CN210518997U

CN210518997U - Copper-based circuit board with heat dissipation function

Info

Publication number: CN210518997U
Application number: CN201921229240.3U
Authority: CN
Inventors: 黄天琴; 苟军
Original assignee: Shenzhen Mingsihai Electronic Technology Co Ltd
Current assignee: Shenzhen Mingsihai Electronic Technology Co Ltd
Priority date: 2019-07-30
Filing date: 2019-07-30
Publication date: 2020-05-12
Anticipated expiration: 2029-07-30

Abstract

The utility model discloses a copper base circuit board with heat dissipation function, including base plate, electrical components and heat-conducting plate, the inside reservation of base plate has first louvre, the outside of radiator-grid is provided with first metal sheet, the lower surface of base plate is connected with the heat-conducting plate, and the surface of heat-conducting plate has seted up the second louvre, the lower surface of heat-conducting plate is connected with the go-between, and the bottom fixedly connected with fixed plate of go-between, both ends all are connected with the connecting block about the upper surface of bottom plate, and the upper surface of connecting block is connected with the lower surface paste of heat-conducting plate, the upper surface intermediate position fixedly connected with riser of bottom plate, and the equidistant notch of having seted up in top of riser, be provided with. The copper-based circuit board with the heat dissipation function is convenient for conducting heat away from an electrical element, so that the electrical element cannot be damaged due to excessive heating.

Description

Copper-based circuit board with heat dissipation function

Technical Field

The utility model relates to a copper base circuit board technical field specifically is a copper base circuit board with heat dissipation function.

Background

The circuit board is an important part in the electronic equipment, and a plurality of chip elements and circuits are arranged on the surface of the circuit board, so that the electronic equipment can be ensured to normally operate, and the performance of the electronic equipment is ensured;

however, when the existing circuit board in the market is used, the heat dissipation performance of the existing circuit board is poor, and the existing circuit board is easily damaged by heat, so that the normal operation of electronic equipment is affected, and therefore, a copper-based circuit board with a heat dissipation function is developed to solve the problems.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a copper base circuit board with heat dissipation function to when solving the circuit board that has now on the market that proposes in the above-mentioned background art, its self heat dispersion is relatively poor, leads to being heated easily impaired, thereby influences the problem of electronic equipment normal function.

In order to achieve the above object, the utility model provides a following technical scheme: a copper-based circuit board with a heat dissipation function comprises a substrate, an electrical element and a heat conduction plate, wherein a first heat dissipation hole is reserved in the substrate, a heat dissipation net is embedded and connected in the middle of the upper surface of the substrate, a first metal plate is arranged on the outer side of the heat dissipation net, a second metal plate is fixedly connected to the surface of the inner end of the first metal plate, and the surface of the outer end of the first metal plate is connected with the electrical element;

the lower surface of base plate is connected with the heat-conducting plate, and the surface of heat-conducting plate has seted up the second louvre, the lower surface of heat-conducting plate is connected with the go-between, and the bottom fixedly connected with fixed plate of go-between to the lower surface of fixed plate is connected with the bottom plate, both ends all are connected with the connecting block about the upper surface of bottom plate, and the upper surface of connecting block is connected with the lower surface paste of heat-conducting plate, the upper surface intermediate position fixedly connected with riser of bottom plate, and the top of riser is equidistant to have seted up the notch, be provided with.

Preferably, the first heat dissipation holes are uniformly distributed in the substrate, the substrate and the first metal plate are connected in a welding mode, the outer end surface of the first metal plate is attached to the inner end of the electrical component, and the second metal plate connected with the inner end surface of the first metal plate penetrates through the substrate and is connected with the heat conduction plate.

Preferably, the heat-conducting plate and the base plate are connected in a sticking manner, the depth of the second heat dissipation hole is the same as the width of the heat-conducting plate, and the lower surface of the heat-conducting plate is of an arc groove-shaped structure.

Preferably, the arc groove-shaped structures on the lower surface of the heat conducting plate are uniformly distributed, the groove-shaped structures correspond to the connecting rings one to one, the outer surfaces of the connecting rings are tightly attached to the inner walls of the groove-shaped structures, and the connecting rings are fixed on the upper surface of the base plate through bolts between the fixing plate and the base plate.

Preferably, the vertical plate is connected with the heat-conducting plate in a clamping mode through the notch, the vertical plate is connected with the rubber pad in a sticking mode, and the vertical plate and the heat-conducting plate form an elastic mechanism through the rubber pad.

Compared with the prior art, the beneficial effects of the utility model are that: the copper-based circuit board with the heat dissipation function is convenient for conducting heat away from an electrical element, so that the electrical element cannot be damaged due to excessive heating;

1. the lower surface of the heat conducting plate is of an arc groove-shaped structure, the groove-shaped structure is tightly connected with the connecting ring, the connecting ring can enable the heat conducting plate to be connected more stably, and meanwhile, the connecting ring made of copper enables heat to be dissipated more quickly;

2. the first metal plate is attached to the electrical element, so that heat can be conveniently transferred to the second metal plate, and the bottom of the second metal plate penetrates through the substrate to be in contact with the heat conducting plate, so that the heat can be rapidly and stably transferred through the first metal plate and the second metal plate, and the heat dissipation capacity is ensured;

3. the riser carries out the block through notch and heat-conducting plate and is connected, connects convenient and stable like this to make the rubber pad and heat-conducting plate contact, even vibrations appear this moment, also can carry out the buffering shock attenuation through the rubber pad.

Drawings

FIG. 1 is a schematic front view of the present invention;

FIG. 2 is a schematic top view of the substrate of the present invention;

fig. 3 is an enlarged schematic view of a portion a in fig. 1 according to the present invention.

In the figure: 1. a substrate; 2. a first heat dissipation hole; 3. a heat-dissipating web; 4. a first metal plate; 5. a second metal plate; 6. an electrical component; 7. a heat conducting plate; 8. a second heat dissipation hole; 9. a connecting ring; 10. a fixing plate; 11. a base plate; 12. connecting blocks; 13. a vertical plate; 14. a recess; 15. and (7) a rubber pad.

Detailed Description

In the following, reference will be made to the accompanying drawings in the embodiments of the present invention for clearly and completely describing the technical solutions in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-3, the present invention provides a technical solution: a copper-based circuit board with a heat dissipation function comprises a substrate 1, a first heat dissipation hole 2, a heat dissipation net 3, a first metal plate 4, a second metal plate 5, an electrical component 6, a heat conduction plate 7, a second heat dissipation hole 8, a connection ring 9, a fixing plate 10, a bottom plate 11, a connection block 12, a vertical plate 13, a notch 14 and a rubber pad 15, wherein the first heat dissipation hole 2 is reserved inside the substrate 1, the heat dissipation net 3 is connected to the middle position of the upper surface of the substrate 1 in an embedded mode, the first metal plate 4 is arranged on the outer side of the heat dissipation net 3, the second metal plate 5 is fixedly connected to the surface of the inner end of the first metal plate 4, and the electrical component 6 is connected to the surface of the outer end of;

the lower surface of the base plate 1 is connected with a heat conducting plate 7, the surface of the heat conducting plate 7 is provided with a second heat dissipation hole 8, the heat conducting plate 7 is connected with the base plate 1 in a sticking way, the depth dimension of the second heat dissipation hole 8 is the same as the width dimension of the heat conducting plate 7, the lower surface of the heat conducting plate 7 is in an arc groove-shaped structure, heat dissipation is facilitated through the second heat dissipation hole 8, the lower surface of the heat conducting plate 7 is connected with a connecting ring 9, the bottom end of the connecting ring 9 is fixedly connected with a fixing plate 10, the lower surface of the fixing plate 10 is connected with a bottom plate 11, the arc groove-shaped structure of the lower surface of the heat conducting plate 7 is uniformly distributed, the positions of the groove-shaped structure correspond to the positions of the connecting ring 9 one by one, the outer surface of the, not only can support fixedly through go-between 9, also can carry out the heat conduction through its metal material simultaneously, both ends all are connected with connecting block 12 about the upper surface of bottom plate 11, and the upper surface of connecting block 12 is connected with the lower surface paste of heat-conducting plate 7, the upper surface intermediate position fixedly connected with riser 13 of bottom plate 11, and the equidistant notch 14 of having seted up in the top of riser 13, riser 13 passes through notch 14 and is connected with 7 blocks of heat-conducting plate, and the connected mode of riser 13 and rubber pad 15 is connected for pasting, and riser 13 passes through rubber pad 15 and constitutes elastic mechanism with heat-conducting plate 7, be convenient for fix heat-conducting plate 7 like this, be convenient for cushion through elastic mechanism simultaneously, be provided with rubber pad 15 between riser 13 and the heat-.

As shown in fig. 1, first heat dissipation holes 2 are uniformly distributed in substrate 1, and substrate 1 and first metal plate 4 are connected by welding, and the outer end surface of first metal plate 4 is attached to the inner end of electrical component 6, while second metal plate 5 connected to the inner end surface of first metal plate 4 penetrates through the interior of substrate 1 and is connected to heat conduction plate 7, and together with second metal plate 5, heat generated by electrical component 6 can be transferred to heat conduction plate 7.

The working principle is as follows: when the copper-based circuit board with the heat dissipation function is used, firstly, heat generated when the electrical component 6 works is conducted through the first metal plate 4, and then is transmitted to the heat conduction plate 7 through the second metal plate 5 in fig. 1 and 2, and meanwhile, the heat is dissipated through the first heat dissipation hole 2 in fig. 1 and the heat dissipation net 3 in fig. 2;

after heat is transferred to the heat conducting plate 7, the heat conducting plate 7 can dissipate the heat, at the moment, the second heat dissipation holes 8 volatilize the heat, and meanwhile, the lower surface of the heat conducting plate 7 is connected with the connecting ring 9 made of copper, so that the heat dissipation is fast and stable, and the connecting ring 9 is fixedly arranged on the bottom plate 11 through the fixing plate 10, so that the connection is stable, and meanwhile, the replacement is convenient;

meanwhile, the connecting ring 9 on the bottom plate 11 in fig. 1 enables the heat conducting plate 7 to be stably connected, and the vertical plate 13 is in snap-fit connection with the heat conducting plate 7 through the notch 14, so that the rubber pad 15 is in contact with the heat conducting plate 7, and thus the circuit board is protected by buffering and shock absorption, so as to avoid the circuit board from being damaged, which is the whole process of using the copper-based circuit board with the heat dissipation function, and what is not described in detail in this specification belongs to the prior art well known to those skilled in the art.

The utility model discloses the standard part that uses all can purchase from the market, and dysmorphism piece all can be customized according to the description with the record of drawing of description, and the concrete connection mode of each part all adopts conventional means such as ripe bolt, rivet, welding among the prior art, and machinery, part and equipment all adopt prior art, and conventional model, including circuit connection adopts conventional connection mode among the prior art, does not detailed here again.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A copper base circuit board with heat dissipation function, includes base plate (1), electrical components (6) and heat-conducting plate (7), its characterized in that: a first heat dissipation hole (2) is reserved in the substrate (1), a heat dissipation net (3) is embedded and connected in the middle of the upper surface of the substrate (1), a first metal plate (4) is arranged on the outer side of the heat dissipation net (3), a second metal plate (5) is fixedly connected to the surface of the inner end of the first metal plate (4), and an electrical component (6) is connected to the surface of the outer end of the first metal plate (4);

the lower surface of base plate (1) is connected with heat-conducting plate (7), and second louvre (8) have been seted up on the surface of heat-conducting plate (7), the lower surface of heat-conducting plate (7) is connected with go-between (9), and the bottom fixedly connected with fixed plate (10) of go-between (9) to the lower surface of fixed plate (10) is connected with bottom plate (11), both ends all are connected with connecting block (12) about the upper surface of bottom plate (11), and the upper surface of connecting block (12) is connected with the lower surface paste of heat-conducting plate (7), the upper surface intermediate position fixedly connected with riser (13) of bottom plate (11), and the top of riser (13) is equidistant to have seted up notch (14), be provided with rubber pad (15) between riser (13) and heat-.

2. The copper-based wiring board with a heat dissipation function according to claim 1, characterized in that: the heat dissipation structure is characterized in that the first heat dissipation holes (2) are uniformly distributed in the base plate (1), the base plate (1) and the first metal plate (4) are connected in a welding mode, the outer end surface of the first metal plate (4) is attached to the inner end of an electrical element (6), and meanwhile the second metal plate (5) connected with the inner end surface of the first metal plate (4) penetrates through the inside of the base plate (1) and is connected with the heat conduction plate (7).

3. The copper-based wiring board with a heat dissipation function according to claim 1, characterized in that: the heat-conducting plate (7) is connected with the base plate (1) in a sticking mode, the depth dimension of the second heat dissipation holes (8) is the same as the width dimension of the heat-conducting plate (7), and the lower surface of the heat-conducting plate (7) is of an arc groove-shaped structure.

4. The copper-based wiring board with a heat dissipation function according to claim 1, characterized in that: the arc groove-shaped structure of the lower surface of the heat conducting plate (7) is uniformly distributed, the position of the groove-shaped structure corresponds to the position of the connecting ring (9) one by one, the outer surface of the connecting ring (9) is tightly attached to the inner wall of the groove-shaped structure, and the connecting ring (9) is fixed on the upper surface of the bottom plate (11) through the bolt connection between the fixing plate (10) and the bottom plate (11).

5. The copper-based wiring board with a heat dissipation function according to claim 1, characterized in that: the vertical plate (13) is connected with the heat-conducting plate (7) in a clamping mode through the notch (14), the vertical plate (13) is connected with the rubber pad (15) in a sticking mode, and the vertical plate (13) and the heat-conducting plate (7) form an elastic mechanism through the rubber pad (15).