散熱器2a、2b、2c、2d、2e的位置。 FIG. 2 is a perspective view of the internal structure of the liquid crystal display device 100 as viewed from the liquid crystal display surface side. FIG. 2 shows a state where the liquid crystal display element 13, the optical sheet 12, the diffusion plate 11, the light guide rod 10, and the reflection portion 8 are removed. In FIG. 2, the positions of the heat sinks 2 a, 2 b, 2 c, 2 d, and 2 e arranged on the back surface (-Z axis direction side) of the back surface portion 1 are indicated by broken lines.
本實施例1的液晶顯示裝置100具有組合LED光源4與雷射光源5的面光源裝置200。面光源裝置200如第4圖所示,具有背面部1、散熱器2、LED光源陣列3、雷射光源5。面光源裝置200能夠具有反射部8、導光棒10、及擴散板11。背面部1的內部收納了光學片12與液晶顯示元件13。 The liquid crystal display device 100 of the first embodiment includes a surface light source device 200 that combines an LED light source 4 and a laser light source 5. As shown in FIG. 4, the surface light source device 200 includes a back surface portion 1, a heat sink 2, an LED light source array 3, and a laser light source 5. The surface light source device 200 can include a reflection portion 8, a light guide rod 10, and a diffusion plate 11. An optical sheet 12 and a liquid crystal display element 13 are housed inside the back surface portion 1.
LED光源陣列3a、3b、3c、3d、3e、3f為複數的LED光源4基板上排成一列。排列LED光源4的基板為細長的矩形。實施例1中,LED光源陣列3的LED光源4排列在X軸方向。LED光源陣列3a、3b、3c、3d、3e、3f配置在背面部1的+Z軸方向的面上。LED光源陣列3a、3b、3c、3d、3e、3f排列在Y軸方向。也就是說,複數的LED光源陣列3a、3b、3c、3d、3e、3f在鉛直方向(+Y軸方向)等間隔地排列。藉此,LED光源4形成二維排列於液晶顯示元件13的背面的「直下型」構造。 The LED light source arrays 3a, 3b, 3c, 3d, 3e, and 3f are plural LED light sources 4 arranged in a row on a substrate. The substrate on which the LED light sources 4 are arranged is an elongated rectangle. In the first embodiment, the LED light sources 4 of the LED light source array 3 are arranged in the X-axis direction. The LED light source arrays 3 a, 3 b, 3 c, 3 d, 3 e, and 3 f are arranged on the surface in the + Z axis direction of the back surface portion 1. The LED light source arrays 3a, 3b, 3c, 3d, 3e, and 3f are arranged in the Y-axis direction. That is, the plurality of LED light source arrays 3a, 3b, 3c, 3d, 3e, and 3f are arranged at regular intervals in the vertical direction (+ Y-axis direction). As a result, the LED light source 4 has a “straight-down” structure that is two-dimensionally arranged on the back surface of the liquid crystal display element 13.
LLED光源陣列3a、3b、3c、3d、3e、3f也可排列在水平方向(+X軸方向)。在這個情況下,LED光源陣列3的基板以Y軸方向為長邊的細長矩形的狀態下排列。也就是說,LED光源陣列3的LED光源4可以排列於Y軸方向。1個LED光源陣列3也可分割為複數個。例如,LED光源陣列3a在x軸方向的中央部分分割為2個。甚至是,LED光源陣列3a、3b、3c、3d、3e、3f的數目不限於6個。LED光源陣列3a、3b、3c、3d、3e、3f的數目能夠因應例如液晶顯示元件13的大小而設定為其他的個數。散熱器2a、2b、2c、2d、2e的數目也不限於6個。散熱器2a、2b、2c、2d、2e的數目能夠因應例如液晶顯示元件13的大小而設定為其他的個數。 The LLED light source arrays 3a, 3b, 3c, 3d, 3e, and 3f may also be arranged in the horizontal direction (+ X-axis direction). In this case, the substrates of the LED light source array 3 are arranged in a state of an elongated rectangle with the long side in the Y-axis direction. That is, the LED light sources 4 of the LED light source array 3 may be arranged in the Y-axis direction. One LED light source array 3 may be divided into a plurality. For example, the central portion of the LED light source array 3a in the x-axis direction is divided into two. Furthermore, the number of the LED light source arrays 3a, 3b, 3c, 3d, 3e, 3f is not limited to six. The number of the LED light source arrays 3a, 3b, 3c, 3d, 3e, and 3f can be set to another number according to the size of the liquid crystal display element 13, for example. The number of the radiators 2a, 2b, 2c, 2d, and 2e is also not limited to six. The number of the heat sinks 2a, 2b, 2c, 2d, and 2e can be set to another number according to the size of the liquid crystal display element 13, for example.
第3圖係顯示散熱器2的形狀的立體圖。散熱器2是以熱傳導率高的材料作成。例如,散熱器2以鋁作成。散熱器2具有散熱鰭片21。散熱鰭片21的配置使風路朝向鉛直方向(+Y軸方向)。散熱鰭片21形成在基底板部24的-Z軸方向的表面。基底板部24為平行於X-Y平面的板狀。散熱鰭片21相對於基底板部24垂直地形成。也就是說,散熱鰭片21為平行於Y-Z平面的板狀構件。另外,複數散熱鰭片21排列於X軸方向上。 FIG. 3 is a perspective view showing the shape of the heat sink 2. The heat sink 2 is made of a material having a high thermal conductivity. For example, the heat sink 2 is made of aluminum. The heat sink 2 includes a heat radiation fin 21. The heat radiating fins 21 are arranged so that the air path faces the vertical direction (+ Y-axis direction). The heat radiating fins 21 are formed on the surface in the −Z axis direction of the base plate portion 24. The base plate portion 24 has a plate shape parallel to the X-Y plane. The heat radiation fins 21 are formed perpendicularly to the base plate portion 24. That is, the heat radiation fin 21 is a plate-like member parallel to the Y-Z plane. The plurality of heat radiation fins 21 are arranged in the X-axis direction.
散熱器2的下端(-Y軸方向)形成有安裝部22。安裝部22為突出+Z軸方向的板狀。安裝部22為平行於Z-X平面的板狀。安裝部22為安裝雷射光源5的部分。安裝部22形成有孔23。孔23貫通安裝部22開口於Y軸方向。雷射光源5以朝向+Y軸方向射出光線的方式安裝於孔23。也就是說,雷射光源5安裝於孔23中。而雷射光源5的光線的射出方向朝向+Y軸方向。 A mounting portion 22 is formed at the lower end (-Y axis direction) of the heat sink 2. The mounting portion 22 has a plate shape protruding in the + Z axis direction. The mounting portion 22 has a plate shape parallel to the Z-X plane. The mounting portion 22 is a portion where the laser light source 5 is mounted. The mounting portion 22 is formed with a hole 23. The hole 23 penetrates the mounting portion 22 and opens in the Y-axis direction. The laser light source 5 is attached to the hole 23 so as to emit light in the + Y-axis direction. That is, the laser light source 5 is installed in the hole 23. The emission direction of the light from the laser light source 5 faces the + Y axis direction.
第3圖中,安裝部22為矩形,但不限於此。安裝部22可以是其他形狀,例如圓弧形。雷射光源5也可安裝於孔23使光線朝-Y軸方向射出。然而在這個情況下,散熱鰭片21配置於液晶顯示元件13的外側。因此,會有液晶顯示裝置100的邊框部(邊緣部)無法變細的缺點。「邊框」是指包圍顯示畫面的框狀殼體的部分。近年來,使包圍顯示畫面的框狀殼體的部分變細是比較受歡迎的設計。細的邊框也稱為「窄邊框」。 In FIG. 3, the mounting portion 22 is rectangular, but is not limited thereto. The mounting portion 22 may have other shapes, such as a circular arc shape. The laser light source 5 may be attached to the hole 23 so that light is emitted in the −Y axis direction. However, in this case, the heat radiation fins 21 are arranged outside the liquid crystal display element 13. Therefore, there is a disadvantage that the frame portion (edge portion) of the liquid crystal display device 100 cannot be made thin. "Border" refers to the part of the frame-shaped casing that surrounds the display screen. In recent years, it has been a popular design to make a portion of a frame-shaped casing that surrounds a display screen thinner. A thin border is also called a "narrow border."
雷射光源5產生的熱從雷射光源5的背面(-Y軸方向側)傳像背面部1。傳到至背面部1的雷射光源5的熱會再傳倒散熱器2的下端面25(-Y軸方向側的面)。傳到散熱器2的下端面25(-Y軸方向)的熱再傳到安裝部22。傳到安裝部22的熱再傳到散熱鰭片21,排放至外部空氣。散熱器2以下端面25接觸背面部1的方式安裝於背面部1。 The heat generated by the laser light source 5 is transmitted from the back surface (the side in the -Y axis direction) of the laser light source 5 to the back surface portion 1. The heat transmitted to the laser light source 5 to the back surface portion 1 is transmitted to the lower end surface 25 (the surface on the -Y axis direction side) of the heat sink 2 again. The heat transmitted to the lower end surface 25 (-Y axis direction) of the heat sink 2 is transmitted to the mounting portion 22. The heat transmitted to the mounting portion 22 is transmitted to the heat radiating fin 21 and discharged to the outside air. The heat sink 2 is attached to the back surface portion 1 so that the lower end surface 25 contacts the back surface portion 1.
在第3圖中,安裝部22與散熱鰭片21一體成形。然而,安裝部22也可以是其他零件,但在這種情況下,安裝部22的散熱效能會有若干地下降。不過用其他零件構成安裝部22,能夠使散熱器2的製造容易,可抑制製造成本。另外,在第3圖中的1個散熱器2安裝1個雷射光源5,但1個散熱器2也可以安裝複數個雷射光源5。 In FIG. 3, the mounting portion 22 and the heat radiation fin 21 are integrally formed. However, the mounting portion 22 may be other parts, but in this case, the heat dissipation efficiency of the mounting portion 22 may be slightly reduced. However, if the mounting portion 22 is configured by other components, the manufacturing of the heat sink 2 can be facilitated, and the manufacturing cost can be suppressed. In addition, although one laser light source 5 is mounted on one heat sink 2 in FIG. 3, a plurality of laser light sources 5 may be mounted on one heat sink 2.
LED光源4具有藍色LED元件與螢光體。具體來說,LED光源4是在具備發射藍光的藍色LED元件的封裝中填充了吸收此藍光而主要發射綠光的螢光體。 The LED light source 4 includes a blue LED element and a phosphor. Specifically, the LED light source 4 is a package including a blue LED element that emits blue light, and is filled with a phosphor that absorbs the blue light and mainly emits green light.
人眼對紅色的色差感度較高。因此紅色的波長帶域的差在人眼視覺上能感受到顯著的差異。在此,波長帶域的 差是色純度的差。過去,做為液晶顯示裝置的光源所使用的白色LED特別在600nm~700nm的波長帶的紅色頻譜的能量較少。也就是說,若為了提高色純度而使用波長帶域窄的彩色濾光片將波長限制在極佳的高純度紅色的630nm~640nm的波長範圍下,透過光量會極度地降低,使光的利用效率下降。因此,會產生顯著地亮度下降的問題。在此,高純度的紅色稱為「純紅」。 The human eye has a higher sensitivity to red color difference. Therefore, the difference in the red wavelength band can make a significant difference in human vision. Here, the wavelength band The difference is a difference in color purity. In the past, a white LED used as a light source of a liquid crystal display device has a low red spectrum energy in a wavelength band of 600 nm to 700 nm. In other words, if a color filter with a narrow wavelength band is used to improve the color purity, the wavelength is limited to a wavelength range of 630nm to 640nm, which is an excellent high purity red. Reduced efficiency. Therefore, there is a problem that the brightness is significantly reduced. Here, high-purity red is called "pure red".
另一方面,雷射發光元件5的波長帶域窄,能夠抑制光的損失獲得色純度高的光。藉由採用3原色中單色性特別高的紅色的雷射發光元件5,對降低耗電與提高色純度有極佳的效果。因此,本實施例1的液晶顯示裝置100中,雷射光源5採用發出紅光的光源。 On the other hand, the laser light emitting element 5 has a narrow wavelength band, and can suppress light loss to obtain light with high color purity. The use of a red laser light emitting element 5 having particularly high monochromaticity among the three primary colors has an excellent effect on reducing power consumption and improving color purity. Therefore, in the liquid crystal display device 100 of the first embodiment, the laser light source 5 is a light source that emits red light.
能發出極佳的純紅色的630nm~640nm波長範圍的紅色的雷射光源5會隨著元件的溫度上升,電光轉換效率顯著降低。也就是說,紅色的雷射光源是容易受熱影響的光源。「純紅色」是指波長範圍窄的高純度的紅色、顏色深的紅色。顏色深的紅色最好是630~640nm的波長範圍。若雷射光源5在高溫的狀態下持續輸出高亮度的光,會讓元件劣化加速,壽命縮短。因此必須導入高效率的冷卻系統。 The red laser light source 5 which can emit an excellent pure red in the wavelength range of 630nm to 640nm will significantly decrease the electro-optical conversion efficiency as the temperature of the element rises. In other words, the red laser light source is a light source that is easily affected by heat. "Pure red" refers to high-purity red with a narrow wavelength range and deep red. The dark red is preferably in the wavelength range of 630 ~ 640nm. If the laser light source 5 continues to output high-intensity light in a high-temperature state, the degradation of the element will be accelerated, and the life will be shortened. Therefore, an efficient cooling system must be introduced.
另一方面,LED光源4的電光轉換效率對溫度的變化比起雷射光源5來說是極少。也就是說,LED光源是不容易受熱影響的光源。但是也需要有效率的散熱,不讓發熱傳遞到雷射光源5那一側。 On the other hand, the electro-optical conversion efficiency of the LED light source 4 has less change in temperature than the laser light source 5. In other words, LED light sources are light sources that are not easily affected by heat. However, efficient heat dissipation is also required to prevent heat from being transmitted to the laser light source 5 side.
雷射光源5射出的光指向性高。因此,為了獲得面 光源裝置發光的均一性,雷射光源5要求更高的位置精確度。一般使用的雷射光源5為直徑約6mm的圓筒形狀的封裝。雷射光源5將封裝壓入散熱器2的安裝部22上的孔23而固定。雷射光源5從雷射光51射出的發光側壓入散熱器2的安裝部22上的孔23。 The light emitted from the laser light source 5 has high directivity. So in order to get noodles The light source device emits light uniformly, and the laser light source 5 requires higher position accuracy. The laser light source 5 generally used is a cylindrical package having a diameter of about 6 mm. The laser light source 5 presses the package into a hole 23 in the mounting portion 22 of the heat sink 2 and fixes it. The light emitting side of the laser light source 5 from the laser light 51 is pressed into a hole 23 in the mounting portion 22 of the heat sink 2.
雷射光源5壓入安裝部22後的散熱器2會安裝於背面部1。此時,散熱鰭片21與基底板部24需要伸出背面部1的外側面(-Z軸方向)。安裝部22從背面部1的背面側(-Z軸方向側)插入開口於背面部1的安裝孔14而固定。 The heat sink 2 after the laser light source 5 is pressed into the mounting portion 22 is mounted on the back portion 1. At this time, the heat radiation fins 21 and the base plate portion 24 need to protrude from the outer side surface (-Z axis direction) of the back surface portion 1. The mounting portion 22 is inserted into the mounting hole 14 opened in the back surface portion 1 from the back surface side (-Z axis direction side) of the back surface portion 1 and fixed.
基底板部24與背面部1之間存在有斷熱部15。在此,「斷熱部」的熱傳導率可顯著地比背面部1及散熱部2的熱傳導率低。例如,斷熱部15為樹脂材料或橡膠材料。斷熱部15也可以是空氣層。空氣層希望有數mm左右的厚度。當斷熱部15為空氣層的情況下,希望在上側(+Y軸側)設置開口部,使空氣層的空氣變暖後能夠上升。另外,也希望在下側(-Y軸側)設置開口部,使低溫的空氣能夠從下側(-Y軸側)流入斷熱部。第4圖所示的斷熱部15中,低溫的空氣從X軸方向流入,暖化的空氣朝+Y軸方向上升。 A heat-insulating portion 15 is provided between the base plate portion 24 and the back surface portion 1. Here, the thermal conductivity of the “heat-cutting portion” can be significantly lower than the thermal conductivity of the back surface portion 1 and the heat radiation portion 2. For example, the thermal cutoff portion 15 is a resin material or a rubber material. The thermal insulation section 15 may be an air layer. The thickness of the air layer is desirably about several mm. When the heat insulation part 15 is an air layer, it is desirable to provide an opening part on the upper side (+ Y-axis side) so that the air in the air layer can rise after warming. In addition, it is also desirable to provide an opening portion on the lower side (-Y axis side) so that low-temperature air can flow from the lower side (-Y axis side) to the heat insulation portion. In the thermal insulation section 15 shown in FIG. 4, low-temperature air flows in from the X-axis direction, and warmed air rises in the + Y-axis direction.
也可以將斷熱部15追加在基底板部24與背面部1之間以外,例如安裝部22與背面部1之間。當例如安裝部22與LED光源陣列3a的距離較近的情況下,能夠使不容易受熱影響的LED光源的熱難以傳遞至容易受熱影響的雷射光源處。這種情況下,雷射光源5發出的熱會從安裝部22傳遞至基底板部24,再從散熱鰭片21散熱。 The heat-insulating portion 15 may be added between the base plate portion 24 and the back surface portion 1, for example, between the mounting portion 22 and the back surface portion 1. For example, when the distance between the mounting portion 22 and the LED light source array 3 a is short, it is possible to make it difficult for the heat of the LED light source that is not easily affected by heat to be transmitted to the laser light source that is easily affected by heat. In this case, the heat emitted from the laser light source 5 is transferred from the mounting portion 22 to the base plate portion 24 and is then radiated from the heat radiation fin 21.
第4圖是從-X軸方向觀看液晶顯示裝置100的構造圖。第4圖是在雷射光源5的位置以Y-Z平面切斷液晶顯示裝置100的構造圖。液晶顯示元件13、光學片12、擴散板11及導光棒10平行於X-Y平面配置。這些構成元件10、11、12、13從+Z軸方向朝向-Z軸方向按照液晶顯示元件13、光學片12、擴散板11及導光棒10的順序配置。 FIG. 4 is a structural diagram of the liquid crystal display device 100 as viewed from the −X axis direction. FIG. 4 is a structural diagram of cutting the liquid crystal display device 100 in the Y-Z plane at the position of the laser light source 5. The liquid crystal display element 13, the optical sheet 12, the diffusion plate 11, and the light guide rod 10 are arranged parallel to the X-Y plane. These constituent elements 10, 11, 12, and 13 are arranged in the order of the liquid crystal display element 13, the optical sheet 12, the diffusion plate 11, and the light guide rod 10 from the + Z axis direction to the −Z axis direction.
導光棒10的-Z軸側配置了LED光源陣列3a、3b、3c、3d、3e、3f。LED光源陣列3a、3b、3c、3d、3e、3f配置在背面部1的+Z軸方向側的表面。反射部8為在+Z軸方向具有開口部的箱形狀。反射部8的箱形狀的內側配置了LED光源陣列3及導光棒10。反射部8的底板部82配合LED光源4的形狀而開有多個孔。LED光源4從-Z軸方向插入反射部8的孔。反射部8為薄板狀,因此LED光源4以從孔中伸出+Z軸方向的狀態配置。反射部8也可以用板狀的構件製作。因此,側板部81a、81b、81c、81d及底板部82包含厚度從極薄的片狀至板狀的形狀。 LED light source arrays 3a, 3b, 3c, 3d, 3e, 3f are arranged on the -Z axis side of the light guide rod 10. The LED light source arrays 3 a, 3 b, 3 c, 3 d, 3 e, and 3 f are arranged on the surface on the + Z axis direction side of the back surface portion 1. The reflecting portion 8 has a box shape having an opening in the + Z axis direction. An LED light source array 3 and a light guide rod 10 are arranged inside the box shape of the reflection portion 8. The bottom plate portion 82 of the reflection portion 8 is formed with a plurality of holes in accordance with the shape of the LED light source 4. The LED light source 4 is inserted into the hole of the reflection portion 8 from the −Z axis direction. Since the reflecting portion 8 is thin, the LED light source 4 is arranged in a state of protruding from the hole in the + Z axis direction. The reflection portion 8 may be made of a plate-like member. Therefore, the side plate portions 81a, 81b, 81c, and 81d and the bottom plate portion 82 include shapes having extremely thin sheet shapes to plate shapes.
第5圖是面光源裝置200的構造的立體圖。第5圖是從液晶顯示元件13的顯示面側觀看的立體圖。第5圖中,是卸下液晶顯示裝置100的液晶顯示元件13、光學片12、及擴散板11的狀態。反射板8是片狀,如第5圖所示,四邊以90度向上延伸的箱型。也就是說,反射板8具有從底板部82的四邊往+Z軸方向延伸的側板部81a、81b、81c、81d。反射部8的箱型內側的表面為反射面。LED光源4的發光點配置在反射部8的+Z軸方向的面上。LED光源4的LED光41朝向液晶顯示元件13射出。 FIG. 5 is a perspective view of the structure of the surface light source device 200. FIG. 5 is a perspective view viewed from the display surface side of the liquid crystal display element 13. In FIG. 5, the liquid crystal display element 13, the optical sheet 12, and the diffusion plate 11 of the liquid crystal display device 100 are removed. The reflecting plate 8 has a sheet shape, and as shown in FIG. 5, the box shape has four sides extending upward at 90 degrees. That is, the reflection plate 8 includes side plate portions 81a, 81b, 81c, and 81d extending from the four sides of the bottom plate portion 82 in the + Z-axis direction. The box-shaped inner surface of the reflecting portion 8 is a reflecting surface. The light emitting point of the LED light source 4 is arranged on a surface in the + Z axis direction of the reflecting portion 8. The LED light 41 of the LED light source 4 is emitted toward the liquid crystal display element 13.
導光棒10的-Y軸方向側設置有雷射光51的入射 面101。導光棒10為棒狀。入射面101為棒狀的1個端面。導光棒10的+Y軸方向側的端面貼有反射片9。反射片9貼附的平面是與入射面相對的棒狀的另一端面。導光棒10的兩端通過設置在側板部81a、81b的孔。導光棒10被保持於反射部8。反射板8以薄片狀的構件製作,因此導光棒10也可保持於其他構件上。另外,如上述,反射部8也可用足以保持導光板10的程度的板狀構件製作。 Incident of the laser light 51 is provided on the -Y axis direction side of the light guide rod 10 面 101。 Surface 101. The light guide rod 10 has a rod shape. The incident surface 101 is a rod-shaped one end surface. A reflection sheet 9 is attached to an end surface of the light guide rod 10 on the + Y-axis direction side. The plane to which the reflection sheet 9 is attached is the other end surface having a rod shape opposite to the incident surface. Both ends of the light guide rod 10 pass through holes provided in the side plate portions 81a and 81b. The light guide rod 10 is held by the reflection portion 8. Since the reflecting plate 8 is made of a sheet-like member, the light guide rod 10 can also be held on other members. In addition, as described above, the reflecting portion 8 may be made of a plate-like member sufficient to hold the light guide plate 10.
導光棒10的-Y軸方向側配置雷射光源5。雷射光源5面向入射面101配置。從雷射光源5射出的雷射光51透過導光棒10的-Y軸方向側的入射面101入射導光棒10中。 A laser light source 5 is disposed on the -Y axis direction side of the light guide rod 10. The laser light source 5 is arranged facing the incident surface 101. The laser light 51 emitted from the laser light source 5 passes through the incident surface 101 on the −Y-axis direction side of the light guide rod 10 and enters the light guide rod 10.
由雷射光源5射出的雷射光51從入射面101入射導光棒10的內部。入射的雷射光51在導光棒10的內部反覆反射並朝+Y軸方向前進。反射的雷射光51的一部分從導光棒10的側面射出至外部。剛從雷射光源5射出後的雷射光51為點狀的光。然而,雷射光51一邊在導光棒10的內部前進,一邊會有一部分的雷射光51從側面射出,藉此,雷射光51由點狀的光轉變為線狀的光。當導光棒較粗的情況下,雷射光51會轉變為棒狀的光。 The laser light 51 emitted from the laser light source 5 enters the inside of the light guide rod 10 from the incident surface 101. The incident laser light 51 is repeatedly reflected inside the light guide rod 10 and advances in the + Y-axis direction. A part of the reflected laser light 51 is emitted from the side of the light guide rod 10 to the outside. The laser light 51 immediately after being emitted from the laser light source 5 is point light. However, while the laser light 51 is advancing inside the light guide rod 10, a part of the laser light 51 is emitted from the side, whereby the laser light 51 is changed from point light to linear light. When the light guide rod is thick, the laser light 51 is converted into rod-shaped light.
「點光源」是只從一個點放射光線的光源。在此「一個點」仍然具有一定程度的面積,這個程度的面積在考量到產品的性能而在光學計算下能將光源視為點來處理而不造成問題。因此,使用雷射做為光源的背光裝置需要將點光源的雷射光轉換為面光源的光學元件。此面光源是以均一強度照明液晶顯示元件13的光源。 A "point light source" is a light source that emits light from only one point. Here, "a point" still has a certain degree of area, which can be treated as a point under optical calculation without causing problems in consideration of the performance of the product. Therefore, a backlight device using a laser as a light source requires an optical element that converts laser light from a point light source into a surface light source. This surface light source is a light source that illuminates the liquid crystal display element 13 with a uniform intensity.
成為棒狀光的雷射光51與配置為陣列狀的LED光 源4射出的LED光41一起射出至反射部8的內部。「陣列狀」是指多數的要素並排排列的狀態。在此「配置為陣列狀的LED光源4」表示LED光源4排列而成的LED光源陣列3。在反射部8內部反覆反射的LED光41與雷射光51入射擴散板11。 Laser light 51 as rod-shaped light and LED light arranged in an array The LED light 41 emitted from the source 4 is also emitted to the inside of the reflection portion 8 together. "Array-like" refers to a state in which many elements are arranged side by side. Here, “the LED light sources 4 arranged in an array” means the LED light source array 3 in which the LED light sources 4 are arranged. The LED light 41 and the laser light 51 that are repeatedly reflected inside the reflection section 8 enter the diffusion plate 11.
從導光棒10射出的雷射光51以Y軸為中心軸朝全方位方向射出。全方位方向是指360度的方向。因此,朝+Z軸方向射出的光會入射擴散板11。另一方面,朝-Z軸方向射出的光會在反射部8的底板部82反射後入射擴散板11。朝X-Y平面射出的雷射光51會在反射部8的四邊向上延伸的側板部81a、81b、81c、81d反射後入射擴散板11。 The laser light 51 emitted from the light guide rod 10 is emitted in all directions with the Y axis as the central axis. The omnidirectional direction refers to a 360-degree direction. Therefore, the light emitted in the + Z axis direction enters the diffusion plate 11. On the other hand, light emitted in the -Z axis direction is reflected by the bottom plate portion 82 of the reflection portion 8 and enters the diffusion plate 11. The laser light 51 emitted toward the X-Y plane is reflected by the side plate portions 81 a, 81 b, 81 c, and 81 d extending upward on the four sides of the reflection portion 8 and enters the diffusion plate 11.
雷射光51與LED光41轉變為面狀光後入射擴散板11。擴散板11進一步將雷射光51與LED光41均一化。雷射光51與LED光41會做為被擴散板11均一化的白色面狀光朝向光學片12及液晶顯示元件13射出。 The laser light 51 and the LED light 41 are converted into planar light and enter the diffusion plate 11. The diffusion plate 11 further uniformizes the laser light 51 and the LED light 41. The laser light 51 and the LED light 41 are emitted toward the optical sheet 12 and the liquid crystal display element 13 as white planar light uniformized by the diffusion plate 11.
反射部8及導光棒10是將從雷射光源5射出時為點狀光的雷射光51轉換為面狀光的導光部30。導光棒10將雷射光51從點狀光轉換為線狀光(棒狀光)。反射部8將雷射光51從線狀光(棒狀光)轉換為面狀光。因此,做為將雷射光51轉換為面狀光的方法,也能夠採用側光型的導光板。在這個情況下,雷射光51被側光型的導光板轉變為面狀光。而LED光41則藉由直下型排列的LED光源4轉換為面狀光。側光型的導光板相對LED光源4係配置在面光源裝置的光射出面側。 The reflecting portion 8 and the light guiding rod 10 are light guiding portions 30 that convert the laser light 51 that is point light when emitted from the laser light source 5 into planar light. The light guide rod 10 converts the laser light 51 from a point light into a linear light (rod light). The reflection unit 8 converts the laser light 51 from linear light (rod light) to planar light. Therefore, as a method of converting the laser light 51 into planar light, a side-light type light guide plate can also be used. In this case, the laser light 51 is converted into planar light by a side-light type light guide plate. The LED light 41 is converted into planar light by the LED light sources 4 arranged in a direct type. The side light type light guide plate is disposed on the light emitting surface side of the surface light source device with respect to the LED light source 4.
製作側光型的導光板的方式例如用白色墨水印刷反射點於壓克力板上的絲網印刷方式、在壓克力板上加上凹凸 構造的成型方式、將點狀的黏著材料貼上壓克力板與反射板的黏著點方式及溝加工方式等。光源射出的光從導光板的側部入射。入射導光板的光反覆地表面反射後在導光板的寬廣的平面上擴展開來。此時,若有反射點等,光會散射而從導光板的表面往外射出。導光板中靠近光源的反射點的面積小,越遠離光源反射點的面積越大。藉此,導光板能夠形成均一的面狀光。 The method of making a side-light type light guide plate is, for example, a screen printing method in which white dots are used to print reflection dots on an acrylic plate, and an acrylic plate is provided with irregularities. Structure forming method, point-type adhesive material sticking to acrylic plate and reflective plate, point-of-adhesion method, groove processing method, etc. The light emitted from the light source is incident from the side of the light guide plate. The light incident on the light guide plate is reflected repeatedly on the ground surface and spreads out on a wide plane of the light guide plate. At this time, if there is a reflection point or the like, light is scattered and emitted outward from the surface of the light guide plate. The area of the light guide plate near the reflection point of the light source is small, and the area farther from the light source reflection point is larger. Thereby, the light guide plate can form uniform planar light.
然而,使用本實施例1說明的反射部8及導光棒10的面光源裝置200,因為雷射光51與LED光41在反射部8的箱體內部混合這點,而能夠以簡單的構造產生均一性高的面狀光。 However, the surface light source device 200 using the reflection portion 8 and the light guide rod 10 described in the first embodiment can generate the light with a simple structure because the laser light 51 and the LED light 41 are mixed inside the case of the reflection portion 8. Planar light with high uniformity.
第6圖與第4圖同樣為從-X軸方向觀看液晶顯示裝置100的構造圖。第6圖除去液晶顯示元件13、光學片12及擴散板11。也就是說,第6圖僅顯示液晶顯示裝置100中的面光源裝置200的部分。第6圖是在雷射光源5的位置以Y-Z平面切斷液晶顯示裝置100的構造圖。 6 is a structural view of the liquid crystal display device 100 as viewed from the −X axis direction, similarly to FIG. 4. FIG. 6 excludes the liquid crystal display element 13, the optical sheet 12, and the diffusion plate 11. That is, FIG. 6 shows only a part of the surface light source device 200 in the liquid crystal display device 100. FIG. 6 is a structural diagram of cutting the liquid crystal display device 100 in the Y-Z plane at the position of the laser light source 5.
第6圖是用來說明LED光源4產生的熱的流動與雷射光源5產生的熱的流動。液晶顯示元件13主要以玻璃構成。而擴散板11、光學片12及反射部8主要以樹脂構成。樹脂或玻璃構成的這些材料熱傳導率低。 FIG. 6 illustrates the flow of heat generated by the LED light source 4 and the flow of heat generated by the laser light source 5. The liquid crystal display element 13 is mainly composed of glass. The diffusion plate 11, the optical sheet 12, and the reflection portion 8 are mainly made of resin. These materials made of resin or glass have low thermal conductivity.
LED光源4的+Z軸方向配置有熱傳導率低的反射部8。因此,LED光源4產生的熱不容易傳遞至+Z軸方向。另一方面,LED光源4的-Z軸方向配置有熱導率高的背面部1。因此,LED光源4產生的熱容易傳遞至-Z軸方向。根據以上所述,LED光源4產生的熱比較難透過反射部8流向+Z軸方向。這是第6圖除去液晶顯示元件13、光學膜12、擴散板11及反射部8 的理由。 The LED light source 4 is provided with a reflecting portion 8 having a low thermal conductivity in the + Z axis direction. Therefore, the heat generated by the LED light source 4 is not easily transmitted to the + Z axis direction. On the other hand, in the -Z axis direction of the LED light source 4, a back surface portion 1 having high thermal conductivity is arranged. Therefore, the heat generated by the LED light source 4 is easily transmitted to the -Z axis direction. As described above, it is relatively difficult for the heat generated by the LED light source 4 to flow through the reflecting portion 8 to the + Z axis direction. This is FIG. 6 except that the liquid crystal display element 13, the optical film 12, the diffusion plate 11, and the reflection portion 8 are removed. Reason.
使用2種光源的液晶顯示裝置100中,使各個光源4、5的光41、51的輸出最佳化,使光輸出為白色。例如,雷射光源5射出的雷射光51的總放射束為1W的情況下,LED光源4射出的LED光41的總放射束必須有3W左右。藉此,雷射光51與LED光41混合的光形成白色。此時,根據雷射光源5與LED光源4各自的電光變換效率,若各光源4、5的溫度為室溫左右(30度左右)的話,發熱量皆相當於3W左右。為了提高顯示畫面的亮度,而增加光源4、5射出的放射束的話,光源4、5的發熱量也會隨之增加。然而,即使光源4、5的發熱量增加,如果能充分對光源4、5散熱的話,各光源4、5的元件的溫度變化減小,發熱量也不會大幅變化。也就是說,雷射光源5的發熱量及LED光源4的發熱量大致為同程度的3W。相反地,若光源4、5的散熱不充分的話,各光源4、5的元件的溫度升高,電光變換效率下降。結果造成各光源4、5的發熱量增加,陷入各光源4、5的溫度逐漸上升的惡性循環。也就是說,為了不發生熱造成的問題,需要正確地估計裝置使用的環境溫度與在該環境溫度下的發熱量,提供合適的高效率的散熱機能。 In the liquid crystal display device 100 using two types of light sources, the output of the light 41 and 51 of each of the light sources 4 and 5 is optimized so that the light output is white. For example, when the total radiation beam of the laser light 51 emitted from the laser light source 5 is 1W, the total radiation beam of the LED light 41 emitted from the LED light source 4 must be about 3W. Thereby, the light mixed with the laser light 51 and the LED light 41 becomes white. At this time, according to the respective electro-optical conversion efficiencies of the laser light source 5 and the LED light source 4, if the temperature of each of the light sources 4, 5 is about room temperature (about 30 degrees), the calorific value is equivalent to about 3W. In order to increase the brightness of the display screen, if the radiation beams emitted from the light sources 4 and 5 are increased, the heat generation of the light sources 4 and 5 will also increase accordingly. However, even if the amount of heat generated by the light sources 4 and 5 is increased, if the light sources 4 and 5 can be sufficiently radiated, the temperature change of the elements of each of the light sources 4 and 5 will be reduced, and the amount of heat generated will not change significantly. In other words, the amount of heat generated by the laser light source 5 and the amount of heat generated by the LED light source 4 are approximately 3W. Conversely, if the heat radiation of the light sources 4 and 5 is insufficient, the temperature of the elements of each of the light sources 4 and 5 increases, and the electro-optical conversion efficiency decreases. As a result, the amount of heat generated by each of the light sources 4 and 5 increases, and a vicious cycle in which the temperature of each of the light sources 4 and 5 gradually rises is caused. In other words, in order not to cause problems caused by heat, it is necessary to accurately estimate the ambient temperature used by the device and the amount of heat generated at the ambient temperature, and to provide a suitable and efficient heat dissipation function.
雷射光源5產生的熱18從散熱器2的安裝部22傳遞至基底板部24後再傳遞至散熱鰭片21,放出至周遭空氣16。散熱器2配置在液晶顯示裝置100的最底面側(-Y軸側)。散熱鰭片21放出至周遭空氣16的熱18往+Y軸方向移動。這是因為,從散熱鰭片21接收到熱18的空氣16比周遭空氣輕而上昇。因此,散熱鰭片21會有來自-Y軸方向或-Z軸方向的新鮮空氣流 入。「新鮮空氣」是指沒有接收來自散熱鰭片21的熱18或來自背面部1的熱17的空氣。由固體表面至空氣的熱傳遞量會因為固體表面的溫度與空氣的溫度差增大而變多。也就是說,流入散熱器2的空氣溫度越低,散熱器2能夠高效率地將熱18釋放。另外,也可將雷射光源5產生的熱18高效率地釋放至周圍空氣16中。 The heat 18 generated by the laser light source 5 is transmitted from the mounting portion 22 of the heat sink 2 to the base plate portion 24 and then to the heat radiation fins 21 and is released to the surrounding air 16. The heat sink 2 is disposed on the bottommost surface side (-Y axis side) of the liquid crystal display device 100. The heat radiating fin 21 emits heat 18 from the surrounding air 16 to the + Y axis direction. This is because the air 16 which receives the heat 18 from the heat radiation fin 21 rises lighter than the surrounding air. Therefore, the cooling fin 21 has a fresh air flow from the -Y axis direction or the -Z axis direction. Into. “Fresh air” means air that does not receive heat 18 from the heat dissipation fins 21 or heat 17 from the back surface portion 1. The amount of heat transfer from the solid surface to the air will increase as the temperature difference between the solid surface and air increases. That is, the lower the temperature of the air flowing into the radiator 2, the more efficiently the radiator 18 can release the heat 18. In addition, the heat 18 generated by the laser light source 5 can also be efficiently released into the surrounding air 16.
另一方面,各個LED光源陣列3a、3b、3c、3d、3e、3f安裝於背面部1。LED光源4產生的熱17傳遞至光源陣列3a、3b、3c、3d、3e、3f的各個基板後再傳遞至背面部1。背面部1的厚度為2mm左右。背面部1的剖面面積小,因此傳遞至背面部1的熱不容易在X-Y面方向上傳遞。 On the other hand, each of the LED light source arrays 3a, 3b, 3c, 3d, 3e, and 3f is mounted on the back surface portion 1. The heat 17 generated by the LED light source 4 is transmitted to the respective substrates of the light source arrays 3a, 3b, 3c, 3d, 3e, and 3f, and then is transmitted to the back surface portion 1. The thickness of the back surface portion 1 is about 2 mm. Since the cross-sectional area of the back surface portion 1 is small, the heat transmitted to the back surface portion 1 is not easily transmitted in the X-Y plane direction.
LED光源陣列3b、3c、3d、3e、3f遠離散熱器2配置。因此,LED光源陣列3b、3c、3d、3e、3f的熱17大多從背面部1的背面側(-Z軸方向側)的面釋出至空氣中。 The LED light source arrays 3b, 3c, 3d, 3e, and 3f are arranged away from the heat sink 2. Therefore, most of the heat 17 of the LED light source arrays 3b, 3c, 3d, 3e, and 3f is released into the air from the surface of the back surface side (the -Z axis direction side) of the back surface portion 1.
在此,討論靠近散熱器2的LED光源陣列3a放出的熱17。LED光源陣列3a配置在散熱器2的+Y軸方向。因此,LED光源陣列3a放出的熱17不容易傳遞至散熱器2。第1理由是背面部1的剖面積小,因此傳遞至背面部1的熱17不容易在X-Y平面上的方向傳遞。第2理由是從背面部1釋放至空氣中的熱17如先前所述地上昇,朝+Y軸方向移動。第3理由是散熱器2的基底板部24與背面部1之間存在有斷熱部15。 Here, the heat 17 emitted from the LED light source array 3a near the heat sink 2 will be discussed. The LED light source array 3 a is arranged in the + Y-axis direction of the heat sink 2. Therefore, the heat 17 emitted from the LED light source array 3 a is not easily transmitted to the heat sink 2. The first reason is that the cross-sectional area of the back surface portion 1 is small, and therefore the heat 17 transmitted to the back surface portion 1 is not easily transmitted in the X-Y plane direction. The second reason is that the heat 17 released into the air from the back surface portion 1 rises as described above and moves in the + Y-axis direction. The third reason is that there is a thermal break 15 between the base plate portion 24 and the back surface portion 1 of the heat sink 2.
散熱器2配置在LED光源3a的下側(-Y軸方向側)。也就是說,LED光源陣列3a所安裝的部分的背面部1的背面(-Z軸方向側的面)會直接接觸從散熱器2接收熱18後上昇 而來的空氣16。因此,LED光源陣列3a、3b、3c、3d、3e、3f放出至空氣中的熱17從背面部1釋放至空氣16。在此,空氣16是從散熱器2接收熱18後上昇而來的空氣。 The heat sink 2 is disposed below the LED light source 3a (-Y-axis direction side). That is, the back surface (the surface on the -Z axis side) of the back surface portion 1 of the portion where the LED light source array 3a is mounted directly contacts the heat sink 18 and rises Coming air 16. Therefore, the heat 17 emitted from the LED light source arrays 3a, 3b, 3c, 3d, 3e, and 3f into the air is released from the back surface portion 1 to the air 16. Here, the air 16 is air that has risen after receiving heat 18 from the radiator 2.
從散熱器2的散熱鰭片21接收熱18而暖化的空氣16向上昇。LED光源4又配置在散熱器2的上方(+Y軸方向)。因此,LED光源4放出的熱17會從背面部1釋放至在散熱鰭片21暖化的空氣16。也就是說,越上方(+Y軸方向)LED光源4的冷卻性能越降低。 The warmed air 16 rises as it receives heat 18 from the radiating fins 21 of the heat sink 2. The LED light source 4 is disposed above the heat sink 2 (+ Y-axis direction). Therefore, the heat 17 emitted from the LED light source 4 is released from the back surface portion 1 to the air 16 warmed by the heat radiation fins 21. In other words, the cooling performance of the LED light source 4 decreases as it goes upward (+ Y-axis direction).
然而,LED光源4比起雷射光源5來說,對熱的特性(熱特性)較佳。因此,LED光源4對溫度有較大容許度,能夠在品質上不成問題的範圍內設計。 However, the LED light source 4 has better thermal characteristics (thermal characteristics) than the laser light source 5. Therefore, the LED light source 4 has a large tolerance for temperature, and can be designed within a range that does not cause a problem in quality.
反之,雷射光源5比起LED光源4來說,熱特性較差。「熱特性差」是指對溫度的容許度低。散熱器2配置在液晶顯示裝置100的最底面側(-Y軸側)。因此,散熱鰭片21會有新鮮空氣流入。「新鮮空氣」是指沒有接收來自散熱鰭片21的熱18或來自背面部1的熱17的空氣。由固體表面至空氣的熱傳遞量會因為固體表面的溫度與空氣的溫度差增大而變多。也就是說,流入散熱器2的空氣溫度越低,散熱器2能夠高效率地將熱18釋放。另外,也可將雷射光源5產生的熱18高效率地釋放至周圍空氣16中。 In contrast, the laser light source 5 has worse thermal characteristics than the LED light source 4. "Poor thermal characteristics" means that the tolerance to temperature is low. The heat sink 2 is disposed on the bottommost surface side (-Y axis side) of the liquid crystal display device 100. Therefore, fresh air will flow into the heat dissipation fins 21. “Fresh air” means air that does not receive heat 18 from the heat dissipation fins 21 or heat 17 from the back surface portion 1. The amount of heat transfer from the solid surface to the air will increase as the temperature difference between the solid surface and air increases. That is, the lower the temperature of the air flowing into the radiator 2, the more efficiently the radiator 18 can release the heat 18. In addition, the heat 18 generated by the laser light source 5 can also be efficiently released into the surrounding air 16.
液晶顯示裝置100具備雷射光源5、LED光源4及散熱器2。雷射光源5放出雷射光51。LED光源4放出LED光41。散熱器2保持雷射光源5並同時將雷射光源5產生的熱傳遞至空氣中。雷射光源5配置在LED光源4的下側。 The liquid crystal display device 100 includes a laser light source 5, an LED light source 4, and a heat sink 2. The laser light source 5 emits laser light 51. The LED light source 4 emits LED light 41. The heat sink 2 holds the laser light source 5 and at the same time transfers heat generated by the laser light source 5 to the air. The laser light source 5 is disposed below the LED light source 4.
液晶顯示裝置100具備導光部30。導光部30從入射端部射入雷射光51,並轉換為面狀光後射出。從導光部30射出的雷射光51及LED光41會從開口部83射出。LED光源4具備複數個,朝向開口部83二維地排列。開口部83具有光射出面的功能。也就是說,光射出面是射至於開口部30f的假想面。入射端部在實施例1中是入射面101。採用如上述側光型導光板的情況下,就是光入射的側面。 The liquid crystal display device 100 includes a light guide unit 30. The light guide unit 30 enters the laser light 51 from the incident end portion, converts it into planar light, and emits it. The laser light 51 and the LED light 41 emitted from the light guide 30 are emitted from the opening 83. The LED light source 4 includes a plurality of LED light sources 4 and is arranged two-dimensionally toward the opening 83. The opening portion 83 functions as a light exit surface. That is, the light exit surface is an imaginary surface that hits the opening 30f. The incident end portion is the incident surface 101 in the first embodiment. When an edge-light type light guide plate as described above is used, it is the side where light is incident.
導光部30具備導光棒10及反射部8。導光棒10具有入射面101,將前述的雷射光51轉換為線狀光後射出。反射部8將導光棒10射出的雷射光51轉換為面狀光。LED光源4配置在與反射部8的開口部83相對的面上。導光部30將轉換為面狀光的雷射光51與LED光41混合後射出。入射面101是入射端部。開口部83具有光射出面的功能。 The light guide section 30 includes a light guide rod 10 and a reflection section 8. The light guide rod 10 has an incident surface 101, and converts the aforementioned laser light 51 into linear light and emits the same. The reflection section 8 converts the laser light 51 emitted from the light guide rod 10 into planar light. The LED light source 4 is disposed on a surface facing the opening portion 83 of the reflection portion 8. The light guide unit 30 mixes the laser light 51 converted into the planar light with the LED light 41 and outputs the mixed light. The incident surface 101 is an incident end portion. The opening portion 83 functions as a light exit surface.
如以上所述,實施例1所記載的發明藉由使用紅色的雷射發光元件做為光源,能夠實現較廣的色彩重現範圍。而實施例1記載的發明能夠獲得一種背光裝置,其構造使得不容易受熱影響的LED光源的熱難以朝向容易受熱影響的雷射光源傳遞。 As described above, the invention described in Embodiment 1 can realize a wide color reproduction range by using a red laser light emitting element as a light source. In contrast, the invention described in Embodiment 1 can provide a backlight device having a structure that makes it difficult for the heat of the LED light source that is not easily affected by heat to be transmitted toward the laser light source that is easily affected by heat.
實施例2 Example 2
第7圖係本發明實施例2的液晶顯示裝置102的背面立體圖。與第1圖所示的實施例1的液晶顯示裝置100的不同點為散熱器2a、2b、2c、2d、2e中,配置在水平方向(X軸方向)內側的散熱器2b、2c、2d的散射面積比配置在水平方向外側的散熱器2a、2e的散熱面積大。 FIG. 7 is a rear perspective view of a liquid crystal display device 102 according to Embodiment 2 of the present invention. The difference from the liquid crystal display device 100 of the first embodiment shown in FIG. 1 is the heat sinks 2a, 2b, 2c, 2d, and 2e, which are arranged inside the horizontal direction (X-axis direction). The scattering area is larger than the radiation area of the heat sinks 2a and 2e arranged on the outer side in the horizontal direction.
除了上述差異點外,實施例2與實施例1相同。也就是說,背面部1、斷熱部15、LED光源陣列3、LED光源4、雷射光源5、反射部8、反射片9、導光棒10、擴散板11、光學片12、液晶顯示元件13、以及散熱器2的散熱面積以外的構造與實施例1相同。 Except for the differences, the second embodiment is the same as the first embodiment. In other words, the rear portion 1, the heat-dissipating portion 15, the LED light source array 3, the LED light source 4, the laser light source 5, the reflection portion 8, the reflection sheet 9, the light guide rod 10, the diffusion plate 11, the optical sheet 12, the liquid crystal display Structures other than the heat radiation area of the element 13 and the heat sink 2 are the same as those of the first embodiment.
例如,第7圖的例子中位於水平方向的外側的散熱器2a、2e的散熱鰭片21是14片。然而,配置於散熱器2a、2e內側的散熱器2b、2d的散熱鰭片是15片。位於最內側的散熱鰭片2c的散熱鰭片21是18片。如此一來,散熱器2的配置越接近內側,其散熱鰭片21的片數越多,散熱面積增大。 For example, in the example of FIG. 7, there are 14 radiating fins 21 of the heat sinks 2 a and 2 e located on the outer side in the horizontal direction. However, there are 15 radiating fins of the heat sinks 2b and 2d arranged inside the heat sinks 2a and 2e. There are 18 heat radiating fins 21 on the innermost heat radiating fin 2c. In this way, the closer the heat sink 2 is arranged to the inside, the larger the number of the heat radiation fins 21, and the heat radiation area increases.
液晶顯示裝置102中,液晶驅動用的時序控制器電路基板、驅動電源基板及影像信號處理電路基板等周邊元件會配置在背面部1上的周邊元件配置位置19。第7圖及第8圖中,以虛線表示周邊元件配置位置19。 In the liquid crystal display device 102, peripheral elements such as a timing controller circuit substrate for a liquid crystal drive, a driving power source substrate, and a video signal processing circuit substrate are arranged at a peripheral element placement position 19 on the rear portion 1. In FIGS. 7 and 8, the peripheral element arrangement position 19 is indicated by a dotted line.
這些周邊元件的配置位置19會根據信號線的配線長度或液晶顯示裝置102的設計、各元件的重心位置而決定。然而,通常周邊元件會集中在背面部1的中心部位。大多的周邊元件會產生熱。周邊元件安裝有電解電容器、發熱量多的LSI及開關元件用的散熱器等高度比較高的元件。也就是說,周邊元件配置位置19上會產生熱,並且安裝有高度比較高的零件。 The arrangement position 19 of these peripheral elements is determined according to the wiring length of the signal line, the design of the liquid crystal display device 102, and the position of the center of gravity of each element. However, the peripheral elements are usually concentrated at the center of the back surface portion 1. Most peripheral components generate heat. Peripheral components are mounted with relatively high height components such as electrolytic capacitors, LSIs with high heat generation, and heat sinks for switching elements. In other words, heat is generated at the peripheral element arrangement position 19, and parts with a relatively high height are mounted.
第8圖是從-X軸方向觀看液晶顯示裝置102的構造圖。第8圖是在包含周邊元件配置位置19的雷射光源5的位置以Y-Z平面切斷液晶顯示裝置102的構造圖。與第6圖所示的液晶顯示裝置100的構造不同點在於追加了周邊元件配置位置 19。另外,與第6圖所示的液晶顯示裝置100的構造不同點在於周邊元件配置位置19的下方(-Y軸方向)產生空氣氣流的亂流20。 FIG. 8 is a configuration diagram of the liquid crystal display device 102 viewed from the −X axis direction. FIG. 8 is a structural diagram of the liquid crystal display device 102 cut in the Y-Z plane at the position of the laser light source 5 including the peripheral element arrangement position 19. The difference from the structure of the liquid crystal display device 100 shown in FIG. 6 is that a peripheral element arrangement position is added. 19. The structure of the liquid crystal display device 100 is different from that of the liquid crystal display device 100 shown in FIG. 6 in that a turbulent flow 20 of airflow is generated below the peripheral element placement position 19 (-Y axis direction).
從散熱器2的散熱鰭片21接收熱18而暖化的外部空氣16朝+Y軸方向上昇。然而,周邊元件的配置在散熱器2的上方(+Y軸方向)妨礙了流路,在這個情況下,上昇氣流受阻,而產生渦流等空氣氣流的亂流20。 The warmed external air 16 receives heat 18 from the radiating fins 21 of the heat sink 2 and rises in the + Y-axis direction. However, the arrangement of peripheral elements above the heat sink 2 (+ Y-axis direction) obstructs the flow path. In this case, the updraft is blocked, and a turbulent flow 20 of airflow such as a vortex is generated.
當產生空氣氣流的亂流20時,流路的壓力損失增加,流過散熱器2的空氣16的流速下降。結果造成散熱鰭片21往空氣16的散熱量減少。也就是說,當周邊元件的配置在散熱器2的上方(+Y軸方向)妨礙了流路,配置在周邊元件下方(-Y軸方向)的散熱器2b、2c、2d的散熱能力比起上方(+Y軸方向)沒有配置周邊元件的散熱器2a、2e的散熱能力,每單位散熱面積的散熱能力低。 When the turbulent flow 20 of the air flow is generated, the pressure loss in the flow path increases, and the flow velocity of the air 16 flowing through the radiator 2 decreases. As a result, the heat radiation amount of the heat radiation fins 21 to the air 16 is reduced. That is, when the peripheral elements are arranged above the heat sink 2 (+ Y-axis direction) hinder the flow path, the heat dissipation capabilities of the heat sinks 2b, 2c, and 2d arranged below the peripheral elements (-Y-axis direction) are compared with There is no heat dissipation capability of the heat sinks 2a, 2e provided with peripheral elements above (+ Y-axis direction), and the heat dissipation capability per unit of heat dissipation area is low.
配置在周邊元件配置位置19的周邊元件中有很多會產生熱的元件。液晶顯示裝置102做為一般產品使用時,通常會收納於樹脂性的筐體等當中。因此,熱源集中且熱流束密度增加的水平方向的中央部的空氣16及水平方向中央部的背面部1比起周邊部溫度更高。「熱流束密度」單純是指每單位體積的熱流束量。 Many of the peripheral elements arranged at the peripheral element arrangement position 19 generate heat. When the liquid crystal display device 102 is used as a general product, it is usually stored in a resin case or the like. Therefore, the air 16 in the horizontal central portion and the back surface portion 1 in the horizontal central portion where the heat source is concentrated and the heat flux density increases are higher in temperature than the peripheral portions. "Heat flux density" simply refers to the amount of heat flux per unit volume.
散熱器2與背面部1之間存在有斷熱部15。斷熱部15能夠妨礙背面部1往散熱器2的熱傳導。然而,無法防止來自背面部1的熱輻射等。散熱器2b、2c、2d受到周邊元件的輻射熱而溫度上昇。因此,配置於水平方向中央部的散熱器2b、2c、 2d的散熱鰭片21的溫度會比配置於水平方向周邊部的散熱氣2a、2e的散熱鰭片21的溫度高。從固體表面往空氣的熱傳遞量會隨固體表面的溫度與空氣的溫度的差越大而越多。因此,即使相同溫度的外部空氣16流入散熱器2的散熱鰭片21,配置於水平方向中央部的散熱器2b、2c、2d散熱能力也會比配置於水平方向周邊部的散熱氣2a、2e的散熱鰭片21的散熱能力差。 A heat-insulating portion 15 is provided between the heat sink 2 and the back surface portion 1. The heat interruption portion 15 can prevent heat conduction from the back surface portion 1 to the heat sink 2. However, heat radiation and the like from the back surface portion 1 cannot be prevented. The heat sinks 2b, 2c, and 2d are subjected to radiant heat from peripheral elements, and their temperature rises. Therefore, the heat sinks 2b, 2c, and The temperature of the heat radiating fins 2d of 2d is higher than the temperature of the heat radiating fins 21 of the heat radiating gases 2a and 2e arranged in the horizontal peripheral portion. The amount of heat transfer from the solid surface to the air will increase as the difference between the temperature of the solid surface and the temperature of the air increases. Therefore, even if the outside air 16 having the same temperature flows into the radiating fins 21 of the radiator 2, the heat dissipating capacity of the radiators 2b, 2c, and 2d disposed in the horizontal central portion is greater than that of the heat radiating gas 2a, 2e disposed in the horizontal peripheral portion. The heat-dissipating fin 21 has a poor heat-dissipating capability.
在此,將散熱器2a、2b、2c、2d、2e配置在背面部1的Y軸方向的下方附近的情況下,使配置於水平方向(X軸方向)的內側的散熱器2b、2c、2d的散熱面積比配置於水平方向的外側的散熱器2a、2e的散熱面積大。藉此,改善配置於水平方向的內側的散熱器2b、2c、2d的散熱能力。也就是說,不靠向雷射光源5配置的位置,散熱器2也能夠將雷射光源5產生的熱18有效率地釋放至空氣16中。 Here, when the heat sinks 2a, 2b, 2c, 2d, and 2e are arranged near the lower side in the Y-axis direction of the back portion 1, the heat sinks 2b, 2c, which are arranged inside the horizontal direction (X-axis direction) The heat radiation area of 2d is larger than the heat radiation area of the heat sinks 2a and 2e arrange | positioned on the outer side in a horizontal direction. Thereby, the heat radiation ability of the heat sinks 2b, 2c, and 2d arrange | positioned inside the horizontal direction is improved. That is, the heat sink 2 can efficiently release the heat 18 generated by the laser light source 5 into the air 16 without relying on the position where the laser light source 5 is arranged.
在此,將散熱面積增大的方法已經說明了增加散熱鰭片21的片數的例子。然而,也可以增加散熱鰭片21的大小來增加散熱面積。本次是將配置於周邊元件配置位置19的下方(-Y軸方向)的散熱器2b、2c、2d中最內側的散熱器2c的散熱面積增到最大。然而,根據周邊元件配置的狀況,也可使散熱器2b、2d的散熱面積的大小與散熱器2c的散熱面積的大小相同。 Here, the method of increasing the heat radiation area has been described as an example of increasing the number of heat radiation fins 21. However, the size of the heat dissipation fins 21 can also be increased to increase the heat dissipation area. This time, the heat radiation area of the innermost heat sink 2c among the heat sinks 2b, 2c, and 2d arranged below (-Y axis direction) the peripheral element placement position 19 is maximized. However, the size of the heat radiation area of the heat sinks 2b and 2d may be the same as the size of the heat radiation area of the heat sink 2c according to the condition of the arrangement of the peripheral elements.
雷射光源5有複數個,沿著前述入射端部排列。排列的雷射光源5當中,位於兩端部的雷射光源5的散熱器2的散熱能力比起夾於兩端部間的雷射光源5的散熱器2的散熱能力小。入射端部在實施例1中是排列於X軸方向的複數個導光棒10 的入射面101。入射面101在X軸方向上配置複數個,雷射光源5面向入射面101配置。而採用前述的側光型的導光板的情況下,入射面為光入射的側面。 A plurality of laser light sources 5 are arranged along the incident end. Among the arrayed laser light sources 5, the heat radiation capability of the heat sink 2 of the laser light source 5 located at both end portions is smaller than that of the heat sink 2 of the laser light source 5 sandwiched between the two end portions. The incident end is a plurality of light guide rods 10 arranged in the X-axis direction in Example 1. The incidence surface 101. A plurality of incident surfaces 101 are arranged in the X-axis direction, and the laser light source 5 is arranged facing the incident surface 101. On the other hand, in the case of using the above-mentioned side-light type light guide plate, the incident surface is the side where the light is incident.
在上述各實施例中,會使用「中心」、「水平」或「垂直」等表示元件的位置關係的用語或者是表示元件的形狀的用語。這些用語包含考量到製造上的公差與組裝上的偏差的範圍。 In each of the above-mentioned embodiments, terms such as "center", "horizontal", or "vertical" are used to indicate the positional relationship of the elements or terms to indicate the shape of the elements. These terms cover the range from manufacturing tolerances to assembly tolerances.
以上雖說明了本發明的實施例,但本發明並不限定於上述的實施例。 Although the embodiments of the present invention have been described above, the present invention is not limited to the above-mentioned embodiments.
1‧‧‧背面部 1‧‧‧ back
2‧‧‧散熱器 2‧‧‧ radiator
3、3a、3b、3c、3d、3e、3f‧‧‧LED光源陣列 3, 3a, 3b, 3c, 3d, 3e, 3f‧‧‧LED light source array
4‧‧‧LED光源 4‧‧‧LED light source
41‧‧‧LED光 41‧‧‧LED light
5‧‧‧雷射光源 5‧‧‧laser light source
51‧‧‧雷射光 51‧‧‧laser light
8‧‧‧反射部 8‧‧‧Reflection
9‧‧‧反射片 9‧‧‧Reflector
10‧‧‧導光棒 10‧‧‧light guide
11‧‧‧擴散板 11‧‧‧ diffuser
12‧‧‧光學片 12‧‧‧ Optical Sheet
13‧‧‧液晶顯示元件 13‧‧‧LCD display element
15‧‧‧斷熱部 15‧‧‧Insulation
22‧‧‧安裝部 22‧‧‧Mounting Department
24‧‧‧基底板部 24‧‧‧ base plate
30‧‧‧導光部 30‧‧‧light guide
83‧‧‧開口部 83‧‧‧ opening
100‧‧‧液晶顯示裝置 100‧‧‧LCD display device
101‧‧‧入射端面 101‧‧‧incident face
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CN105425467A (en) * | 2016-01-04 | 2016-03-23 | 京东方科技集团股份有限公司 | Light source, backlight, and display device |
CN109343275B (en) * | 2018-11-28 | 2021-07-09 | 厦门天马微电子有限公司 | Backlight module and display device |
CN112083598B (en) * | 2019-06-13 | 2022-10-11 | 海信视像科技股份有限公司 | Backlight module, driving method thereof and display device |
CN111405090A (en) * | 2020-03-18 | 2020-07-10 | Oppo广东移动通信有限公司 | Camera calling method of mobile equipment and mobile equipment |
CN112599509A (en) * | 2020-11-09 | 2021-04-02 | 新沂市锡沂高新材料产业技术研究院有限公司 | Solid-state illumination light source with high brightness and adjustable color temperature |
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WO2012099099A1 (en) * | 2011-01-21 | 2012-07-26 | 三菱電機株式会社 | Surface light source device and liquid crystal display device |
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TW201142436A (en) * | 2010-04-15 | 2011-12-01 | Mitsubishi Electric Corp | Backlight device and liquid crystal display device |
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