CN214757083U - Multilayer composite circuit board - Google Patents
Multilayer composite circuit board Download PDFInfo
- Publication number
- CN214757083U CN214757083U CN202121211496.9U CN202121211496U CN214757083U CN 214757083 U CN214757083 U CN 214757083U CN 202121211496 U CN202121211496 U CN 202121211496U CN 214757083 U CN214757083 U CN 214757083U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- multilayer composite
- connecting plate
- screw
- shells
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses a multilayer composite line board, including a plurality of circuit board casings, still include the spacing groove of shaping in the circuit board casing outside, it is adjacent all be equipped with the connecting plate that is used for connecting the circuit board casing between the circuit board casing, the circuit board casing outside is equipped with the spacing locating part to the connecting plate. The utility model discloses in, be connected through stud and the thread bush that fixed block and first screw rod and second screw rod are constituteed, can fix adjacent circuit board casing, simple structure, it is convenient to connect, has avoided among the prior art to the loaded down with trivial details phenomenon of circuit board casing equipment, through the setting of heat conduction fin and louvre, can improve the heat dispersion of the composite circuit board who forms.
Description
Technical Field
The utility model relates to a circuit board technical field especially relates to a multilayer composite circuit board.
Background
The name of the circuit board is ceramic circuit board, alumina ceramic circuit board, aluminum nitride ceramic circuit board, PCB board, aluminum substrate, high frequency board, thick copper board, impedance board, PCB, ultra-thin circuit board, printed (copper etching technology) circuit board, etc. The circuit board enables the circuit to be miniaturized and visualized, and plays an important role in batch production of fixed circuits and optimization of electric appliance layout.
Many electronic products on the market need use a plurality of circuit boards at present, and when the installation of a plurality of circuit boards, extremely troublesome can't install a plurality of circuit boards into a holistic structure, and the electromagnetic interference between the circuit board is difficult effectively isolated simultaneously.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a: in order to solve the problems, a multilayer composite circuit board is provided.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
the multilayer composite circuit board comprises a plurality of circuit board shells and limiting grooves formed in the outer sides of the circuit board shells, connecting plates used for connecting the circuit board shells are arranged between the adjacent circuit board shells, and limiting parts for limiting the connecting plates are arranged on the outer sides of the circuit board shells.
As a further description of the above technical solution:
the locating part includes that detachable sets up in the thread bush at connecting plate both ends, the circuit board casing outside is equipped with the fixed block, the first screw rod of fixed block one end fixedly connected with, fixed block other end fixedly connected with second screw rod, the screw hole with second screw rod looks adaptation is seted up to the one end that the thread bush is connected with the second screw rod, be equipped with the radiating part on the connecting plate in order to dispel the heat to the circuit board that the equipment connection formed.
As a further description of the above technical solution:
the heat dissipation part comprises a plurality of heat conduction fins arranged on the outer side of the connecting plate, and the plurality of heat conduction fins are linearly distributed along the arrangement direction of the connecting plate.
As a further description of the above technical solution:
and heat dissipation holes are formed between every two adjacent heat conduction fins.
As a further description of the above technical solution:
and a rubber gasket is arranged at the joint of the fixed block and the circuit board shell.
As a further description of the above technical solution:
and a plurality of positioning holes matched with the second screw rods are formed in the circuit board shells.
To sum up, owing to adopted above-mentioned technical scheme, the beneficial effects of the utility model are that:
1. the utility model discloses in, be connected through stud and the thread bush that fixed block and first screw rod and second screw rod are constituteed, can fix adjacent circuit board casing, simple structure, it is convenient to connect, has avoided among the prior art to the loaded down with trivial details phenomenon of circuit board casing equipment, through the setting of heat conduction fin and louvre, can improve the heat dispersion of the composite circuit board who forms.
2. The utility model discloses in, can protect the circuit board casing through the rubber gasket, the fixed block causes the damage to the circuit board casing, has improved the linkage effect.
Drawings
Fig. 1 shows a schematic diagram of a circuit board housing in a top view structure provided according to an embodiment of the present invention;
fig. 2 is a schematic diagram illustrating a front view structure of a circuit board housing according to an embodiment of the present invention;
fig. 3 is a schematic diagram illustrating a cross-sectional structure of a circuit board housing according to an embodiment of the present invention;
fig. 4 shows a schematic structural diagram of a connection plate provided according to an embodiment of the present invention;
illustration of the drawings:
1. a circuit board housing; 2. a limiting groove; 3. a connecting plate; 4. heat-conducting fins; 5. a fixed block; 6. a threaded sleeve; 7. a first screw; 8. a second screw; 9. heat dissipation holes; 10. a rubber gasket.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without creative efforts belong to the protection scope of the present invention.
Referring to fig. 1-4, the present invention provides a technical solution: the utility model provides a multilayer composite circuit board, including a plurality of circuit board casings 1, still include the spacing groove 2 of shaping in the 1 outside of circuit board casing, 1 top of circuit board casing and the equal shaping spacing groove 2 in bottom, install connecting plate 3 in the spacing groove 2, connecting plate 3 can support circuit board casing 1, also can play the radiating action simultaneously, all be equipped with the connecting plate 3 that is used for connecting circuit board casing 1 between the adjacent circuit board casing 1, 1 outside of circuit board casing is equipped with 3 spacing locating parts to the connecting plate, can carry on spacingly to connecting plate 3 through the locating part, improve the installation effectiveness of connecting plate 3.
Specifically, as shown in fig. 2, the limiting member includes a detachable thread bushing 6 disposed at two ends of a connecting plate 3, two ends of the thread bushing 6 are respectively abutted against two circuit board housings 1, a fixing block 5 is disposed at an outer side of the circuit board housings 1, a first screw 7 and a second screw 8 having the same specification are respectively formed at two ends of the fixing block 5, one end of the fixing block 5 is fixedly connected with the first screw 7, the other end of the fixing block 5 is fixedly connected with the second screw 8, a plurality of circuit board housings 1 are respectively provided with a positioning hole adapted to the second screw 8, the second screw 8 passes through the circuit board housings 1 and is screwed to the thread bushing 6, so as to fix one end of the thread bushing 6 to the second screw 8, the thread bushing 6 is larger than the gap between the limiting grooves 2, one end of the thread bushing 6 connected to the second screw 8 is provided with a thread hole adapted to the second screw 8, two ends of the thread bushing 6 are provided with thread holes, the connecting plate 3 is provided with a heat dissipation part for dissipating heat of the circuit board formed by assembly and connection.
Specifically, as shown in fig. 4, the heat dissipation portion includes a plurality of heat conduction fins 4 disposed outside the connection plate 3, the connection plate 3 is fixedly connected with the plurality of heat conduction fins 4, the plurality of heat conduction fins 4 are linearly distributed along the arrangement direction of the connection plate 3, heat dissipation holes 9 are disposed between adjacent heat conduction fins 4, and the heat dissipation performance of the composite circuit board formed by the heat conduction fins 4 and the heat dissipation holes 9 can be improved.
Specifically, as shown in fig. 2, a rubber gasket 10 is disposed at a joint of the fixing block 5 and the circuit board housing 1, the circuit board housing 1 can be protected by the rubber gasket 10, and the fixing block 5 damages the circuit board housing 1.
The working principle is as follows: during the use, the stud bolt that constitutes through fixed block 5 and first screw rod 7 and second screw rod 8 is connected with thread bush 6, can fix adjacent circuit board casing 1, simple structure, and it is convenient to connect, has avoided the loaded down with trivial details phenomenon of circuit board casing 1 equipment among the prior art, through the setting of heat conduction fin 4 and louvre 9, can improve the heat dispersion who constitutes the composite circuit board who forms, can protect circuit board casing 1 through rubber gasket 10, fixed block 5 causes the damage to circuit board casing 1.
The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.
Claims (6)
1. The multilayer composite circuit board comprises a plurality of circuit board shells (1) and is characterized by further comprising limiting grooves (2) formed in the outer sides of the circuit board shells (1), connecting plates (3) used for connecting the circuit board shells (1) are arranged between the adjacent circuit board shells (1), and limiting parts for limiting the connecting plates (3) are arranged on the outer sides of the circuit board shells (1).
2. The multilayer composite circuit board of claim 1, wherein the limiting member comprises a threaded sleeve (6) detachably disposed at two ends of the connecting plate (3), a fixing block (5) is disposed at the outer side of the circuit board casing (1), a first screw (7) is fixedly connected to one end of the fixing block (5), a second screw (8) is fixedly connected to the other end of the fixing block (5), a threaded hole matched with the second screw (8) is formed in one end of the threaded sleeve (6) connected with the second screw (8), and a heat dissipation portion is disposed on the connecting plate (3) to dissipate heat of the circuit board formed by assembling and connecting.
3. A multilayer composite wiring board according to claim 2, wherein the heat dissipating portion comprises a plurality of heat conductive fins (4) disposed outside the connecting plate (3), and the plurality of heat conductive fins (4) are linearly arranged along the direction in which the connecting plate (3) is arranged.
4. The multilayer composite wiring board according to claim 3, wherein heat dissipation holes (9) are formed between adjacent heat conduction fins (4).
5. The multilayer composite circuit board according to claim 2, wherein a rubber gasket (10) is provided at the joint of the fixing block (5) and the circuit board housing (1).
6. The multilayer composite circuit board according to claim 2, wherein a plurality of the circuit board housings (1) are provided with positioning holes adapted to the second screws (8).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121211496.9U CN214757083U (en) | 2021-06-01 | 2021-06-01 | Multilayer composite circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121211496.9U CN214757083U (en) | 2021-06-01 | 2021-06-01 | Multilayer composite circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214757083U true CN214757083U (en) | 2021-11-16 |
Family
ID=78627207
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121211496.9U Expired - Fee Related CN214757083U (en) | 2021-06-01 | 2021-06-01 | Multilayer composite circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214757083U (en) |
-
2021
- 2021-06-01 CN CN202121211496.9U patent/CN214757083U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20211116 |