TWM639946U - PCB assembling structure - Google Patents

PCB assembling structure Download PDF

Info

Publication number
TWM639946U
TWM639946U TW112200549U TW112200549U TWM639946U TW M639946 U TWM639946 U TW M639946U TW 112200549 U TW112200549 U TW 112200549U TW 112200549 U TW112200549 U TW 112200549U TW M639946 U TWM639946 U TW M639946U
Authority
TW
Taiwan
Prior art keywords
circuit board
hole
assembly structure
board assembly
inner peripheral
Prior art date
Application number
TW112200549U
Other languages
Chinese (zh)
Inventor
向韋愷
李慶隆
林光輝
許逸香
Original Assignee
泓創綠能股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 泓創綠能股份有限公司 filed Critical 泓創綠能股份有限公司
Priority to TW112200549U priority Critical patent/TWM639946U/en
Publication of TWM639946U publication Critical patent/TWM639946U/en

Links

Images

Landscapes

  • Combinations Of Printed Boards (AREA)

Abstract

本創作係關於一種電路板組裝結構,此電路板組裝結構包括殼體、電路板、端子座、絕緣件及金屬螺絲,殼體具有金屬散熱板,金屬散熱板設有第一通孔;電路板熱連接在金屬散熱板的一側,電路板具有電接點及設有第二通孔;端子座安裝於電路板,端子座具有電連接於電接點的導電部及設有鎖孔;絕緣件延伸有套管,套管穿設於第一通孔;金屬螺絲具有穿設於套管與第二通孔且螺固於鎖孔的螺桿;其中,第二通孔的內周壁尺寸大於套管的內周壁尺寸,以令螺桿與第二通孔的內周壁之間形成有間距。This creation relates to a circuit board assembly structure, the circuit board assembly structure includes a shell, a circuit board, a terminal block, an insulating piece and a metal screw, the shell has a metal heat dissipation plate, and the metal heat dissipation plate is provided with a first through hole; the circuit board Thermally connected to one side of the metal heat sink, the circuit board has electrical contacts and a second through hole; the terminal base is installed on the circuit board, the terminal base has a conductive part electrically connected to the electrical contacts and is provided with a lock hole; insulation There is a casing extending from the piece, and the casing is passed through the first through hole; the metal screw has a screw rod that passes through the casing and the second through hole and is screwed into the lock hole; wherein, the size of the inner peripheral wall of the second through hole is larger than that of the sleeve The size of the inner peripheral wall of the tube is such that a distance is formed between the screw rod and the inner peripheral wall of the second through hole.

Description

電路板組裝結構Circuit Board Assembly Structure

本創作是有關於一種組裝有電路板、端子座及殼體的組裝結構,且特別是有關於一種電路板組裝結構。The invention relates to an assembly structure assembled with a circuit board, a terminal base and a casing, and in particular relates to a circuit board assembly structure.

電路板組件(Printed Circuit Board Assembly,PCBA),是PCB裸板先經過SMT(Surface Mount Technology)打件再經過DIP(Dual In-Line Package)插件後,由PCB裸板與各類IC、電容、電阻、連接器等電子元件所組裝成品。Printed Circuit Board Assembly (PCBA) is a PCB bare board that first passes through SMT (Surface Mount Technology) and then DIP (Dual In-Line Package) plug-ins. The PCB bare board and various ICs, capacitors, Finished products assembled from electronic components such as resistors and connectors.

其中,PCB裸板為例如:鋁基板等高導熱金屬材料製成,並將PCB裸板熱貼接在鋁等高導熱金屬材料製成的殼體上,以達到幫助各類IC、電容、電阻散熱之作用;同時,為避免組裝PCB裸板上的端子座與PCB裸板電導通,端子座會採用塑膠螺絲組裝。Among them, the PCB bare board is made of high thermal conductivity metal materials such as aluminum substrates, and the PCB bare board is thermally bonded to the housing made of aluminum and other high thermal conductivity metal materials to help various ICs, capacitors, and resistors The role of heat dissipation; at the same time, in order to avoid electrical conduction between the terminal block on the assembled PCB bare board and the bare PCB, the terminal block will be assembled with plastic screws.

然而,上述塑膠螺絲的結構強韌度比金屬螺絲的結構強韌度低,導致在端子座的組裝過程,若發生鎖固施力不當或螺絲受力不均等情形時,塑膠螺絲就容易發生斷裂或破損,更嚴重為塑膠螺絲卡死於螺孔,造成組裝人員感到作業不便。However, the structural strength and toughness of the above-mentioned plastic screws is lower than that of metal screws. As a result, in the assembly process of the terminal block, if the locking force is improperly applied or the force of the screws is uneven, the plastic screws are prone to breakage. Or damaged, more seriously, the plastic screw is stuck in the screw hole, causing the assembly personnel to feel inconvenient to work.

有鑑於此,本創作人遂針對上述現有技術,特潛心研究並配合學理的運用,盡力解決上述之問題點,即成為本創作人改良之目標。In view of this, the author of the present invention, aiming at the above-mentioned prior art, devoted himself to the research and cooperated with the application of theories, and tried his best to solve the above-mentioned problems, which became the goal of the author's improvement.

本創作提供一種電路板組裝結構,其係利用第二通孔的內周壁尺寸大於套管的內周壁尺寸,從而令螺桿與第二通孔的內周壁之間形成有間距,進而避免金屬螺絲與電路板發生電連接,以達到電路板組裝結構具有優良地絕緣能力。。This creation provides a circuit board assembly structure, which uses the size of the inner peripheral wall of the second through hole to be larger than the inner peripheral wall of the sleeve, so that a distance is formed between the screw rod and the inner peripheral wall of the second through hole, thereby avoiding the metal screw and the inner peripheral wall of the sleeve. The circuit boards are electrically connected so that the circuit board assembly structure has excellent insulation capability. .

於本創作實施例中,本創作係提供一種電路板組裝結構,包括:一殼體,具有一金屬散熱板,該金屬散熱板設有至少一第一通孔;一電路板,熱連接在該金屬散熱板的一側,該電路板具有一電接點及設有至少一第二通孔;一端子座,安裝於該電路板,該端子座具有電連接於該電接點的一導電部及設有至少一鎖孔;至少一絕緣件,延伸有至少一套管,該套管穿設於該第一通孔;以及至少一金屬螺絲,具有穿設於該套管與該第二通孔且螺固於該鎖孔的一螺桿;其中,該第二通孔的內周壁尺寸大於該套管的內周壁尺寸,以令該螺桿與該第二通孔的內周壁之間形成有一間距。In the embodiment of the invention, the invention provides a circuit board assembly structure, including: a housing with a metal heat dissipation plate, the metal heat dissipation plate is provided with at least one first through hole; a circuit board, thermally connected to the One side of the metal heat dissipation plate, the circuit board has an electrical contact and at least one second through hole; a terminal base is installed on the circuit board, and the terminal base has a conductive part electrically connected to the electrical contact And at least one lock hole is provided; at least one insulator is extended with at least a sleeve, and the sleeve is passed through the first through hole; and at least one metal screw is provided with the sleeve and the second through hole. hole and screwed to a screw in the locking hole; wherein, the size of the inner peripheral wall of the second through hole is larger than the size of the inner peripheral wall of the sleeve, so that a distance is formed between the screw rod and the inner peripheral wall of the second through hole .

基於上述,相較習知採用塑膠螺絲組裝端子座,本創作採用金屬螺絲組裝端子座,因金屬螺絲的結構強韌度比塑膠螺絲的結構強韌度高,以有效降低組裝過程發生螺絲斷裂、破損或卡死於螺孔之可能性,進而增加電路板組裝結構的組裝良率及結構強度。Based on the above, compared with the conventional use of plastic screws to assemble the terminal block, this creation uses metal screws to assemble the terminal block. Because the structural strength and toughness of metal screws is higher than that of plastic screws, it can effectively reduce the occurrence of screw breakage during the assembly process. The possibility of being damaged or stuck in the screw holes will increase the assembly yield and structural strength of the circuit board assembly structure.

有關本創作之詳細說明及技術內容,將配合圖式說明如下,然而所附圖式僅作為說明用途,並非用於侷限本創作。The detailed description and technical content of this creation will be described as follows with the drawings, but the attached drawings are only for illustration purposes and are not used to limit this creation.

請參考圖1至圖7所示,本創作係提供一種電路板組裝結構,此電路板組裝結構10主要包括一殼體1、一電路板2、一端子座3、一或複數絕緣件4及一或複數金屬螺絲5。Please refer to Figures 1 to 7, the invention provides a circuit board assembly structure, the circuit board assembly structure 10 mainly includes a housing 1, a circuit board 2, a terminal block 3, one or a plurality of insulating parts 4 and One or plural metal screws 5 .

如圖1至圖7所示,殼體1由鋁、銅等高導熱金屬材質所構成,殼體1具有一金屬散熱板11,金屬散熱板11設有一或複數第一通孔12,且金屬散熱板11遠離電路板2的一面延伸有複數散熱鰭片111及設有一卡溝112。As shown in Figures 1 to 7, the housing 1 is made of high thermal conductivity metal materials such as aluminum and copper. The housing 1 has a metal heat sink 11, and the metal heat sink 11 is provided with one or a plurality of first through holes 12, and A plurality of heat dissipation fins 111 extend from the side of the heat dissipation plate 11 away from the circuit board 2 and define a slot 112 .

如圖1至圖2、圖5至圖7所示,電路板2熱連接在金屬散熱板11的一側,電路板2具有一電接點(圖未揭示)及設有一或複數第二通孔22。As shown in Figures 1 to 2 and Figures 5 to 7, the circuit board 2 is thermally connected to one side of the metal heat sink 11, and the circuit board 2 has an electrical contact (not shown in the figure) and is provided with one or a plurality of second channels. Hole 22.

如圖1至圖2、圖5至圖7所示,端子座3由金屬等導電材質所構成,端子座3為一電池端子母座或一射頻同軸端子母座等終端端子,端子座3安裝於電路板2,端子座3具有電連接於電接點的一導電部31及設有一或複數鎖孔32,導電部31形成在二鎖孔32之間。As shown in Figures 1 to 2 and Figures 5 to 7, the terminal base 3 is made of conductive materials such as metal. The terminal base 3 is a terminal terminal such as a battery terminal base or a radio frequency coaxial terminal base. The terminal base 3 is installed On the circuit board 2 , the terminal base 3 has a conductive portion 31 electrically connected to an electrical contact and is provided with one or a plurality of locking holes 32 , and the conductive portion 31 is formed between the two locking holes 32 .

如圖1至圖2、圖4至圖7所示,絕緣件4由塑膠等絕緣材質所構成,絕緣件4延伸有一或複數套管41,套管41穿設於第一通孔12,絕緣件4具有被止擋限位在金屬散熱板11的另一側的一基體42,基體42延伸有卡合於卡溝112的一卡塊421,以令絕緣件4穩固地卡固於殼體1。As shown in Figures 1 to 2 and Figures 4 to 7, the insulator 4 is made of insulating materials such as plastic, and the insulator 4 extends with one or a plurality of bushings 41, and the bushings 41 are installed in the first through hole 12 to insulate The component 4 has a base 42 that is stopped and positioned on the other side of the metal heat sink 11. The base 42 is extended with a clamping block 421 engaged in the clamping groove 112, so that the insulating component 4 is firmly clamped to the housing. 1.

詳細說明如下,本實施例之數量二個以上的套管41自單一個基體42上間隔延伸成型,但不以此為限制,各套管41也可分別自各基體42上延伸成型(圖未揭示),即單一個套管41自單一個基體42上延伸成型。The details are as follows. In this embodiment, more than two sleeves 41 are formed by extending from a single substrate 42 at intervals, but this is not a limitation. Each sleeve 41 can also be extended and formed from each base 42 (not shown in the figure). ), that is, a single sleeve 41 is formed by extending from a single base 42 .

如圖1至圖2、圖4至圖7所示,金屬螺絲5具有一螺桿51及一頭部52,螺桿51穿設於套管41與第二通孔22且螺固於鎖孔32,頭部52被基體42止擋限位。As shown in Figures 1 to 2 and Figures 4 to 7, the metal screw 5 has a screw rod 51 and a head 52, the screw rod 51 passes through the sleeve 41 and the second through hole 22 and is screwed into the lock hole 32, The head 52 is stopped and limited by the base body 42 .

如圖1至圖2、圖5至圖7所示,本創作電路板組裝結構10更包括一子電路板7,電路板2為母電路板,子電路板7搭接在電路板2上方,電路板2、子電路板7、端子座3與各類IC、電容、電阻、連接器等電子元件組裝一電路板組件(Printed Circuit Board Assembly,PCBA)。As shown in Figures 1 to 2 and Figures 5 to 7, the inventive circuit board assembly structure 10 further includes a sub-circuit board 7, the circuit board 2 is a mother circuit board, and the sub-circuit board 7 is overlapped on the top of the circuit board 2, The circuit board 2 , the sub-circuit board 7 , the terminal block 3 and various electronic components such as ICs, capacitors, resistors, and connectors are assembled into a printed circuit board assembly (PCBA).

另外,本實施例之子電路板7設有二第三通孔71,子電路板7抵接在端子座3下方且與端子座3電連接,各金屬螺絲5穿設於各第三通孔71。In addition, the sub-circuit board 7 of this embodiment is provided with two third through holes 71, the sub-circuit board 7 abuts against the bottom of the terminal block 3 and is electrically connected with the terminal block 3, and each metal screw 5 is passed through each third through hole 71 .

其中,為幫助IC、電容、電阻等元件散熱,電路板2會採用鋁基板等高導熱金屬材質所構成,為避免端子座3與子電路板7因相互抵靠而電導通,子電路板7會採用塑膠基板等絕緣材質所構成。Among them, in order to help components such as ICs, capacitors, and resistors dissipate heat, the circuit board 2 will be made of high thermal conductivity metal materials such as aluminum substrates. It will be made of insulating materials such as plastic substrates.

如圖1至圖2、圖5至圖7所示,本創作電路板組裝結構10更包括一隔絕件8,隔絕件8由塑膠等絕緣材質所構成,隔絕件8夾置在電路板2與端子座3之間且設置在導電部31的外側,以防止端子座3與電路板2相互抵靠而電導通。As shown in Figures 1 to 2 and Figures 5 to 7, the inventive circuit board assembly structure 10 further includes a spacer 8, the spacer 8 is made of insulating materials such as plastic, and the spacer 8 is sandwiched between the circuit board 2 and the The terminal bases 3 are arranged outside the conductive portion 31 to prevent the terminal bases 3 and the circuit board 2 from abutting against each other and electrically conducting.

再者,螺桿51被套設定位於套管41中時,因第二通孔22的內周壁尺寸大於套管41的內周壁尺寸,第三通孔71的內周壁尺寸大於套管41的內周壁尺寸,從而令螺桿51與第二通孔22的內周壁之間形成有一間距,螺桿51與第三通孔71的內周壁之間形成有一間距,使得螺桿51無法與第二通孔22的內周壁或第三通孔71的內周壁接觸,進而避免金屬螺絲5與電路板2或子電路板7發生電連接之情形。Furthermore, when the screw rod 51 is set in the casing 41, the size of the inner wall of the third through hole 71 is larger than the size of the inner wall of the sleeve 41 because the size of the inner wall of the second through hole 22 is larger than the size of the inner wall of the sleeve 41. , so that a distance is formed between the screw rod 51 and the inner peripheral wall of the second through hole 22, and a distance is formed between the screw rod 51 and the inner peripheral wall of the third through hole 71, so that the screw rod 51 cannot be in contact with the inner peripheral wall of the second through hole 22. Or the inner peripheral wall of the third through hole 71 is in contact, thereby avoiding the situation that the metal screw 5 is electrically connected to the circuit board 2 or the sub-circuit board 7 .

又,如圖五所示,套管41的末端可延伸長度而穿設於第二通孔22或第三通孔71(圖未揭示),讓套管41設置在螺桿51與第二通孔22的內周壁或第三通孔71的內周壁之間,更能防止金屬螺絲5與電路板2或子電路板7發生電連接之情形。Also, as shown in FIG. 5, the end of the sleeve 41 can be extended to pass through the second through hole 22 or the third through hole 71 (not shown in the figure), so that the sleeve 41 is arranged between the screw rod 51 and the second through hole. Between the inner peripheral wall of 22 or the inner peripheral wall of the third through hole 71, the situation of electrical connection between the metal screw 5 and the circuit board 2 or the sub-circuit board 7 can be prevented.

此外,本實施例之端子座3與基體42的數量分別為複數個,但不以此為限制,端子座3與基體42的數量可分別為一個。In addition, the number of the terminal base 3 and the base body 42 in this embodiment is plural, but it is not limited thereto, and the number of the terminal base 3 and the base body 42 can be one.

且,本實施例之第一通孔12、第二通孔22、鎖孔32、套管41、金屬螺絲5及第三通孔71的數量分別為二個或二的倍數個以上,但不以此為限制,第一通孔12、第二通孔22、鎖孔32、套管41、金屬螺絲5及第三通孔71的數量也可為一個。Moreover, the number of the first through hole 12, the second through hole 22, the lock hole 32, the casing 41, the metal screw 5 and the third through hole 71 in this embodiment is two or more than two, but not As a limitation, the number of the first through hole 12 , the second through hole 22 , the locking hole 32 , the bushing 41 , the metal screw 5 and the third through hole 71 may also be one.

如圖5至圖6所示,本創作電路板組裝結構10之使用狀態,其係利用絕緣件4的套管41穿設於殼體1的第一通孔12,金屬螺絲5的螺桿51再穿設於套管41且螺固於鎖孔32,因電路板2的第二通孔22的內周壁尺寸大於套管41的內周壁尺寸,從而令螺桿51與第二通孔22的內周壁之間形成有間距,使得螺桿51無法與第二通孔22的內周壁接觸,進而避免金屬螺絲5與電路板2發生電連接之情形,以達到電路板組裝結構10具有優良地絕緣能力。As shown in Figures 5 to 6, the use state of the inventive circuit board assembly structure 10 is that the sleeve 41 of the insulating member 4 is used to penetrate the first through hole 12 of the housing 1, and the screw rod 51 of the metal screw 5 is then used. Through the casing 41 and screwed to the lock hole 32, because the size of the inner peripheral wall of the second through hole 22 of the circuit board 2 is larger than the size of the inner peripheral wall of the sleeve 41, so that the screw rod 51 and the inner peripheral wall of the second through hole 22 There is a distance between them, so that the screw 51 cannot contact the inner peripheral wall of the second through hole 22 , thereby avoiding the electrical connection between the metal screw 5 and the circuit board 2 , so that the circuit board assembly structure 10 has excellent insulation capability.

另外,相較習知採用塑膠螺絲組裝端子座,本創作採用金屬螺絲5組裝端子座3,因金屬螺絲5的結構強韌度比塑膠螺絲的結構強韌度高,以有效降低組裝過程發生螺絲斷裂、破損或卡死於螺孔之可能性,進而增加電路板組裝結構10的組裝良率及結構強度。In addition, compared with the conventional use of plastic screws to assemble the terminal block, this creation uses metal screws 5 to assemble the terminal block 3, because the structural strength and toughness of the metal screw 5 is higher than that of the plastic screw, so as to effectively reduce the occurrence of screws during the assembly process. The possibility of breaking, breaking or being stuck in the screw holes increases the assembly yield and structural strength of the circuit board assembly structure 10 .

綜上所述,本創作之電路板組裝結構,確可達到預期之使用目的,而解決習知之缺失,並具有產業利用性、新穎性與進步性,完全符合專利申請要件,爰依專利法提出申請,敬請詳查並批准本案專利,以保障創作人之權利。To sum up, the circuit board assembly structure of this creation can indeed achieve the expected purpose of use, and solve the lack of conventional knowledge, and has industrial applicability, novelty and progress, and fully meets the requirements for patent application. It is filed in accordance with the Patent Law. Application, please check and approve the patent in this case to protect the rights of creators.

10:電路板組裝結構 1:殼體 11:金屬散熱板 111:散熱鰭片 112:卡溝 12:第一通孔 2:電路板 22:第二通孔 3:端子座 31:導電部 32:鎖孔 4:絕緣件 41:套管 42:基體 421:卡塊 5:金屬螺絲 51:螺桿 52:頭部 7:子電路板 71:第三通孔 8:隔絕件 10: Circuit board assembly structure 1: Shell 11: Metal cooling plate 111: cooling fins 112: card groove 12: The first through hole 2: circuit board 22: Second through hole 3: Terminal block 31: Conductive part 32: Keyhole 4: Insulation 41: Casing 42: matrix 421: block 5: metal screw 51: screw 52: head 7:Sub circuit board 71: The third through hole 8: Isolation piece

圖1 係本創作電路板組裝結構之立體分解圖。Figure 1 is a three-dimensional exploded view of the circuit board assembly structure of this invention.

圖2 係本創作電路板組裝結構之另一立體分解圖。Fig. 2 is another three-dimensional exploded view of the circuit board assembly structure of this invention.

圖3 係本創作電路板組裝結構之立體組合圖。Figure 3 is a three-dimensional combination diagram of the circuit board assembly structure of this invention.

圖4 係本創作電路板組裝結構之另一立體組合圖。Fig. 4 is another three-dimensional combination diagram of the circuit board assembly structure of this invention.

圖5 係本創作電路板組裝結構之剖面示意圖。Figure 5 is a schematic cross-sectional view of the circuit board assembly structure of this invention.

圖6 係本創作電路板組裝結構之另一剖面示意圖。Fig. 6 is another schematic cross-sectional view of the circuit board assembly structure of the present invention.

圖7 係本創作電路板組裝結構之又一剖面示意圖。Fig. 7 is another schematic cross-sectional view of the circuit board assembly structure of the present invention.

10:電路板組裝結構 10: Circuit board assembly structure

1:殼體 1: shell

11:金屬散熱板 11: Metal cooling plate

4:絕緣件 4: Insulation

42:基體 42: matrix

5:金屬螺絲 5: metal screw

52:頭部 52: head

Claims (11)

一種電路板組裝結構,包括: 一殼體,具有一金屬散熱板,該金屬散熱板設有至少一第一通孔; 一電路板,熱連接在該金屬散熱板的一側,該電路板具有一電接點及設有至少一第二通孔; 一端子座,安裝於該電路板,該端子座具有電連接於該電接點的一導電部及設有至少一鎖孔; 至少一絕緣件,延伸有至少一套管,該套管穿設於該第一通孔;以及 至少一金屬螺絲,具有穿設於該套管與該第二通孔且螺固於該鎖孔的一螺桿; 其中,該第二通孔的內周壁尺寸大於該套管的內周壁尺寸,以令該螺桿與該第二通孔的內周壁之間形成有一間距。 A circuit board assembly structure, comprising: A housing with a metal heat dissipation plate, the metal heat dissipation plate is provided with at least one first through hole; A circuit board, thermally connected to one side of the metal heat sink, the circuit board has an electrical contact and is provided with at least one second through hole; A terminal base installed on the circuit board, the terminal base has a conductive part electrically connected to the electrical contact and is provided with at least one locking hole; At least one insulating member extends with at least a sleeve, and the sleeve is passed through the first through hole; and at least one metal screw, having a screw threaded through the sleeve and the second through hole and screwed into the locking hole; Wherein, the size of the inner peripheral wall of the second through hole is larger than the size of the inner peripheral wall of the sleeve, so that a distance is formed between the screw rod and the inner peripheral wall of the second through hole. 如請求項1所述之電路板組裝結構,其中第一通孔、第二通孔、鎖孔、套管及金屬螺絲的數量分別為二,該導電部形成在該二鎖孔之間。The circuit board assembly structure as described in Claim 1, wherein the number of the first through hole, the second through hole, the lock hole, the bushing and the metal screw is two respectively, and the conductive part is formed between the two lock holes. 如請求項2所述之電路板組裝結構,其中絕緣件的數量為一,該絕緣件具有被止擋限位在該金屬散熱板的另一側的一基體,該二套管自該基體上間隔延伸成型。The circuit board assembly structure as described in claim 2, wherein the number of insulators is one, and the insulator has a base body that is stopped and limited on the other side of the metal heat dissipation plate, and the two sleeves are formed from the base body Spacer extension molding. 如請求項2所述之電路板組裝結構,其中絕緣件的數量為二,各該絕緣件具有被止擋限位在該金屬散熱板的另一側的一基體,各該套管分別自各該基體上延伸成型。The circuit board assembly structure as described in claim 2, wherein the number of insulators is two, and each insulator has a base body that is stopped and limited on the other side of the metal heat dissipation plate, and each of the sleeves is respectively connected to the Extended molding on the substrate. 如請求項3或4所述之電路板組裝結構,其中該金屬散熱板遠離該電路板的一面延伸有複數散熱鰭片及設有一卡溝,該基體延伸有卡合於該卡溝的一卡塊。The circuit board assembly structure as described in claim 3 or 4, wherein the side of the metal heat dissipation plate away from the circuit board is extended with a plurality of heat dissipation fins and a slot, and the base body is extended with a slot that is engaged with the slot piece. 如請求項3或4所述之電路板組裝結構,其中每一該金屬螺絲具有被該基體止擋限位的一頭部。The circuit board assembly structure as claimed in claim 3 or 4, wherein each of the metal screws has a head limited by the stopper of the base body. 如請求項2所述之電路板組裝結構,其更包括一子電路板,該子電路板搭接在該電路板上方,該子電路板設有二第三通孔,該子電路板抵接在該端子座下方且與該端子座電連接,各該金屬螺絲穿設於各該第三通孔。As the circuit board assembly structure described in claim 2, it further includes a sub-circuit board, the sub-circuit board is overlapped on the top of the circuit board, the sub-circuit board is provided with two third through holes, and the sub-circuit board abuts against Under the terminal base and electrically connected with the terminal base, each of the metal screws passes through each of the third through holes. 如請求項7所述之電路板組裝結構,其中該第三通孔的內周壁尺寸大於該套管的內周壁尺寸,以令該螺桿與該第三通孔的內周壁之間形成有一間距。The circuit board assembly structure according to claim 7, wherein the size of the inner peripheral wall of the third through hole is larger than the size of the inner peripheral wall of the sleeve, so that a distance is formed between the screw and the inner peripheral wall of the third through hole. 如請求項1所述之電路板組裝結構,其更包括一隔絕件,該隔絕件夾置在該電路板與該端子座之間且設置在該導電部的外側。The circuit board assembly structure according to claim 1 further includes an isolator, which is interposed between the circuit board and the terminal block and disposed outside the conductive portion. 如請求項1所述之電路板組裝結構,其中該套管穿設於該第二通孔。The circuit board assembly structure according to claim 1, wherein the sleeve is passed through the second through hole. 如請求項1所述之電路板組裝結構,其中該端子座為一電池端子母座或一射頻同軸端子母座。The circuit board assembly structure as described in Claim 1, wherein the terminal base is a battery terminal female base or a radio frequency coaxial terminal female base.
TW112200549U 2023-01-16 2023-01-16 PCB assembling structure TWM639946U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW112200549U TWM639946U (en) 2023-01-16 2023-01-16 PCB assembling structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW112200549U TWM639946U (en) 2023-01-16 2023-01-16 PCB assembling structure

Publications (1)

Publication Number Publication Date
TWM639946U true TWM639946U (en) 2023-04-11

Family

ID=86944515

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112200549U TWM639946U (en) 2023-01-16 2023-01-16 PCB assembling structure

Country Status (1)

Country Link
TW (1) TWM639946U (en)

Similar Documents

Publication Publication Date Title
US6058013A (en) Molded housing with integral heatsink
US20040037044A1 (en) Heat sink for surface mounted power devices
US9832856B2 (en) Circuit board
TWI389272B (en) Heat dissipating module of electronic component and assembling method thereof
US10524349B2 (en) Printed circuit board with built-in vertical heat dissipation ceramic block, and electrical assembly comprising the board
KR20070092432A (en) Printed circuit board having metal core
US20220029262A1 (en) High powered rf part for improved manufacturability
JP6420966B2 (en) WIRING BOARD, MANUFACTURING METHOD THEREOF, AND ELECTRONIC COMPONENT DEVICE
TWM639946U (en) PCB assembling structure
JPH04113695A (en) Heat dissipating structure for electronic device
US7573359B2 (en) Reducing crosstalk in electronic devices having microstrip lines covered by a flexible insulating material and a metallic backing plate
KR102543495B1 (en) PCB module having multi-directional heat-radiation structure, and radiation plate, multi-layer PCB assembly, and module case used in the same PCB module
US10212850B1 (en) Electronic device with heat sink flange and related methods
US11744009B2 (en) Electronic module
CN219627972U (en) Circuit board assembling structure
US11153973B2 (en) Electronic module
CN111315108B (en) Circuit board and electrical equipment
US11224117B1 (en) Heat transfer in the printed circuit board of an SMPS by an integrated heat exchanger
CN214757083U (en) Multilayer composite circuit board
CN207283915U (en) A kind of wiring board of perfect heat-dissipating
TWM568412U (en) Terminal block grounding structure and power supply with terminal block
CN221488181U (en) Single tube IGBT mounting structure and electric device
CN217064101U (en) Environment-friendly HDI circuit board
CN113260137B (en) Printed circuit board, circuit board assembly and power supply device
US11081828B2 (en) Power module housing