CN115904028A - A kind of fan cooling server board and chassis layout structure and server - Google Patents

Abstract

This application discloses a fan cooling server board and chassis layout structure and server, which relate to the server field. The boards are used to set hardware components, the fan modules are arranged between the horizontal layer boards, the fan modules are independently controlled, and the air inlets and outlets of the fan modules are independent of each other. The hardware components are set in layers, and each fan module correspondingly dissipates heat for the hardware components between the horizontal shelves. The fan modules are independently controlled, and can separately control whether to dissipate heat for the corresponding horizontal shelves to achieve more accurate cooling. The fan speed is adjusted to avoid the problem that the overheating of a certain component causes the speed of all fans to increase, and avoids the waste of fan power consumption. In addition, the air inlet and air outlet of the fan module are independent of each other, so that the hot air generated by heat dissipation will not cause the temperature of hardware components on other laminates to rise, which improves the heat dissipation efficiency of the fan.

Description

A kind of fan cooling server board and chassis layout structure and server

technical field

The present application relates to the field of servers, in particular to a fan cooling server board and chassis layout structure.

Background technique

With the rapid development of technology, computer-related technology has penetrated into every industry and business function area today. The sharp increase in the amount of information and computing requirements requires servers to have higher and higher data storage and computing capabilities. Therefore, the performance of servers is getting higher and higher, followed by rising system power consumption and increasing cooling requirements for servers. come higher.

Common two-way standard machine server chassis and board layout, the whole system is air-cooled and dissipated through the built-in fan module of the chassis, the cold air enters from the hard disk side of the front window, and passes through the heat dissipation components such as storage hard disk, CPU/DIMM and external card in turn , the hot air flows out from the side of the rear window outside the card, so as to realize the heat dissipation of each heating module.

In this way, the main heat dissipation modules are cascaded, and the heat dissipation cascade leads to higher airflow temperature towards the rear window and lower heat dissipation efficiency. At the same time, all heat-generating components share the air duct. If the temperature of one of the components is too high, the speed of all fans will increase, resulting in waste of fan power consumption.

It can be seen that how to solve the problem of wasteful heat dissipation and power consumption is a technical problem to be solved urgently by those skilled in the art.

Contents of the invention

The purpose of this application is to provide a fan cooling server board and chassis layout structure which solves the problem of waste heat dissipation and power consumption.

In order to solve the above technical problems, the present application provides a server board and chassis layout structure for fan cooling, including:

Left backplane, right backplane, at least three horizontal laminates, at least two sets of fan modules;

The left backplane and the right backplane are vertically connected to the horizontal laminates, and the horizontal laminates are parallel and horizontal;

The hardware components are set between the horizontal shelves, the fan module is set between the horizontal shelves, and the fan modules are independently controlled to dissipate heat for the hardware components set on the corresponding horizontal shelves. The air inlet of the fan module , The air outlets are independent of each other.

As a preferred solution, in the layout structure of the above-mentioned fan cooling server board and chassis, the number of horizontal laminates is five;

The five horizontal boards are arranged separately: processor and storage module, PCIe add-in card module, storage hard disk module, management/peripheral hardware and PSU module.

As a preferred solution, in the layout structure of the above-mentioned server board and chassis for heat dissipation by the fan, the number of fan modules is three;

The three fan modules are respectively arranged between the processor and the storage module, the PCIe add-in card module, and the corresponding horizontal laminates of the storage hard disk module.

As a preferred solution, in the layout structure of the above-mentioned fan-cooled server board and chassis, the processor and storage module include: a central processing unit and a dual in-line storage module.

As a preferred solution, in the above-mentioned fan cooling server board and chassis layout structure, the left backplane, the right backplane, and the horizontal laminate are PCB boards;

The left backplane, right backplane and each horizontal layer are interconnected through power supply interfaces or high-density interfaces to provide signals and power to each module.

As a preferred solution, in the above-mentioned server board and chassis layout structure for heat dissipation by the fan, the fan module corresponding to the PCIe external card module includes a plurality of air ducts;

The air ducts are in one-to-one correspondence with the installation positions of the PCIe add-in cards, and each air duct corresponds to a cooling fan.

As a preferred solution, in the layout structure of the above-mentioned server board and chassis for heat dissipation by the fan, the fan module is fixed to the rear side through an integrated cable.

As a preferred solution, the above-mentioned fan cooling server board and chassis layout structure also includes: a cable management frame;

The cable management frame is arranged on the left backplane and the right side backplane, and the wires of the hardware components are laid on the cable management frame.

As a preferred solution, in the layout structure of the above-mentioned fan-cooled server board and chassis, the height between the horizontal laminates can be adjusted.

In order to solve the above-mentioned technical problem, the present application also provides a server, including the above-mentioned fan-cooled server board and a chassis layout structure.

The fan heat dissipation server board and chassis layout structure provided by this application includes: a left backplane, a right backplane, at least three horizontal laminates, at least two sets of fan modules; a left backplane, a right backplane The boards are vertically connected to the horizontal laminates, and the horizontal laminates are parallel and horizontal; the hardware components are set between the horizontal laminates, the fan modules are set between the horizontal laminates, and the fan modules are independently controlled. To dissipate heat for the hardware components provided on the corresponding horizontal laminates, the air inlet and air outlet of the fan module are independent of each other. The hardware components are set in layers, and each fan module correspondingly dissipates heat for the hardware components between the horizontal shelves. The fan modules are independently controlled, and can separately control whether to dissipate heat for the corresponding horizontal shelves to achieve more accurate cooling. The fan speed is adjusted to avoid the problem that the overheating of a certain component causes the speed of all fans to increase, and avoids the waste of fan power consumption. In addition, the air inlet and air outlet of the fan module 13 are independent of each other, so that the hot air generated by heat dissipation will not cause the temperature of hardware components on other laminates to rise. The heat dissipation cascading situation of each hardware component is eliminated, and the heat dissipation efficiency of the fan is improved.

In addition, the present application also provides a server, including the above-mentioned server board for heat dissipation by the fan and a chassis layout structure, and the effect is the same as above.

Description of drawings

In order to illustrate the embodiments of the present application more clearly, the following will briefly introduce the accompanying drawings used in the embodiments. Obviously, the accompanying drawings in the following description are only some embodiments of the present application. As far as people are concerned, other drawings can also be obtained based on these drawings on the premise of not paying creative work.

FIG. 1 is a schematic diagram of a fan cooling server board and a chassis layout structure provided by an embodiment of the present application;

Wherein, the reference signs are as follows: 11 is the left backplane, 12 is the right backplane, 13 is the fan module, 14 is the horizontal laminate, and 15 is the cable management frame.

Detailed ways

The following will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of this application.

The core of the present application is to provide a fan cooling server board and chassis layout structure and server.

In order to enable those skilled in the art to better understand the solution of the present application, the present application will be further described in detail below in conjunction with the drawings and specific implementation methods.

With the rapid development of technology, computer-related technology has penetrated into every industry and business function area today. The sharp increase in the amount of information and computing requirements requires servers to have higher and higher data storage and computing capabilities. Therefore, the performance of servers is getting higher and higher, followed by rising system power consumption and increasing cooling requirements for servers. come higher.

Existing heat dissipation of the chassis is usually achieved through a power supply fan and/or cooling holes provided on the chassis wall. This heat dissipation method only uses the power supply fan and/or heat dissipation holes to exhaust outward, because the exhaust capacity of the power supply fan and/or heat dissipation holes is very limited, especially when the machine is running for a long time, the heat dissipation inside the chassis The heat generated by the continuous operation of the components is accumulated inside the box and cannot be discharged in time, which seriously affects the normal operation of the machine and even affects its service life.

Common two-way standard machine server chassis and board layout, the whole system is air-cooled and heat-dissipated through the built-in fan module of the chassis, the cold air enters from the hard disk side of the front window, and passes through the storage hard disk, central processing unit (CPU), Dual-inline-memory-modules (Dual-Inline-Memory-Modules, DIMMs) and external cards and other heat dissipation components, hot air flows out from the side of the external card on the rear window, thereby realizing heat dissipation for each heating module.

In this way, the main heat dissipation modules are cascaded, and the heat dissipation cascade leads to higher airflow temperature towards the rear window and lower heat dissipation efficiency. At the same time, all heat-generating components share the air duct. If the temperature of one of the components is too high, the speed of all fans will increase, resulting in waste of fan power consumption.

In order to solve the above technical problems, the embodiment of the present application provides a fan cooling server board and chassis layout structure, Figure 1 is a schematic diagram of the fan cooling server board and chassis layout structure provided by the embodiment of the application, as shown 1, including:

Left backplane 11, right backplane 12, at least three horizontal laminates 14, at least two sets of fan modules 13;

The left backboard 11 and the right backboard 12 are vertically connected to the horizontal laminates 14 respectively, and the horizontal laminates 14 are parallel and horizontal;

The hardware components are arranged between the horizontal laminates 14, the fan modules 13 are arranged between the horizontal laminates 14, and the fan modules 13 are independently controlled to dissipate heat for the hardware components provided on the corresponding horizontal laminates 14. The air inlet and the air outlet of the module 13 are independent of each other.

The left backboard 11, the right backboard 12, and at least three horizontal laminates 14 mentioned in this embodiment form a device including at least two layers of space, and the hardware components are arranged between the horizontal laminates 14, including but Not limited to, CPU, Microcontroller Unit (Microcontroller Unit; MCU), high-speed serial computer expansion bus standard (peripheral component interconnect express, PCI-Express) equipment, flash memory, cache, etc., according to specific needs, different hardware components can be arbitrarily setting, which is not specifically limited in this embodiment. It can be set according to the heat dissipation power and size of the hardware components.

This embodiment does not limit the connection method of the hardware components, which can be set according to actual needs.

In addition, the present embodiment mentions that the fan modules 13 are heat dissipation devices, and each fan module 13 correspondingly dissipates heat for the hardware components between the horizontal laminates 14, and the fan modules 13 are independently controlled, and can be controlled separately whether they are The corresponding horizontal laminates dissipate heat for 14 hours to achieve more precise fan speed regulation, avoiding the problem of an increase in the speed of all fans caused by overheating of a certain component, and avoiding the waste of fan power consumption. In addition, the air inlet and air outlet of the fan module 13 are independent of each other, so that the hot air generated by heat dissipation will not cause the temperature of hardware components on other laminates to rise. The heat dissipation cascading situation of each hardware component is eliminated, and the heat dissipation efficiency of the fan is improved.

The server board and chassis layout structure provided by the application for heat dissipation through the fan includes: a left backplane 11, a right backplane 12, at least three horizontal laminates 14, at least two sets of fan modules 13; a left backplane 11. The right side backplane 12 is vertically connected to the horizontal laminates 14, and the horizontal laminates 14 are parallel and horizontal; the horizontal laminates 14 are used for setting hardware components, and the fan module 13 is arranged between the horizontal laminates 14 The fan modules 13 are independently controlled to dissipate heat for the hardware components provided on the corresponding horizontal laminates 14, and the air inlets and air outlets of the fan modules 13 are independent of each other. The hardware components are arranged in layers, and each fan module 13 correspondingly dissipates heat for the hardware components between the horizontal laminates 14, and the fan modules 13 are independently controlled to control whether to dissipate heat for the corresponding horizontal laminates 14 at a time, Realize more accurate fan speed regulation, avoid the problem that the overheating of a certain component causes the speed of all fans to increase, and avoid the waste of fan power consumption. In addition, the air inlet and air outlet of the fan module 13 are independent of each other, so that the hot air generated by heat dissipation will not cause the temperature of hardware components on other laminates to rise. The heat dissipation cascading situation of each hardware component is eliminated, and the heat dissipation efficiency of the fan is improved.

According to the above-mentioned embodiment, this embodiment provides a preferred solution, the above-mentioned fan cooling server board and chassis layout structure, the number of horizontal laminates 14 is five;

The five horizontal laminates 14 are arranged respectively: processor and storage module, PCIe external card module, storage hard disk module, management/peripheral hardware and PSU module.

Preferably, the processor and storage module include: a central processing unit and a dual in-line memory module (DIMM).

According to the actual application environment, there may be multiple CPUs.

According to the different heat dissipation power of common hardware components, the processor and storage module, PCIe external card module, storage hard disk module, management/peripheral hardware and PSU module are respectively arranged between the horizontal layer boards 14, and the corresponding The fan modules 13 are independently controlled, and can separately control whether to dissipate heat for the corresponding horizontal shelf 14 at a time, so as to realize more accurate fan speed regulation, avoid the problem of an overheating of a certain component causing the speed of all fans to rise, and avoid waste of fan power consumption . Through more accurate module division and fan module 13 design, more accurate fan speed regulation is realized, avoiding the problem of an increase in the speed of all fans caused by overheating of a certain component, and avoiding waste of fan power consumption.

According to the above embodiment, this embodiment provides a preferred solution, the above-mentioned fan cooling server board and chassis layout structure, the number of fan modules 13 is three;

The three fan modules 13 are respectively arranged between the processor and the storage module, the PCIe add-in card module, and the storage hard disk module corresponding to the horizontal laminates 14 .

Since the management/peripheral and PSU modules include the board management unit and the basic peripheral interface part, they mainly realize the functions of server management and basic input/output (Input/Output, I/O) interaction, the power consumption is very low, and no separate External fan for heat dissipation; the standard power supply unit (PC Power supply unit, PSU) has its own fan to meet its own cooling needs. It is responsible for converting standard AC power into low-voltage stable DC power for use by other components in the computer. Therefore, normal functions can be realized without placing the fan module 13 on this layer. Corresponding fan modules 13 are arranged between the horizontal layer boards 14 where the other three module processors, storage modules, PCIe add-in card modules, and storage hard disk modules are located, respectively controlling whether to dissipate heat for the corresponding horizontal layer boards 14 for a longer period of time to achieve more Accurate fan speed regulation avoids the problem of rising fan speeds caused by overheating of a certain component, and avoids waste of fan power consumption. Through more accurate module division and fan module 13 design, more accurate fan speed regulation is realized, avoiding the problem of an increase in the speed of all fans caused by overheating of a certain component, and avoiding waste of fan power consumption.

According to the above-mentioned embodiment, in order to achieve better heat dissipation, this embodiment provides a preferred solution. In the above-mentioned server board and chassis layout structure for fan heat dissipation, the fan module 13 is fixed to the rear side through an integrated cable.

The fan module 13 is fixed to the rear side through an integrated cable, and the wind direction is from the rear to the front to dissipate heat from the hardware components. The fan module 13 respectively controls whether to dissipate heat for the corresponding horizontal layer 14 at a time, realizes more precise regulation of the fan speed, avoids the problem of an increase in the speed of all fans caused by overheating of a certain component, and avoids waste of fan power consumption. Through more accurate module division and fan module 13 design, more accurate fan speed regulation is realized, avoiding the problem of an increase in the speed of all fans caused by overheating of a certain component, and avoiding waste of fan power consumption.

According to the above-mentioned embodiment, this embodiment provides a preferred solution. In the above-mentioned fan-cooled server board and chassis layout structure, the left backplane 11, the right backplane 12, and the horizontal laminate 14 are PCB boards;

The left backplane 11, the right backplane 12, and each horizontal layer board 14 are interconnected through power supply interfaces or high-density interfaces to provide signals and power to each module.

In the above embodiments, the specific types of the left backboard 11 , the right backboard 12 , and the horizontal layer board 14 are not limited, and a structural device installed in layers can be formed, which is only used for setting hardware components. Since the installation of hardware components will be accompanied by the connection of a large number of power supply wires and communication cables, this embodiment provides a preferred solution, the left backplane 11, the right backplane 12, and the horizontal laminate 14 are PCB boards; The backplane 11, the right backplane 12 and each horizontal layer board 14 are interconnected through a power supply interface or a high-density interface to provide signals and power to each module. Both the PCIe external card module and the storage hard disk module can also obtain high-speed signals and power supply through the adapter boards on both sides, so as to realize the simplification of circuit connection.

In addition, the fan module 13 is connected to the signal through the left backplane 11 and the right backplane 12, and each fan is fixedly connected to the rear window through an integrated cable, so that each fan can be controlled independently.

According to the above-mentioned embodiment, the PCIe add-in card module usually includes a plurality of add-in cards, and the power consumption of these add-in cards is not necessarily the same. Among them, the fan module 13 corresponding to the PCIe external card module includes a plurality of air ducts;

The air ducts are in one-to-one correspondence with the installation positions of the PCIe add-in cards, and each air duct corresponds to a cooling fan.

In this embodiment, the fan module 13 corresponding to the PCIe external card module includes a plurality of air ducts; the air ducts correspond to the installation positions of the PCIe external cards one by one, and each air duct is correspondingly provided with a cooling fan to achieve more accurate Fan speed regulation. In the same way, the size of each component in each layer is relatively regular, and it can also be easily isolated into independent air ducts. According to different power consumption hardware components, it is divided into multiple air ducts, and each air duct is equipped with a fan to achieve a more accurate fan. Speed regulation. The fan module 13 separately controls whether to dissipate heat for the corresponding horizontal shelf 14, and controls whether each fan dissipates heat for the corresponding air duct, so as to achieve more precise fan speed regulation and avoid the problem that the speed of all fans increases due to overheating of a certain component , avoiding the waste of fan power consumption. Through more accurate module division and fan module 13 design, more accurate fan speed regulation is realized, avoiding the problem of an increase in the speed of all fans caused by overheating of a certain component, and avoiding waste of fan power consumption.

According to the above-mentioned embodiment, this embodiment provides a preferred solution, the above-mentioned fan-cooled server board and chassis layout structure also includes: a cable management frame 15;

The cable management frame 15 is arranged on the left backplane 11 and the right side backplane 12 , and the wires of the hardware components are laid on the cable management frame 15 .

By adding the cable management frame 15 module to the front window of the chassis, the signals of each layer can be connected through the cables of the cable management frame 15 on both sides, and can also be matched with different adapter boards on both sides, thereby improving the flexibility of layering.

According to the above-mentioned embodiment, this embodiment provides a preferred solution. In the above-mentioned fan-cooled server board and chassis layout structure, the height between the horizontal laminates 14 can be adjusted.

In this embodiment, the height between the horizontal laminates 14 can be adjusted, so that hardware components of different specifications can be added according to actual needs. Through more accurate module division and fan module 13 design, more accurate fan speed regulation is realized, avoiding the problem of an increase in the speed of all fans caused by overheating of a certain component, and avoiding waste of fan power consumption.

Finally, the embodiment of the present application also provides a server, including the fan cooling server board and the chassis layout structure mentioned in the above embodiment, including: a left backplane 11, a right backplane 12, and at least three horizontal laminates 14. At least two sets of fan modules 13; the left backplane 11 and the right backplane 12 are vertically connected to the horizontal laminates 14, and the horizontal laminates 14 are parallel and horizontal; the horizontal laminates 14 are used to set hardware Components, the fan module 13 is arranged between the horizontal laminates 14, and the fan modules 13 are independently controlled to dissipate heat for the hardware components arranged on the corresponding horizontal laminates 14. The air inlet and the air outlet of the fan module 13 are mutually independent. The hardware components are arranged in layers, and each fan module 13 correspondingly dissipates heat for the hardware components between the horizontal laminates 14, and the fan modules 13 are independently controlled to control whether to dissipate heat for the corresponding horizontal laminates 14 at a time, Realize more accurate fan speed regulation, avoid the problem that the overheating of a certain component causes the speed of all fans to increase, and avoid the waste of fan power consumption. In addition, the air inlet and air outlet of the fan module 13 are independent of each other, so that the hot air generated by heat dissipation will not cause the temperature of hardware components on other laminates to rise. The heat dissipation cascading situation of each hardware component is eliminated, and the heat dissipation efficiency of the fan is improved.

The fan cooling server board and chassis layout structure and the server provided in this application have been introduced in detail above. Each embodiment in the description is described in a progressive manner, each embodiment focuses on the difference from other embodiments, and the same and similar parts of each embodiment can be referred to each other. As for the device disclosed in the embodiment, since it corresponds to the method disclosed in the embodiment, the description is relatively simple, and for the related information, please refer to the description of the method part. It should be pointed out that those skilled in the art can make some improvements and modifications to the application without departing from the principles of the application, and these improvements and modifications also fall within the protection scope of the claims of the application.

It should also be noted that in this specification, relative terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply that these entities or operations There is no such actual relationship or order between the operations. Furthermore, the term "comprises", "comprises" or any other variation thereof is intended to cover a non-exclusive inclusion such that a process, method, article, or apparatus comprising a set of elements includes not only those elements, but also includes elements not expressly listed. other elements of or also include elements inherent in such a process, method, article, or device. Without further limitations, an element defined by the phrase "comprising a ..." does not exclude the presence of additional identical elements in the process, method, article or apparatus comprising said element.

Claims (10)

1. A fan cooling server board and chassis layout structure, characterized in that, comprising: Left backboard (11), right backboard (12), at least three horizontal laminates (14), at least two sets of fan modules (13); The left backboard (11) and the right backboard (12) are respectively vertically connected to the horizontal laminates (14), and the horizontal laminates (14) are parallel and horizontal; Hardware components are arranged between the horizontal laminates (14), the fan modules (13) are arranged between the horizontal laminates (14), and the fan modules (13) are independently controlled, The air inlet and air outlet of the fan module (13) are independent from each other for dissipating heat from the hardware components provided on the corresponding horizontal laminate (14). 2. the server board and the chassis layout structure of fan cooling according to claim 1, is characterized in that, the quantity of described horizontal laminate (14) is five; The five horizontal laminates (14) are arranged respectively: processor and storage module, PCIe external card module, storage hard disk module, management/peripheral hardware and PSU module. 3. the server board and the chassis layout structure of fan cooling according to claim 2, is characterized in that, the quantity of described fan module (13) is three; The three fan modules (13) are respectively arranged between the horizontal layer boards (14) corresponding to the processor and storage module, the PCIe add-in card module, and the storage hard disk module. 4. according to claim 3, the server board and the chassis layout structure for heat dissipation by fan, is characterized in that, The processor and storage module include: a central processing unit and a dual in-line storage module. 5. the server board and the cabinet layout structure of fan cooling according to claim 4, it is characterized in that, described left side backplane (11), described right side backplane (12), described horizontal laminate ( 14) is a PCB board; The left backplane (11), the right backplane (12) and each of the horizontal laminates (14) are interconnected through a power supply interface or a high-density interface to provide signals and power to each module. 6. the server board and chassis layout structure of fan cooling according to claim 3, is characterized in that, described fan module (13) corresponding to described PCIe external card module comprises a plurality of air ducts; The air ducts are in one-to-one correspondence with the installation positions of the PCIe add-in cards, and each of the air ducts is correspondingly provided with a cooling fan. 7. The fan cooling server board and chassis layout structure according to claim 3, characterized in that, the fan module (13) is fixed to the rear side through an integrated cable. 8. The server board and the chassis layout structure of fan heat dissipation according to claim 1, is characterized in that, also comprises: cable management frame (15); The wire management frame (15) is arranged on the left backboard (11) and the right side backboard (12), and the wires of the hardware components are laid on the wire management frame (15). 9. The fan cooling server board and chassis layout structure according to claim 1, characterized in that the height between the horizontal laminates (14) is adjustable. 10. A server, characterized in that it comprises the fan-cooled server board and the chassis layout structure according to any one of claims 1 to 9.

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