CN216310674U

CN216310674U - Double-deck mainboard convenient to power supply is connected and server thereof

Info

Publication number: CN216310674U
Application number: CN202120405848.8U
Authority: CN
Inventors: 聂爱君
Original assignee: Shenzhen Guoxin Hengyun Information Security Co ltd
Current assignee: Shenzhen Guoxin Hengyun Information Security Co ltd
Priority date: 2021-02-24
Filing date: 2021-02-24
Publication date: 2022-04-15
Anticipated expiration: 2031-02-24

Abstract

The utility model provides a double-layer mainboard convenient for power supply connection and a server thereof, wherein the double-layer mainboard convenient for power supply connection comprises: the computer comprises an interface bottom plate, a first computing plate and a second computing plate, wherein the first computing plate and the second computing plate are arranged above the interface bottom plate side by side; and a second power output interface is arranged at one end of the interface bottom plate close to the front panel of the case, a second power input interface is arranged on the side edge of the second computing plate close to the front panel of the case, and the second power input interface is connected with the second power output interface. The utility model realizes the double-layer mainboard of the multi-path CPU and the quick power supply connection between the double-layer mainboards, and is simple, effective and short in path.

Description

Double-deck mainboard convenient to power supply is connected and server thereof

Technical Field

The present invention relates to a dual-layer motherboard, and more particularly, to a dual-layer motherboard convenient for power connection, and a server including the dual-layer motherboard convenient for power connection.

Background

A server motherboard is a motherboard developed specifically to meet the environment of server applications, such as high stability, high performance, and high compatibility. The server has long operation time, high operation intensity, huge data conversion amount required to be processed, and large power consumption and I/O throughput, so the requirement on the server mainboard is quite strict; along with the change of the demand and the demand of the product, the multipath CPU mainboard is limited due to the limited area of the single board, and meets the technical bottleneck in the design of the hardware structure, so that the requirement of the multipath CPU mainboard is met, the convenient degree of power supply connection between the double-layer mainboard is ensured, and the factors required to be considered for improving the working efficiency and ensuring the product quality are also included.

Disclosure of Invention

The technical problem to be solved by the utility model is to provide a double-layer mainboard which can meet the requirements of multiple CPU mainboards and is convenient for power supply connection, and further provide a server comprising the double-layer mainboard which is convenient for power supply connection on the basis.

To this end, the present invention provides a dual-layer motherboard for facilitating power connection, comprising: the computer comprises an interface bottom plate, a first computing plate and a second computing plate, wherein the first computing plate and the second computing plate are arranged above the interface bottom plate side by side; and a second power output interface is arranged at one end of the interface bottom plate close to the front panel of the case, a second power input interface is arranged on the side edge of the second computing plate close to the front panel of the case, and the second power input interface is connected with the second power output interface.

The utility model has the further improvement that a power connector is arranged on the interface base plate, and the power connector is respectively connected with the first power output interface and the second power output interface.

The utility model is further improved in that the power connector is respectively connected with the first power output interface and the second power output interface through a prefabricated circuit of the interface base plate.

The utility model is further improved in that the power connector is arranged at one end of the interface bottom plate close to the front panel of the case.

A further development of the utility model is that the first and second computer boards are identical in structure.

A further development of the utility model is that the first and second computing boards are arranged rotationally symmetrically above the interface backplane.

The utility model is further improved in that the first computing board and the second computing board have 180-degree rotational symmetry therebetween.

The utility model has the further improvement that the first computing board and the second computing board are both provided with a CPU module and a memory slot module, and the memory slot modules are symmetrically arranged on two sides of the CPU module side by side.

The utility model has the further improvement that the utility model also comprises an interface module, and the interface module is arranged at one end of the interface bottom plate close to the rear panel of the case.

The utility model also provides a server which comprises a case and the double-layer mainboard convenient for power supply connection, wherein the double-layer mainboard convenient for power supply connection is arranged in the case.

Compared with the prior art, the utility model has the beneficial effects that: the first computing board and the second computing board are arranged above the interface bottom board side by side, and are stacked in a space mode through the two computing boards and the interface bottom board, so that a multi-CPU double-layer main board is convenient to achieve.

Drawings

FIG. 1 is a schematic perspective view of an embodiment of the present invention;

FIG. 2 is a schematic top view of an embodiment of the present invention;

FIG. 3 is a schematic front view of an interface backplane according to an embodiment of the present invention;

FIG. 4 is a schematic diagram of a front side of a first computing board according to one embodiment of the utility model;

FIG. 5 is a schematic diagram of a back structure of a first computing board according to an embodiment of the utility model.

Detailed Description

Preferred embodiments of the present invention will be described in further detail below with reference to the accompanying drawings.

As shown in fig. 1 to 5, this embodiment provides a dual-layer motherboard for facilitating power supply connection, including: the computer comprises an interface bottom plate 1, a first computing plate 2 and a second computing plate 3, wherein the first computing plate 2 and the second computing plate 3 are arranged above the interface bottom plate 1 side by side, one end of the interface bottom plate 1, which is close to a rear panel of a case, is provided with a first power output interface 101, the side edge of the first computing plate 2, which is close to the rear panel of the case, is provided with a first power input interface 201, and the first power input interface 201 is connected with the first power output interface 101; a second power output interface 102 is arranged at one end of the interface bottom plate 1 close to the front panel of the case, a second power input interface 301 is arranged on the side edge of the second computing plate 3 close to the front panel of the case, and the second power input interface 301 is connected with the second power output interface 102.

As shown in fig. 1 and fig. 2, the interface backplane 1 in this embodiment is a first layer motherboard, and is mainly used for implementing the settings of an interface module 104, a power supply (including a first power output interface 101, a second power output interface 102, and a power connector 103), a heat sink, and the like; the first computing board 2 and the second computing board 3 are both second-layer mainboards used for setting the CPU module 4 and the memory slot module 5 and used for realizing data processing, the first computing board 2 and the second computing board 3 are arranged side by side, so that four-path CPU setting is convenient to realize, and certainly, in practical application, the multi-path double-layer mainboards with other quantities can be designed according to different circuit boards, and are not limited to four paths.

In this embodiment, a power connector 103 (preferably, a 48V power connector) is disposed on the interface backplane 1 to facilitate power connection, and the power connector 103 is respectively connected to the first power output interface 101 (preferably, a two-way power output interface) and the second power output interface 102 (preferably, a two-way power output interface), so as to respectively realize power output through the first power output interface 101 and the second power output interface 102.

First calculation board 2 and second calculation board 3 set up side by side in the top of interface bottom plate 1, and then form the space through two calculation boards and interface bottom plate 1 and pile up, are convenient for realize multichannel CPU's double-deck mainboard, on this basis, first calculation board 2 is connected to through first power input interface 201 and first power output interface 101 interface 1, second calculation board 3 is connected to through second power input interface 301 and second power output interface 102 interface 1 to realize the power supply of double-deck mainboard and connect, the simple effective and route of mode of connection is short, and this example is rational in infrastructure, high-efficient and the assembly of being convenient for, and production efficiency is high, and the product is reliable and stable.

Preferably, the power connector 103 in this embodiment is connected to the first power output interface 101 and the second power output interface 102 through a prefabricated circuit of the interface backplane 1, and power output is achieved through the prefabricated circuit, so that stability of a product can be improved, and connecting wires required during processing can be reduced. In this embodiment, the power connector 103 is preferably disposed at one end of the interface chassis 1 close to the front panel of the chassis; the power supply connector comprises an interface module 104, wherein the interface module 104 is preferably arranged at one end of the interface bottom plate 1 close to the rear panel of the case, and by the design, the stability and reliability of the interface module 104 can be ensured, and meanwhile, the power supply connector 103 and the interface module 104 are separately arranged, so that more spaces are reserved for arranging interfaces, and the space and layout are more reasonable in design.

As shown in fig. 1 to 5, in this embodiment, the first computing board 2 and the second computing board 3 have the same structure, and the first computing board 2 and the second computing board 3 are rotationally symmetrically disposed above the interface board 1. More preferably, the first calculating board 2 and the second calculating board 3 are in 180 ° rotational symmetry. In this embodiment, the first computing board 2 and the second computing board 3 have the same structure, that is, during production, the same computing main board is actually used, and only during assembly, one of the computing main boards is rotationally and symmetrically arranged on the interface bottom board 1.

On the basis, the first computing board 2 and the second computing board 3 are preferably in 180 ° rotational symmetry, and such a design can regularly shift the CPU modules 4 on the first computing board 2 and the second computing board 3, thereby improving the heat dissipation efficiency, which is very important for a dual-layer motherboard including a plurality of CPU modules 4.

As shown in fig. 1 and fig. 2, in this example, a CPU module 4 and a memory slot module 5 are disposed on both the first computing board 2 and the second computing board 3, and the memory slot modules 5 are symmetrically disposed on both sides of the CPU module 4 side by side. Due to the design, the CPU module 4 and the memory slot module 5 can be connected and wired more conveniently, and function expansion is facilitated.

The present example further provides a server, including a chassis and the above dual-layer motherboard facilitating power supply connection, where the dual-layer motherboard facilitating power supply connection is disposed in the chassis. The server is preferably an orthogonal high-density blade server, the sizes of a computing board and an interface bottom board 1 of the server have strict requirements, and the requirements of multiple CPUs and assembly of the multiple CPUs are required to be met.

The above-mentioned embodiments are preferred embodiments of the present invention, and the scope of the present invention is not limited thereto, and the equivalent changes in shape and structure according to the present invention are within the protection scope of the present invention.

Claims

1. A double-deck mainboard convenient to power supply is connected which characterized in that includes: the computer comprises an interface bottom plate, a first computing plate and a second computing plate, wherein the first computing plate and the second computing plate are arranged above the interface bottom plate side by side; and a second power output interface is arranged at one end of the interface bottom plate close to the front panel of the case, a second power input interface is arranged on the side edge of the second computing plate close to the front panel of the case, and the second power input interface is connected with the second power output interface.

2. The dual-layer motherboard convenient for power supply connection as recited in claim 1, wherein said interface motherboard is provided with a power connector, and said power connector is respectively connected with said first power output interface and said second power output interface.

3. The dual-layer motherboard facilitating power connection as recited in claim 2 wherein said power connector is connected to said first power output interface and said second power output interface respectively via pre-fabricated circuitry of said interface backplane.

4. The dual-layer motherboard for facilitating power connection of claim 2, wherein said power connector is disposed at an end of said interface backplane adjacent to a front panel of said chassis.

5. The dual-layer motherboard for facilitating power connection as recited in any one of claims 1 to 4, wherein said first computing board and said second computing board are identical in structure.

6. The dual-layer motherboard for facilitating power connection as recited in claim 5, wherein said first and second computing boards are rotationally symmetric disposed above said interface backplane.

7. The dual-layer motherboard for facilitating power connection as recited in claim 6, wherein said first computing board and said second computing board have 180 ° rotational symmetry therebetween.

8. The dual-layer motherboard convenient for power supply connection as claimed in any one of claims 1 to 4, wherein said first and second computing boards are respectively provided with a CPU module and a memory slot module, and said memory slot modules are symmetrically arranged side by side on two sides of said CPU module.

9. The dual-layer motherboard convenient for power supply connection of any one of claims 1 to 4, further comprising an interface module, wherein said interface module is disposed at one end of said interface bottom board close to the rear panel of the chassis.

10. A server, comprising a chassis and the dual-layer motherboard facilitating power connection of any one of claims 1 to 9, the dual-layer motherboard facilitating power connection being disposed within the chassis.