CN115904028A - Server board card and case layout structure with fans for heat dissipation and server - Google Patents
Server board card and case layout structure with fans for heat dissipation and server Download PDFInfo
- Publication number
- CN115904028A CN115904028A CN202211637661.6A CN202211637661A CN115904028A CN 115904028 A CN115904028 A CN 115904028A CN 202211637661 A CN202211637661 A CN 202211637661A CN 115904028 A CN115904028 A CN 115904028A
- Authority
- CN
- China
- Prior art keywords
- fan
- module
- horizontal
- heat dissipation
- server
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 title abstract description 71
- 238000001816 cooling Methods 0.000 claims description 11
- 230000002093 peripheral effect Effects 0.000 claims description 8
- 238000012545 processing Methods 0.000 claims description 5
- 230000009977 dual effect Effects 0.000 claims description 4
- 238000003780 insertion Methods 0.000 claims 1
- 230000037431 insertion Effects 0.000 claims 1
- 239000011120 plywood Substances 0.000 abstract description 19
- 230000033228 biological regulation Effects 0.000 abstract description 15
- 238000000034 method Methods 0.000 description 11
- 238000007726 management method Methods 0.000 description 10
- 238000013021 overheating Methods 0.000 description 6
- 238000013461 design Methods 0.000 description 5
- 239000002699 waste material Substances 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 230000006870 function Effects 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000013500 data storage Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
Images
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The application discloses radiating server integrated circuit board and quick-witted case layout structure of fan and server relates to the server field, in order to solve the extravagant problem of heat dissipation consumption, the radiating server integrated circuit board of fan and quick-witted case layout structure that this application provided are used for setting up the hardware component between the horizontal plywood, and the fan module sets up between the horizontal plywood, independent control between the fan module, the income wind gap of fan module, air outlet mutual independence. Hardware component layer sets up, and every fan module dispels the heat for the hardware component between the horizontal layer board correspondingly, independent control between the fan module, can control respectively whether for the horizontal layer board time heat dissipation that corresponds, realizes more accurate fan rotational speed regulation and control, avoids the overheated problem that leads to all fan rotational speeds to rise of certain part, has avoided the fan consumption extravagant. In addition, the air inlet and the air outlet of the fan module are mutually independent, so that the temperature of hardware elements of other laminates cannot be increased due to hot air generated by heat dissipation, and the heat dissipation efficiency of the fan is improved.
Description
Technical Field
The application relates to the field of servers, in particular to a server board card and a chassis layout structure with a fan for heat dissipation.
Background
With the rapid development of technology, computer-related technology has penetrated into every industry and business function field today. The amount of information and the demand for computing are increasing rapidly, and the servers are required to have higher and higher data storage capacity and computing capacity, so that the performance of the servers is higher and higher, and the system power consumption is increased continuously, and the heat dissipation demand of the servers is higher and higher.
According to the common double-channel standard machine server case and board card layout, the whole machine system is cooled by air through a fan module arranged in the case, cold air enters from one side of a front window hard disk, sequentially passes through heat dissipation components such as a storage hard disk, a CPU/DIMM (central processing unit/dual in-line memory module) and an external plug-in card, and hot air flows out from one side of the external plug-in card of a rear window, so that heat dissipation of each heating module is realized.
In this way, the main heat dissipation modules are in cascade connection, and the heat dissipation cascade leads to higher temperature of airflow closer to the rear window, and low heat dissipation efficiency. Meanwhile, all heating components share the air duct, and if the temperature of one of the components is too high, the rotating speed of all fans is increased, so that the power consumption of the fans is wasted.
Therefore, how to solve the problem of heat dissipation and power consumption waste is an urgent technical problem to be solved by the person skilled in the art.
Disclosure of Invention
The application aims to provide a server board card and a chassis layout structure capable of achieving fan heat dissipation and solving the problem of heat dissipation power consumption waste.
In order to solve the above technical problem, the present application provides a server board card and a chassis layout structure with heat dissipation by fans, including:
the fan module comprises a left side back plate, a right side back plate, at least three horizontal laminate plates and at least two groups of fan modules;
the left back plate and the right back plate are respectively vertically connected with the horizontal laminate plates, and the horizontal laminate plates are parallel and horizontal;
be used for setting up the hardware component between the horizontal plywood, the fan module sets up between the horizontal plywood, independent control between the fan module for the hardware component heat dissipation of the horizontal plywood setting that corresponds, the income wind gap of fan module, air outlet are independent each other.
As a preferred scheme, in the layout structure of the server board card and the chassis with the fan for heat dissipation, the number of the horizontal laminates is five;
set up respectively between five horizontal plywood: the system comprises a processor, a storage module, a PCIe external plug-in module, a storage hard disk module, a management/peripheral and a PSU module.
As a preferred scheme, in the layout structure of the server board card and the chassis with the fan for heat dissipation, the number of the fan modules is three;
the three fan modules are respectively arranged between the processor and the horizontal layer plates corresponding to the storage module, the PCIe outer plug-in module and the storage hard disk module.
As a preferred scheme, in the layout structure of the server board card and the chassis with heat dissipated by the fan, the processor and the storage module include: a central processing unit and a dual in-line memory module.
As a preferred scheme, in the server board card and chassis layout structure with fan heat dissipation, the left-side back plate, the right-side back plate and the horizontal layer board are PCB board cards;
the left back plate, the right back plate and each horizontal layer plate are interconnected through power supply interfaces or high-voltage interfaces to provide signals and power supplies for each module.
As a preferred scheme, in the server board card and chassis layout structure with fan heat dissipation, the fan module corresponding to the PCIe external plug-in module includes a plurality of air channels;
the air channels correspond to the PCIe external plug-in cards one by one, and each air channel is correspondingly provided with a cooling fan.
As a preferred scheme, in the layout structure of the server board card and the chassis with the heat dissipation fan, the fan module is fixed to the rear side through an integrated cable.
As a preferred scheme, in the server board card and chassis layout structure with heat dissipated by the fan, the method further includes: a wire arranging frame;
the wire arranging frame is arranged on the left back plate and the right back plate, and the wires of the hardware elements are laid on the wire arranging frame.
As a preferable scheme, in the layout structure of the server board card and the chassis with the fans for heat dissipation, the height between the horizontal laminates can be adjusted.
In order to solve the technical problem, the application further provides a server, which comprises the server board card with the fan for heat dissipation and a case layout structure.
The application provides radiating server integrated circuit board of fan and quick-witted case layout structure includes: the fan module comprises a left side back plate, a right side back plate, at least three horizontal laminate plates and at least two groups of fan modules; the left back plate and the right back plate are respectively vertically connected with the horizontal laminates, and the horizontal laminates are parallel and horizontal; be used for setting up hardware component between the horizontal plywood, the fan module sets up between the horizontal plywood, independent control between the fan module for the hardware component heat dissipation of the horizontal plywood setting that corresponds, the income wind gap of fan module, air outlet mutual independence. Hardware components sets up by layers, and every fan module dispels the heat for the hardware components between the horizontal plywood correspondingly, and independent control between the fan module can control respectively whether for the horizontal plywood time heat dissipation that corresponds, realizes more accurate fan rotational speed regulation and control, avoids the overheated problem that leads to all fan rotational speeds to rise of certain part, has avoided the fan consumption extravagant. In addition, the air inlet and the air outlet of the fan module 13 are independent from each other, so that the temperature of the hardware elements of other layers of the board is not increased due to the heat generated by heat dissipation. The heat dissipation cascade condition of each hardware element is eliminated, and the heat dissipation efficiency of the fan is improved.
In addition, this application still provides a server, including radiating server integrated circuit board of above-mentioned fan and quick-witted case layout structure, the effect is the same as above.
Drawings
In order to more clearly illustrate the embodiments of the present application, the drawings needed for the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings can be obtained by those skilled in the art without inventive effort.
Fig. 1 is a schematic diagram of a layout structure of a server board and a chassis for heat dissipation by a fan according to an embodiment of the present disclosure;
wherein the reference numbers are as follows: 11 is a left side back plate, 12 is a right side back plate, 13 is a fan module, 14 is a horizontal layer plate, and 15 is a wire arranging frame.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all the embodiments. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments in the present application without any creative effort belong to the protection scope of the present application.
The core of the application is to provide a server board card and a chassis layout structure with a fan for heat dissipation and a server.
In order that those skilled in the art will better understand the disclosure, the following detailed description will be given with reference to the accompanying drawings.
With the rapid development of technology, computer-related technologies have penetrated into every industry and business function field today. The amount of information and the demand for computing are increasing rapidly, and the servers are required to have higher and higher data storage capacity and computing capacity, so that the performance of the servers is higher and higher, and the system power consumption is increased continuously, and the heat dissipation demand of the servers is higher and higher.
The existing chassis heat dissipation is usually achieved by power supply fans and/or heat dissipation holes formed in the walls of the chassis. The heat dissipation mode only exhausting air outwards through the power supply fan and/or the heat dissipation holes is characterized in that the air exhaust capacity of the power supply fan and/or the heat dissipation holes is very limited, especially under the condition that the running time of the machine is long, heat generated by continuous work of heat dissipation elements inside the case is gathered inside the case and cannot be exhausted in time, the normal operation of the machine is seriously influenced, and even the service life of the machine is influenced.
According to the common double-channel standard machine server case and board card layout, the whole machine system is cooled by air through a fan module arranged in the case, cold air enters from one side of a front window hard disk, sequentially passes through heat dissipation components such as a storage hard disk, a Central Processing Unit (CPU), a Dual-Inline-Memory-Modules (DIMM) and an external plug-in card, and hot air flows out from one side of the external plug-in card of a rear window, so that heat dissipation of each heating module is realized.
In this way, the main heat dissipation modules are in cascade connection, and the heat dissipation cascade connection leads to the fact that the air flow temperature is higher further towards the rear window, and the heat dissipation efficiency is low. Meanwhile, all heating components share the air duct, and if the temperature of one of the components is too high, the rotating speed of all fans is increased, so that the power consumption of the fans is wasted.
In order to solve the foregoing technical problem, an embodiment of the present application provides a fan-cooling server board and chassis layout structure, and fig. 1 is a schematic diagram of a fan-cooling server board and chassis layout structure provided in an embodiment of the present application, and as shown in fig. 1, the fan-cooling server board and chassis layout structure includes:
the system comprises a left side back plate 11, a right side back plate 12, at least three horizontal layer plates 14 and at least two groups of fan modules 13;
the left back plate 11 and the right back plate 12 are respectively vertically connected with the horizontal layer plates 14, and the horizontal layer plates 14 are parallel and horizontal;
be used for setting up the hardware component between the horizontal plywood 14, fan module 13 sets up between horizontal plywood 14, independent control between the fan module 13 for the hardware component heat dissipation that sets up for corresponding horizontal plywood 14, the income wind gap of fan module 13, air outlet are independent each other.
The left backplane 11, the right backplane 12, and the at least three horizontal planes 14 mentioned in this embodiment form a device including at least two layers of spaces, where hardware elements, including but not limited to a CPU, a Micro Controller Unit (MCU), a PCI-Express (peripheral component interconnect Express) device, a flash memory, a cache memory, and the like, are arranged between the horizontal planes 14, and different hardware elements may be arbitrarily arranged according to specific requirements, which is not limited in this embodiment. The setting can be carried out according to the heat dissipation power and the size of the hardware element.
The present embodiment also does not limit the connection method of the hardware elements, and the method may be set according to actual needs.
In addition, in this embodiment, the fan modules 13 are mentioned as heat dissipation devices, each fan module 13 correspondingly dissipates heat for hardware elements between the horizontal plates 14, and the fan modules 13 are independently controlled to respectively control whether to dissipate heat for the corresponding horizontal plates 14 at any time, so as to achieve more accurate control of the rotation speed of the fan, avoid the problem that the rotation speed of all fans is increased due to overheating of a certain component, and avoid waste of power consumption of the fan. In addition, the air inlet and the air outlet of the fan module 13 are independent from each other, so that the temperature of the hardware elements of other layers of the board is not increased due to the heat generated by heat dissipation. The heat dissipation cascade condition of each hardware element is eliminated, and the heat dissipation efficiency of the fan is improved.
Through radiating server integrated circuit board of fan and quick-witted case layout structure that this application provided, include: the fan module comprises a left side back plate 11, a right side back plate 12, at least three horizontal layer plates 14 and at least two groups of fan modules 13; the left back plate 11 and the right back plate 12 are respectively vertically connected with the horizontal layer plates 14, and the horizontal layer plates 14 are parallel and horizontal; be used for setting up the hardware component between the horizontal plywood 14, fan module 13 sets up between horizontal plywood 14, independent control between the fan module 13 for the hardware component heat dissipation that sets up for corresponding horizontal plywood 14, the income wind gap of fan module 13, air outlet are independent each other. Hardware components are arranged in a layered mode, each fan module 13 correspondingly dissipates heat for the hardware components among the horizontal layer plates 14, the fan modules 13 are independently controlled to respectively dissipate heat for the corresponding horizontal layer plates 14, more accurate fan rotating speed regulation and control are achieved, the problem that all fan rotating speeds rise due to overheating of a certain part is avoided, and fan power consumption waste is avoided. In addition, the air inlet and the air outlet of the fan module 13 are independent from each other, so that the temperature of the hardware elements of other layers of the board is not increased due to the heat generated by heat dissipation. The heat dissipation cascade condition of each hardware element is eliminated, and the heat dissipation efficiency of the fan is improved.
According to the above embodiment, this embodiment provides a preferred solution, in the above server board card and chassis layout structure with fan for heat dissipation, the number of the horizontal layer boards 14 is five;
five horizontal layer plates 14 are arranged among the five horizontal layer plates: the system comprises a processor, a storage module, a PCIe external plug-in module, a storage hard disk module, a management/peripheral and a PSU module.
Preferably, the processor and memory module comprises: a central processor and a dual in-line memory module (DIMM).
The number of the central processing units can be multiple according to the actual application environment.
The heat dissipation device comprises a processor, a storage module, a PCIe external card module, a storage hard disk module, a management/peripheral and a PSU module, wherein the processor, the storage module, the PCIe external card module, the storage hard disk module, the management/peripheral and the PSU module are respectively arranged between horizontal layer plates 14, and fan modules 13 corresponding to the modules are independently controlled to respectively control whether the heat dissipation is carried out on the corresponding horizontal layer plates 14, so that more accurate regulation and control of the rotating speed of a fan are realized, the problem that the rotating speed of all fans rises due to overheating of a certain component is avoided, and the power consumption of the fan is avoided. Through more accurate module division and the design of fan module 13, realize more accurate fan rotational speed regulation and control, avoid certain part overheated problem that leads to all fan rotational speeds to rise, avoided the fan consumption extravagant.
According to the above embodiment, this embodiment provides a preferable scheme, in the layout structure of the server board card and the chassis for heat dissipation by the fan, the number of the fan modules 13 is three;
the three fan modules 13 are respectively arranged between the processor and the horizontal layer plate 14 corresponding to the storage module, the PCIe outer card module and the storage hard disk module.
Because the management/peripheral and PSU module comprises the board card management unit and the basic peripheral interface part, the interaction function of server management and basic Input/Output (I/O) is mainly realized, the power consumption is very low, and a single external fan is not needed for heat dissipation; a PC Power Supply Unit (PSU) with a fan can meet its own heat dissipation requirements, and the Power supply is an electric energy conversion type Power supply (different from a battery-powered type Power supply) for a computer and is responsible for converting standard alternating current into low-voltage stable direct current for other components in the computer. Therefore, the layer can realize normal function without placing the fan module 13. Set up corresponding fan module 13 between the horizontal plywood 14 at three module processor and storage module, PCIe outer card module, storage hard disk module place in addition, whether control is 14 time heat dissipations of horizontal plywood that correspond respectively, realize more accurate fan rotational speed regulation and control, avoid the overheated problem that leads to all fan rotational speeds to rise of certain part, avoided the fan power consumption extravagant. Through more accurate module division and the design of fan module 13, realize more accurate fan rotational speed regulation and control, avoid certain part overheated problem that leads to all fan rotational speeds to rise, avoided the fan consumption extravagant.
According to the above embodiments, in order to achieve better heat dissipation, the present embodiment provides a preferable solution, in the layout structure of the server board and the chassis with fan for heat dissipation, the fan module 13 is fixed to the rear side through the integrated cable.
The fan module 13 is fixed to the rear side through an integrated cable, and the wind direction dissipates heat from the rear to the front of the hardware elements. The fan module 13 controls whether to radiate heat for the corresponding horizontal layer plate 14 time respectively, so that more accurate regulation and control of the rotating speed of the fan are realized, the problem that the rotating speed of all fans rises due to overheating of a certain part is avoided, and the power consumption of the fan is avoided being wasted. Through more accurate module division and the design of fan module 13, realize more accurate fan rotational speed regulation and control, avoid certain part overheated problem that leads to all fan rotational speeds to rise, avoided the fan consumption extravagant.
According to the above embodiment, this embodiment provides a preferable scheme, in the layout structure of the server board and the chassis with fan heat dissipation, the left back plate 11, the right back plate 12, and the horizontal layer plate 14 are PCB boards;
the left back plate 11 and the right back plate 12 are interconnected with each horizontal layer plate 14 through power supply interfaces or high-voltage interfaces to provide signals and power for each module.
In the above embodiment, the specific types of the left-side back panel 11, the right-side back panel 12, and the horizontal layer panel 14 are not limited, and a layered installation structure for arranging hardware components may be formed. Because the installation of hardware components is accompanied with the connection of a large number of power supply wires and communication cables, the embodiment provides a preferred scheme, and the left backboard 11, the right backboard 12 and the horizontal layer board 14 are PCB boards; the left back plate 11 and the right back plate 12 are interconnected with each horizontal layer plate 14 through power supply interfaces or high-voltage interfaces to provide signals and power for each module. The PCIe external plug-in module and the storage hard disk module can also acquire high-speed signals and supply power through the adapter plates on two sides, so that the simplification of circuit connection is realized.
In addition, the fan module 13 is connected with signals through the left back plate 11 and the right back plate 12, and each fan is fixedly connected to the rear window through an integrated cable, so that each fan can be independently controlled.
According to the above embodiment, the PCIe external plug-in card module generally includes a plurality of external plug-in cards, and the power consumptions of the external plug-in cards are not necessarily the same, and this embodiment provides a preferred scheme, in the server board card and chassis layout structure with fan heat dissipation, the fan module 13 corresponding to the PCIe external plug-in card module includes a plurality of air channels;
the air channels correspond to the PCIe outer plug-in cards in a one-to-one mode, and each air channel is provided with a cooling fan correspondingly.
In this embodiment, the fan module 13 corresponding to the PCIe external plug-in module includes a plurality of air channels; the air channels correspond to the PCIe outer plug-in cards in a one-to-one mode, and each air channel is correspondingly provided with a cooling fan so as to achieve more accurate fan rotating speed regulation and control. Similarly, the sizes of all parts in each layer are regular, so that the parts can be conveniently isolated into independent air channels, the air channels are divided into a plurality of air channels according to different power consumption hardware elements, and each air channel is matched with one fan, so that the more accurate fan rotating speed regulation and control are realized. The fan module 13 controls whether to radiate heat for the corresponding horizontal layer plate 14 time respectively, and controls whether each fan radiates heat for the corresponding air channel, so that more accurate fan rotating speed regulation and control are realized, the problem that all fan rotating speeds rise due to overheating of a certain part is avoided, and the waste of fan power consumption is avoided. Through more accurate module division and the design of fan module 13, realize more accurate fan rotational speed regulation and control, avoid certain part overheated problem that leads to all fan rotational speeds to rise, avoided the fan consumption extravagant.
According to the foregoing embodiment, this embodiment provides a preferable scheme, and in the layout structure of the server board and the chassis with heat dissipated by the fan, the layout structure further includes: a wire management frame 15;
the wire arranging frame 15 is arranged on the left back plate 11 and the right back plate 12, and the wires of the hardware elements are laid on the wire arranging frame 15.
By adding the cable management frame 15 module on the front window of the case, signals of each layer can be connected through cables of the cable management frames 15 on the two sides, and different adapter plates on the two sides can be matched, so that the layering flexibility is improved.
According to the above embodiments, this embodiment provides a preferable solution, in the layout structure of the server board and the chassis with fan heat dissipation, the height between the horizontal plates 14 is adjustable.
In this embodiment, the height between the horizontal plates 14 is adjustable, so that hardware elements with different specifications can be added according to actual needs. Through more accurate module division and the design of fan module 13, realize more accurate fan rotational speed regulation and control, avoid certain part overheated problem that leads to all fan rotational speeds to rise, avoided the fan consumption extravagant.
Finally, an embodiment of the present application further provides a server, including the server board card and the chassis layout structure with heat dissipation by fans mentioned in the foregoing embodiments, including: the system comprises a left side back plate 11, a right side back plate 12, at least three horizontal layer plates 14 and at least two groups of fan modules 13; the left back plate 11 and the right back plate 12 are respectively vertically connected with horizontal layer plates 14, and the horizontal layer plates 14 are parallel and horizontal; be used for setting up hardware component between the horizontal layer board 14, fan module 13 sets up between horizontal layer board 14, and independent control between the fan module 13 is used for the hardware component heat dissipation for the horizontal layer board 14 setting that corresponds, and the income wind gap of fan module 13, air outlet are independent each other. Hardware components are arranged in a layered mode, each fan module 13 correspondingly dissipates heat for the hardware components between the horizontal layer plates 14, the fan modules 13 are independently controlled to respectively dissipate heat for the corresponding horizontal layer plates 14, more accurate fan rotating speed regulation and control are achieved, the problem that all fan rotating speeds rise due to overheating of certain parts is avoided, and power consumption of the fans is avoided being wasted. In addition, the air inlet and the air outlet of the fan module 13 are independent from each other, so that the temperature of the hardware elements of other layers of the board is not increased due to the heat generated by heat dissipation. The heat dissipation cascade condition of each hardware element is eliminated, and the heat dissipation efficiency of the fan is improved.
The server board card and the chassis layout structure for cooling by the fan and the server provided by the application are described in detail above. The embodiments are described in a progressive manner in the specification, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other. The device disclosed by the embodiment corresponds to the method disclosed by the embodiment, so that the description is simple, and the relevant points can be referred to the method part for description. It should be noted that, for those skilled in the art, it is possible to make several improvements and modifications to the present application without departing from the principle of the present application, and such improvements and modifications also fall within the scope of the claims of the present application.
It is further noted that, in the present specification, relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrases "comprising a," "8230," "8230," or "comprising" does not exclude the presence of additional like elements in a process, method, article, or apparatus that comprises the element.
Claims (10)
1. The utility model provides a radiating server integrated circuit board of fan and quick-witted case layout structure which characterized in that includes:
the device comprises a left side back plate (11), a right side back plate (12), at least three horizontal laminate plates (14) and at least two groups of fan modules (13);
the left back plate (11) and the right back plate (12) are respectively vertically connected with the horizontal laminates (14), and the horizontal laminates (14) are parallel and horizontal;
hardware elements are arranged between the horizontal layer plates (14), the fan modules (13) are independently controlled and used for dissipating heat of the hardware elements arranged on the corresponding horizontal layer plates (14), and air inlets and air outlets of the fan modules (13) are independent.
2. The fanned server board and chassis arrangement of claim 1, wherein the number of horizontal tiers (14) is five;
the five horizontal laminates (14) are arranged between the two plates: the system comprises a processor, a storage module, a PCIe external plug-in module, a storage hard disk module, a management/peripheral and a PSU module.
3. The server board and chassis arrangement for fan cooling according to claim 2, wherein the number of fan modules (13) is three;
the three fan modules (13) are respectively arranged among the horizontal layer plates (14) corresponding to the processor, the storage module, the PCIe outer card insertion module and the storage hard disk module.
4. The fanned server board and chassis arrangement of claim 3,
the processor and memory module includes: a central processing unit and a dual in-line memory module.
5. The fanned server board and chassis layout structure of claim 4, wherein the left backplane (11), the right backplane (12), and the horizontal tier boards (14) are PCB boards;
the left side back plate (11), the right side back plate (12) and each horizontal layer plate (14) are interconnected through power supply interfaces or high-close interfaces to provide signals and power supplies for each module.
6. The server board and chassis arrangement for fan cooling according to claim 3, wherein the fan module (13) corresponding to the PCIe add-in card module comprises a plurality of air channels;
the air channels correspond to the PCIe external plug-in cards one by one, and each air channel is correspondingly provided with a cooling fan.
7. The fanning server board and chassis arrangement according to claim 3, wherein the fan modules (13) are secured to the rear side by integrated cables.
8. The server board and chassis arrangement with fan cooling as claimed in claim 1, further comprising: a wire arrangement frame (15);
the wire arranging frame (15) is arranged on the left side back plate (11) and the right side back plate (12), and the wires of the hardware elements are laid on the wire arranging frame (15).
9. The fanning server board and chassis arrangement according to claim 1, wherein the height between the horizontal tiers (14) is adjustable.
10. A server comprising the fanned server board and chassis arrangement of any of claims 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211637661.6A CN115904028A (en) | 2022-12-16 | 2022-12-16 | Server board card and case layout structure with fans for heat dissipation and server |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211637661.6A CN115904028A (en) | 2022-12-16 | 2022-12-16 | Server board card and case layout structure with fans for heat dissipation and server |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115904028A true CN115904028A (en) | 2023-04-04 |
Family
ID=86471208
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211637661.6A Pending CN115904028A (en) | 2022-12-16 | 2022-12-16 | Server board card and case layout structure with fans for heat dissipation and server |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115904028A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117032429A (en) * | 2023-10-10 | 2023-11-10 | 浪潮(山东)计算机科技有限公司 | Heat abstractor, air cooling system and server |
-
2022
- 2022-12-16 CN CN202211637661.6A patent/CN115904028A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117032429A (en) * | 2023-10-10 | 2023-11-10 | 浪潮(山东)计算机科技有限公司 | Heat abstractor, air cooling system and server |
| CN117032429B (en) * | 2023-10-10 | 2024-02-09 | 浪潮(山东)计算机科技有限公司 | Heat abstractor, air cooling system and server |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI566679B (en) | Server system | |
| US7173821B2 (en) | Computer rack with power distribution system | |
| US8472181B2 (en) | Computer cabinets having progressive air velocity cooling systems and associated methods of manufacture and use | |
| CN107656588B (en) | Server system with optimized heat dissipation and installation method | |
| US20120075795A1 (en) | Modular Re-Configurable Computers and Storage Systems and Methods | |
| TW201338681A (en) | Server cabinnet | |
| CN103034302B (en) | Servomechanism | |
| CN115904028A (en) | Server board card and case layout structure with fans for heat dissipation and server | |
| CN104597973B (en) | Cloud server system | |
| CN201364544Y (en) | High-end cabinet server radiating structure device | |
| CN101291575A (en) | Heat radiating device and server | |
| CN104010478A (en) | Realizing method for data center free of fan arrangement in cabinets | |
| CN210183766U (en) | Integral type rack | |
| CN101807100B (en) | High-density rack server radiating system | |
| JP2010524249A (en) | Thermal management system for electronic devices | |
| CN216145187U (en) | Server capable of achieving efficient heat dissipation | |
| CN206348702U (en) | A kind of computer motherboard structure | |
| CN214896436U (en) | Modular multi-computing-node GPU server structure | |
| CN211264238U (en) | Industrial personal computer | |
| CN113220080A (en) | Modular multi-computing-node GPU server structure | |
| CN214755705U (en) | High-power modular UPS easy to radiate heat | |
| CN220986438U (en) | Integrated fan heat dissipation device | |
| CN219478390U (en) | Heat dissipation device | |
| CN212809202U (en) | Personal computer cluster equipment | |
| CN219497026U (en) | Server device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |