CN207135344U - A kind of low consumption circuit plate - Google Patents
A kind of low consumption circuit plate Download PDFInfo
- Publication number
- CN207135344U CN207135344U CN201721153405.4U CN201721153405U CN207135344U CN 207135344 U CN207135344 U CN 207135344U CN 201721153405 U CN201721153405 U CN 201721153405U CN 207135344 U CN207135344 U CN 207135344U
- Authority
- CN
- China
- Prior art keywords
- copper sheet
- fixedly connected
- heat conduction
- circuit board
- conduction copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 120
- 239000010949 copper Substances 0.000 claims abstract description 120
- 229910052802 copper Inorganic materials 0.000 claims abstract description 120
- 238000009413 insulation Methods 0.000 claims abstract description 17
- 239000012790 adhesive layer Substances 0.000 claims description 26
- 239000011241 protective layer Substances 0.000 claims description 20
- 239000006185 dispersion Substances 0.000 abstract description 11
- 230000032683 aging Effects 0.000 abstract description 8
- 238000000034 method Methods 0.000 description 9
- 230000000694 effects Effects 0.000 description 5
- 239000010410 layer Substances 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- 230000005611 electricity Effects 0.000 description 2
- 229910017083 AlN Inorganic materials 0.000 description 1
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a kind of low consumption circuit plate, including circuit board body, the back side on the left of the circuit board body is fixedly connected with plug connector, and the front on the right side of the circuit board body is fixedly connected with wire；The circuit board body includes conductive copper sheet and heat conduction copper sheet; insulation glue-line has been fixedly connected with the top and bottom of the conductive copper sheet; the heat conduction copper sheet is fixedly connected on the surface of insulation glue-line; FR4 stiffening plates have been fixedly connected with the top and bottom of the heat conduction copper sheet, matcoveredn is fixedly connected with the top and bottom of the FR4 stiffening plates.The cooperation that the utility model passes through conductive copper sheet, insulation glue-line, heat conduction copper sheet, radiating copper sheet and heat conduction copper rod, the heat dispersion for solving existing printed circuit board (PCB) is poor, commonly rely on increase outside heat sink, radiator fan lamp carries out forced air convection to radiate, the problem of adding overall power consumption, and accelerating aging, the deformation of circuit board in itself.
Description
Technical field
Technical field of electronic products is the utility model is related to, specially a kind of low consumption circuit plate.
Background technology
The title of circuit board has：Ceramic circuit board, aluminium oxide ceramics circuit board, aluminium nitride ceramics circuit board, wiring board,
Pcb board, aluminium base, high frequency plate, thick copper coin, impedance plate, PCB, ultra-thin wiring board, ultrathin circuit board, print (copper lithographic technique)
Circuit board etc..Circuit board makes circuit miniaturization, directly perceivedization, batch production and optimization electrical appliance layout lifting for permanent circuit
Act on.Circuit board can be described as printed substrate or printed circuit board (PCB), and (FPC wiring boards are also known as FPC flexible PCB
It is that there is height reliability, excellent flexible printed circuit to be a kind of made of base material using polyimides or polyester film.
With the characteristics of Distribution density is high, in light weight, thickness of thin, good bending property！) and Rigid Flex-FPC and PCB birth and hair
Exhibition, Rigid Flex this new product is expedited the emergence of.Therefore, Rigid Flex, it is exactly FPC and rigid wiring board, passes through
The processes such as pressing, are combined by related process requirement, the wiring board with FPC characteristics and PCB characteristics of formation.
At present, because the inner space of many electric equipment products is very limited, component power is big and more intensive, and environment is held
Continuous temperature is high；The heat dispersion of existing printed circuit board (PCB) is poor, commonly relies on increase outside heat sink, radiator fan lamp enters
Row forced air convection radiates, and adds overall power consumption, and accelerates aging, the deformation of circuit board in itself, and China is practical
A kind of low-power consumption type printed circuit board (PCB) is proposed in novel C N206402530U, although the utility model can by heat emission hole and
Ventilation copper plate layer is radiated, but the heat of conductive layer can not be introduced directly into air, so as to cause self-radiating effect
It is bad, it is poor so as to solve the heat dispersion of existing printed circuit board (PCB), commonly rely on increase outside heat sink, radiating
Fan lamp carries out forced air convection to radiate, and adds overall power consumption, and accelerates aging, the deformation of circuit board in itself,
A kind of therefore, it is proposed that low consumption circuit plate.
Utility model content
The purpose of this utility model is to provide a kind of low consumption circuit plate possess good heat dissipation effect, so as to reduce power consumption
The advantages of, it is poor to solve the heat dispersion of existing printed circuit board (PCB), commonly relies on increase outside heat sink, radiator fan
Lamp carries out forced air convection and radiated, and adds overall power consumption, and makes what aging, the deformation of circuit board in itself accelerated to ask
Topic.
To achieve the above object, the utility model provides following technical scheme：A kind of low consumption circuit plate, including circuit board
Body, the back side on the left of the circuit board body are fixedly connected with plug connector, and the front on the right side of the circuit board body is fixed to be connected
It is connected to wire；
The circuit board body includes conductive copper sheet and heat conduction copper sheet, and the top and bottom of the conductive copper sheet are fixed to be connected
Insulation glue-line is connected to, the heat conduction copper sheet is fixedly connected on the surface of insulation glue-line, and the top and bottom of the heat conduction copper sheet are equal
FR4 stiffening plates are fixedly connected with, matcoveredn is fixedly connected with the top and bottom of the FR4 stiffening plates, the protective layer
Top and bottom have been fixedly connected with radiating copper sheet, and the surface of the heat conduction copper sheet is fixedly connected with heat conduction copper rod, the heat conduction
The one end of copper rod away from heat conduction copper sheet sequentially passes through FR4 stiffening plates and protective layer and is fixedly connected with radiating copper sheet.
Preferably, the surface of the heat conduction copper sheet is fixedly connected with the first adhesive-layer, and the heat conduction copper sheet is viscous by first
Glue-line is fixedly connected with FR4 stiffening plates.
Preferably, the surface of the FR4 stiffening plates is fixedly connected with the second adhesive-layer, and the FR4 stiffening plates pass through second
Adhesive-layer is fixedly connected with protective layer.
Preferably, the surface of the protective layer is fixedly connected with the 3rd adhesive-layer, and the protective layer passes through the 3rd adhesive-layer
It is fixedly connected with radiating copper sheet.
Preferably, via is offered at the top of the circuit board body, the via includes metallic vias and nonmetallic
Via, the corner at the top of the circuit board body offer mounting hole, and the edge at the top of the circuit board body is fixedly connected
There is electrical boundary.
Compared with prior art, the beneficial effects of the utility model are as follows：
1st, the utility model is by the way that there is provided heat conduction copper sheet so that caused heat can pass in conductive copper sheet running
It is handed on heat conduction copper sheet, by the way that there is provided radiating copper sheet so that heat can be delivered to by heat conduction copper rod scattered by heat conduction copper sheet
On hot copper sheet, because radiating copper sheet is big with air contact area, can in a short time by heat spreader in atmosphere, so as to reach
To the effect of radiating, and because the heat conductivility of copper arrives so that the heat dispersion of heat conduction copper sheet, radiating copper sheet and heat conduction copper rod is excellent
Radiated in traditional air vent, by there is provided insulation glue-line, ensure that the insulating properties between conductive copper sheet and heat conduction copper sheet, leading to
The cooperation of conductive copper sheet, insulation glue-line, heat conduction copper sheet, radiating copper sheet and heat conduction copper rod is crossed, solves existing printed circuit board (PCB)
Heat dispersion it is poor, commonly rely on increase outside heat sink, radiator fan lamp carries out forced air convection and radiated, increase
Overall power consumption, and the problem of accelerate aging, the deformation of circuit board in itself.
2nd, the utility model is by the way that there is provided the first adhesive-layer so that heat conduction copper sheet be connected with FR4 stiffening plates it is even closer,
By the way that there is provided the second adhesive-layer so that FR4 stiffening plates be connected with protective layer it is even closer, by there is provided the 3rd adhesive-layer,
So that protective layer is connected even closer with radiating copper sheet, by there is provided via, for connecting component's feet between each layer, lead to
Cross and be provided with mounting hole, facilitate user installation circuit board body, by there is provided electrical boundary, for determining the chi of circuit board
Very little, the component on all circuit boards is all no more than the border.
Brief description of the drawings
Fig. 1 is the utility model structure diagram；
Fig. 2 is the utility model top view.
In figure：1 circuit board body, 101 conductive copper sheets, 102 insulation glue-lines, 103 heat conduction copper sheets, 104FR4 stiffening plates, 105
Protective layer, 106 radiating copper sheets, 107 heat conduction copper rods, 108 first adhesive-layers, 109 second adhesive-layers, 110 the 3rd adhesive-layers, 2 are inserted
Fitting, 3 wires, 4 vias, 5 mounting holes, 6 electrical boundaries.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the embodiment of the utility model is carried out
Clearly and completely describing, it is clear that described embodiment is only the utility model part of the embodiment, rather than whole
Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are not under the premise of creative work is made
The every other embodiment obtained, belong to the scope of the utility model protection.
Fig. 1-2, a kind of low consumption circuit plate, including circuit board body 1 are referred to, the back side in the left side of circuit board body 1 is consolidated
Surely plug connector 2 is connected with, the front on the right side of circuit board body 1 is fixedly connected with wire 3；
Circuit board body 1 includes conductive copper sheet 101 and heat conduction copper sheet 103, and the top and bottom of conductive copper sheet 101 are fixed
Be connected with insulation glue-line 102, heat conduction copper sheet 103 be fixedly connected on insulation glue-line 102 surface, the top of heat conduction copper sheet 103 and
Bottom has been fixedly connected with FR4 stiffening plates 104, and the top and bottom of FR4 stiffening plates 104 are fixedly connected with matcoveredn 105, protects
The top and bottom of sheath 105 have been fixedly connected with radiating copper sheet 106, and the surface of heat conduction copper sheet 103 is fixedly connected with conduction copper
Rod 107, the one end of heat conduction copper rod 107 away from heat conduction copper sheet 103 sequentially pass through FR4 stiffening plates 104 and protective layer 105 and with radiating
Copper sheet 106 is fixedly connected, and the surface of heat conduction copper sheet 103 is fixedly connected with the first adhesive-layer 108, and heat conduction copper sheet 103 passes through first
Adhesive-layer 108 is fixedly connected with FR4 stiffening plates 104, by the way that there is provided the first adhesive-layer 108 so that heat conduction copper sheet 103 and FR4
Stiffening plate 104 connects even closer, and the surface of FR4 stiffening plates 104 is fixedly connected with the second adhesive-layer 109, FR4 stiffening plates 104
It is fixedly connected by the second adhesive-layer 109 with protective layer 105, by the way that there is provided the second adhesive-layer 109 so that FR4 stiffening plates 104
It is connected with protective layer 105 even closer, the surface of protective layer 105 is fixedly connected with the 3rd adhesive-layer 110, and protective layer 105 passes through
3rd adhesive-layer 110 is fixedly connected with radiating copper sheet 106, by the way that there is provided the 3rd adhesive-layer 110 so that protective layer 105 is with dissipating
Hot copper sheet 106 connects even closer, and the top of circuit board body 1 offers via 4, and via 4 includes metallic vias and Fei Jin
Belong to via, the corner at the top of circuit board body 1 offers mounting hole 5, and the edge at the top of circuit board body 1 is fixedly connected with electricity
Gas border 6, by there is provided via 4, for connecting component's feet between each layer, by there is provided mounting hole 5, facilitating user
Mounting circuit boards body 1, by there is provided electrical boundary 6, for determining the size of circuit board, the component on all circuit boards
All no more than the border, by the way that there is provided heat conduction copper sheet 103 so that caused heat can in the running of conductive copper sheet 101
To be transferred on heat conduction copper sheet 103, by the way that there is provided radiating copper sheet 106 so that heat can be passed through heat conduction by heat conduction copper sheet 103
Copper rod 107 is delivered in radiating copper sheet 106, can be in a short time by heat because radiating copper sheet 106 and air contact area are big
Amount radiates in atmosphere, so as to reach the effect of radiating, and because the heat conductivility of copper arrives so that heat conduction copper sheet 103, radiating copper
The heat dispersion of piece 106 and heat conduction copper rod 107 radiates better than traditional air vent, by there is provided insulation glue-line 102, ensure that
Insulating properties between conductive copper sheet 101 and heat conduction copper sheet 103, by conductive copper sheet 101, insulation glue-line 102, heat conduction copper sheet 103,
The cooperation of radiating copper sheet 106 and heat conduction copper rod 107, it is poor to solve the heat dispersion of existing printed circuit board (PCB), typically relies on
Forced air convection is carried out to radiate in increase outside heat sink, radiator fan lamp, adds overall power consumption, and make circuit board
The problem of itself aging, deformation accelerate.
In use, by the way that there is provided heat conduction copper sheet 103 so that caused heat can be with the running of conductive copper sheet 101
It is transferred on heat conduction copper sheet 103, by the way that there is provided radiating copper sheet 106 so that heat can be passed through conduction copper by heat conduction copper sheet 103
Rod 107 is delivered in radiating copper sheet 106, can be in a short time by heat because radiating copper sheet 106 and air contact area are big
Radiate in atmosphere, so as to reach the effect of radiating, and because the heat conductivility of copper arrives so that heat conduction copper sheet 103, radiating copper sheet
106 and the heat dispersion of heat conduction copper rod 107 radiated better than traditional air vent, by there is provided insulation glue-line 102, ensure that and lead
Insulating properties between electrolytic copper piece 101 and heat conduction copper sheet 103, by conductive copper sheet 101, insulation glue-line 102, heat conduction copper sheet 103, dissipate
The cooperation of hot copper sheet 106 and heat conduction copper rod 107, it is poor to solve the heat dispersion of existing printed circuit board (PCB), commonly relies on
Increase outside heat sink, radiator fan lamp carry out forced air convection to radiate, and add overall power consumption, and make circuit board sheet
The problem of aging, the deformation of body accelerate.
In summary：The low consumption circuit plate, pass through circuit board 1, conductive copper sheet 101, insulation glue-line 102, heat conduction copper sheet
103rd, the cooperation of FR4 stiffening plates 104, protective layer 105, radiating copper sheet 106 and heat conduction copper rod 107, solves existing printing electricity
The heat dispersion of road plate is poor, commonly relies on increase outside heat sink, radiator fan lamp carries out forced air convection and radiated,
The problem of adding overall power consumption, and accelerating aging, the deformation of circuit board in itself.
It should be noted that herein, such as first and second or the like relational terms are used merely to a reality
Body or operation make a distinction with another entity or operation, and not necessarily require or imply and deposited between these entities or operation
In any this actual relation or order.Moreover, term " comprising ", "comprising" or its any other variant are intended to
Nonexcludability includes, so that process, method, article or equipment including a series of elements not only will including those
Element, but also the other element including being not expressly set out, or it is this process, method, article or equipment also to include
Intrinsic key element.In the absence of more restrictions, the key element limited by sentence "including a ...", it is not excluded that
Other identical element also be present in process, method, article or equipment including the key element.
While there has been shown and described that embodiment of the present utility model, for the ordinary skill in the art,
It is appreciated that these embodiments can be carried out with a variety of changes in the case where not departing from principle of the present utility model and spirit, repaiied
Change, replace and modification, the scope of the utility model are defined by the appended claims and the equivalents thereof.
Claims (5)
1. a kind of low consumption circuit plate, including circuit board body (1), it is characterised in that：The back of the body on the left of the circuit board body (1)
Face is fixedly connected with plug connector (2), and the front on the right side of the circuit board body (1) is fixedly connected with wire (3)；
The circuit board body (1) includes conductive copper sheet (101) and heat conduction copper sheet (103), the top of the conductive copper sheet (101)
Insulation glue-line (102) is fixedly connected with bottom, the heat conduction copper sheet (103) is fixedly connected on the table of insulation glue-line (102)
Face, FR4 stiffening plates (104), the FR4 stiffening plates (104) have been fixedly connected with the top and bottom of the heat conduction copper sheet (103)
Top and bottom be fixedly connected with matcoveredn (105), be fixedly connected with the top and bottom of the protective layer (105) scattered
Hot copper sheet (106), the surface of the heat conduction copper sheet (103) are fixedly connected with heat conduction copper rod (107), the heat conduction copper rod (107)
One end away from heat conduction copper sheet (103) sequentially passes through FR4 stiffening plates (104) and protective layer (105) and consolidated with radiating copper sheet (106)
Fixed connection.
A kind of 2. low consumption circuit plate according to claim 1, it is characterised in that：The surface of the heat conduction copper sheet (103)
The first adhesive-layer (108) is fixedly connected with, the heat conduction copper sheet (103) passes through the first adhesive-layer (108) and FR4 stiffening plates
(104) it is fixedly connected.
A kind of 3. low consumption circuit plate according to claim 1, it is characterised in that：The surface of the FR4 stiffening plates (104)
The second adhesive-layer (109) is fixedly connected with, the FR4 stiffening plates (104) pass through the second adhesive-layer (109) and protective layer (105)
It is fixedly connected.
A kind of 4. low consumption circuit plate according to claim 1, it is characterised in that：The surface of the protective layer (105) is consolidated
Surely the 3rd adhesive-layer (110) is connected with, the protective layer (105) is fixed by the 3rd adhesive-layer (110) and radiating copper sheet (106)
Connection.
A kind of 5. low consumption circuit plate according to claim 1, it is characterised in that：The top of the circuit board body (1)
Offering via (4), the via (4) includes metallic vias and nonmetallic via, and four at the top of the circuit board body (1)
Angle offers mounting hole (5), and the edge at the top of the circuit board body (1) is fixedly connected with electrical boundary (6).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721153405.4U CN207135344U (en) | 2017-09-08 | 2017-09-08 | A kind of low consumption circuit plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721153405.4U CN207135344U (en) | 2017-09-08 | 2017-09-08 | A kind of low consumption circuit plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207135344U true CN207135344U (en) | 2018-03-23 |
Family
ID=61637836
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721153405.4U Expired - Fee Related CN207135344U (en) | 2017-09-08 | 2017-09-08 | A kind of low consumption circuit plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207135344U (en) |
-
2017
- 2017-09-08 CN CN201721153405.4U patent/CN207135344U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180323 |