CN219476581U - Heat dissipation shell for solid state relay - Google Patents
Heat dissipation shell for solid state relay Download PDFInfo
- Publication number
- CN219476581U CN219476581U CN202320459283.0U CN202320459283U CN219476581U CN 219476581 U CN219476581 U CN 219476581U CN 202320459283 U CN202320459283 U CN 202320459283U CN 219476581 U CN219476581 U CN 219476581U
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- Prior art keywords
- state relay
- heat dissipation
- mounting panel
- solid state
- mounting plate
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
- Y02T10/00—Road transport of goods or passengers
- Y02T10/60—Other road transportation technologies with climate change mitigation effect
- Y02T10/70—Energy storage systems for electromobility, e.g. batteries
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Abstract
The application relates to a heat dissipation casing for solid-state relay, it includes relative first mounting panel and the second mounting panel that sets up, fixed mounting has a plurality of heat dissipation fins between first mounting panel and the second mounting panel, the second mounting panel is kept away from the one side of first mounting panel and is offered and be used for supplying the guide rail to wear to establish the guide rail groove, the draw-in interface has been offered to a side wall of second mounting panel, draw-in interface and guide rail groove intercommunication, the draw-in interface is used for supplying the fixture block damping to wear to establish, a plurality of first screw has been offered to first mounting panel, first screw is used for supplying solid-state relay to install in the one side that the heat dissipation fin was kept away from to first mounting panel. The heat dissipation fin has the effect of facilitating heat conduction to the heat dissipation fin for heat dissipation.
Description
Technical Field
The present application relates to the field of heat sinks, and more particularly to a heat dissipating housing for a solid state relay.
Background
The solid-state relay is a novel contactless switching device which is entirely composed of solid-state electronic components, and the solid-state relay generates heat during operation, so the solid-state relay is generally provided with a heat dissipation shell for heat dissipation.
At present, chinese patent with the publication number of CN207783413U discloses a solid-state relay radiator, which comprises a radiator body, wherein radiating ribs are arranged on the side surface of the radiator body, a mounting surface connected with a radiating bottom plate of the solid-state relay is arranged at the top of the radiator body, fixing legs are arranged on two sides of the bottom of the radiator body, and a matched guide rail groove and an elastic buckle mechanism are arranged between the corresponding fixing legs at the bottom of the radiator body. The solid-state relay is arranged on the mounting surface, then the radiator body slides into the guide rail through the guide rail groove, and then the guide rail is pressed inside the guide rail groove through the elastic buckle mechanism, so that the radiator body is arranged on the guide rail. The heat generated by the solid relay is conducted to the radiator body through the mounting surface, then conducted to the radiating fins from the radiator body, and radiated through the radiating fins.
In view of the above-mentioned related art, the inventors consider that after heat generated by the solid state relay is transferred to the mounting surface, the heat needs to be led into each heat dissipation fin from the heat sink body to dissipate heat, so that the efficiency of transferring the heat on the mounting surface to the heat dissipation fins is low, and the heat dissipation of the solid state relay is affected.
Disclosure of Invention
In order to facilitate heat conduction to the heat dissipation fins for heat dissipation, the application provides a heat dissipation housing for a solid state relay.
The application provides a heat dissipation casing for solid-state relay adopts following technical scheme:
a heat dissipation casing for solid-state relay, including relative first mounting panel and the second mounting panel that sets up, fixed mounting has a plurality of heat dissipation fins between first mounting panel and the second mounting panel, the one side that the first mounting panel was kept away from to the second mounting panel has been seted up and is used for supplying the guide rail to wear to establish the guide rail groove, the draw-in interface has been seted up to a side wall of second mounting panel, draw-in interface and guide rail groove intercommunication, the draw-in interface is used for supplying the fixture block damping to wear to establish, a plurality of first screw has been seted up to first mounting panel, first screw is used for supplying solid-state relay to install in the one side that the heat dissipation fin was kept away from to first mounting panel.
Through adopting above-mentioned technical scheme, solid-state relay installs in first mounting panel through first screw, lets the guide rail slide in the guide rail groove afterwards, uses the fixture block to insert inside the draw-in interface. The guide rail is pressed by the clamping block, so that the heat dissipation shell is fixed on the guide rail. After the heat generated by the solid-state relay is transferred into the first mounting plate, the first mounting plate is in direct contact with each radiating rib, so that the heat is conveniently transferred to the radiating ribs for radiating, and the radiating capacity of the radiating shell is improved. Meanwhile, the heat dissipation fins play a good supporting role between the first mounting plate and the second mounting plate.
Optionally, a support plate is fixedly installed between the first mounting plate and the second mounting plate.
Through adopting above-mentioned technical scheme, the backup pad is favorable to reinforcing the support between first mounting panel and the second mounting panel to reduce the condition that the heat dissipation casing received solid state relay's extrusion and damaged appears.
Optionally, the support plate covers a portion of the first mounting plate provided with the first screw hole, and the support plate is provided with a second screw hole communicated with the first screw hole.
Through adopting above-mentioned technical scheme, use bolt screw in solid-state relay and first screw to make solid-state relay install on first mounting panel. The second screw hole is formed in the supporting plate, and the bolt is screwed into the first screw hole and then is continuously screwed into the second screw hole, so that the firmness of the solid-state relay mounted on the first mounting plate is improved. And meanwhile, the second screw hole in the supporting plate is beneficial to reducing the requirement on the depth of the first screw hole, so that the thickness of the first mounting plate is beneficial to reducing. The thickness of the first mounting plate is reduced, so that heat of the solid-state relay is conveniently conducted to the heat dissipation fins through the first mounting plate to dissipate heat, and the heat dissipation capacity of the heat dissipation shell is improved.
Optionally, the second mounting plate is provided with a through hole communicated with the second screw hole.
Through adopting above-mentioned technical scheme, bolt screw in solid-state relay, first screw and second screw in proper order, then the bolt is worn out from the through-hole. The bolts are tightly abutted to the installation positions of the guide rails, and the bolts can drive the guide rails to be clamped with the inner walls of the guide rail grooves, so that the strength of the heat dissipation device capable of being installed on the guide rails is improved.
Optionally, the inner diameter of the through hole is larger than the inner diameter of the second screw hole.
Through adopting above-mentioned technical scheme, the hole of seting up on the solid-state relay probably is in the dorsal part to make constructor need the bolt screw in solid-state relay after passing through-hole, second screw, first screw in proper order. The nuts of the bolts can enter the through holes and are hidden through the through holes, so that flatness of one face, away from the first mounting plate, of the second mounting plate is kept.
Optionally, a plurality of heat dissipation grooves are formed in two sides of the heat dissipation rib, and the plurality of heat dissipation grooves are arranged at intervals from one side of the heat dissipation rib close to the first mounting plate to the other side of the heat dissipation rib.
By adopting the technical scheme, the radiating grooves are beneficial to increasing the contact area of the radiating ribs and air, so that the radiating capacity of the radiating ribs is improved.
Optionally, the heat dissipation grooves on two sides of the heat dissipation rib are arranged in a staggered manner.
Through adopting above-mentioned technical scheme, the fin forms the heat dissipation groove through the cutting, and is located the dislocation set between the heat dissipation groove on fin both sides to make the fin buckle repeatedly to both sides and form the heat dissipation groove, and then conveniently process the heat dissipation fin.
Optionally, two sides of the heat dissipation rib are fixedly provided with inclined support plates, and one side of the inclined support plates away from the heat dissipation rib is fixedly connected with one side of the first mounting plate, which is close to the second mounting plate.
Through adopting above-mentioned technical scheme, the bracing board supports first mounting panel to reduce the condition that first mounting panel received the crooked damage of extrusion of solid state relay to appear. Meanwhile, heat of the first mounting plate is conducted to the inclined strut plate to radiate, so that the radiating capacity of the radiating shell is improved.
In summary, the present application includes at least one of the following beneficial technical effects:
1. the first mounting plate is in direct contact with the heat radiating ribs, heat of the first mounting plate is directly transferred to the heat radiating ribs, and the area of the heat transferred to the heat radiating ribs by the first mounting plate is increased, so that the heat is conveniently transferred to the heat radiating ribs for heat radiation, and the heat radiation capacity of the heat radiating shell is improved;
2. the first mounting plate and the second mounting plate are supported by the supporting plate, so that the situation that the heat dissipation shell is damaged by extrusion is reduced;
3. the contact area of the heat radiating ribs and the air is increased through the heat radiating grooves, so that the heat radiating capacity of the heat radiating ribs is improved.
Drawings
Fig. 1 is a schematic structural diagram of a heat dissipation housing connected to a guide rail and a solid state relay according to embodiment 1 of the present application;
FIG. 2 is a schematic view of the overall structure of the first view angle of embodiment 1 of the present application;
FIG. 3 is a schematic overall structure of a second view angle of embodiment 1 of the present application;
FIG. 4 is a cross-sectional view of FIG. 3 at A-A;
fig. 5 is a schematic overall structure of embodiment 2 of the present application.
Reference numerals illustrate: 1. a first mounting plate; 2. a second mounting plate; 3. a heat dissipation fin; 4. a support plate; 5. a first screw hole; 6. a second screw hole; 7. a through hole; 8. a guide rail groove; 9. a card interface; 10. a solid state relay; 11. a clamping block; 12. a guide rail; 13. a heat sink; 14. and (5) a diagonal bracing plate.
Detailed Description
The present application is described in further detail below in conjunction with figures 1-5.
Example 1.
Embodiments of the present application disclose a heat dissipating housing for a solid state relay 10.
Referring to fig. 1, a heat dissipating housing for a solid state relay 10 includes a first mounting plate 1 and a second mounting plate 2 disposed opposite each other. A plurality of heat radiation fins 3 are fixedly arranged between the first mounting plate 1 and the second mounting plate 2. There are also support plates 4 fixedly mounted between the first mounting plate 1 and the second mounting plate 2, in this application there are two support plates 4 between the first mounting plate 1 and the second mounting plate 2. The first mounting plate 1 and the second mounting plate 2 are supported together by the heat radiation fins 3 and the support plate 4, thereby reducing the occurrence of damage to the heat radiation housing due to the compression.
The first screw holes 5 are formed in the connection portion of the first mounting plate 1 and the support plates 4, and two first screw holes 5 are formed in the connection portion of each support plate 4 and the first mounting plate 1. The first screw hole 5 is used for the solid state relay 10 to be mounted on the first mounting plate 1 through bolts.
After the solid state relay 10 is mounted on the first mounting board 1, heat generated by the solid state relay 10 is transferred to the first mounting board 1. The heat radiation fins 3 are in direct contact with the first mounting plate 1, so that the first mounting plate 1 is convenient for conducting heat to the heat radiation fins 3 to radiate heat, and the heat radiation capacity of the heat radiation shell is improved.
The second screw hole 6 communicated with the first screw hole 5 is formed in the supporting plate 4, the inner diameter of the first screw hole 5 is the same as that of the second screw hole 6, so that the bolt is screwed into the first screw hole 5 and then is continuously screwed into the second screw hole 6, and the firmness of the solid state relay 10 mounted on the first mounting plate 1 is improved.
The second screw holes 6 are used for screwing bolts in, so that the requirement on the depth of the first screw holes 5 when the solid state relay 10 is installed on the first mounting plate 1 is reduced, and the thickness of the first mounting plate 1 is reduced conveniently. By reducing the thickness of the first mounting plate 1, heat is conveniently conducted to the heat radiating ribs 3 by the first mounting plate 1, and the heat radiating capacity of the heat radiating shell is further improved.
The second mounting plate 2 is provided with a through hole 7 communicated with the second screw hole 6. When the installer installs the solid state relay 10 on the first installation plate 1, one method is that bolts sequentially pass through the solid state relay 10, the first screw hole 5 and the second screw hole 6, thereby installing the solid state relay 10 on the first installation plate 1. Alternatively, bolts are sequentially passed through the through-hole 7, the second screw hole 6, the first screw hole 5, and the solid-state relay 10, thereby mounting the solid-state relay 10 to the first mounting plate 1. The solid state relay 10 is mounted to the first mounting plate 1 by two methods of bolts, thereby facilitating the connection of the solid state relay 10 and the first mounting plate 1 by an installer.
The one side of second mounting panel 2 far away from first mounting panel 1 has seted up the guide rail groove 8 that supplies guide rail 12 to wear to establish, and the draw-in interface 9 with guide rail groove 8 intercommunication has been seted up to a side wall of second mounting panel 2. The clamping interface 9 is used for the damping penetration of the clamping block 11. After the solid state relay 10 is connected to the heat dissipating case, the heat dissipating case needs to be mounted to the rail 12. The guide rail 12 passes through the guide rail groove 8, then the clamping block 11 is inserted into the clamping interface 9, and the guide rail 12 is extruded through the clamping block 11, so that the heat dissipation shell is fixed on the guide rail 12, and the heat dissipation shell is conveniently installed on the guide rail 12.
When the bolts sequentially penetrate through the solid-state relay 10, the first screw holes 5 and the second screw holes 6 to mount the solid-state relay 10 on the first mounting plate 1, the bolts penetrate through the through holes 7 and then are tightly abutted to the mounting positions of the guide rails 12, so that the guide rails 12 are tightly clamped with the inner walls of the guide rail grooves 8, and the situation that the heat dissipation shell is impacted by vibration and slides on the guide rails 12 is reduced.
The inner diameter of the through hole 7 is larger than the inner diameter of the second screw hole 6. The bolt passes through the through hole 7, the second screw hole 6, the first screw hole 5 and the solid-state relay 10 in sequence to when installing the solid-state relay 10 in the first mounting panel 1, the nut of bolt gets into inside the through hole 7, thereby is favorable to keeping the second mounting panel 2 to keep away from the one side of first mounting panel 1 level and smooth, and then reduces the condition that the nut of bolt and the position joint of guide rail 12 installation appear.
The implementation principle of the heat dissipation housing for the solid state relay 10 according to the embodiment of the present application is as follows: after the solid state relay 10 is mounted on the first mounting board 1, heat of the solid state relay 10 is directly transferred to the first mounting board 1. Then, the heat of the first mounting plate 1 is directly conducted into the heat radiating ribs 3, so that the heat is conveniently conducted to the heat radiating ribs 3 for heat radiation, and the heat radiation capacity of the heat radiating shell is improved.
Example 2.
Embodiments of the present application disclose a heat dissipating housing for a solid state relay 10.
Referring to fig. 1, a heat dissipation housing for a solid state relay 10 according to the embodiment of the present application is different from embodiment 1 in that a plurality of heat dissipation grooves 13 are formed on both sides of the heat dissipation fins 3, and the plurality of heat dissipation grooves 13 are arranged from one side of the heat dissipation fins 3 close to the first mounting plate 1 to the other side at intervals. The heat dissipation grooves 13 are advantageous in increasing the contact area of the heat dissipation fins 3 with air, thereby improving the heat dissipation capability of the heat dissipation fins 3.
The heat dissipation grooves 13 positioned on the two sides of the heat dissipation fins 3 are arranged in a staggered way. The radiating ribs 3 are cut to form radiating grooves 13, and the radiating ribs 3 can be repeatedly bent to two sides to form the radiating grooves 13, so that the radiating grooves 13 can be conveniently formed on the radiating fins.
The two sides of the radiating rib 3 are fixedly provided with the inclined supporting plates 14, and one side of the inclined supporting plates 14 away from the radiating rib 3 is fixedly connected with one side of the first mounting plate 1, which is close to the second mounting plate 2. The diagonal brace 14 is used to support the first mounting plate 1, thereby reducing the occurrence of the first mounting plate 1 being subjected to compressive bending. And the inclined supporting plate 14 is beneficial to increasing the conduction of heat of the first mounting plate 1 to the heat radiating ribs 3, so that the heat radiating capacity of the heat radiating shell is improved.
The implementation principle of the heat dissipation housing for the solid state relay 10 according to the embodiment of the present application is as follows: the contact area between the heat radiation fins 3 and the air is increased by the heat radiation grooves 13, thereby improving the heat radiation capability of the heat radiation fins 3.
The foregoing are all preferred embodiments of the present application, and are not intended to limit the scope of the present application in any way, therefore: all equivalent changes in structure, shape and principle of this application should be covered in the protection scope of this application.
Claims (8)
1. A heat dissipating housing for a solid state relay (10), characterized by: including relative first mounting panel (1) and second mounting panel (2) that set up, fixed mounting has a plurality of heat dissipation fins (3) between first mounting panel (1) and second mounting panel (2), second mounting panel (2) are kept away from the one side of first mounting panel (1) and are offered and are used for supplying guide rail (12) to wear to establish guide rail groove (8), interface (9) have been offered to a side wall of second mounting panel (2), interface (9) and guide rail groove (8) intercommunication, interface (9) are used for supplying fixture block (11) damping to wear to establish, a plurality of first screw (5) have been seted up to first mounting panel (1), first screw (5) are used for supplying solid state relay (10) to install in the one side that first mounting panel (1) kept away from heat dissipation fins (3).
2. A heat dissipating housing for a solid state relay (10) according to claim 1, wherein: a supporting plate (4) is fixedly arranged between the first mounting plate (1) and the second mounting plate (2).
3. A heat dissipating housing for a solid state relay (10) according to claim 2, wherein: the support plate (4) covers the first mounting plate (1) and is provided with a first screw hole (5), and the support plate (4) is provided with a second screw hole (6) communicated with the first screw hole (5).
4. A heat dissipating housing for a solid state relay (10) according to claim 3, wherein: and the second mounting plate (2) is provided with a through hole (7) communicated with the second screw hole (6).
5. A heat dissipating housing for a solid state relay (10) according to claim 4, wherein: the inner diameter of the through hole (7) is larger than that of the second screw hole (6).
6. A heat dissipating housing for a solid state relay (10) according to claim 1, wherein: a plurality of radiating grooves (13) are formed in two sides of the radiating rib (3), and the radiating grooves (13) are arranged at intervals from one side of the radiating rib (3) close to the first mounting plate (1) to the other side.
7. A heat dissipating housing for a solid state relay (10) according to claim 5, wherein: the heat dissipation grooves (13) positioned on the two sides of the heat dissipation rib (3) are arranged in a staggered mode.
8. A heat dissipating housing for a solid state relay (10) according to claim 1, wherein: two sides of the radiating rib (3) are fixedly provided with inclined supporting plates (14), and one side of the inclined supporting plates (14) far away from the radiating rib (3) is fixedly connected with one side of the first mounting plate (1) close to the second mounting plate (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320459283.0U CN219476581U (en) | 2023-03-01 | 2023-03-01 | Heat dissipation shell for solid state relay |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320459283.0U CN219476581U (en) | 2023-03-01 | 2023-03-01 | Heat dissipation shell for solid state relay |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219476581U true CN219476581U (en) | 2023-08-04 |
Family
ID=87439122
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320459283.0U Active CN219476581U (en) | 2023-03-01 | 2023-03-01 | Heat dissipation shell for solid state relay |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219476581U (en) |
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2023
- 2023-03-01 CN CN202320459283.0U patent/CN219476581U/en active Active
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