CN206402527U - A kind of radiating explosion-proof type PCB multilayer board - Google Patents
A kind of radiating explosion-proof type PCB multilayer board Download PDFInfo
- Publication number
- CN206402527U CN206402527U CN201720081149.6U CN201720081149U CN206402527U CN 206402527 U CN206402527 U CN 206402527U CN 201720081149 U CN201720081149 U CN 201720081149U CN 206402527 U CN206402527 U CN 206402527U
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- CN
- China
- Prior art keywords
- circuit board
- radiating
- radiating area
- pcb multilayer
- main body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses a kind of radiating explosion-proof type PCB multilayer board, including the top layer circuit board being sequentially connected, bus plane, ground plane and bottom circuit board, top layer circuit board, bus plane, the outside of ground plane and bottom circuit board set substrate, substrate is fixedly connected with top layer circuit board, bus plane, ground plane and bottom circuit board by screw, and a heat dissipating layer is set respectively between the circuit board and bus plane, between bus plane and ground plane, between ground plane and bottom circuit board, between bottom circuit board and substrate.The heat dissipating layer includes main body and the main radiating area being arranged in main body and secondary radiating area, and main radiating area is connected with secondary radiating area by heat dissipation channel.Heat dissipating layer is set between the utility model adjacent circuit flaggy, can in time be radiated when PCB multilayer board works, is prevented because the PCB multilayer board working time is long, it is impossible to radiating in time plate bursting or component loss caused by, the service life of pcb board is influenceed.
Description
Technical field
The utility model is related to PCB multilayer board, more particularly to a kind of radiating explosion-proof type PCB multilayer board.
Background technology
PCB (Printed Circuit Board), i.e. printed circuit board, are the supporters of electronic component, are electronics members
The supplier of device electrical connection.Single sided board, dual platen and multi-layer sheet can be divided into according to the circuit number of plies.General pcb board includes base
Installation electronic component is generally required on plate and printed circuit, printed circuit, and for the ease of the installation of electronic component, in base
Installing zone is set on plate, then the installing zone is stamped and formed out the mounting groove of electronic device by techniques such as punching presses, however, in punching press
During, because the pressure of pressing equipment time is larger, and lifting surface area is smaller, so the punching press side stress collection of pcb board
In easily cause damage explosion, or even circuit land damaged around it etc., therefore, this pcb board structure are installing groove processing
During, circuit board damage is easily caused, causes defective products to increase, cost is improved.
But PCB multilayer board of the prior art is in the process of running, because prolonged operation, causes PCB multilayer board
Temperature is too high, easily burns out or deforms, and how to prevent from damaging in use, and extension pcb board service life turns into this area
The technical problem that technical staff constantly pursues.
Utility model content
The purpose of this utility model is to overcome the deficiencies in the prior art there is provided a kind of radiating explosion-proof type PCB multilayer board, dissipates
Thermal exhaust effect is good, prevents plate bursting.
In order to achieve the above object, the technical solution adopted in the utility model is：
A kind of radiating explosion-proof type PCB multilayer board, including top layer circuit board, bus plane, ground plane and the bottom being sequentially connected
Circuit board, top layer circuit board, bus plane, the outside of ground plane and bottom circuit board set substrate, substrate and top layer circuit board, electricity
Active layer, ground plane and bottom circuit board are fixedly connected by screw, between the circuit board and bus plane, bus plane and ground plane
Between, between ground plane and bottom circuit board, between bottom circuit board and substrate a heat dissipating layer is set respectively.
As preferred embodiment of the present utility model, heat dissipating layer described in the utility model includes main body and is arranged in main body
Main radiating area and secondary radiating area, main radiating area is connected with pair radiating area by heat dissipation channel.
As preferred embodiment of the present utility model, main radiating area described in the utility model is arranged at the center of main body, main
Four secondary radiating areas are set on body, and the secondary radiating area is arranged on four angles of main body.
Set and dissipate as preferred embodiment of the present utility model, on secondary radiating area described in the utility model to the edge of main body
Heat pipe.
As preferred embodiment of the present utility model, at least two sides of secondary radiating area described in the utility model and main body
Radiating tube is set between edge.
As preferred embodiment of the present utility model, at least set on secondary radiating area described in the utility model to the edge of main body
Put three radiating tubes.
Set as preferred embodiment of the present utility model, on substrate described in the utility model it is corresponding to radiating tube position and
The heat emission hole of connection.
Compared with prior art, the beneficial effects of the utility model are：Heat dissipating layer is set between adjacent circuit flaggy, can
Radiate, prevent because the PCB multilayer board working time is long in time when PCB multilayer board works, it is impossible to which radiating is caused by time
Plate bursting or component loss, influence the service life of pcb board.
Brief description of the drawings
Fig. 1 is overall structure diagram of the present utility model；
Fig. 2 is cooling plate structure schematic diagram of the present utility model；
Fig. 3 is substrate side surfaces structural representation of the present utility model.
Embodiment
It is described in detail referring to the drawings with reference to embodiment, to enter to technical characteristic of the present utility model and advantage
Row deeper into annotation.
Structural representation of the present utility model is as shown in figure 1, a kind of radiating explosion-proof type PCB multilayer board, including is sequentially connected
Top layer circuit board 1, bus plane 2, ground plane 3 and bottom circuit board 4, top layer circuit board 1, bus plane 2, ground plane 3 and bottom
The outside of circuit board 4 sets substrate 6, and substrate 6 passes through spiral shell with top layer circuit board 1, bus plane 2, ground plane 3 and bottom circuit board 4
Nail 7 is fixedly connected, between the circuit board 1 and bus plane 2, between bus plane 2 and ground plane 3, ground plane 3 and bottom circuit board
A heat dissipating layer 5 is set respectively between 4, between bottom circuit board 4 and substrate 6.Heat dissipating layer, energy are set between adjacent circuit flaggy
Enough ensure in time to distribute heat during PCB multilayer board work, increase the service life.
As shown in Fig. 2 heat dissipating layer 5 described in the utility model includes main body 51 and the main radiating area 52 being arranged in main body 51
With secondary radiating area 54, main radiating area 52 is connected with secondary radiating area 54 by heat dissipation channel 53.The main radiating area 52 is arranged at master
Four secondary radiating areas 54 are set in the center of body 51, main body 51, and the secondary radiating area 54 is arranged on four angles of main body 51.Such as
Shown in Fig. 2, main radiating area 52 is arranged at the center of heat dissipating layer 5, in time can transmit the heat produced by each layer pcb board in time
To the secondary radiating area 54 in four corners, heat is conducted by hot channel 53.In addition, the secondary radiating area 54 is to the side of main body 51
Radiating tube 55 is set on edge, radiating tube 55 is set between at least two sides of the secondary radiating area 54 and the edge of main body 51.Such as
Shown in Fig. 2, secondary radiating area 54 is set to rectangle, and radiating tube 55, institute are set between two sides near the edge of main body 51
Secondary radiating area 54 is stated to the edge of main body 51 at least provided with three radiating tubes 55, certain the utility model is not limited to three,
Other any amounts are set according to actual conditions.
As shown in figure 3, setting corresponding to the position of radiating tube 55 and connection heat emission hole on substrate 6 described in the utility model
61.The side of substrate 6 is according to corresponding heat dissipating layer 5 below top layer circuit board 1, bus plane 2, ground plane 3 and bottom circuit board 4
The position of radiating tube 55 is set, and radiating, increases the service life in time.
Operation principle of the present utility model is as follows：When PCB multilayer board works, top layer circuit board 1, bus plane 2, ground plane 3
And the heat that bottom circuit board 4 is produced passes to main radiating area 52 and secondary radiating area 54 first, main radiating area 52 is logical by radiating
Road 53 is delivered to secondary radiating area 54, and secondary radiating area 54 is conducted in time by radiating tube 55, and passes through the heat emission hole on substrate 6
61 are conducted again, and the heat that in time can be produced PCB multilayer board is conducted in time, reduce the temperature of PCB multilayer board, so that
The short circuit, open circuit or the protection that is stopped brought because temperature is too high is prevented, extends the service life of PCB multilayer board.
Clear, complete description is carried out to the utility model by the technical scheme in above example, it is clear that described
Embodiment be the embodiment of the utility model part, rather than whole embodiment.Based on the implementation in the utility model
Example, the every other embodiment that those of ordinary skill in the art are obtained under the premise of creative work is not made is belonged to
The scope of the utility model protection.
Claims (7)
1. a kind of radiating explosion-proof type PCB multilayer board, it is characterised in that：Including top layer circuit board (1), the bus plane being sequentially connected
(2), ground plane (3) and bottom circuit board (4), top layer circuit board (1), bus plane (2), ground plane (3) and bottom circuit board (4)
Outside substrate (6) is set, substrate (6) and top layer circuit board (1), bus plane (2), ground plane (3) and bottom circuit board (4) are logical
Cross screw (7) to be fixedly connected, between the circuit board (1) and bus plane (2), between bus plane (2) and ground plane (3), ground connection
A heat dissipating layer (5) is set respectively between layer (3) and bottom circuit board (4), between bottom circuit board (4) and substrate (6).
2. radiating explosion-proof type PCB multilayer board according to claim 1, it is characterised in that：The heat dissipating layer (5) includes main body
(51) and the main radiating area (52) that is arranged in main body (51) and secondary radiating area (54), main radiating area (52) and secondary radiating area (54)
Connected by heat dissipation channel (53).
3. radiating explosion-proof type PCB multilayer board according to claim 2, it is characterised in that：The main radiating area (52) is set
Four secondary radiating areas (54) are set in the center in main body (51), main body (51), and the secondary radiating area (54) is arranged at main body
(51) on four angles.
4. radiating explosion-proof type PCB multilayer board according to claim 3, it is characterised in that：The secondary radiating area (54) is extremely main
Radiating tube (55) is set on the edge of body (51).
5. radiating explosion-proof type PCB multilayer board according to claim 4, it is characterised in that：The secondary radiating area (54) is extremely
Radiating tube (55) is set between few two sides and the edge of main body (51).
6. radiating explosion-proof type PCB multilayer board according to claim 4, it is characterised in that：The secondary radiating area (54) is extremely main
At least provided with three radiating tubes (55) on the edge of body (51).
7. the radiating explosion-proof type PCB multilayer board according to any one of claim 4-6, it is characterised in that：The substrate (6)
It is upper that corresponding to radiating tube (55) position and connection heat emission hole (61) is set.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720081149.6U CN206402527U (en) | 2017-01-22 | 2017-01-22 | A kind of radiating explosion-proof type PCB multilayer board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720081149.6U CN206402527U (en) | 2017-01-22 | 2017-01-22 | A kind of radiating explosion-proof type PCB multilayer board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206402527U true CN206402527U (en) | 2017-08-11 |
Family
ID=59515612
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720081149.6U Expired - Fee Related CN206402527U (en) | 2017-01-22 | 2017-01-22 | A kind of radiating explosion-proof type PCB multilayer board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206402527U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110602867A (en) * | 2019-08-09 | 2019-12-20 | 苏州浪潮智能科技有限公司 | PCB design method and system for improving power supply connection stability of server and PCB |
-
2017
- 2017-01-22 CN CN201720081149.6U patent/CN206402527U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110602867A (en) * | 2019-08-09 | 2019-12-20 | 苏州浪潮智能科技有限公司 | PCB design method and system for improving power supply connection stability of server and PCB |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170811 Termination date: 20220122 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |