CN206402527U - A heat dissipation and explosion-proof PCB multilayer board - Google Patents

Abstract

The utility model discloses an explosion-proof type PCB multiply wood dispels heat, including top layer circuit board, power plane, ground plane and the bottom circuit board that connects gradually, the outside of top layer circuit board, power plane, ground plane and bottom circuit board sets up the base plate, and the base plate passes through screw fixed connection with top layer circuit board, power plane, ground plane and bottom circuit board, set up a heat dissipation layer between circuit board and the power plane, between power plane and the ground plane, between ground plane and the bottom circuit board, between bottom circuit board and the base plate respectively. The heat dissipation layer comprises a main body, and a main heat dissipation area and an auxiliary heat dissipation area which are arranged on the main body, wherein the main heat dissipation area is connected with the auxiliary heat dissipation area through a heat dissipation channel. The utility model discloses set up the heat dissipation layer between the adjacent circuit board layer, can in time dispel the heat at PCB multiply wood during operation, thereby prevent because of PCB multiply wood operating time overlength, thereby the unable board or the components and parts loss of exploding that leads to of in time dispelling the heat influences the life of PCB board.

Description

A heat dissipation and explosion-proof PCB multilayer board

technical field

The utility model relates to a PCB multilayer board, in particular to a heat dissipation and explosion-proof PCB multilayer board.

Background technique

PCB (Printed Circuit Board), that is, a printed circuit board, is a support for electronic components and a provider of electrical connections for electronic components. According to the number of circuit layers, it can be divided into single-sided board, double-sided board and multi-layer board. Generally, a PCB board includes a substrate and a printed circuit. Electronic components generally need to be installed on the printed circuit. In order to facilitate the installation of electronic components, an installation area is set on the substrate, and then the installation area is stamped by stamping and other processes to form the installation of electronic devices. However, during the stamping process, due to the high pressure of the stamping equipment and the small stress area, the stamping edge of the PCB board is prone to damage and burst due to stress concentration, and even damage the surrounding circuit pads, etc. Therefore, in the process of processing the mounting grooves of this PCB board structure, it is easy to cause damage to the circuit board, resulting in an increase of defective products and an increase in cost.

However, during the operation of the PCB multilayer board in the prior art, due to long-term operation, the temperature of the PCB multilayer board is too high, and it is easy to burn out or deform. How to prevent damage during use and prolong the service life of the PCB board has become a problem. A technical problem constantly pursued by those skilled in the art.

Utility model content

The purpose of the utility model is to overcome the deficiencies of the prior art, and provide a heat dissipation and explosion-proof PCB multilayer board, which has a good heat dissipation and exhaust effect and prevents the explosion of the board.

In order to achieve the above object, the technical scheme that the utility model adopts is:

A heat dissipation and explosion-proof PCB multilayer board, including a top circuit board, a power supply layer, a ground layer and a bottom circuit board connected in sequence, a substrate is arranged on the outside of the top circuit board, a power supply layer, a ground layer and the bottom circuit board, and the substrate and the top circuit board Board, power layer, ground layer and bottom circuit board are fixedly connected by screws, between the circuit board and the power layer, between the power layer and the ground layer, between the ground layer and the bottom circuit board, between the bottom circuit board and the substrate A heat dissipation layer is provided respectively.

As a preferred embodiment of the present invention, the heat dissipation layer of the present invention includes a main body and a main heat dissipation area and a secondary heat dissipation area arranged on the main body, and the main heat dissipation area and the auxiliary heat dissipation area are connected through a heat dissipation channel.

As a preferred embodiment of the present utility model, the main cooling area of the utility model is arranged at the center of the main body, and four auxiliary cooling areas are arranged on the main body, and the auxiliary cooling areas are arranged at four corners of the main body.

As a preferred embodiment of the utility model, a radiating pipe is arranged on the edge of the utility model from the sub-radiating area to the main body.

As a preferred embodiment of the utility model, a radiating pipe is arranged between at least two sides of the sub-radiating area of the utility model and the edge of the main body.

As a preferred embodiment of the utility model, at least three heat dissipation pipes are arranged on the edge of the utility model from the secondary heat dissipation area to the main body.

As a preferred embodiment of the utility model, the substrate of the utility model is provided with cooling holes corresponding to the positions of the cooling pipes and communicating with each other.

Compared with the prior art, the beneficial effect of the utility model is that a heat dissipation layer is set between adjacent circuit board layers, which can dissipate heat in time when the PCB multilayer board is working, and prevent the PCB multilayer board from being unable to timely Explosion or loss of components caused by heat dissipation will affect the service life of the PCB board.

Description of drawings

Fig. 1 is the overall structural representation of the utility model;

Fig. 2 is the structure schematic diagram of the radiator plate of the present utility model;

Fig. 3 is a schematic diagram of the side structure of the substrate of the present invention.

detailed description

The following will be described in detail with reference to the accompanying drawings in conjunction with the embodiments, so as to further explain the technical features and advantages of the present utility model.

The structural diagram of the utility model is shown in Figure 1, a heat dissipation and explosion-proof PCB multilayer board, including a top circuit board 1, a power supply layer 2, a ground layer 3 and a bottom circuit board 4 connected in sequence, the top circuit board 1, the power supply Layer 2, ground layer 3 and bottom circuit board 4 are provided with substrate 6 outside, substrate 6 and top layer circuit board 1, power supply layer 2, ground layer 3 and bottom circuit board 4 are fixedly connected by screws 7, and said circuit board 1 and power supply A heat dissipation layer 5 is provided between the layers 2 , between the power supply layer 2 and the ground layer 3 , between the ground layer 3 and the bottom circuit board 4 , and between the bottom circuit board 4 and the substrate 6 . A heat dissipation layer is provided between adjacent circuit board layers, which can ensure that the heat is dissipated in time when the PCB multilayer board is working, and prolongs the service life.

As shown in FIG. 2 , the heat dissipation layer 5 of the present invention includes a main body 51 and a main heat dissipation area 52 and a secondary heat dissipation area 54 arranged on the main body 51 . The main heat dissipation area 52 and the auxiliary heat dissipation area 54 are connected through a heat dissipation channel 53 . The main heat dissipation area 52 is disposed at the center of the main body 51 , and four auxiliary heat dissipation areas 54 are disposed on the main body 51 , and the auxiliary heat dissipation areas 54 are disposed at four corners of the main body 51 . As shown in FIG. 2 , the main heat dissipation area 52 is set at the center of the heat dissipation layer 5 , and can timely transfer the heat generated by each layer of PCB boards to the secondary heat dissipation areas 54 at the four corners, and conduct heat through the heat dissipation pipes 53 . In addition, heat dissipation pipes 55 are disposed on the edge from the secondary heat dissipation area 54 to the main body 51 , and heat dissipation pipes 55 are disposed between at least two sides of the secondary heat dissipation area 54 and the edge of the main body 51 . As shown in Figure 2, the auxiliary heat dissipation area 54 is arranged as a rectangle, and a heat dissipation pipe 55 is arranged between the two sides closest to the edge of the main body 51, and at least three heat dissipation pipes 55 are arranged on the edge of the main body 51 from the auxiliary heat dissipation area 54, Certainly the utility model is not limited to three, and other arbitrary numbers are set according to actual conditions.

As shown in FIG. 3 , the substrate 6 of the present invention is provided with cooling holes 61 corresponding to and communicating with the cooling pipes 55 . One side of the substrate 6 is set according to the positions of the heat dissipation pipes 55 of the heat dissipation layer 5 below the top circuit board 1, the power supply layer 2, the ground layer 3 and the bottom circuit board 4, so as to dissipate heat in time and prolong the service life.

The working principle of the utility model is as follows: when the PCB multilayer board is working, the heat generated by the top circuit board 1, the power supply layer 2, the ground layer 3 and the bottom circuit board 4 is first transferred to the main cooling area 52 and the auxiliary cooling area 54, and the main cooling area The area 52 is transmitted to the secondary heat dissipation area 54 through the heat dissipation channel 53, and the secondary heat dissipation area 54 is conducted in time through the heat dissipation pipe 55, and is conducted again through the heat dissipation holes 61 on the substrate 6, so that the heat generated by the PCB multilayer board can be conducted in time. , Reduce the temperature of the PCB multilayer board, thereby preventing short circuit, open circuit or stop working protection caused by excessive temperature, and prolonging the service life of the PCB multilayer board.

The utility model is clearly and completely described through the technical solutions in the above embodiments, and it is obvious that the described embodiments are a part of the embodiments of the utility model, rather than all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of the present utility model.

Claims (7)

1. A heat dissipation and explosion-proof PCB multilayer board is characterized in that: comprise top layer circuit board (1), power supply layer (2), grounding layer (3) and bottom circuit board (4) connected successively, top layer circuit board ( 1), the power supply layer (2), the grounding layer (3) and the outer side of the bottom circuit board (4) are provided with a substrate (6), and the substrate (6) is connected with the top circuit board (1), the power supply layer (2), and the grounding layer ( 3) and the bottom circuit board (4) are fixedly connected by screws (7), between the circuit board (1) and the power layer (2), between the power layer (2) and the ground layer (3), and between the ground layer ( 3) A heat dissipation layer (5) is respectively arranged between the bottom circuit board (4) and the bottom circuit board (4) and the substrate (6). 2. The heat dissipation and explosion-proof PCB multilayer board according to claim 1, characterized in that: the heat dissipation layer (5) includes a main body (51) and a main heat dissipation area (52) and a secondary heat dissipation area (52) arranged on the main body (51) The heat dissipation area (54), the main heat dissipation area (52) and the secondary heat dissipation area (54) are connected through the heat dissipation channel (53). 3. The heat dissipation and explosion-proof PCB multilayer board according to claim 2, characterized in that: the main heat dissipation area (52) is arranged at the center of the main body (51), and four secondary heat dissipation areas ( 54), the secondary heat dissipation area (54) is arranged on the four corners of the main body (51). 4. The heat dissipation explosion-proof PCB multilayer board according to claim 3, characterized in that: a heat dissipation pipe (55) is arranged on the edge from the secondary heat dissipation area (54) to the main body (51). 5. The heat dissipation and explosion-proof PCB multilayer board according to claim 4, characterized in that: heat pipes (55) are arranged between at least two sides of the secondary heat dissipation area (54) and the edge of the main body (51). 6. The heat dissipation explosion-proof PCB multilayer board according to claim 4, characterized in that: at least three heat dissipation pipes (55) are arranged on the edge from the secondary heat dissipation area (54) to the main body (51). 7. The heat dissipation and explosion-proof PCB multilayer board according to any one of claims 4-6, characterized in that: the substrate (6) is provided with heat dissipation holes (61) corresponding to and connected to the positions of the heat dissipation pipes (55) ).