CN216310674U - Double-deck mainboard convenient to power supply is connected and server thereof - Google Patents

Double-deck mainboard convenient to power supply is connected and server thereof Download PDF

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CN216310674U
CN216310674U CN202120405848.8U CN202120405848U CN216310674U CN 216310674 U CN216310674 U CN 216310674U CN 202120405848 U CN202120405848 U CN 202120405848U CN 216310674 U CN216310674 U CN 216310674U
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power supply
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聂爱君
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Shenzhen Guoxin Shuzhi Technology Co ltd
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Shenzhen Guoxin Hengyun Information Security Co ltd
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Abstract

The utility model provides a double-layer mainboard convenient for power supply connection and a server thereof, wherein the double-layer mainboard convenient for power supply connection comprises: the computer comprises an interface bottom plate, a first computing plate and a second computing plate, wherein the first computing plate and the second computing plate are arranged above the interface bottom plate side by side; and a second power output interface is arranged at one end of the interface bottom plate close to the front panel of the case, a second power input interface is arranged on the side edge of the second computing plate close to the front panel of the case, and the second power input interface is connected with the second power output interface. The utility model realizes the double-layer mainboard of the multi-path CPU and the quick power supply connection between the double-layer mainboards, and is simple, effective and short in path.

Description

一种便于供电连接的双层主板及其服务器A double-layer motherboard and its server for easy power supply connection

技术领域technical field

本实用新型涉及一种双层主板,尤其涉及一种便于供电连接的双层主板,并涉及包括了该便于供电连接的双层主板的服务器。The utility model relates to a double-layer motherboard, in particular to a double-layer motherboard that is convenient for power supply connection, and relates to a server including the double-layer motherboard that is convenient for power supply connection.

背景技术Background technique

服务器主板是专门为满足服务器应用,比如高稳定性、高性能和高兼容性的环境而开发的主机板。由于服务器的运作时间长,运作强度高,并需要处理巨大的数据转换量,其电源功耗量和I/O吞吐量都比较大,因此对服务器主板的要求是相当严格的;而随着需求的变化和产品的需求,多路CPU主板由于单板的有限面积有所限制,已经在硬件结构设计上,遇到了技术瓶颈,那么,如何满足多路CPU主板的需求,并且保证双层主板之间的供电连接便捷程度,也是提高工作效率和保证产品质量所需要考虑的因素。Server motherboards are motherboards specially developed to meet server applications, such as environments with high stability, high performance and high compatibility. Due to the long operation time and high operation intensity of the server, and the need to deal with a huge amount of data conversion, its power consumption and I/O throughput are relatively large, so the requirements for the server motherboard are quite strict; Due to the limited area of the single board, the multi-channel CPU motherboard has encountered technical bottlenecks in the design of the hardware structure. Then, how to meet the needs of the multi-channel CPU motherboard and ensure that the dual-layer motherboard The convenience of power supply connection is also a factor to be considered to improve work efficiency and ensure product quality.

发明内容SUMMARY OF THE INVENTION

本实用新型所要解决的技术问题是需要提供一种既能够满足多路CPU主板的需求,又便于供电连接的双层主板,在此基础上,还进一步提供包括该便于供电连接的双层主板的服务器。The technical problem to be solved by the present invention is to provide a double-layer motherboard that can meet the requirements of multi-channel CPU motherboards and is convenient for power supply connection. server.

对此,本实用新型提供一种便于供电连接的双层主板,包括:接口底板、第一计算板和第二计算板,所述第一计算板和第二计算板并排设置于所述接口底板的上方,所述接口底板靠近机箱后面板的一端设置有第一电源输出接口,所述第一计算板靠近所述机箱后面板的侧边上设置有第一电源输入接口,所述第一电源输入接口和第一电源输出接口相连接;所述接口底板靠近机箱前面板的一端设置有第二电源输出接口,所述第二计算板靠近所述机箱前面板的侧边上设置有第二电源输入接口,所述第二电源输入接口和第二电源输出接口相连接。In this regard, the present invention provides a double-layer motherboard that is convenient for power supply connection, comprising: an interface base plate, a first calculation board and a second calculation board, wherein the first calculation board and the second calculation board are arranged side by side on the interface base plate Above, the end of the interface base plate close to the rear panel of the chassis is provided with a first power output interface, the side of the first computing board close to the rear panel of the chassis is provided with a first power input interface, the first power supply The input interface is connected with the first power output interface; the end of the interface base plate close to the front panel of the chassis is provided with a second power output interface, and the side of the second computing board close to the front panel of the chassis is provided with a second power supply an input interface, the second power input interface is connected with the second power output interface.

本实用新型的进一步改进在于,所述接口底板上设置有电源连接器,所述电源连接器分别与所述第一电源输出接口和第二电源输出接口相连接。A further improvement of the present invention lies in that the interface base plate is provided with a power supply connector, and the power supply connector is respectively connected with the first power output interface and the second power output interface.

本实用新型的进一步改进在于,所述电源连接器通过所述接口底板的预制线路分别与所述第一电源输出接口和第二电源输出接口相连接。A further improvement of the present invention is that the power connector is respectively connected with the first power output interface and the second power output interface through the prefabricated circuit of the interface base plate.

本实用新型的进一步改进在于,所述电源连接器设置于所述接口底板靠近机箱前面板的一端。A further improvement of the present invention is that the power connector is arranged at one end of the interface base plate close to the front panel of the chassis.

本实用新型的进一步改进在于,所述第一计算板和第二计算板结构相同。A further improvement of the present invention is that the first computing board and the second computing board have the same structure.

本实用新型的进一步改进在于,所述第一计算板和第二计算板旋转对称设置于所述接口底板的上方。A further improvement of the present invention is that the first computing board and the second computing board are rotationally symmetrically arranged above the interface base plate.

本实用新型的进一步改进在于,所述第一计算板和第二计算板之间呈180°旋转对称。A further improvement of the present invention is that the first computing board and the second computing board are 180° rotationally symmetrical.

本实用新型的进一步改进在于,所述第一计算板和第二计算板上均设置有CPU模块和内存插槽模块,所述内存插槽模块对称并排设置于所述CPU模块的两侧。A further improvement of the present invention lies in that both the first computing board and the second computing board are provided with a CPU module and a memory slot module, and the memory slot modules are symmetrically arranged on both sides of the CPU module.

本实用新型的进一步改进在于,还包括接口模块,所述接口模块设置于所述接口底板靠近机箱后面板的一端。A further improvement of the present invention is that it further comprises an interface module, and the interface module is arranged at one end of the interface base plate close to the rear panel of the chassis.

本实用新型还提供一种服务器,包括机箱以及如上所述的便于供电连接的双层主板,所述便于供电连接的双层主板设置于所述机箱内。The utility model also provides a server, which includes a chassis and the above-mentioned double-layer mainboard which is convenient for power supply connection, and the double-layer mainboard for easy power supply connection is arranged in the chassis.

与现有技术相比,本实用新型的有益效果在于:所述第一计算板和第二计算板并排设置于所述接口底板的上方,进而通过两块计算板和接口底板形成空间堆叠,便于实现多路CPU的双层主板,在此基础上,所述第一计算板通过第一电源输入接口和第一电源输出接口连接至所述接口底板,所述第二计算板通过第二电源输入接口和第二电源输出接口连接至所述接口底板,以便实现双层主板的供电连接,接线方式简单有效且路径短,本实用新型结构合理、高效且便于装配,生产效率高,产品稳定可靠。Compared with the prior art, the beneficial effect of the present invention is that: the first computing board and the second computing board are arranged side by side above the interface backplane, and further space stacking is formed by the two computing boards and the interface backplane, which is convenient for A double-layer motherboard that implements multi-channel CPUs, on which the first computing board is connected to the interface backplane through a first power input interface and a first power output interface, and the second computing board is input through a second power supply The interface and the second power output interface are connected to the interface base plate, so as to realize the power supply connection of the double-layer main board, the wiring method is simple and effective, and the path is short.

附图说明Description of drawings

图1是本实用新型一种实施例的立体结构示意图;Fig. 1 is a three-dimensional schematic diagram of an embodiment of the present utility model;

图2是本实用新型一种实施例的俯视结构示意图;2 is a schematic top view of an embodiment of the present utility model;

图3是本实用新型一种实施例的接口底板的正面结构示意图;Fig. 3 is the front structure schematic diagram of the interface bottom plate of an embodiment of the present invention;

图4是本实用新型一种实施例的第一计算板的正面结构示意图;FIG. 4 is a schematic view of the front structure of the first computing board according to an embodiment of the present invention;

图5是本实用新型一种实施例的第一计算板的背面结构示意图。FIG. 5 is a schematic diagram of a rear structure of a first computing board according to an embodiment of the present invention.

具体实施方式Detailed ways

下面结合附图,对本实用新型的较优的实施例作进一步的详细说明。The preferred embodiments of the present utility model will be further described in detail below with reference to the accompanying drawings.

如图1至图5所示,本例提供一种便于供电连接的双层主板,包括:接口底板1、第一计算板2和第二计算板3,所述第一计算板2和第二计算板3并排设置于所述接口底板1的上方,所述接口底板1靠近机箱后面板的一端设置有第一电源输出接口101,所述第一计算板2靠近所述机箱后面板的侧边上设置有第一电源输入接口201,所述第一电源输入接口201和第一电源输出接口101相连接;所述接口底板1靠近机箱前面板的一端设置有第二电源输出接口102,所述第二计算板3靠近所述机箱前面板的侧边上设置有第二电源输入接口301,所述第二电源输入接口301和第二电源输出接口102相连接。As shown in FIG. 1 to FIG. 5 , this example provides a double-layer motherboard that is convenient for power supply connection, including: an interface backplane 1 , a first computing board 2 and a second computing board 3 , the first computing board 2 and the second computing board 3 The computing boards 3 are arranged side by side above the interface base plate 1, the end of the interface base plate 1 close to the rear panel of the chassis is provided with a first power output interface 101, and the first computing board 2 is close to the side of the rear panel of the chassis A first power input interface 201 is provided on the upper part, and the first power input interface 201 is connected with the first power output interface 101; the end of the interface base plate 1 close to the front panel of the chassis is provided with a second power output interface 102. A second power input interface 301 is provided on the side of the second computing board 3 close to the front panel of the chassis, and the second power input interface 301 is connected with the second power output interface 102 .

如图1和图2所示,本例所述接口底板1为第一层主板,主要用于实现接口模块104、电源供给(包括第一电源输出接口101、第二电源输出接口102以及电源连接器103)和散热器等设置;所述第一计算板2和第二计算板3均为用于设置CPU模块4和内存插槽模块5的用于实现数据处理的第二层主板,所述第一计算板2和第二计算板3并排设置,便于实现四路CPU的设置,当然,在实际应用中,可以根据不同的电路板设计成其他数量的多路双层主板,不局限于四路。As shown in FIG. 1 and FIG. 2 , the interface backplane 1 in this example is a first-layer motherboard, which is mainly used to realize the interface module 104 , power supply (including the first power output interface 101 , the second power output interface 102 and the power supply connection) The first computing board 2 and the second computing board 3 are both second-layer motherboards used to implement data processing for setting the CPU module 4 and the memory slot module 5, and the The first computing board 2 and the second computing board 3 are arranged side by side, which is convenient to realize the setting of four-way CPU. Of course, in practical applications, other numbers of multi-channel double-layer motherboards can be designed according to different circuit boards, not limited to four. road.

本例所述接口底板1上设置有电源连接器103(优选为48V的电源连接器),便于实现电源连接,所述电源连接器103分别与所述第一电源输出接口101(优选为两路的电源输出接口)和第二电源输出接口102(优选为两路的电源输出接口)相连接,以便通过所述第一电源输出接口101和第二电源输出接口102分别实现电源输出。In this example, a power supply connector 103 (preferably a 48V power supply connector) is provided on the interface base plate 1 to facilitate power connection. The power supply connector 103 is respectively connected to the first power output interface 101 (preferably two-way The first power output interface 101 and the second power output interface 102 respectively realize power output.

本例所述第一计算板2和第二计算板3并排设置于所述接口底板1的上方,进而通过两块计算板和接口底板1形成空间堆叠,便于实现多路CPU的双层主板,在此基础上,所述第一计算板2通过第一电源输入接口201和第一电源输出接口101连接至所述接口底板1,所述第二计算板3通过第二电源输入接口301和第二电源输出接口102连接至所述接口底板1,以便实现双层主板的供电连接,接线方式简单有效且路径短,本例结构合理、高效且便于装配,生产效率高,产品稳定可靠。In this example, the first computing board 2 and the second computing board 3 are arranged side by side above the interface base plate 1, and further space stacking is formed by the two computing boards and the interface base plate 1, which is convenient to realize a double-layer motherboard with multiple CPUs, On this basis, the first computing board 2 is connected to the interface base plate 1 through the first power input interface 201 and the first power output interface 101 , and the second computing board 3 is connected to the interface base plate 1 through the second power input interface 301 and the first power output interface 101 . The second power output interface 102 is connected to the interface base plate 1, so as to realize the power supply connection of the double-layer motherboard. The wiring method is simple and effective, and the path is short. This example has a reasonable structure, high efficiency and easy assembly, high production efficiency, and stable and reliable products.

优选的,本例所述电源连接器103通过所述接口底板1的预制线路分别与所述第一电源输出接口101和第二电源输出接口102相连接,通过预制线路实现电源输出,可以提高产品的稳定性,减少加工时所需的连接线。本例所述电源连接器103优选设置于所述接口底板1靠近机箱前面板的一端;还包括接口模块104,所述接口模块104优选设置于所述接口底板1靠近机箱后面板的一端,这样的设计,既能够保证所述接口模块104的稳定可靠,同时也将所述电源连接器103和接口模块104分开设置,便于预留更多的空间来设置接口,空间和布局的设计更为合理。Preferably, the power connector 103 in this example is connected to the first power output interface 101 and the second power output interface 102 respectively through the prefabricated circuit of the interface base plate 1, and the power output is realized through the prefabricated circuit, which can improve the product quality. stability and reduce the number of connecting wires required for processing. In this example, the power connector 103 is preferably disposed at one end of the interface base plate 1 close to the front panel of the chassis; it also includes an interface module 104, and the interface module 104 is preferably disposed at one end of the interface base plate 1 close to the rear panel of the chassis, so that The design can not only ensure the stability and reliability of the interface module 104, but also separate the power connector 103 and the interface module 104, so as to reserve more space for setting the interface, and the design of space and layout is more reasonable. .

如图1至图5所示,本例所述第一计算板2和第二计算板3结构相同,所述第一计算板2和第二计算板3旋转对称设置于所述接口底板1的上方。更为优选的,本例所述第一计算板2和第二计算板3之间呈180°旋转对称。本例所述第一计算板2和第二计算板3的结构相同,也就是说,在生产的时候,其实就是同一款计算主板,只是在装配的时候,将其中一块计算主板旋转对称地设置于所述接口底板1上,这样的设计,就无需加工两种不同尺寸/布局的计算主板,便于降低物料种类和加工生产成本,提高其物料共用率和生产效率。As shown in FIG. 1 to FIG. 5 , the first computing board 2 and the second computing board 3 in this example have the same structure, and the first computing board 2 and the second computing board 3 are rotationally symmetrically arranged on the bottom of the interface base plate 1 . above. More preferably, the first computing board 2 and the second computing board 3 in this example are 180° rotationally symmetrical. In this example, the first computing board 2 and the second computing board 3 have the same structure, that is to say, during production, they are actually the same computing motherboard, but during assembly, one of the computing motherboards is rotationally symmetrical. On the interface base plate 1, such a design eliminates the need to process two computing motherboards of different sizes/layouts, which is convenient to reduce material types and processing and production costs, and improve the material sharing rate and production efficiency.

在此基础上,本例所述第一计算板2和第二计算板3之间优选呈180°旋转对称,这样的设计,能够将所述第一计算板2和第二计算板3上的CPU模块4进行有规律的错开,进而提高其散热效率,这一点对于包括多个CPU模块4的双层主板来说,非常重要。On this basis, the first computing board 2 and the second computing board 3 in this example are preferably 180° rotationally symmetrical. Such a design can make the first computing board 2 and the second computing board 3 The CPU modules 4 are regularly staggered, thereby improving the heat dissipation efficiency, which is very important for a dual-layer motherboard including a plurality of CPU modules 4 .

如图1和图2所示,本例所述第一计算板2和第二计算板3上均设置有CPU模块4和内存插槽模块5,所述内存插槽模块5对称并排设置于所述CPU模块4的两侧。这样的设计,能够更为方便所述CPU模块4和内存插槽模块5之间的连接和走线,便于实现功能扩展。As shown in FIG. 1 and FIG. 2 , in this example, the first computing board 2 and the second computing board 3 are both provided with a CPU module 4 and a memory slot module 5 , and the memory slot modules 5 are symmetrically arranged side by side in all the both sides of the CPU module 4 described above. Such a design can make the connection and wiring between the CPU module 4 and the memory slot module 5 more convenient, and facilitate the realization of function expansion.

本例还提供一种服务器,包括机箱以及如上所述的便于供电连接的双层主板,所述便于供电连接的双层主板设置于所述机箱内。本例所述服务器优选为正交高密度刀片服务器,其计算板和接口底板1的尺寸都有严格要求,并且需要满足多路CPU及其装配需求,本例可以很好地实现其最大尺寸规格要求,既能够满足多路CPU主板的需求,又能够保证双层主板之间供电连接的便捷程度。This example also provides a server, which includes a chassis and the above-mentioned double-layer motherboard that facilitates power supply connection, and the double-layer motherboard that facilitates power supply connection is disposed in the chassis. The server described in this example is preferably an orthogonal high-density blade server. The size of the computing board and the interface backplane 1 has strict requirements, and needs to meet the requirements of multi-channel CPU and its assembly. This example can well achieve its maximum size specification. It can not only meet the needs of multi-channel CPU motherboards, but also ensure the convenience of power supply connection between double-layer motherboards.

以上所述之具体实施方式为本实用新型的较佳实施方式,并非以此限定本实用新型的具体实施范围,本实用新型的范围包括并不限于本具体实施方式,凡依照本实用新型之形状、结构所作的等效变化均在本实用新型的保护范围内。The specific embodiments described above are the preferred embodiments of the present invention, and are not intended to limit the specific implementation scope of the present invention. The scope of the present invention includes, but is not limited to, the specific embodiments. The equivalent changes made by the structure are all within the protection scope of the present invention.

Claims (10)

1. A double-deck mainboard convenient to power supply is connected which characterized in that includes: the computer comprises an interface bottom plate, a first computing plate and a second computing plate, wherein the first computing plate and the second computing plate are arranged above the interface bottom plate side by side; and a second power output interface is arranged at one end of the interface bottom plate close to the front panel of the case, a second power input interface is arranged on the side edge of the second computing plate close to the front panel of the case, and the second power input interface is connected with the second power output interface.
2. The dual-layer motherboard convenient for power supply connection as recited in claim 1, wherein said interface motherboard is provided with a power connector, and said power connector is respectively connected with said first power output interface and said second power output interface.
3. The dual-layer motherboard facilitating power connection as recited in claim 2 wherein said power connector is connected to said first power output interface and said second power output interface respectively via pre-fabricated circuitry of said interface backplane.
4. The dual-layer motherboard for facilitating power connection of claim 2, wherein said power connector is disposed at an end of said interface backplane adjacent to a front panel of said chassis.
5. The dual-layer motherboard for facilitating power connection as recited in any one of claims 1 to 4, wherein said first computing board and said second computing board are identical in structure.
6. The dual-layer motherboard for facilitating power connection as recited in claim 5, wherein said first and second computing boards are rotationally symmetric disposed above said interface backplane.
7. The dual-layer motherboard for facilitating power connection as recited in claim 6, wherein said first computing board and said second computing board have 180 ° rotational symmetry therebetween.
8. The dual-layer motherboard convenient for power supply connection as claimed in any one of claims 1 to 4, wherein said first and second computing boards are respectively provided with a CPU module and a memory slot module, and said memory slot modules are symmetrically arranged side by side on two sides of said CPU module.
9. The dual-layer motherboard convenient for power supply connection of any one of claims 1 to 4, further comprising an interface module, wherein said interface module is disposed at one end of said interface bottom board close to the rear panel of the chassis.
10. A server, comprising a chassis and the dual-layer motherboard facilitating power connection of any one of claims 1 to 9, the dual-layer motherboard facilitating power connection being disposed within the chassis.
CN202120405848.8U 2021-02-24 2021-02-24 Double-deck mainboard convenient to power supply is connected and server thereof Active CN216310674U (en)

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