TW202131780A - A server heat dissipation structure - Google Patents

Abstract

The disclosure relates to computer technology field and provides a server heat dissipation structure that is configured to dissipate heat of host casing of dense-type server. The server heat dissipation structure includes a thermosyphon heat exchanger and a fan assembly; the thermosyphon heat exchanger includes an absorbing end and a heat dissipation end that are connected by a connection tube; the fan assembly is disposed on a side of the heat dissipation end so as to help dissipating heat of the heat dissipation end. The disclosure effectively uses the space of server for heat dissipation and for saving power consumed by fan, such that the temperature of electronic component is effectively reduced thereby being able to support high-end chip.

Description

Server heat dissipation structure

The invention relates to the field of computer technology, and in particular to a heat dissipation structure of a server.

In the Internet age, the exchange of electronic information relies heavily on servers, and the ability to respond positively can be reflected in the quality of the customer’s experience. We often see in the news that a large website or application (application, APP) caused the server to crash due to a large number of users. This is an important role played by the server in the electronic information age.

Since the server is very important, how to structure the server platform and ensure the normal and efficient operation of the server is extremely important. According to our experience of using ordinary computers, the heat generated by the computer is quite considerable. However, home computers basically have only one processor, and most servers have multiple processors working at the same time, ranging from two to more than a dozen. Therefore, the heat dissipation of the server is very critical.

The current heat dissipation of the server is mostly indoor cooling and air cooling, which is satisfactory in winter or cold regions. In summer or in hot areas, the heat dissipation problem can be very difficult. There are applications for oil cooling of the server abroad. This method can achieve silence and cooling, but the cost is not low, and the risk factor is high, which is not suitable for large-scale promotion.

The water cooling solution is a better choice for server cooling. Since the application of water-cooled heat dissipation in ordinary computers is very successful, it is also very suitable to directly use the server heat dissipation. The refrigeration heads can be set in batches, and the integrated pump and discharge water circuit can effectively reduce the temperature, and the cost is controllable. It is suitable for enterprise-level server to make the overall plan.

At present, the most widely used water-cooling radiators on servers are often limited in terms of space. At the same time, the heat-dissipating function of the radiator is affected by factors such as the influence of its own volume, the limitation of the motherboard design, and the heat dissipation contact surface. limit.

The original intention of the present invention is to solve the above-mentioned shortcomings of the traditional water-cooled heat sink. After research and practice, the inventor of the present application believes that if the working medium can perform a liquid-to-gas conversion similar to a siphon heat sink under a water-cooled architecture, it can further take away more heat energy from the heat source. If the fan is further matched to cool the heat dissipation end of the siphon heat sink, the heat dissipation efficiency can be further improved.

Based on the above reasons, the present invention proposes a server heat dissipation structure, which is used to dissipate heat from the main chassis of a dense server, including a siphon radiator and a fan module;

The siphon type radiator includes a heat absorption end and a heat dissipation end connected through a connecting pipe;

The fan module is arranged on one side of the heat dissipation end to help the heat dissipation end to dissipate heat.

In the above-mentioned server heat dissipation structure, each fan in the fan module is of a separate type and can be disassembled and assembled separately.

In the above-mentioned server heat dissipation structure, there are a total of 6 fans in the fan module, of which 5 are a group and are fixed as a whole, and the other is a redundant fan, which can be quickly disassembled and assembled.

In the above-mentioned server heat dissipation structure, the heat absorption end inputs liquid and outputs gas; the heat dissipation end inputs gas and outputs liquid; wherein, the liquid output from the heat dissipation end is input to the heat absorption end through a liquid pipe. The gas output from the heat absorption end is input to the heat dissipation end through a gas pipe.

In the above-mentioned server heat dissipation structure, the heat dissipation end is attached and fixed to a surface of a heating element.

In the above-mentioned server heat dissipation structure, the heat dissipation end is fixed by screws or thermally conductive glue.

The above-mentioned server heat dissipation structure further includes a power module. The power module takes power from the terminal of the server rack through a floating clamp, and the obtained power is connected to the power supply in the main chassis. Power distribution board.

In the above-mentioned server heat dissipation structure, the power distribution board and the main board are connected by means of golden fingers.

In the above heat dissipation structure of the server, the power distribution board is arranged in the middle of the main board.

Compared with the prior art, the technical solution of the present invention has the following beneficial effects:

1. The server space can be effectively used for heat dissipation: the heat sink and heat sink of the siphon radiator can be set in two positions respectively. Not only is the volume smaller, but the choice of installation position is more flexible. It is not easy to be affected by the length and The limitation of the direction can effectively use the free space inside the main cabinet to place the condenser to take away the heat. The larger the free space inside the main casing, the more obvious the heat dissipation advantage of the present invention.

2. Save fan power consumption: At present, servo fans all adopt proportional-integral-derivative (PID) speed control method, that is, the speed of the fan will change with the temperature of the chip. When the temperature of the chip decreases, the fan The speed of rotation has also been reduced accordingly. After adopting the invention, the power consumption of the fan can be effectively saved.

3. Effectively reduce the temperature of electronic components, which can support higher power consumption chips.

4. The mass production price is not high: the siphon radiator in the present invention can be made of aluminum material, which greatly reduces the cost compared with copper fins and heat pipes; the specific number of fan modules in the present invention is optional , It can save costs to a certain extent.

In order to make the purpose and features of the present invention more comprehensible, the specific embodiments of the present invention will be further described below with reference to the accompanying drawings. However, the present invention can be implemented in different forms and should not be limited to the described embodiments. Moreover, in the case of no conflict, the embodiments in the present application and the features in the embodiments are allowed to be combined or replaced with each other. Combined with the following description, the advantages and features of the present invention will be more clear.

It should be noted that the structure, ratio, size, etc. shown in the accompanying drawings in this specification are only used to match the content disclosed in the specification for the understanding and reading of those familiar with this technology, and are not intended to limit the present invention. The limited conditions that can be implemented do not have technical significance. Any structural modification, proportional relationship change, or size adjustment should still be implemented without affecting the effects and objectives that can be achieved by the present invention. It is within the scope of the technical content disclosed in the present invention. At the same time, the terms such as "upper", "lower", "left", "right", "middle" and "one" quoted in this manual are only for the convenience of description and are not used to limit the text. The scope of implementation of the invention, the change or adjustment of its relative relationship, shall be regarded as the scope of implementation of the invention without substantial changes to the technical content.

Figure 1 shows the internal layout of our Arctic 3.0 server. Arctic 3.0 server is a dual central processing unit (CPU) high-performance computing server based on the Intel whitley platform. Its mainframe adopts a standard 1U mainframe with limited internal space, especially the height is not high. (The height that can be effectively used inside the 1U main chassis is only about 40 mm), but it requires 7 3.5-inch hard disk drives (HDD) 5, 1 fast non-volatile memory (NVM) express, NVME) hard disk 6, 2 full-height and half-length peripheral component connection interface (Peripheral Component Interconnect Express, PCIE) cards 8 and 1 Open Compute Project (OCP) 3.0 network card 9 (OCP3.0 network card 9 Below the full-height and half-length PCIE card 8, only its interface is shown in the figure.) A total of 11 functional modules. Among them, two full-height and half-length PCIE cards 8 and one OCP3.0 network card 9 must also be arranged in the front window. At the same time, in the case of such a high-density layout, in order to solve the heat dissipation problem inside the main chassis, the radiator 10 and the fan module 11 are indispensable. Therefore, the radiator and the fan must be reasonably arranged.

The present invention improves the arrangement of the radiator and the fan. The radiator and the fan are arranged. First, the radiator 10 in FIG. 1 adopts a siphon type radiator.

The process of so-called siphon radiator dissipating heat is: the liquid medium is input to the heat-absorbing end 1, and the liquid medium absorbs enough heat in the heat-absorbing end 1 (because the heat-absorbing end 1 is close to the heat source) and then evaporates into In gaseous state, the gaseous medium passes through the gas pipeline 3 to the heat dissipation end 2. Since the heat dissipation end 2 itself is a multi-blade structure, it is more conducive to heat dissipation. At the same time, there is a fan to cool it down. Therefore, the gaseous medium returns to Liquid. The liquid medium passes through the liquid pipe 4 and enters the heat-absorbing end 1 again. Since there is always a temperature difference between the heat absorption end 1 and the heat dissipation end 2, there is always a pressure difference between the two ends of the gas pipeline 3 and the liquid pipeline 4. Due to the siphon effect, the liquid and gaseous media can naturally form a loop.

Please refer to FIG. 3 and FIG. 4 in combination. The siphon radiator includes a heat absorption end 1, a heat dissipation end 2, a gas pipeline 3 and a liquid pipeline 4. Among them, the heat absorption end 1 and the heat dissipation end 2 are connected through a gas pipeline 3 and a liquid pipeline 4. When using the siphon radiator, the heat sink 1 needs to be closely attached to the heat source in the server mainframe, such as a computing node, a storage node, etc. In the embodiment shown in FIG. 1, the heat sink 1 is arranged on the upper surface of the CPU (in FIG. 1, the CPU is completely shielded by the heat sink 1 ); the heat sink 2 is arranged in the empty space of the main chassis of the server. In the embodiment shown in FIG. 1, the heat dissipation end 2 is disposed at a position connected to the rear window of the main chassis. If no fan is provided there, the heat dissipation end 2 can be directly disposed on the rear window. The heat-absorbing end 1 and the heat-dissipating end 2 can be arranged separately, which brings convenience to the layout of the main chassis. Because the heat sink often requires more space for the heat sink, and the heating element (heat source) is often a computing chip, and memory, communication modules, etc. are usually arranged around it. It is not easy to find enough space for the heat sink. . The radiator shown in Figure 3 and Figure 4 separates the heat-absorbing end and the heat-dissipating end to reduce the difficulty of layout. The radiating end 2 can be relatively freely selected to be arranged in a well-ventilated position in the main chassis.

Specifically, the heat-absorbing end 1 is provided with a first mounting hole 15 and the heat-dissipating end 2 is provided with a second mounting hole 21. The heat-absorbing end 1 and the heat-dissipating end 2 can be fixed in designated positions by using screws and other connecting parts. In order to achieve better thermal conductivity, thermally conductive glue can also be used to fix the heat-absorbing end 1.

In order to save cost, in a preferred embodiment, aluminum alloy is used to make all the components of the siphon radiator.

Because there are other components and modules between the heat-absorbing end 1 and the heat-dissipating end 2. In order not to affect these structures, the gas pipeline 3 and the liquid pipeline 4 need to be set according to the actual situation during installation, and avoidance can be achieved by bending a certain angle when necessary.

When the space of the server permits, each heat source is provided with a siphon type radiator as shown in Fig. 3 and Fig. 4. In the embodiment shown in Fig. 1, two CPUs are used for each of the two CPUs. Siphon radiator. By separately dissipating heat from the heat source, while improving the heat dissipation effect, it can also reduce the interference between each other.

Secondly, in FIG. 1, a fan module 11 is also provided at the rear window of the main casing. As mentioned above, the heat dissipating end 2 of the radiator is located close to the rear window. Therefore, the fan module 11 and the heat dissipating end 2 are close to each other, and the main function of the fan module 11 is to cool the heat dissipating end 2.

Specifically, since the technical solution of the present invention can be applied to other main cabinets, the heat dissipation requirements of different main cabinets are not consistent. Therefore, preferably, each fan in the fan module 11 is a separate type, which can be Disassemble and assemble separately. In other words, the fan module 11 can be equipped with one, two... fans according to requirements. At the same time, the fan is preferably a snap-on type, which is convenient for direct disassembly and assembly from the rear window. In the embodiment shown in FIG. 1, a total of 6 fan card positions are arranged. According to the requirements of the Arctic 3.0 server, as shown in Figure 2, in this embodiment, 5 of them are used as standing fans, and a non-detachable fixing method is adopted, while the fan 12 is used as a redundant fan and a snap-on installation method is adopted. . It can be easily disassembled and assembled when needed.

Furthermore, the present invention also includes a power supply module, as shown in FIG. 5. The power supply module is not fully shown in FIG. 1, and only the floating clamp 13 is set on one side of the fan module 11. Specifically, one end of the power module is a floating clamp 13 and the other end is a power distribution board 14. The two are connected by wires bent into a suitable shape. The power supply module introduces the power supply from the rear window of the main casing to a relatively central position of the main casing, which is beneficial to supply power to the power consumption modules on a relatively average basis. The mainboard is connected to all modules in the mainboard, and the power distribution board 14 is connected to the power inlet on the mainboard to supply power to the entire server. In order to facilitate installation, the power distribution board 14 and the power inlet are connected in a gold finger manner.

The above-mentioned server heat dissipation structure can take advantage of the characteristics of flexible installation and good heat dissipation effect of the siphon radiator, and reasonably arrange the positions in the mainframe to realize the high-density arrangement of components in the mainframe of the server. The layout difficulty of the main chassis is reduced, and it can be applied to various main chassis, providing a good solution for similar problems.

Obviously, those skilled in the art can make various changes and modifications to the invention without departing from the spirit and scope of the invention. In this way, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalent technologies, the present invention is also intended to include these modifications and variations.

1: Endothermic 2: Heat sink 3: Gas pipeline 4: Liquid pipeline 5: 3.5 inch hard disk 6: NVME hard drive 8: Full height and half length PCIE card 9: OCP3.0 network card 10: radiator 11: Fan module 12: Fan 13: Floating clamp 14: Power Distribution Board 15: The first mounting hole 21: The second mounting hole

FIG. 1 is a layout diagram of a main chassis according to an embodiment of the present invention; Figure 2 is a schematic diagram of an electric fan module in an embodiment of the present invention; Figure 3 is a schematic diagram of a siphon radiator in an embodiment of the present invention; Figure 4 is a bottom view of the radiator in Figure 3; Fig. 5 is a schematic diagram of a power module in an embodiment of the present invention.

1: Endothermic

2: Heat sink

5: 3.5 inch hard disk

6: NVME hard drive

8: Full height and half length PCIE card

9: OCP3.0 network card

10: radiator

11: Fan module

13: Floating clamp

Claims (9)

A server heat dissipation structure used to dissipate heat from a main chassis of a dense server, the server heat dissipation structure including a siphon radiator and a fan module; The siphon type radiator includes a heat absorption end and a heat dissipation end connected through a connecting pipe; The fan module is arranged on one side of the heat dissipation end to help the heat dissipation end to dissipate heat. The server heat dissipation structure according to claim 1, wherein each fan in the fan module is a separate type and can be disassembled and assembled separately. According to the heat dissipation structure of the server according to claim 1, wherein, there are a total of 6 fans in the fan module, 5 of which are a group and are fixed as a whole, and the other is a redundant fan, which can be quickly disassembled and assembled. The server heat dissipation structure according to claim 1, wherein the heat absorption end inputs liquid and outputs gas; the heat dissipation end inputs gas and outputs liquid; wherein, the liquid output from the heat dissipation end is input to the all through a liquid pipe In the heat absorption end, the gas output from the heat absorption end is input to the heat dissipation end through a gas pipe. The server heat dissipation structure according to claim 1, wherein the heat dissipation end is attached and fixed to a surface of a heating element. The server heat dissipation structure according to claim 5, wherein the heat dissipation end is fixed by screws or thermally conductive glue. The server heat dissipation structure according to any one of claim 1 to claim 6, further comprising a power module, the power module takes power from a terminal of a server rack through a floating clamp, The obtained electricity is connected to a power distribution board in the main chassis. The server heat dissipation structure according to claim 7, wherein the power distribution board and a motherboard are connected through a golden finger. The server heat dissipation structure according to claim 7, wherein the power distribution board is disposed in a middle part of a motherboard.

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