CN218352969U - High-performance 5G circuit board - Google Patents
High-performance 5G circuit board Download PDFInfo
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- CN218352969U CN218352969U CN202221578769.8U CN202221578769U CN218352969U CN 218352969 U CN218352969 U CN 218352969U CN 202221578769 U CN202221578769 U CN 202221578769U CN 218352969 U CN218352969 U CN 218352969U
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- circuit board
- heat
- heat dissipation
- connecting plate
- heat exchange
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Abstract
The utility model relates to a 5G circuit board technical field, especially a high performance 5G circuit board, including the 5G circuit board, the top of 5G circuit board is provided with heat dissipation mechanism, the locating piece is all installed to the both sides of 5G circuit board outer wall, locating piece outer wall sliding connection has the connecting plate, the inside of connecting plate and the sliding connection of top at the locating piece have the stopper; the heat dissipation mechanism comprises a heat dissipation plate movably connected to the top of the 5G circuit board, the heat conduction pad is installed at the bottom of the heat dissipation plate, the heat exchange tube is installed at the top of the heat dissipation plate, heat dissipation fins are installed on the outer wall of the heat exchange tube and above the heat dissipation plate, and by arranging the 5G circuit board and the heat dissipation mechanism, the problems that the heat dissipation performance of the 5G circuit board is poor, heat cannot be dissipated timely, and the running performance of the 5G circuit board is low are solved.
Description
Technical Field
The utility model relates to a 5G circuit board technical field specifically is a high performance 5G circuit board.
Background
The 5G circuit board is applied to a large number of small electronic products, and constitutes an indispensable important component of the electronic products, but the 5G circuit board still has insufficient manufacture, specifically: the 5G circuit board has poor heat dissipation performance, and heat cannot be dissipated timely, so that the 5G circuit board has low running performance.
Therefore, a high-performance 5G circuit board is required to solve the problems suggested in the background art described above.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a high performance 5G circuit board to solve the problem that proposes in the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme:
a high-performance 5G circuit board comprises a 5G circuit board, wherein a heat dissipation mechanism is arranged at the top of the 5G circuit board, positioning blocks are mounted on two sides of the outer wall of the 5G circuit board, a connecting plate is connected to the outer wall of each positioning block in a sliding mode, and a limiting block is connected to the inner portion of each connecting plate and above each positioning block in a sliding mode;
the heat dissipation mechanism comprises a heat dissipation plate movably connected to the top of the 5G circuit board, a heat conduction pad is installed at the bottom of the heat dissipation plate, a heat exchange tube is installed at the top of the heat dissipation plate, and heat dissipation fins are installed on the outer wall of the heat exchange tube and above the heat dissipation plate.
As the utility model discloses preferred scheme, locating piece, connecting plate and stopper are made by ABS plastics, by interference fit between locating piece and connecting plate and stopper and the connecting plate.
As the utility model discloses preferred scheme, locating piece and stopper are hexagon structural design, locating piece, connecting plate and stopper all are provided with the multiunit, the stopper is fixed connection with the connected mode of heating panel.
As the utility model discloses preferred scheme, the heating panel is made by red copper, radiating fin is made by the aluminum alloy.
As the utility model discloses preferred scheme, the heat exchange tube is made by the heat pipe, the heat exchange tube is 0 type structural design.
As the utility model discloses preferred scheme, radiating fin and heat exchange tube all are provided with the multiunit, the heat conduction pad is made by heat conduction silica gel piece.
Compared with the prior art, the beneficial effects of the utility model are that:
1. the utility model discloses in, through setting up 5G circuit board and heat dissipation mechanism, the user is through increasing heat dissipation mechanism on 5G circuit board, when 5G circuit board operation, the heat that 5G circuit board produced can be through heat conduction pad and heating panel transmission to the heat exchange tube in, the coolant in the heat exchange tube made by the heat pipe can absorb the heat in the heating panel, the thermal coolant of absorption can turn into the gaseous state, and rise to the heat exchange tube top, heat in the gaseous state coolant passes through in the fin transmits the air, the thermal coolant of having released turns into liquid again and relies on the capillary force to flow back the bottom of heat exchange tube, can in time distribute away the heat of 5G circuit board, the heat dispersion of having solved 5G circuit board is relatively poor, the heat can't in time give off, lead to the lower problem of 5G circuit board working property.
Drawings
Fig. 1 is a front view of the present invention;
FIG. 2 is a front sectional view of the heat dissipating mechanism of the present invention;
fig. 3 is a partial front sectional view of the connection plate of the present invention.
In the figure: 1. 5G circuit board; 2. a heat dissipation mechanism; 3. positioning a block; 4. a connecting plate; 5. a limiting block; 201. a heat dissipation plate; 202. a thermally conductive pad; 203. a heat exchange pipe; 204. and (4) radiating fins.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, rather than all embodiments, and all other embodiments obtained by a person of ordinary skill in the art without creative work belong to the scope of the present invention based on the embodiments of the present invention.
In order to facilitate understanding of the invention, the invention will be described more fully hereinafter with reference to the accompanying drawings, in which several embodiments of the invention are shown, but which can be embodied in many different forms and are not limited to the embodiments described herein, but rather are provided for the purpose of making the disclosure more thorough and complete.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present, that when an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present, and that the terms "vertical", "horizontal", "left", "right" and the like are used herein for descriptive purposes only.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs, and the terms used herein in the specification of the present invention are for the purpose of describing particular embodiments only and are not intended to limit the present invention, and the term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.
Referring to fig. 1-3, the present invention provides a technical solution:
a high-performance 5G circuit board comprises a 5G circuit board 1, heat dissipation mechanisms 2 arranged at the top of the 5G circuit board 1, positioning blocks 3 arranged on two sides of the outer wall of the 5G circuit board 1, a connecting plate 4 connected with the outer wall of the positioning blocks 3 in a sliding manner, and a limiting block 5 connected with the inner part of the connecting plate 4 and above the positioning blocks 3 in a sliding manner;
the positioning block 3, the connecting plate 4 and the limiting block 5 are all made of ABS plastic, the positioning block 3, the connecting plate 4 and the limiting block 5 made of ABS plastic are low in manufacturing cost, the positioning block 3, the connecting plate 4, the limiting block 5 and the connecting plate 4 are in interference fit, the positioning block 3 and the limiting block 5 are all designed in a hexagonal structure, the positioning block 3, the connecting plate 4 and the limiting block 5 are all provided with multiple groups, and the limiting block 5 is fixedly connected with the heat dissipation plate 201;
in this embodiment, referring to fig. 1 and 2, the heat dissipation mechanism 2 includes a heat dissipation plate 201 movably connected to the top of the 5G circuit board 1, a heat conduction pad 202 is installed at the bottom of the heat dissipation plate 201, a heat exchange tube 203 is installed at the top of the heat dissipation plate 201, and a heat dissipation fin 204 is installed on the outer wall of the heat exchange tube 203 and above the heat dissipation plate 201;
the heat dissipation plate 201 is made of red copper, the heat conductivity coefficient of the heat dissipation plate 201 made of red copper is large, heat generated when the 5G circuit board 1 runs can be timely transmitted out, the heat dissipation fins 204 are made of aluminum alloy, the heat exchange tubes 203 are made of heat tubes, the heat exchange tubes 203 are of a 0-type structure design, the heat dissipation fins 204 and the heat exchange tubes 203 are respectively provided with multiple groups, the heat conduction pads 202 are made of heat conduction silica gel sheets, a user adds the heat dissipation mechanism 2 on the 5G circuit board 1, when the 5G circuit board 1 runs, heat generated by the 5G circuit board 1 can be transmitted into the heat exchange tubes 203 through the heat conduction pads 202 and the heat dissipation plate 201, a coolant in the heat exchange tubes 203 made of the heat tubes can absorb heat in the heat dissipation plate 201, the coolant absorbing the heat can be converted into a gas state and ascends to the tops of the heat exchange tubes 203, the heat in the gas-state coolant is transmitted into the air through the heat dissipation fins 204, the coolant releasing the heat can be converted into a liquid state again and flows back to the bottoms of the heat exchange tubes 203 by virtue of capillary force, and the heat of the 5G circuit board 1 can be timely transmitted out.
The utility model discloses work flow: the user is through increasing heat dissipation mechanism 2 on 5G circuit board 1, when 5G circuit board 1 moves, the heat that 5G circuit board 1 produced can be transmitted to heat exchange tube 203 through heat conduction pad 202 and heating panel 201, the coolant in the heat exchange tube 203 made by the heat pipe can absorb the heat in the heating panel 201, the coolant of absorbed heat can turn into the gaseous state, and rise to the heat exchange tube 203 top, heat in the gaseous state coolant passes through radiating fin 204 and transmits to the air, the coolant of having released the heat turns into liquid state again and relies on capillary force to flow back to the bottom of heat exchange tube 203, can in time distribute away the heat of 5G circuit board 1.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. A high-performance 5G circuit board comprises a 5G circuit board (1), and is characterized in that: the heat dissipation mechanism (2) is arranged at the top of the 5G circuit board (1), the positioning blocks (3) are mounted on two sides of the outer wall of the 5G circuit board (1), the outer wall of each positioning block (3) is connected with a connecting plate (4) in a sliding mode, and a limiting block (5) is connected inside each connecting plate (4) and above each positioning block (3) in a sliding mode;
heat dissipation mechanism (2) are including swing joint heating panel (201) at 5G circuit board (1) top, heat conduction pad (202) are installed to the bottom of heating panel (201), heat exchange tube (203) are installed at the top of heating panel (201), radiating fin (204) are just installed in the top of heating panel (201) to the outer wall of heat exchange tube (203).
2. A high performance 5G circuit board according to claim 1, wherein: the positioning block (3), the connecting plate (4) and the limiting block (5) are all made of ABS plastic, and the positioning block (3), the connecting plate (4), the limiting block (5) and the connecting plate (4) are in interference fit with each other.
3. A high performance 5G circuit board according to claim 1, wherein: locating piece (3) and stopper (5) are hexagon structural design, locating piece (3), connecting plate (4) and stopper (5) all are provided with the multiunit, the connected mode of stopper (5) and heating panel (201) is fixed connection.
4. A high performance 5G circuit board according to claim 1, wherein: the heat dissipation plate (201) is made of red copper, and the heat dissipation fins (204) are made of aluminum alloy.
5. A high performance 5G circuit board according to claim 1, wherein: the heat exchange tube (203) is made of a heat pipe, and the heat exchange tube (203) is designed to be of a 0-type structure.
6. A high performance 5G circuit board according to claim 1, wherein: the radiating fins (204) and the heat exchange tubes (203) are provided with multiple groups, and the heat conducting pad (202) is made of a heat conducting silica gel sheet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221578769.8U CN218352969U (en) | 2022-06-22 | 2022-06-22 | High-performance 5G circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221578769.8U CN218352969U (en) | 2022-06-22 | 2022-06-22 | High-performance 5G circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218352969U true CN218352969U (en) | 2023-01-20 |
Family
ID=84912740
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221578769.8U Active CN218352969U (en) | 2022-06-22 | 2022-06-22 | High-performance 5G circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218352969U (en) |
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2022
- 2022-06-22 CN CN202221578769.8U patent/CN218352969U/en active Active
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