CN216310674U - Double-deck mainboard convenient to power supply is connected and server thereof - Google Patents

Abstract

The utility model provides a double-layer mainboard convenient for power supply connection and a server thereof, wherein the double-layer mainboard convenient for power supply connection comprises: the computer comprises an interface bottom plate, a first computing plate and a second computing plate, wherein the first computing plate and the second computing plate are arranged above the interface bottom plate side by side; and a second power output interface is arranged at one end of the interface bottom plate close to the front panel of the case, a second power input interface is arranged on the side edge of the second computing plate close to the front panel of the case, and the second power input interface is connected with the second power output interface. The utility model realizes the double-layer mainboard of the multi-path CPU and the quick power supply connection between the double-layer mainboards, and is simple, effective and short in path.

Description

A double-layer motherboard and its server for easy power supply connection

technical field

The utility model relates to a double-layer motherboard, in particular to a double-layer motherboard that is convenient for power supply connection, and relates to a server including the double-layer motherboard that is convenient for power supply connection.

Background technique

Server motherboards are motherboards specially developed to meet server applications, such as environments with high stability, high performance and high compatibility. Due to the long operation time and high operation intensity of the server, and the need to deal with a huge amount of data conversion, its power consumption and I/O throughput are relatively large, so the requirements for the server motherboard are quite strict; Due to the limited area of the single board, the multi-channel CPU motherboard has encountered technical bottlenecks in the design of the hardware structure. Then, how to meet the needs of the multi-channel CPU motherboard and ensure that the dual-layer motherboard The convenience of power supply connection is also a factor to be considered to improve work efficiency and ensure product quality.

SUMMARY OF THE INVENTION

The technical problem to be solved by the present invention is to provide a double-layer motherboard that can meet the requirements of multi-channel CPU motherboards and is convenient for power supply connection. server.

In this regard, the present invention provides a double-layer motherboard that is convenient for power supply connection, comprising: an interface base plate, a first calculation board and a second calculation board, wherein the first calculation board and the second calculation board are arranged side by side on the interface base plate Above, the end of the interface base plate close to the rear panel of the chassis is provided with a first power output interface, the side of the first computing board close to the rear panel of the chassis is provided with a first power input interface, the first power supply The input interface is connected with the first power output interface; the end of the interface base plate close to the front panel of the chassis is provided with a second power output interface, and the side of the second computing board close to the front panel of the chassis is provided with a second power supply an input interface, the second power input interface is connected with the second power output interface.

A further improvement of the present invention lies in that the interface base plate is provided with a power supply connector, and the power supply connector is respectively connected with the first power output interface and the second power output interface.

A further improvement of the present invention is that the power connector is respectively connected with the first power output interface and the second power output interface through the prefabricated circuit of the interface base plate.

A further improvement of the present invention is that the power connector is arranged at one end of the interface base plate close to the front panel of the chassis.

A further improvement of the present invention is that the first computing board and the second computing board have the same structure.

A further improvement of the present invention is that the first computing board and the second computing board are rotationally symmetrically arranged above the interface base plate.

A further improvement of the present invention is that the first computing board and the second computing board are 180° rotationally symmetrical.

A further improvement of the present invention lies in that both the first computing board and the second computing board are provided with a CPU module and a memory slot module, and the memory slot modules are symmetrically arranged on both sides of the CPU module.

A further improvement of the present invention is that it further comprises an interface module, and the interface module is arranged at one end of the interface base plate close to the rear panel of the chassis.

The utility model also provides a server, which includes a chassis and the above-mentioned double-layer mainboard which is convenient for power supply connection, and the double-layer mainboard for easy power supply connection is arranged in the chassis.

Compared with the prior art, the beneficial effect of the present invention is that: the first computing board and the second computing board are arranged side by side above the interface backplane, and further space stacking is formed by the two computing boards and the interface backplane, which is convenient for A double-layer motherboard that implements multi-channel CPUs, on which the first computing board is connected to the interface backplane through a first power input interface and a first power output interface, and the second computing board is input through a second power supply The interface and the second power output interface are connected to the interface base plate, so as to realize the power supply connection of the double-layer main board, the wiring method is simple and effective, and the path is short.

Description of drawings

Fig. 1 is a three-dimensional schematic diagram of an embodiment of the present utility model;

2 is a schematic top view of an embodiment of the present utility model;

Fig. 3 is the front structure schematic diagram of the interface bottom plate of an embodiment of the present invention;

FIG. 4 is a schematic view of the front structure of the first computing board according to an embodiment of the present invention;

FIG. 5 is a schematic diagram of a rear structure of a first computing board according to an embodiment of the present invention.

Detailed ways

The preferred embodiments of the present utility model will be further described in detail below with reference to the accompanying drawings.

As shown in FIG. 1 to FIG. 5 , this example provides a double-layer motherboard that is convenient for power supply connection, including: an interface backplane 1 , a first computing board 2 and a second computing board 3 , the first computing board 2 and the second computing board 3 The computing boards 3 are arranged side by side above the interface base plate 1, the end of the interface base plate 1 close to the rear panel of the chassis is provided with a first power output interface 101, and the first computing board 2 is close to the side of the rear panel of the chassis A first power input interface 201 is provided on the upper part, and the first power input interface 201 is connected with the first power output interface 101; the end of the interface base plate 1 close to the front panel of the chassis is provided with a second power output interface 102. A second power input interface 301 is provided on the side of the second computing board 3 close to the front panel of the chassis, and the second power input interface 301 is connected with the second power output interface 102 .

As shown in FIG. 1 and FIG. 2 , the interface backplane 1 in this example is a first-layer motherboard, which is mainly used to realize the interface module 104 , power supply (including the first power output interface 101 , the second power output interface 102 and the power supply connection) The first computing board 2 and the second computing board 3 are both second-layer motherboards used to implement data processing for setting the CPU module 4 and the memory slot module 5, and the The first computing board 2 and the second computing board 3 are arranged side by side, which is convenient to realize the setting of four-way CPU. Of course, in practical applications, other numbers of multi-channel double-layer motherboards can be designed according to different circuit boards, not limited to four. road.

In this example, a power supply connector 103 (preferably a 48V power supply connector) is provided on the interface base plate 1 to facilitate power connection. The power supply connector 103 is respectively connected to the first power output interface 101 (preferably two-way The first power output interface 101 and the second power output interface 102 respectively realize power output.

In this example, the first computing board 2 and the second computing board 3 are arranged side by side above the interface base plate 1, and further space stacking is formed by the two computing boards and the interface base plate 1, which is convenient to realize a double-layer motherboard with multiple CPUs, On this basis, the first computing board 2 is connected to the interface base plate 1 through the first power input interface 201 and the first power output interface 101 , and the second computing board 3 is connected to the interface base plate 1 through the second power input interface 301 and the first power output interface 101 . The second power output interface 102 is connected to the interface base plate 1, so as to realize the power supply connection of the double-layer motherboard. The wiring method is simple and effective, and the path is short. This example has a reasonable structure, high efficiency and easy assembly, high production efficiency, and stable and reliable products.

Preferably, the power connector 103 in this example is connected to the first power output interface 101 and the second power output interface 102 respectively through the prefabricated circuit of the interface base plate 1, and the power output is realized through the prefabricated circuit, which can improve the product quality. stability and reduce the number of connecting wires required for processing. In this example, the power connector 103 is preferably disposed at one end of the interface base plate 1 close to the front panel of the chassis; it also includes an interface module 104, and the interface module 104 is preferably disposed at one end of the interface base plate 1 close to the rear panel of the chassis, so that The design can not only ensure the stability and reliability of the interface module 104, but also separate the power connector 103 and the interface module 104, so as to reserve more space for setting the interface, and the design of space and layout is more reasonable. .

As shown in FIG. 1 to FIG. 5 , the first computing board 2 and the second computing board 3 in this example have the same structure, and the first computing board 2 and the second computing board 3 are rotationally symmetrically arranged on the bottom of the interface base plate 1 . above. More preferably, the first computing board 2 and the second computing board 3 in this example are 180° rotationally symmetrical. In this example, the first computing board 2 and the second computing board 3 have the same structure, that is to say, during production, they are actually the same computing motherboard, but during assembly, one of the computing motherboards is rotationally symmetrical. On the interface base plate 1, such a design eliminates the need to process two computing motherboards of different sizes/layouts, which is convenient to reduce material types and processing and production costs, and improve the material sharing rate and production efficiency.

On this basis, the first computing board 2 and the second computing board 3 in this example are preferably 180° rotationally symmetrical. Such a design can make the first computing board 2 and the second computing board 3 The CPU modules 4 are regularly staggered, thereby improving the heat dissipation efficiency, which is very important for a dual-layer motherboard including a plurality of CPU modules 4 .

As shown in FIG. 1 and FIG. 2 , in this example, the first computing board 2 and the second computing board 3 are both provided with a CPU module 4 and a memory slot module 5 , and the memory slot modules 5 are symmetrically arranged side by side in all the both sides of the CPU module 4 described above. Such a design can make the connection and wiring between the CPU module 4 and the memory slot module 5 more convenient, and facilitate the realization of function expansion.

This example also provides a server, which includes a chassis and the above-mentioned double-layer motherboard that facilitates power supply connection, and the double-layer motherboard that facilitates power supply connection is disposed in the chassis. The server described in this example is preferably an orthogonal high-density blade server. The size of the computing board and the interface backplane 1 has strict requirements, and needs to meet the requirements of multi-channel CPU and its assembly. This example can well achieve its maximum size specification. It can not only meet the needs of multi-channel CPU motherboards, but also ensure the convenience of power supply connection between double-layer motherboards.

The specific embodiments described above are the preferred embodiments of the present invention, and are not intended to limit the specific implementation scope of the present invention. The scope of the present invention includes, but is not limited to, the specific embodiments. The equivalent changes made by the structure are all within the protection scope of the present invention.

Claims (10)

1. A double-deck mainboard convenient to power supply is connected which characterized in that includes: the computer comprises an interface bottom plate, a first computing plate and a second computing plate, wherein the first computing plate and the second computing plate are arranged above the interface bottom plate side by side; and a second power output interface is arranged at one end of the interface bottom plate close to the front panel of the case, a second power input interface is arranged on the side edge of the second computing plate close to the front panel of the case, and the second power input interface is connected with the second power output interface.

2. The dual-layer motherboard convenient for power supply connection as recited in claim 1, wherein said interface motherboard is provided with a power connector, and said power connector is respectively connected with said first power output interface and said second power output interface.

3. The dual-layer motherboard facilitating power connection as recited in claim 2 wherein said power connector is connected to said first power output interface and said second power output interface respectively via pre-fabricated circuitry of said interface backplane.

4. The dual-layer motherboard for facilitating power connection of claim 2, wherein said power connector is disposed at an end of said interface backplane adjacent to a front panel of said chassis.

5. The dual-layer motherboard for facilitating power connection as recited in any one of claims 1 to 4, wherein said first computing board and said second computing board are identical in structure.

6. The dual-layer motherboard for facilitating power connection as recited in claim 5, wherein said first and second computing boards are rotationally symmetric disposed above said interface backplane.

7. The dual-layer motherboard for facilitating power connection as recited in claim 6, wherein said first computing board and said second computing board have 180 ° rotational symmetry therebetween.

8. The dual-layer motherboard convenient for power supply connection as claimed in any one of claims 1 to 4, wherein said first and second computing boards are respectively provided with a CPU module and a memory slot module, and said memory slot modules are symmetrically arranged side by side on two sides of said CPU module.

9. The dual-layer motherboard convenient for power supply connection of any one of claims 1 to 4, further comprising an interface module, wherein said interface module is disposed at one end of said interface bottom board close to the rear panel of the chassis.

10. A server, comprising a chassis and the dual-layer motherboard facilitating power connection of any one of claims 1 to 9, the dual-layer motherboard facilitating power connection being disposed within the chassis.

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