TWM639946U - PCB assembling structure - Google Patents
PCB assembling structure Download PDFInfo
- Publication number
- TWM639946U TWM639946U TW112200549U TW112200549U TWM639946U TW M639946 U TWM639946 U TW M639946U TW 112200549 U TW112200549 U TW 112200549U TW 112200549 U TW112200549 U TW 112200549U TW M639946 U TWM639946 U TW M639946U
- Authority
- TW
- Taiwan
- Prior art keywords
- circuit board
- hole
- assembly structure
- board assembly
- inner peripheral
- Prior art date
Links
Images
Landscapes
- Combinations Of Printed Boards (AREA)
Abstract
本創作係關於一種電路板組裝結構,此電路板組裝結構包括殼體、電路板、端子座、絕緣件及金屬螺絲,殼體具有金屬散熱板,金屬散熱板設有第一通孔;電路板熱連接在金屬散熱板的一側,電路板具有電接點及設有第二通孔;端子座安裝於電路板,端子座具有電連接於電接點的導電部及設有鎖孔;絕緣件延伸有套管,套管穿設於第一通孔;金屬螺絲具有穿設於套管與第二通孔且螺固於鎖孔的螺桿;其中,第二通孔的內周壁尺寸大於套管的內周壁尺寸,以令螺桿與第二通孔的內周壁之間形成有間距。This creation relates to a circuit board assembly structure, the circuit board assembly structure includes a shell, a circuit board, a terminal block, an insulating piece and a metal screw, the shell has a metal heat dissipation plate, and the metal heat dissipation plate is provided with a first through hole; the circuit board Thermally connected to one side of the metal heat sink, the circuit board has electrical contacts and a second through hole; the terminal base is installed on the circuit board, the terminal base has a conductive part electrically connected to the electrical contacts and is provided with a lock hole; insulation There is a casing extending from the piece, and the casing is passed through the first through hole; the metal screw has a screw rod that passes through the casing and the second through hole and is screwed into the lock hole; wherein, the size of the inner peripheral wall of the second through hole is larger than that of the sleeve The size of the inner peripheral wall of the tube is such that a distance is formed between the screw rod and the inner peripheral wall of the second through hole.
Description
本創作是有關於一種組裝有電路板、端子座及殼體的組裝結構,且特別是有關於一種電路板組裝結構。The invention relates to an assembly structure assembled with a circuit board, a terminal base and a casing, and in particular relates to a circuit board assembly structure.
電路板組件(Printed Circuit Board Assembly,PCBA),是PCB裸板先經過SMT(Surface Mount Technology)打件再經過DIP(Dual In-Line Package)插件後,由PCB裸板與各類IC、電容、電阻、連接器等電子元件所組裝成品。Printed Circuit Board Assembly (PCBA) is a PCB bare board that first passes through SMT (Surface Mount Technology) and then DIP (Dual In-Line Package) plug-ins. The PCB bare board and various ICs, capacitors, Finished products assembled from electronic components such as resistors and connectors.
其中,PCB裸板為例如:鋁基板等高導熱金屬材料製成,並將PCB裸板熱貼接在鋁等高導熱金屬材料製成的殼體上,以達到幫助各類IC、電容、電阻散熱之作用;同時,為避免組裝PCB裸板上的端子座與PCB裸板電導通,端子座會採用塑膠螺絲組裝。Among them, the PCB bare board is made of high thermal conductivity metal materials such as aluminum substrates, and the PCB bare board is thermally bonded to the housing made of aluminum and other high thermal conductivity metal materials to help various ICs, capacitors, and resistors The role of heat dissipation; at the same time, in order to avoid electrical conduction between the terminal block on the assembled PCB bare board and the bare PCB, the terminal block will be assembled with plastic screws.
然而,上述塑膠螺絲的結構強韌度比金屬螺絲的結構強韌度低,導致在端子座的組裝過程,若發生鎖固施力不當或螺絲受力不均等情形時,塑膠螺絲就容易發生斷裂或破損,更嚴重為塑膠螺絲卡死於螺孔,造成組裝人員感到作業不便。However, the structural strength and toughness of the above-mentioned plastic screws is lower than that of metal screws. As a result, in the assembly process of the terminal block, if the locking force is improperly applied or the force of the screws is uneven, the plastic screws are prone to breakage. Or damaged, more seriously, the plastic screw is stuck in the screw hole, causing the assembly personnel to feel inconvenient to work.
有鑑於此,本創作人遂針對上述現有技術,特潛心研究並配合學理的運用,盡力解決上述之問題點,即成為本創作人改良之目標。In view of this, the author of the present invention, aiming at the above-mentioned prior art, devoted himself to the research and cooperated with the application of theories, and tried his best to solve the above-mentioned problems, which became the goal of the author's improvement.
本創作提供一種電路板組裝結構,其係利用第二通孔的內周壁尺寸大於套管的內周壁尺寸,從而令螺桿與第二通孔的內周壁之間形成有間距,進而避免金屬螺絲與電路板發生電連接,以達到電路板組裝結構具有優良地絕緣能力。。This creation provides a circuit board assembly structure, which uses the size of the inner peripheral wall of the second through hole to be larger than the inner peripheral wall of the sleeve, so that a distance is formed between the screw rod and the inner peripheral wall of the second through hole, thereby avoiding the metal screw and the inner peripheral wall of the sleeve. The circuit boards are electrically connected so that the circuit board assembly structure has excellent insulation capability. .
於本創作實施例中,本創作係提供一種電路板組裝結構,包括:一殼體,具有一金屬散熱板,該金屬散熱板設有至少一第一通孔;一電路板,熱連接在該金屬散熱板的一側,該電路板具有一電接點及設有至少一第二通孔;一端子座,安裝於該電路板,該端子座具有電連接於該電接點的一導電部及設有至少一鎖孔;至少一絕緣件,延伸有至少一套管,該套管穿設於該第一通孔;以及至少一金屬螺絲,具有穿設於該套管與該第二通孔且螺固於該鎖孔的一螺桿;其中,該第二通孔的內周壁尺寸大於該套管的內周壁尺寸,以令該螺桿與該第二通孔的內周壁之間形成有一間距。In the embodiment of the invention, the invention provides a circuit board assembly structure, including: a housing with a metal heat dissipation plate, the metal heat dissipation plate is provided with at least one first through hole; a circuit board, thermally connected to the One side of the metal heat dissipation plate, the circuit board has an electrical contact and at least one second through hole; a terminal base is installed on the circuit board, and the terminal base has a conductive part electrically connected to the electrical contact And at least one lock hole is provided; at least one insulator is extended with at least a sleeve, and the sleeve is passed through the first through hole; and at least one metal screw is provided with the sleeve and the second through hole. hole and screwed to a screw in the locking hole; wherein, the size of the inner peripheral wall of the second through hole is larger than the size of the inner peripheral wall of the sleeve, so that a distance is formed between the screw rod and the inner peripheral wall of the second through hole .
基於上述,相較習知採用塑膠螺絲組裝端子座,本創作採用金屬螺絲組裝端子座,因金屬螺絲的結構強韌度比塑膠螺絲的結構強韌度高,以有效降低組裝過程發生螺絲斷裂、破損或卡死於螺孔之可能性,進而增加電路板組裝結構的組裝良率及結構強度。Based on the above, compared with the conventional use of plastic screws to assemble the terminal block, this creation uses metal screws to assemble the terminal block. Because the structural strength and toughness of metal screws is higher than that of plastic screws, it can effectively reduce the occurrence of screw breakage during the assembly process. The possibility of being damaged or stuck in the screw holes will increase the assembly yield and structural strength of the circuit board assembly structure.
有關本創作之詳細說明及技術內容,將配合圖式說明如下,然而所附圖式僅作為說明用途,並非用於侷限本創作。The detailed description and technical content of this creation will be described as follows with the drawings, but the attached drawings are only for illustration purposes and are not used to limit this creation.
請參考圖1至圖7所示,本創作係提供一種電路板組裝結構,此電路板組裝結構10主要包括一殼體1、一電路板2、一端子座3、一或複數絕緣件4及一或複數金屬螺絲5。Please refer to Figures 1 to 7, the invention provides a circuit board assembly structure, the circuit
如圖1至圖7所示,殼體1由鋁、銅等高導熱金屬材質所構成,殼體1具有一金屬散熱板11,金屬散熱板11設有一或複數第一通孔12,且金屬散熱板11遠離電路板2的一面延伸有複數散熱鰭片111及設有一卡溝112。As shown in Figures 1 to 7, the
如圖1至圖2、圖5至圖7所示,電路板2熱連接在金屬散熱板11的一側,電路板2具有一電接點(圖未揭示)及設有一或複數第二通孔22。As shown in Figures 1 to 2 and Figures 5 to 7, the
如圖1至圖2、圖5至圖7所示,端子座3由金屬等導電材質所構成,端子座3為一電池端子母座或一射頻同軸端子母座等終端端子,端子座3安裝於電路板2,端子座3具有電連接於電接點的一導電部31及設有一或複數鎖孔32,導電部31形成在二鎖孔32之間。As shown in Figures 1 to 2 and Figures 5 to 7, the
如圖1至圖2、圖4至圖7所示,絕緣件4由塑膠等絕緣材質所構成,絕緣件4延伸有一或複數套管41,套管41穿設於第一通孔12,絕緣件4具有被止擋限位在金屬散熱板11的另一側的一基體42,基體42延伸有卡合於卡溝112的一卡塊421,以令絕緣件4穩固地卡固於殼體1。As shown in Figures 1 to 2 and Figures 4 to 7, the
詳細說明如下,本實施例之數量二個以上的套管41自單一個基體42上間隔延伸成型,但不以此為限制,各套管41也可分別自各基體42上延伸成型(圖未揭示),即單一個套管41自單一個基體42上延伸成型。The details are as follows. In this embodiment, more than two
如圖1至圖2、圖4至圖7所示,金屬螺絲5具有一螺桿51及一頭部52,螺桿51穿設於套管41與第二通孔22且螺固於鎖孔32,頭部52被基體42止擋限位。As shown in Figures 1 to 2 and Figures 4 to 7, the
如圖1至圖2、圖5至圖7所示,本創作電路板組裝結構10更包括一子電路板7,電路板2為母電路板,子電路板7搭接在電路板2上方,電路板2、子電路板7、端子座3與各類IC、電容、電阻、連接器等電子元件組裝一電路板組件(Printed Circuit Board Assembly,PCBA)。As shown in Figures 1 to 2 and Figures 5 to 7, the inventive circuit
另外,本實施例之子電路板7設有二第三通孔71,子電路板7抵接在端子座3下方且與端子座3電連接,各金屬螺絲5穿設於各第三通孔71。In addition, the
其中,為幫助IC、電容、電阻等元件散熱,電路板2會採用鋁基板等高導熱金屬材質所構成,為避免端子座3與子電路板7因相互抵靠而電導通,子電路板7會採用塑膠基板等絕緣材質所構成。Among them, in order to help components such as ICs, capacitors, and resistors dissipate heat, the
如圖1至圖2、圖5至圖7所示,本創作電路板組裝結構10更包括一隔絕件8,隔絕件8由塑膠等絕緣材質所構成,隔絕件8夾置在電路板2與端子座3之間且設置在導電部31的外側,以防止端子座3與電路板2相互抵靠而電導通。As shown in Figures 1 to 2 and Figures 5 to 7, the inventive circuit
再者,螺桿51被套設定位於套管41中時,因第二通孔22的內周壁尺寸大於套管41的內周壁尺寸,第三通孔71的內周壁尺寸大於套管41的內周壁尺寸,從而令螺桿51與第二通孔22的內周壁之間形成有一間距,螺桿51與第三通孔71的內周壁之間形成有一間距,使得螺桿51無法與第二通孔22的內周壁或第三通孔71的內周壁接觸,進而避免金屬螺絲5與電路板2或子電路板7發生電連接之情形。Furthermore, when the
又,如圖五所示,套管41的末端可延伸長度而穿設於第二通孔22或第三通孔71(圖未揭示),讓套管41設置在螺桿51與第二通孔22的內周壁或第三通孔71的內周壁之間,更能防止金屬螺絲5與電路板2或子電路板7發生電連接之情形。Also, as shown in FIG. 5, the end of the
此外,本實施例之端子座3與基體42的數量分別為複數個,但不以此為限制,端子座3與基體42的數量可分別為一個。In addition, the number of the
且,本實施例之第一通孔12、第二通孔22、鎖孔32、套管41、金屬螺絲5及第三通孔71的數量分別為二個或二的倍數個以上,但不以此為限制,第一通孔12、第二通孔22、鎖孔32、套管41、金屬螺絲5及第三通孔71的數量也可為一個。Moreover, the number of the first through
如圖5至圖6所示,本創作電路板組裝結構10之使用狀態,其係利用絕緣件4的套管41穿設於殼體1的第一通孔12,金屬螺絲5的螺桿51再穿設於套管41且螺固於鎖孔32,因電路板2的第二通孔22的內周壁尺寸大於套管41的內周壁尺寸,從而令螺桿51與第二通孔22的內周壁之間形成有間距,使得螺桿51無法與第二通孔22的內周壁接觸,進而避免金屬螺絲5與電路板2發生電連接之情形,以達到電路板組裝結構10具有優良地絕緣能力。As shown in Figures 5 to 6, the use state of the inventive circuit
另外,相較習知採用塑膠螺絲組裝端子座,本創作採用金屬螺絲5組裝端子座3,因金屬螺絲5的結構強韌度比塑膠螺絲的結構強韌度高,以有效降低組裝過程發生螺絲斷裂、破損或卡死於螺孔之可能性,進而增加電路板組裝結構10的組裝良率及結構強度。In addition, compared with the conventional use of plastic screws to assemble the terminal block, this creation uses
綜上所述,本創作之電路板組裝結構,確可達到預期之使用目的,而解決習知之缺失,並具有產業利用性、新穎性與進步性,完全符合專利申請要件,爰依專利法提出申請,敬請詳查並批准本案專利,以保障創作人之權利。To sum up, the circuit board assembly structure of this creation can indeed achieve the expected purpose of use, and solve the lack of conventional knowledge, and has industrial applicability, novelty and progress, and fully meets the requirements for patent application. It is filed in accordance with the Patent Law. Application, please check and approve the patent in this case to protect the rights of creators.
10:電路板組裝結構 1:殼體 11:金屬散熱板 111:散熱鰭片 112:卡溝 12:第一通孔 2:電路板 22:第二通孔 3:端子座 31:導電部 32:鎖孔 4:絕緣件 41:套管 42:基體 421:卡塊 5:金屬螺絲 51:螺桿 52:頭部 7:子電路板 71:第三通孔 8:隔絕件 10: Circuit board assembly structure 1: Shell 11: Metal cooling plate 111: cooling fins 112: card groove 12: The first through hole 2: circuit board 22: Second through hole 3: Terminal block 31: Conductive part 32: Keyhole 4: Insulation 41: Casing 42: matrix 421: block 5: metal screw 51: screw 52: head 7:Sub circuit board 71: The third through hole 8: Isolation piece
圖1 係本創作電路板組裝結構之立體分解圖。Figure 1 is a three-dimensional exploded view of the circuit board assembly structure of this invention.
圖2 係本創作電路板組裝結構之另一立體分解圖。Fig. 2 is another three-dimensional exploded view of the circuit board assembly structure of this invention.
圖3 係本創作電路板組裝結構之立體組合圖。Figure 3 is a three-dimensional combination diagram of the circuit board assembly structure of this invention.
圖4 係本創作電路板組裝結構之另一立體組合圖。Fig. 4 is another three-dimensional combination diagram of the circuit board assembly structure of this invention.
圖5 係本創作電路板組裝結構之剖面示意圖。Figure 5 is a schematic cross-sectional view of the circuit board assembly structure of this invention.
圖6 係本創作電路板組裝結構之另一剖面示意圖。Fig. 6 is another schematic cross-sectional view of the circuit board assembly structure of the present invention.
圖7 係本創作電路板組裝結構之又一剖面示意圖。Fig. 7 is another schematic cross-sectional view of the circuit board assembly structure of the present invention.
10:電路板組裝結構 10: Circuit board assembly structure
1:殼體 1: shell
11:金屬散熱板 11: Metal cooling plate
4:絕緣件 4: Insulation
42:基體 42: matrix
5:金屬螺絲 5: metal screw
52:頭部 52: head
Claims (11)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW112200549U TWM639946U (en) | 2023-01-16 | 2023-01-16 | PCB assembling structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW112200549U TWM639946U (en) | 2023-01-16 | 2023-01-16 | PCB assembling structure |
Publications (1)
Publication Number | Publication Date |
---|---|
TWM639946U true TWM639946U (en) | 2023-04-11 |
Family
ID=86944515
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW112200549U TWM639946U (en) | 2023-01-16 | 2023-01-16 | PCB assembling structure |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWM639946U (en) |
-
2023
- 2023-01-16 TW TW112200549U patent/TWM639946U/en unknown
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US6058013A (en) | Molded housing with integral heatsink | |
US20040037044A1 (en) | Heat sink for surface mounted power devices | |
US9832856B2 (en) | Circuit board | |
TWI389272B (en) | Heat dissipating module of electronic component and assembling method thereof | |
US10524349B2 (en) | Printed circuit board with built-in vertical heat dissipation ceramic block, and electrical assembly comprising the board | |
KR20070092432A (en) | Printed circuit board having metal core | |
US20220029262A1 (en) | High powered rf part for improved manufacturability | |
JP6420966B2 (en) | WIRING BOARD, MANUFACTURING METHOD THEREOF, AND ELECTRONIC COMPONENT DEVICE | |
TWM639946U (en) | PCB assembling structure | |
JPH04113695A (en) | Heat dissipating structure for electronic device | |
US7573359B2 (en) | Reducing crosstalk in electronic devices having microstrip lines covered by a flexible insulating material and a metallic backing plate | |
KR102543495B1 (en) | PCB module having multi-directional heat-radiation structure, and radiation plate, multi-layer PCB assembly, and module case used in the same PCB module | |
US10212850B1 (en) | Electronic device with heat sink flange and related methods | |
US11744009B2 (en) | Electronic module | |
CN219627972U (en) | Circuit board assembling structure | |
US11153973B2 (en) | Electronic module | |
CN111315108B (en) | Circuit board and electrical equipment | |
US11224117B1 (en) | Heat transfer in the printed circuit board of an SMPS by an integrated heat exchanger | |
CN214757083U (en) | Multilayer composite circuit board | |
CN207283915U (en) | A kind of wiring board of perfect heat-dissipating | |
TWM568412U (en) | Terminal block grounding structure and power supply with terminal block | |
CN221488181U (en) | Single tube IGBT mounting structure and electric device | |
CN217064101U (en) | Environment-friendly HDI circuit board | |
CN113260137B (en) | Printed circuit board, circuit board assembly and power supply device | |
US11081828B2 (en) | Power module housing |